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DE69109898D1 - Nassätzverfahren und -zusammensetzung. - Google Patents

Nassätzverfahren und -zusammensetzung.

Info

Publication number
DE69109898D1
DE69109898D1 DE69109898T DE69109898T DE69109898D1 DE 69109898 D1 DE69109898 D1 DE 69109898D1 DE 69109898 T DE69109898 T DE 69109898T DE 69109898 T DE69109898 T DE 69109898T DE 69109898 D1 DE69109898 D1 DE 69109898D1
Authority
DE
Germany
Prior art keywords
composition
etching process
wet etching
wet
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69109898T
Other languages
English (en)
Other versions
DE69109898T2 (de
Inventor
Douglas Eric Fjare
Allyson Jeanne Beuhler
Cynthia Ann Navar
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas A&M University System
Original Assignee
BP Corp North America Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BP Corp North America Inc filed Critical BP Corp North America Inc
Publication of DE69109898D1 publication Critical patent/DE69109898D1/de
Application granted granted Critical
Publication of DE69109898T2 publication Critical patent/DE69109898T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31127—Etching organic layers
    • H01L21/31133—Etching organic layers by chemical means
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00—Etching, surface-brightening or pickling compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Paints Or Removers (AREA)
  • Weting (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
DE69109898T 1990-03-09 1991-03-07 Nassätzverfahren und -zusammensetzung. Expired - Fee Related DE69109898T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US49143890A 1990-03-09 1990-03-09
US07/605,555 US5183534A (en) 1990-03-09 1990-10-30 Wet-etch process and composition

Publications (2)

Publication Number Publication Date
DE69109898D1 true DE69109898D1 (de) 1995-06-29
DE69109898T2 DE69109898T2 (de) 1995-10-19

Family

ID=27050443

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69109898T Expired - Fee Related DE69109898T2 (de) 1990-03-09 1991-03-07 Nassätzverfahren und -zusammensetzung.

Country Status (8)

Country Link
US (2) US5183534A (de)
EP (1) EP0446032B1 (de)
JP (1) JP3173730B2 (de)
KR (1) KR100201194B1 (de)
CA (1) CA2037490C (de)
DE (1) DE69109898T2 (de)
MX (1) MX172813B (de)
MY (1) MY105324A (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5350489A (en) * 1990-10-19 1994-09-27 Purex Co., Ltd. Treatment method of cleaning surface of plastic molded item
US5397506A (en) * 1993-08-20 1995-03-14 Ecolab Inc. Solid cleaner
US5443688A (en) * 1993-12-02 1995-08-22 Raytheon Company Method of manufacturing a ferroelectric device using a plasma etching process
US5714196A (en) * 1994-07-20 1998-02-03 Galileo Corporation Method of forming a strippable polyimide coating for an optical fiber
US5649045A (en) * 1995-12-13 1997-07-15 Amoco Corporation Polymide optical waveguide structures
US5914052A (en) * 1997-08-21 1999-06-22 Micron Technology, Inc. Wet etch method and apparatus
US6221567B1 (en) 1998-01-14 2001-04-24 Fujitsu Limited Method of patterning polyamic acid layers
US6159666A (en) * 1998-01-14 2000-12-12 Fijitsu Limited Environmentally friendly removal of photoresists used in wet etchable polyimide processes
WO1999053381A1 (en) * 1998-04-15 1999-10-21 Etec Systems, Inc. Photoresist developer and method of development
WO2001007247A1 (en) 1999-07-27 2001-02-01 North Carolina State University Patterned release film between two laminated surfaces
KR100356987B1 (ko) * 2000-01-22 2002-10-18 엘지.필립스 엘시디 주식회사 열경화성 수지 제거용 조성물
US7041232B2 (en) * 2001-03-26 2006-05-09 International Business Machines Corporation Selective etching of substrates with control of the etch profile
US7261997B2 (en) * 2002-01-17 2007-08-28 Brewer Science Inc. Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
US7325309B2 (en) * 2004-06-08 2008-02-05 Hewlett-Packard Development Company, L.P. Method of manufacturing a fluid ejection device with a dry-film photo-resist layer
US7323699B2 (en) * 2005-02-02 2008-01-29 Rave, Llc Apparatus and method for modifying an object
US20070290379A1 (en) * 2006-06-15 2007-12-20 Dueber Thomas E Hydrophobic compositions for electronic applications
JP5063138B2 (ja) * 2007-02-23 2012-10-31 株式会社Ｓｏｋｕｄｏ 基板現像方法および現像装置
US20080206997A1 (en) * 2007-02-26 2008-08-28 Semiconductor Energy Laboratory Co., Ltd. Method for Manufacturing Insulating Film and Method for Manufacturing Semiconductor Device
WO2012005068A1 (ja) * 2010-07-09 2012-01-12 化研テック株式会社 洗浄剤組成物用原液、洗浄剤組成物および洗浄方法
WO2013066058A2 (ko) * 2011-11-04 2013-05-10 동우 화인켐 주식회사 자성체막 및 자성체막 잔류물 제거용 조성물
KR102468776B1 (ko) 2015-09-21 2022-11-22 삼성전자주식회사 폴리실리콘 습식 식각용 조성물 및 이를 이용한 반도체 소자의 제조 방법
JP2019162565A (ja) * 2016-07-25 2019-09-26 富士フイルム株式会社 ガス分離膜、ガス分離膜モジュールおよびガス分離装置
TWI678596B (zh) * 2018-09-13 2019-12-01 新應材股份有限公司 正型光阻組成物及圖案化聚醯亞胺層之形成方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3361589A (en) * 1964-10-05 1968-01-02 Du Pont Process for treating polyimide surface with basic compounds, and polyimide surface having thin layer of polyamide acid
US3791848A (en) * 1972-05-19 1974-02-12 Western Electric Co A method of improving the adherence of a metal deposit to a polyimide surface
US4276186A (en) * 1979-06-26 1981-06-30 International Business Machines Corporation Cleaning composition and use thereof
US4369090A (en) * 1980-11-06 1983-01-18 Texas Instruments Incorporated Process for etching sloped vias in polyimide insulators
JPS58108229A (ja) * 1981-12-21 1983-06-28 Hitachi Ltd ポリイミド系樹脂膜の選択エツチング方法
US4411735A (en) * 1982-05-06 1983-10-25 National Semiconductor Corporation Polymeric insulation layer etching process and composition
US4592787A (en) * 1984-11-05 1986-06-03 The Dow Chemical Company Composition useful for stripping photoresist polymers and method
DE3602800A1 (de) * 1985-06-07 1986-12-11 agru Alois Gruber + Sohn oHG, Bad Hall Verfahren zur oberflaechenmodifizierung von formkoerpern aus polyvinylidenfluorid
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
US4857143A (en) * 1988-12-16 1989-08-15 International Business Machines Corp. Wet etching of cured polyimide

Also Published As

Publication number Publication date
JPH04219933A (ja) 1992-08-11
EP0446032A2 (de) 1991-09-11
CA2037490A1 (en) 1992-05-01
MX172813B (es) 1994-01-13
JP3173730B2 (ja) 2001-06-04
KR910016902A (ko) 1991-11-05
US5183534A (en) 1993-02-02
EP0446032B1 (de) 1995-05-24
US5292445A (en) 1994-03-08
CA2037490C (en) 2002-05-21
KR100201194B1 (ko) 1999-06-15
MY105324A (en) 1994-09-30
DE69109898T2 (de) 1995-10-19
EP0446032A3 (en) 1992-04-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: THE TEXAS A & M UNIVERSITY SYSTEM, COLLEGE STATION

8328 Change in the person/name/address of the agent

Free format text: WINTER, BRANDL, FUERNISS, HUEBNER, ROESS, KAISER, POLTE, PARTNERSCHAFT, 85354 FREISING

8339 Ceased/non-payment of the annual fee