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DE69832110D1 - Herstellungsverfahren für eine Prüfnadel für Halbleitergeräte - Google Patents

Herstellungsverfahren für eine Prüfnadel für Halbleitergeräte

Info

Publication number
DE69832110D1
DE69832110D1 DE69832110T DE69832110T DE69832110D1 DE 69832110 D1 DE69832110 D1 DE 69832110D1 DE 69832110 T DE69832110 T DE 69832110T DE 69832110 T DE69832110 T DE 69832110T DE 69832110 D1 DE69832110 D1 DE 69832110D1
Authority
DE
Germany
Prior art keywords
probe
manufacturing
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69832110T
Other languages
English (en)
Other versions
DE69832110T2 (de
Inventor
Shigeki Maekawa
Mogumi Takemoto
Kazunobu Miki
Mutsumi Kano
Takahiro Nagata
Yoshihiro Kashiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP03842998A external-priority patent/JP3238659B2/ja
Priority claimed from JP03843098A external-priority patent/JP3279246B2/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE69832110D1 publication Critical patent/DE69832110D1/de
Application granted granted Critical
Publication of DE69832110T2 publication Critical patent/DE69832110T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE69832110T 1997-07-24 1998-07-23 Herstellungsverfahren für eine Prüfnadel für Halbleitergeräte Expired - Lifetime DE69832110T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP19853497 1997-07-24
JP19853497 1997-07-24
JP24849397 1997-09-12
JP24849397 1997-09-12
JP3842998 1998-02-20
JP3843098 1998-02-20
JP03842998A JP3238659B2 (ja) 1997-07-24 1998-02-20 プローブ先端付着異物の除去部材および除去部材の製造方法
JP03843098A JP3279246B2 (ja) 1997-09-12 1998-02-20 半導体装置のテスト用プローブ針とその製造方法、このプローブ針を用いたプローブ装置、このプローブ針による半導体装置のテスト方法、およびこのプローブ針によりテストされた半導体装置

Publications (2)

Publication Number Publication Date
DE69832110D1 true DE69832110D1 (de) 2005-12-01
DE69832110T2 DE69832110T2 (de) 2006-07-20

Family

ID=27460602

Family Applications (3)

Application Number Title Priority Date Filing Date
DE69832110T Expired - Lifetime DE69832110T2 (de) 1997-07-24 1998-07-23 Herstellungsverfahren für eine Prüfnadel für Halbleitergeräte
DE69832010T Expired - Lifetime DE69832010T2 (de) 1997-07-24 1998-07-23 Prüfspitze für Halbleiterschaltungen und Verfahren zu ihrer Herstellung
DE69837690T Expired - Lifetime DE69837690T2 (de) 1997-07-24 1998-07-23 Gerät zur Entfernung von an einer Prüfspitzenendfläche haftenden Fremdstoffen

Family Applications After (2)

Application Number Title Priority Date Filing Date
DE69832010T Expired - Lifetime DE69832010T2 (de) 1997-07-24 1998-07-23 Prüfspitze für Halbleiterschaltungen und Verfahren zu ihrer Herstellung
DE69837690T Expired - Lifetime DE69837690T2 (de) 1997-07-24 1998-07-23 Gerät zur Entfernung von an einer Prüfspitzenendfläche haftenden Fremdstoffen

Country Status (6)

Country Link
US (2) US6646455B2 (de)
EP (3) EP1621893B1 (de)
KR (1) KR100276422B1 (de)
CN (1) CN1166957C (de)
DE (3) DE69832110T2 (de)
TW (1) TW373074B (de)

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JP3279294B2 (ja) * 1998-08-31 2002-04-30 三菱電機株式会社 半導体装置のテスト方法、半導体装置のテスト用プローブ針とその製造方法およびそのプローブ針を備えたプローブカード
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US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
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JP5378411B2 (ja) * 2008-01-10 2013-12-25 エシコン・インコーポレイテッド タングステン合金縫合針
JP5498173B2 (ja) 2008-02-06 2014-05-21 株式会社東芝 プローブ針およびその製造方法
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US8371316B2 (en) 2009-12-03 2013-02-12 International Test Solutions, Inc. Apparatuses, device, and methods for cleaning tester interface contact elements and support hardware
US8484795B2 (en) 2010-08-11 2013-07-16 Seagate Technology Llc Collecting debris from a tool
EP2524648B1 (de) * 2011-05-20 2016-05-04 Imec Verfahren zur schärfung von mikrosondenspitzen
JP2013101043A (ja) * 2011-11-08 2013-05-23 Renesas Electronics Corp 半導体装置の製造方法
JP5452640B2 (ja) * 2012-02-07 2014-03-26 シャープ株式会社 半導体試験装置
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
CN104251935B (zh) * 2013-06-26 2018-03-06 中芯国际集成电路制造(上海)有限公司 测量晶圆电阻率的装置及方法
DE102013010934A1 (de) * 2013-06-29 2015-01-15 Feinmetall Gmbh Prüfvorrichtung zur elektrischen Prüfung eines elektrischen Prüflings
JP6525620B2 (ja) * 2015-02-05 2019-06-05 キヤノン株式会社 液体吐出ヘッド用基板の製造方法
CN105092908B (zh) * 2015-06-04 2017-11-14 合肥京东方光电科技有限公司 一种测试探针和测试装置
JP6407128B2 (ja) * 2015-11-18 2018-10-17 三菱電機株式会社 半導体装置の評価装置および半導体装置の評価方法
US9935024B2 (en) 2016-04-28 2018-04-03 Taiwan Semiconductor Manufacturing Co., Ltd. Method for forming semiconductor structure
US9825000B1 (en) 2017-04-24 2017-11-21 International Test Solutions, Inc. Semiconductor wire bonding machine cleaning device and method
KR20200135363A (ko) 2018-02-23 2020-12-02 인터내셔널 테스트 솔루션즈, 인코포레이티드 플렉시블 전자 웹 롤을 자동으로 청소하기 위한 신규 재료 및 하드웨어
US11756811B2 (en) 2019-07-02 2023-09-12 International Test Solutions, Llc Pick and place machine cleaning system and method
US10792713B1 (en) 2019-07-02 2020-10-06 International Test Solutions, Inc. Pick and place machine cleaning system and method
US11211242B2 (en) 2019-11-14 2021-12-28 International Test Solutions, Llc System and method for cleaning contact elements and support hardware using functionalized surface microfeatures
US11318550B2 (en) 2019-11-14 2022-05-03 International Test Solutions, Llc System and method for cleaning wire bonding machines using functionalized surface microfeatures
US11035898B1 (en) 2020-05-11 2021-06-15 International Test Solutions, Inc. Device and method for thermal stabilization of probe elements using a heat conducting wafer
JP7497629B2 (ja) * 2020-07-03 2024-06-11 富士電機株式会社 半導体チップの試験装置および試験方法
CN114414862B (zh) * 2020-11-28 2023-03-14 法特迪精密科技（苏州）有限公司 测试探针清洁方法的粘性吸附方法
CN113009324B (zh) * 2021-05-24 2021-08-03 中国电子科技集团公司第二十九研究所 一种曲面多探针测试治具
KR102409029B1 (ko) * 2022-04-12 2022-06-14 이시훈 프로브 핀

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Also Published As

Publication number Publication date
EP1351060A2 (de) 2003-10-08
KR100276422B1 (ko) 2001-01-15
KR19990014174A (ko) 1999-02-25
EP1351060A3 (de) 2004-02-04
EP0893695A3 (de) 2000-12-06
EP0893695B1 (de) 2005-10-26
US6646455B2 (en) 2003-11-11
DE69837690T2 (de) 2007-12-27
US6888344B2 (en) 2005-05-03
EP1351060B1 (de) 2005-10-26
CN1166957C (zh) 2004-09-15
DE69832010D1 (de) 2005-12-01
TW373074B (en) 1999-11-01
EP1621893A1 (de) 2006-02-01
EP0893695A2 (de) 1999-01-27
US20020097060A1 (en) 2002-07-25
DE69832010T2 (de) 2006-07-13
DE69832110T2 (de) 2006-07-20
US20030090280A1 (en) 2003-05-15
CN1213083A (zh) 1999-04-07
DE69837690D1 (de) 2007-06-06
EP1621893B1 (de) 2007-04-25

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