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DE69432624D1 - Koppelungsstruktur zwischen einem Niedertemperatur- und einem Raumtemperatur-Schaltkreis - Google Patents

Koppelungsstruktur zwischen einem Niedertemperatur- und einem Raumtemperatur-Schaltkreis

Info

Publication number
DE69432624D1
DE69432624D1 DE69432624T DE69432624T DE69432624D1 DE 69432624 D1 DE69432624 D1 DE 69432624D1 DE 69432624 T DE69432624 T DE 69432624T DE 69432624 T DE69432624 T DE 69432624T DE 69432624 D1 DE69432624 D1 DE 69432624D1
Authority
DE
Germany
Prior art keywords
coupling structure
room temperature
low temperature
circuit
temperature circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69432624T
Other languages
English (en)
Other versions
DE69432624T2 (de
Inventor
Hitoki Tokuda
Michitomo Iiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Application granted granted Critical
Publication of DE69432624D1 publication Critical patent/DE69432624D1/de
Publication of DE69432624T2 publication Critical patent/DE69432624T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H01L23/445—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air the fluid being a liquefied gas, e.g. in a cryogenic vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Containers, Films, And Cooling For Superconductive Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Superconductor Devices And Manufacturing Methods Thereof (AREA)
DE69432624T 1993-10-22 1994-10-21 Koppelungsstruktur zwischen einem Niedertemperatur- und einem Raumtemperatur-Schaltkreis Expired - Lifetime DE69432624T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP28741893 1993-10-22
JP5287418A JP2953273B2 (ja) 1993-10-22 1993-10-22 低温に冷却する素子の接続方法

Publications (2)

Publication Number Publication Date
DE69432624D1 true DE69432624D1 (de) 2003-06-12
DE69432624T2 DE69432624T2 (de) 2004-01-22

Family

ID=17717078

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69432624T Expired - Lifetime DE69432624T2 (de) 1993-10-22 1994-10-21 Koppelungsstruktur zwischen einem Niedertemperatur- und einem Raumtemperatur-Schaltkreis

Country Status (4)

Country Link
US (1) US5977479A (de)
EP (1) EP0650192B1 (de)
JP (1) JP2953273B2 (de)
DE (1) DE69432624T2 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2326029A (en) 1997-06-03 1998-12-09 Marconi Gec Ltd Cryogenic electronic assembly with stripline connection and adjustment means
US6586835B1 (en) * 1998-08-31 2003-07-01 Micron Technology, Inc. Compact system module with built-in thermoelectric cooling
JP4056348B2 (ja) * 2002-10-07 2008-03-05 株式会社ルネサステクノロジ 集積回路チップモジュールおよび携帯電話機
JP4278617B2 (ja) * 2002-11-12 2009-06-17 富士通株式会社 実装構造及び電子装置
US20130258595A1 (en) * 2012-03-27 2013-10-03 Microsoft Corporation Heat Transfer For Superconducting Integrated Circuits At Millikelvin Temperatures
RU2650183C2 (ru) * 2013-08-07 2018-04-11 АББ С.п.А. Охлаждающее устройство для электрического устройства и электрическое устройство, в частности автоматический выключатель, содержащий такое охлаждающее устройство
US10509448B2 (en) * 2015-09-24 2019-12-17 Rambus Inc. Thermal clamp for cyrogenic digital systems
AU2017430443C1 (en) 2017-09-07 2021-05-06 Google Llc Flexible wiring for low temperature applications
US10891251B2 (en) * 2018-11-09 2021-01-12 International Business Machines Corporation Signal connector for microwave circuits
US11551125B2 (en) 2019-02-21 2023-01-10 International Business Machines Corporation High density microwave hermetic interconnects for quantum applications
JP7095136B2 (ja) * 2021-03-09 2022-07-04 グーグル エルエルシー 低温用途のためのフレキシブル配線

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60229353A (ja) * 1984-04-27 1985-11-14 Hitachi Ltd 熱伝達装置
US4739633A (en) * 1985-11-12 1988-04-26 Hypres, Inc. Room temperature to cryogenic electrical interface
EP0288022B1 (de) * 1987-04-22 1995-11-15 Sharp Kabushiki Kaisha Supraleitfähiges Gerät
US4805420A (en) * 1987-06-22 1989-02-21 Ncr Corporation Cryogenic vessel for cooling electronic components
US4950181A (en) * 1988-07-28 1990-08-21 Ncr Corporation Refrigerated plug-in module
JPH0242720A (ja) * 1988-08-01 1990-02-13 Matsushita Electric Ind Co Ltd 冷却装置
JP2681288B2 (ja) * 1988-11-02 1997-11-26 富士通株式会社 超伝導素子用パッケージ
US5028988A (en) * 1989-12-27 1991-07-02 Ncr Corporation Method and apparatus for low temperature integrated circuit chip testing and operation
FR2661775B1 (fr) * 1990-05-04 1994-03-04 Telemecanique Contacteur-disjoncteur.
EP0464498A3 (en) * 1990-06-22 1992-03-04 Kabushiki Kaisha Toshiba Current lead
US5075555A (en) * 1990-08-10 1991-12-24 Kevex Instruments Peltier cooled lithium-drifted silicon x-ray spectrometer

Also Published As

Publication number Publication date
JP2953273B2 (ja) 1999-09-27
EP0650192A3 (de) 1996-11-13
EP0650192A2 (de) 1995-04-26
DE69432624T2 (de) 2004-01-22
JPH07122788A (ja) 1995-05-12
EP0650192B1 (de) 2003-05-07
US5977479A (en) 1999-11-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition