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DE69839104D1 - Herstellung von Isolierlacken und diese verwendenden mehrschichtigen gedruckten Leiterplatten - Google Patents

Herstellung von Isolierlacken und diese verwendenden mehrschichtigen gedruckten Leiterplatten

Info

Publication number
DE69839104D1
DE69839104D1 DE69839104T DE69839104T DE69839104D1 DE 69839104 D1 DE69839104 D1 DE 69839104D1 DE 69839104 T DE69839104 T DE 69839104T DE 69839104 T DE69839104 T DE 69839104T DE 69839104 D1 DE69839104 D1 DE 69839104D1
Authority
DE
Germany
Prior art keywords
production
printed circuit
circuit boards
multilayer printed
insulating lacquers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69839104T
Other languages
English (en)
Inventor
Kazuhito Kobayashi
Yasushi Kumashiro
Atsushi Takahashi
Koji Morita
Takahiro Tanabe
Kazunori Yamamoto
Akishi Nakaso
Shigeharu Arike
Kazuhisa Otsuka
Naoyuki Urasaki
Daisuke Fujimoto
Nozomu Takano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP09630097A external-priority patent/JP3838390B2/ja
Priority claimed from JP9630197A external-priority patent/JPH10287833A/ja
Priority claimed from JP9630297A external-priority patent/JPH10287834A/ja
Priority claimed from JP09629997A external-priority patent/JP3804812B2/ja
Priority claimed from JP09629897A external-priority patent/JP3838389B2/ja
Priority claimed from JP27537797A external-priority patent/JP3343330B2/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Application granted granted Critical
Publication of DE69839104D1 publication Critical patent/DE69839104D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0248—Needles or elongated particles; Elongated cluster of chemically bonded particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0358—Resin coated copper [RCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/249942—Fibers are aligned substantially parallel
    • Y10T428/249944—Fiber is precoated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/249942—Fibers are aligned substantially parallel
    • Y10T428/249946—Glass fiber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/24995—Two or more layers
    • Y10T428/249952—At least one thermosetting synthetic polymeric material layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69839104T 1997-04-15 1998-04-14 Herstellung von Isolierlacken und diese verwendenden mehrschichtigen gedruckten Leiterplatten Expired - Lifetime DE69839104D1 (de)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP09630097A JP3838390B2 (ja) 1997-04-15 1997-04-15 絶縁ワニスの製造方法およびこの絶縁ワニスを用いた多層プリント配線板
JP9630197A JPH10287833A (ja) 1997-04-15 1997-04-15 絶縁ワニスの製造方法およびこのワニスを用いた多層プリント配線板
JP9630297A JPH10287834A (ja) 1997-04-15 1997-04-15 絶縁ワニスの製造方法およびこのワニスを用いた多層プリント配線板
JP09629997A JP3804812B2 (ja) 1997-04-15 1997-04-15 絶縁ワニスの製造方法
JP09629897A JP3838389B2 (ja) 1997-04-15 1997-04-15 絶縁材料及びこれを用いた多層プリント配線板
JP16644897 1997-06-24
JP27537797A JP3343330B2 (ja) 1997-06-24 1997-10-08 絶縁ワニスの製造方法及びこの方法によって得られた絶縁ワニス並びにこの絶縁ワニスを用いた多層プリント配線板

Publications (1)

Publication Number Publication Date
DE69839104D1 true DE69839104D1 (de) 2008-03-27

Family

ID=27565577

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69839104T Expired - Lifetime DE69839104D1 (de) 1997-04-15 1998-04-14 Herstellung von Isolierlacken und diese verwendenden mehrschichtigen gedruckten Leiterplatten

Country Status (3)

Country Link
US (1) US6197149B1 (de)
EP (1) EP0873047B1 (de)
DE (1) DE69839104D1 (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6524717B1 (en) * 1999-02-19 2003-02-25 Hitachi Chemical Co., Ltd. Prepreg, metal-clad laminate, and printed circuit board obtained from these
EP1275680B1 (de) * 2000-03-31 2013-07-17 Hitachi Chemical Co., Ltd. Verfahren zur herstellung eines neuen silikonpolymeren, durch dieses verfahren hergestelltes silikonpolymer, wärmehärtende harzzusammensetzung, harzfilm, metallfolie mit isoliermaterial, isolierfilm mit metallfolien auf beiden seiten, metallbeschichtetes laminat, mehrlagig metall- beschichtetes laminat sowie mehrschichtleiterplatte
TW539614B (en) * 2000-06-06 2003-07-01 Matsushita Electric Works Ltd Laminate
KR100851799B1 (ko) * 2000-12-08 2008-08-13 세키스이가가쿠 고교가부시키가이샤 절연 기판용 물질, 인쇄 보드, 적층물, 수지가 있는 구리호일, 구리를 씌운 적층물, 폴리이미드 필름, ｔａｂ 용필름 및 프리프레그
US20040068061A1 (en) * 2001-04-20 2004-04-08 Kohichiro Kawate Thermosetting adhesive film, and an adhesive structure based on the use thereof
JP4259817B2 (ja) * 2002-06-14 2009-04-30 株式会社Ａｄｅｋａ エポキシ樹脂組成物
US7126215B2 (en) 2004-03-30 2006-10-24 Intel Corporation Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
TW200613903A (en) * 2004-05-26 2006-05-01 Showa Denko Kk Photosensitive resin composition, and cured product and use thereof
KR20090108636A (ko) * 2007-02-08 2009-10-15 스미토모 베이클리트 컴퍼니 리미티드 적층체, 적층체를 포함하는 회로 기판, 반도체 패키지 및 적층체의 제조 방법
FR2927233B1 (fr) * 2008-02-08 2011-11-11 Oreal Dispositif pour l'application d'un produit cosmetique, comportant un organe chauffant
EP2479231B1 (de) 2009-02-13 2020-07-08 Avery Dennison Corporation Klebeverbindungen
JP5842664B2 (ja) * 2012-02-23 2016-01-13 日立金属株式会社 熱硬化性接着剤組成物並びにそれを用いた耐熱接着フィルム、積層フィルム、配線フィルム及び多層配線フィルム

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US3476641A (en) 1965-06-01 1969-11-04 Gen Technologies Corp High-strength single crystal whisker paper composites and laminates
JPS5080364A (de) 1973-11-21 1975-06-30
JPS52120205A (en) 1976-04-03 1977-10-08 Setsuo Yamamoto Process for production of whiskerrreinforced composite material
JPS5445345A (en) * 1977-09-16 1979-04-10 Dainichi Nippon Cables Ltd Coating for insulating electric wire
FR2527593B1 (fr) 1982-05-28 1986-05-02 Lorraine Carbone Structures en graphite impregne renforce et procede d'obtention
JPS6060134A (ja) 1983-09-12 1985-04-06 Daiwa Seiko Inc プリプレグシ−トの製造法
JPS6149824A (ja) 1984-08-16 1986-03-11 Tokai Carbon Co Ltd ＳｉＣウイスカ−強化樹脂シ−トの連続製造法
US4839232A (en) 1985-10-31 1989-06-13 Mitsui Toatsu Chemicals, Incorporated Flexible laminate printed-circuit board and methods of making same
US4888247A (en) 1986-08-27 1989-12-19 General Electric Company Low-thermal-expansion, heat conducting laminates having layers of metal and reinforced polymer matrix composite
JPS63166715A (ja) * 1986-12-26 1988-07-09 Mitsubishi Mining & Cement Co Ltd マグネシアウィスカ−の製造方法
US4992325A (en) 1987-12-15 1991-02-12 The Dexter Corporation Inorganic whisker containing impact enhanced prepregs and formulations formulations
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US4956316A (en) * 1988-04-25 1990-09-11 Hoechst Celanese Corp. Process for dispersing silicon carbide whiskers
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Also Published As

Publication number Publication date
EP0873047B1 (de) 2008-02-13
US6197149B1 (en) 2001-03-06
EP0873047A2 (de) 1998-10-21
EP0873047A3 (de) 1999-11-24

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Legal Events

Date Code Title Description
8332 No legal effect for de