[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

DE69013976D1 - Verfahren zum Montieren von elektronischen Bauteilen auf Leiterplatten. - Google Patents

Verfahren zum Montieren von elektronischen Bauteilen auf Leiterplatten.

Info

Publication number
DE69013976D1
DE69013976D1 DE69013976T DE69013976T DE69013976D1 DE 69013976 D1 DE69013976 D1 DE 69013976D1 DE 69013976 T DE69013976 T DE 69013976T DE 69013976 T DE69013976 T DE 69013976T DE 69013976 D1 DE69013976 D1 DE 69013976D1
Authority
DE
Germany
Prior art keywords
printed circuit
electronic components
circuit boards
mounting electronic
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69013976T
Other languages
English (en)
Other versions
DE69013976T2 (de
Inventor
Kenji Uchida
Kiyomi Ohkubo
Makoto Matumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69013976D1 publication Critical patent/DE69013976D1/de
Publication of DE69013976T2 publication Critical patent/DE69013976T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0053—Arrangements for assisting the manual mounting of components, e.g. special tables or light spots indicating the place for mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49137—Different components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53004—Means to assemble or disassemble with means to regulate operation by use of templet, tape, card or other replaceable information supply
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
    • Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DE69013976T 1989-05-15 1990-05-15 Verfahren zum Montieren von elektronischen Bauteilen auf Leiterplatten. Expired - Fee Related DE69013976T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1118542A JPH07101791B2 (ja) 1989-05-15 1989-05-15 プリント配線板への電子部品実装方法

Publications (2)

Publication Number Publication Date
DE69013976D1 true DE69013976D1 (de) 1994-12-15
DE69013976T2 DE69013976T2 (de) 1995-04-20

Family

ID=14739169

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69013976T Expired - Fee Related DE69013976T2 (de) 1989-05-15 1990-05-15 Verfahren zum Montieren von elektronischen Bauteilen auf Leiterplatten.

Country Status (4)

Country Link
US (1) US4980970A (de)
EP (1) EP0398248B1 (de)
JP (1) JPH07101791B2 (de)
DE (1) DE69013976T2 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2969910B2 (ja) * 1990-10-29 1999-11-02 松下電器産業株式会社 部品実装方法
JP2966082B2 (ja) * 1990-11-06 1999-10-25 株式会社日立製作所 実装順序決定方法及びその実装方法
JP3358464B2 (ja) * 1996-10-11 2002-12-16 松下電器産業株式会社 電子部品実装方法
MX9709038A (es) 1996-11-25 1998-08-30 Samsung Electronics Co Ltd Sistema y metodo de produccion de montajes de tableros de circuitos impresos.
AT411308B (de) * 2002-02-04 2003-11-25 Eae Stoeckl Elektroanlagen Ele Verfahren für den zusammenbau und die verdrahtung eines schalt-/verteilerschrankes
DE102006022370A1 (de) * 2006-05-12 2007-11-15 Siemens Ag Anweisung zum manuellen Bestücken von Bauelementen
US20080071840A1 (en) * 2006-09-14 2008-03-20 Viswanath Srikanth Introducing Multi-Level Nested Kits Into Existing E-Commerce Systems
CN114173490A (zh) * 2021-11-08 2022-03-11 陕西千山航空电子有限责任公司 一种表贴底部端子元器件手工返修方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3548493A (en) * 1967-09-05 1970-12-22 Wells Gardner Electronics Method and apparatus for assembling electrical components on printed circuit boards
US3831250A (en) * 1971-06-21 1974-08-27 King Radio Corp Method and apparatus for assembling printed circuit boards
JPS57154890A (en) * 1980-11-28 1982-09-24 Maakurisu Electonics Ltd Instruction of position necessary for component to be assembled on machined part during manufacturing
IN163064B (de) * 1984-03-22 1988-08-06 Siemens Ag

Also Published As

Publication number Publication date
EP0398248A3 (de) 1991-07-24
DE69013976T2 (de) 1995-04-20
US4980970A (en) 1991-01-01
EP0398248A2 (de) 1990-11-22
JPH07101791B2 (ja) 1995-11-01
EP0398248B1 (de) 1994-11-09
JPH02299296A (ja) 1990-12-11

Similar Documents

Publication Publication Date Title
DE69024594D1 (de) Verfahren zum Verbinden von Leiterplatten
DE59202991D1 (de) Vorrichtung zum Bestücken von Leiterplatten.
DE59700705D1 (de) Verfahren zum verlöten von elektronischen bauelementen auf einer leiterplatte
DE69410737D1 (de) Vorrichtung und Verfahren zum Löten von elektronischen Baugruppen auf Leiterplatten
DE69120887D1 (de) Verfahren zum Zusammenbau von gedruckten Leiterplatten mit hoher Abwechselung
DE69020696D1 (de) Verfahren zum Montieren eines elektrischen Bauteils auf einer Leiterplatte.
DE69208601D1 (de) Verfahren zur Verbindung von Leiterplatten
DE69017582D1 (de) Zwischenverbindungsvorrichtung für Leiterplatten.
AT380993B (de) Vorrichtung zur befestigung von schaltungselementen an einer leiterplatte fuer gedruckte schaltungen
DE69113679D1 (de) Verfahren und Bauteil zum Montieren von Bauelementen auf einer Leiterplatte.
DE69118301D1 (de) Vorrichtung zur Förderung von Leiterplatten
DE59208656D1 (de) Verfahren zum Beloten und Montieren von Leiterplatten mit Bauelementen
DE3482545D1 (de) Gedruckte schaltungsplatte zur montierung eines elektronischen elementes und herstellungsverfahren dafuer.
DE59009928D1 (de) Verfahren zum Beloten von Leiterplatten.
DE69404082D1 (de) Verfahren zum Montieren eines elektronischen Bauelements auf einer flexiblen Leiterplatte
DE69226937D1 (de) Prüfverfahren für Leiterplatten
DE59708222D1 (de) Leiterplatte und Verfahren zum lagegegenauen Bestücken und Löten von elektronischen Bauelementen auf der Oberfläche der Leiterplatte
DE69114676D1 (de) Vorrichtung und Methode zur Montage von elektronischen Bauelementen auf Leiterplatten.
DE69102788D1 (de) Verpackungen für Leiterplatten und Verfahren zum Herausnehmen der Leiterplatten.
DE69401459D1 (de) Vorrichtung zum Montieren von elektronischen Bauelementen auf Platten
DE69023972D1 (de) Randverbinder für gedruckte Leiterplatten.
DE69314984D1 (de) Verfahren und Vorrichtung zum Austausch von elektronischen Bauelementen auf einer Leiterplatte
DE69011958D1 (de) Verbindungszusammenbau für gedruckte Schaltungskarten.
DE69013976D1 (de) Verfahren zum Montieren von elektronischen Bauteilen auf Leiterplatten.
DE69926162D1 (de) Vorrichtung zum Bestücken von Leiterplatten mit elektronischen Bauteilen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee