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DE634699T1 - Gruppiertes fotolithografisches System. - Google Patents

Gruppiertes fotolithografisches System.

Info

Publication number
DE634699T1
DE634699T1 DE0634699T DE94201723T DE634699T1 DE 634699 T1 DE634699 T1 DE 634699T1 DE 0634699 T DE0634699 T DE 0634699T DE 94201723 T DE94201723 T DE 94201723T DE 634699 T1 DE634699 T1 DE 634699T1
Authority
DE
Germany
Prior art keywords
unit
substrate
robot
spin coating
fixed axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE0634699T
Other languages
English (en)
Inventor
Michael R Biche
Michael L Parodi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Systems Inc
Original Assignee
Semiconductor Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Systems Inc filed Critical Semiconductor Systems Inc
Publication of DE634699T1 publication Critical patent/DE634699T1/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67225—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one lithography chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Coating Apparatus (AREA)

Claims (10)

Deutschsprachige Übersetzung der Patentansprüche der Europäischen Patentanmeldung Nr. 94 201 723.7 des Europäischen Patents Nr. 0 634 699 Patentansprüche
1. Photolithographie-System, mit:
zumindest einer Schleuderbeschichtungseinheit; zumindest einer Brenneinheit; und
zumindest einem um eine feststehende Achse schwenkbaren Substratgreifroboter, der ein Substrat zu der zumindest einen Schleuderbeschichtungseinheit und der zumindest einen Brenneinheit fördern und von diesen zurückfördern kann.
2. System nach Anspruch 1, wobei der zumindest eine Roboter drei Freiheitsgrade hat.
3. System nach Anspruch 1, wobei der zumindest eine Roboter einen Doppel-End-Effektor hat.
4. System nach Anspruch 1, ferner mit zumindest einer Entwicklungseinheit.
5. System nach Anspruch 1, mit zumindest einer Substratkühleinrichtung.
6. System nach Anspruch I7 mit einer Heiz-/Kühleinheit, wobei die Heiz-/Kühleinheit eine Vielzahl von gestapelten Modulen hat.
7. System nach Anspruch 6, wobei jedes der gestapelten Module einen Ofen und eine Kühlplatte hat.
8. System nach Anspruch 1, mit zumindest einer Substratkassetten-Eingabe-ZAusgabeeinheit.
9. Photolithographie-System, mit:
zumindest einer Entwicklungseinheit; zumindest einer Brenneinheit; und
zumindest einem um eine feststehende Achse schwenkbaren Substratgreifroboter, der ein Substrat zu der zumindest einen Schleuderbeschichtungseinheit und der zumindest einen Brenneinheit fördern und von diesen zurückfördern kann.
10. Verfahren zur Übermittlung eines Substrates von einer Schleuderbeschichtungsmaschine zu einer Brenneinheit, wobei das Verfahren die folgenden Schritte aufweist:
Vorsehen eines Roboters, wobei der Roboter um eine feststehende Achse drehbar ist und einen Arm zum Heben und Senken eines Substrates hat;
Zurückfördern eines Substrates von der Schleuderbeschichtungsmaschine mit Hilfe des Roboters; Drehen des Roboters um die feststehende Achse; und
Anordnen des Substrates in der Brenneinheit mit Hilfe des Roboters.
DE0634699T 1993-07-16 1994-06-15 Gruppiertes fotolithografisches System. Pending DE634699T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US9350593A 1993-07-16 1993-07-16

Publications (1)

Publication Number Publication Date
DE634699T1 true DE634699T1 (de) 1996-02-15

Family

ID=22239332

Family Applications (1)

Application Number Title Priority Date Filing Date
DE0634699T Pending DE634699T1 (de) 1993-07-16 1994-06-15 Gruppiertes fotolithografisches System.

Country Status (5)

Country Link
US (1) US5651823A (de)
EP (1) EP0634699A1 (de)
JP (1) JPH07169678A (de)
KR (1) KR950004376A (de)
DE (1) DE634699T1 (de)

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5826129A (en) * 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
US5993081A (en) * 1995-10-24 1999-11-30 Canon Kabushiki Kaisha In-line processing system
US6062798A (en) * 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
US5779799A (en) * 1996-06-21 1998-07-14 Micron Technology, Inc. Substrate coating apparatus
EP0819981B1 (de) * 1996-07-18 2002-06-05 JSR Corporation Strahlungsempfindliche Harzzusammensetzung
JP3779393B2 (ja) * 1996-09-06 2006-05-24 東京エレクトロン株式会社 処理システム
JP3566475B2 (ja) * 1996-12-03 2004-09-15 東京エレクトロン株式会社 処理装置
GB2320135A (en) * 1996-12-04 1998-06-10 Smiths Industries Plc Semiconductor wafer processing apparatus
JP3926890B2 (ja) * 1997-06-11 2007-06-06 東京エレクトロン株式会社 処理システム
DE19725866C1 (de) * 1997-06-18 1999-04-22 Ivoclar Ag Brennofen
WO1999040615A1 (en) 1998-02-04 1999-08-12 Semitool, Inc. Method and apparatus for low-temperature annealing of metallization micro-structures in the production of a microelectronic device
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US6079927A (en) * 1998-04-22 2000-06-27 Varian Semiconductor Equipment Associates, Inc. Automated wafer buffer for use with wafer processing equipment
US6178361B1 (en) * 1998-11-20 2001-01-23 Karl Suss America, Inc. Automatic modular wafer substrate handling device
US6616394B1 (en) 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
US6075334A (en) * 1999-03-15 2000-06-13 Berkeley Process Control, Inc Automatic calibration system for wafer transfer robot
US6454512B1 (en) 1999-03-18 2002-09-24 Pri Automation, Inc. Person-guided vehicle
TW451274B (en) * 1999-06-11 2001-08-21 Tokyo Electron Ltd Substrate processing apparatus
US6402400B1 (en) * 1999-10-06 2002-06-11 Tokyo Electron Limited Substrate processing apparatus
US6443359B1 (en) * 1999-12-03 2002-09-03 Diebold, Incorporated Automated transaction system and method
US6402508B2 (en) * 1999-12-09 2002-06-11 Tokyo Electron Limited Heat and cooling treatment apparatus and substrate processing system
SG185822A1 (en) * 2000-02-01 2012-12-28 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
US6471913B1 (en) 2000-02-09 2002-10-29 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece including an apparatus and method for executing a processing step at an elevated temperature
US6780374B2 (en) 2000-12-08 2004-08-24 Semitool, Inc. Method and apparatus for processing a microelectronic workpiece at an elevated temperature
US6544338B1 (en) * 2000-02-10 2003-04-08 Novellus Systems, Inc. Inverted hot plate cure module
EP1124252A2 (de) * 2000-02-10 2001-08-16 Applied Materials, Inc. Verfahren und Vorrichtung zur Verarbeitung von Substraten
AU2001271904A1 (en) 2000-07-10 2002-02-05 Temptronic Corporation Wafer chuck having with interleaved heating and cooling elements
AU2002213345A1 (en) * 2000-10-13 2002-04-22 Irm, Llc High throughput processing system and method of using
US6754975B2 (en) 2001-01-16 2004-06-29 Taiwan Semiconductor Manufacturing Co., Ltd Microelectronic substrate retainer apparatus providing reduced microelectronic substrate damage
US6529686B2 (en) 2001-06-06 2003-03-04 Fsi International, Inc. Heating member for combination heating and chilling apparatus, and methods
JP2005501180A (ja) * 2001-08-31 2005-01-13 セミトゥール・インコーポレイテッド 超小型電子ワークピースの電気化学処理のための装置及び方法
US6515261B1 (en) 2002-03-06 2003-02-04 Applied Materials, Inc. Enhanced lift pin
JP4274736B2 (ja) 2002-03-28 2009-06-10 大日本スクリーン製造株式会社 基板処理装置
JP4342147B2 (ja) * 2002-05-01 2009-10-14 大日本スクリーン製造株式会社 基板処理装置
KR100490175B1 (ko) * 2002-07-04 2005-05-17 주성엔지니어링(주) 반도체 제조장치의 컨트롤러 모듈
JP4233285B2 (ja) * 2002-08-23 2009-03-04 大日本スクリーン製造株式会社 基板処理装置
US6817821B2 (en) * 2002-10-21 2004-11-16 Robert D. Henderson Wafer handling for a reflow tool
US7384484B2 (en) * 2002-11-18 2008-06-10 Dainippon Screen Mfg. Co., Ltd. Substrate processing method, substrate processing apparatus and substrate processing system
US6939403B2 (en) * 2002-11-19 2005-09-06 Blue29, Llc Spatially-arranged chemical processing station
TWI220052B (en) * 2002-11-25 2004-08-01 Au Optronics Corp Plasma display panel having shared data electrodes
US7274429B2 (en) * 2003-12-10 2007-09-25 Asml Netherlands B.V. Integrated lithographic fabrication cluster
DE102004019732A1 (de) * 2004-04-20 2005-11-17 Sse Sister Semiconductor Equipment Gmbh Vorrichtung und Verfahren für die Bearbeitung eines Substrats in der Halbleitertechnik sowie System, das eine Vorrichtung für die Bearbeitung eines Substrats umfasst
JP4343151B2 (ja) * 2004-08-11 2009-10-14 東京エレクトロン株式会社 加熱プレートの温度測定方法、基板処理装置及び加熱プレートの温度測定用のコンピュータプログラム
US7288746B2 (en) * 2004-12-22 2007-10-30 Sokudo Co., Ltd. Integrated thermal unit having laterally adjacent bake and chill plates on different planes
US7601934B2 (en) * 2004-12-22 2009-10-13 Sokudo Co., Ltd. Integrated thermal unit having a shuttle with a temperature controlled surface
US7297906B2 (en) * 2004-12-22 2007-11-20 Sokudo Co., Ltd. Integrated thermal unit having a shuttle with two-axis movement
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7282675B2 (en) * 2004-12-22 2007-10-16 Sokudo Co., Ltd. Integrated thermal unit having a shuttle with a temperature controlled surface
WO2006069256A2 (en) * 2004-12-22 2006-06-29 Sokudo Co., Ltd. Integrated thermal unit
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7741585B2 (en) * 2004-12-22 2010-06-22 Sokudo Co., Ltd. Integrated thermal unit having a shuttle with two-axis movement
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
KR100637717B1 (ko) * 2005-09-28 2006-10-25 세메스 주식회사 베이크 유닛, 상기 베이크 유닛에 사용되는 가열플레이트를 냉각하는 방법, 그리고 상기 베이크 유닛을포함하는 기판 처리 장치 및 방법
US20080028360A1 (en) * 2006-07-31 2008-01-31 Picciotto Carl E Methods and systems for performing lithography, methods for aligning objects relative to one another, and nanoimprinting molds having non-marking alignment features
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
US20080203083A1 (en) * 2007-02-28 2008-08-28 Wirth Paul Z Single wafer anneal processor
JP5006122B2 (ja) 2007-06-29 2012-08-22 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4505006B2 (ja) * 2007-09-28 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JP4505005B2 (ja) * 2007-09-28 2010-07-14 大日本スクリーン製造株式会社 基板処理装置
JP4499147B2 (ja) * 2007-11-21 2010-07-07 大日本スクリーン製造株式会社 基板処理装置
JP5128918B2 (ja) * 2007-11-30 2013-01-23 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP4617349B2 (ja) * 2007-12-27 2011-01-26 大日本スクリーン製造株式会社 基板処理装置
JP5001828B2 (ja) 2007-12-28 2012-08-15 株式会社Ｓｏｋｕｄｏ 基板処理装置
JP5179170B2 (ja) 2007-12-28 2013-04-10 株式会社Ｓｏｋｕｄｏ 基板処理装置
US7798487B2 (en) * 2008-06-27 2010-09-21 Eastman Kodak Company Print plate handling system
JP5306908B2 (ja) * 2009-06-03 2013-10-02 東京エレクトロン株式会社 搬送モジュール
US8847122B2 (en) * 2009-06-08 2014-09-30 Macronix International Co., Ltd. Method and apparatus for transferring substrate
US9176397B2 (en) * 2011-04-28 2015-11-03 Mapper Lithography Ip B.V. Apparatus for transferring a substrate in a lithography system
US8703581B2 (en) * 2011-06-15 2014-04-22 Applied Materials, Inc. Water soluble mask for substrate dicing by laser and plasma etch
CN102402133B (zh) * 2011-11-12 2013-09-18 哈尔滨工业大学 基于并联机构的双工件台同相位回转交换方法与装置
CN103199032A (zh) * 2012-01-04 2013-07-10 沈阳芯源微电子设备有限公司 一种集束式结构的涂胶显影设备
US9281251B2 (en) * 2013-08-09 2016-03-08 Tokyo Electron Limited Substrate backside texturing
CN105789085B (zh) * 2014-12-24 2018-08-14 上海微电子装备（集团）股份有限公司 一种兼容多种工艺硅片的物料传输系统

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US762888A (en) * 1904-01-15 1904-06-21 Augustin Decker Label-cabinet.
US2165122A (en) * 1938-02-08 1939-07-04 Ray S Ashbery Cabinet
FR922144A (fr) * 1945-12-17 1947-05-30 Dispositif pour le classement de fiches rectangulaires
US3854605A (en) * 1974-02-25 1974-12-17 Ibm Article conveying
GB1590089A (en) * 1977-10-20 1981-05-28 Tool Production & Design Co Lt Workpiece feed mechanism
NL8201532A (nl) * 1982-04-13 1983-11-01 Philips Nv Werkwijze en inrichting voor het controleren van de aanwezigheid respectievelijk afwezigheid van een voorwerp op het uiteinde van een vacuuem-opnemer.
AU548550B2 (en) * 1983-03-01 1985-12-19 Dart Industries Inc. Extensible workpiece manipulator
US4971515A (en) * 1985-06-03 1990-11-20 Roberts Corporation Apparatus for moving individual sheets from a stack of sheets
US4786569A (en) * 1985-09-04 1988-11-22 Ciba-Geigy Corporation Adhesively bonded photostructurable polyimide film
JPS636857A (ja) * 1986-06-26 1988-01-12 Fujitsu Ltd ウエ−ハ移し替え装置
US4808059A (en) * 1986-07-15 1989-02-28 Peak Systems, Inc. Apparatus and method for transferring workpieces
FR2605834B1 (fr) * 1986-11-05 1989-01-06 Pellenc & Motte Machine robotisee, notamment pour la recolte de fruits
US4842683A (en) * 1986-12-19 1989-06-27 Applied Materials, Inc. Magnetic field-enhanced plasma etch reactor
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5193972A (en) * 1987-02-09 1993-03-16 Svg Lithography Systems, Inc. Wafer handling system
KR970003907B1 (ko) * 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5061144A (en) * 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
EP0408216A3 (en) * 1989-07-11 1991-09-18 Hitachi, Ltd. Method for processing wafers and producing semiconductor devices and apparatus for producing the same
JP2905857B2 (ja) * 1989-08-11 1999-06-14 東京エレクトロン株式会社 縦型処理装置
US5079854A (en) * 1989-12-27 1992-01-14 Xerox Corporation Method and apparatus for cleaning, coating and curing receptor substrates in an enclosed planetary array
CA2017719C (en) * 1990-05-29 1999-01-19 Zarlink Semiconductor Inc. Moisture-free sog process
JP2704309B2 (ja) * 1990-06-12 1998-01-26 大日本スクリーン製造株式会社 基板処理装置及び基板の熱処理方法
JPH0810686B2 (ja) * 1990-09-14 1996-01-31 株式会社東芝 半導体基板エッチング処理装置
US5180276A (en) * 1991-04-18 1993-01-19 Brooks Automation, Inc. Articulated arm transfer device
US5171393A (en) * 1991-07-29 1992-12-15 Moffat William A Wafer processing apparatus
JP2867194B2 (ja) * 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法

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Publication number Publication date
EP0634699A1 (de) 1995-01-18
JPH07169678A (ja) 1995-07-04
KR950004376A (ko) 1995-02-17
US5651823A (en) 1997-07-29

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