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DE602008000734D1 - Vorrichtung und Verfahren zum Abscheiden einer Schutzschicht - Google Patents

Vorrichtung und Verfahren zum Abscheiden einer Schutzschicht

Info

Publication number
DE602008000734D1
DE602008000734D1 DE602008000734T DE602008000734T DE602008000734D1 DE 602008000734 D1 DE602008000734 D1 DE 602008000734D1 DE 602008000734 T DE602008000734 T DE 602008000734T DE 602008000734 T DE602008000734 T DE 602008000734T DE 602008000734 D1 DE602008000734 D1 DE 602008000734D1
Authority
DE
Germany
Prior art keywords
depositing
protective layer
protective
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008000734T
Other languages
English (en)
Inventor
Yong-Sup Choi
Jin-Pil Kim
Kang-Il Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung SDI Co Ltd
Original Assignee
Samsung SDI Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung SDI Co Ltd filed Critical Samsung SDI Co Ltd
Publication of DE602008000734D1 publication Critical patent/DE602008000734D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/20—Manufacture of screens on or from which an image or pattern is formed, picked up, converted or stored; Applying coatings to the vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/34—Vessels, containers or parts thereof, e.g. substrates
    • H01J11/40—Layers for protecting or enhancing the electron emission, e.g. MgO layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Physical Vapour Deposition (AREA)
DE602008000734T 2007-03-22 2008-03-19 Vorrichtung und Verfahren zum Abscheiden einer Schutzschicht Active DE602008000734D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070028236A KR100927621B1 (ko) 2007-03-22 2007-03-22 보호막층을 증착시키는 장치와, 이를 이용한 증착 방법

Publications (1)

Publication Number Publication Date
DE602008000734D1 true DE602008000734D1 (de) 2010-04-15

Family

ID=39616509

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008000734T Active DE602008000734D1 (de) 2007-03-22 2008-03-19 Vorrichtung und Verfahren zum Abscheiden einer Schutzschicht

Country Status (6)

Country Link
US (1) US20080233283A1 (de)
EP (1) EP1973145B1 (de)
JP (1) JP4842988B2 (de)
KR (1) KR100927621B1 (de)
DE (1) DE602008000734D1 (de)
TW (1) TW200847217A (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7666766B2 (en) * 2005-09-27 2010-02-23 Semiconductor Energy Laboratory Co., Ltd. Film formation apparatus, method for forming film, and method for manufacturing photoelectric conversion device
JP5330721B2 (ja) * 2007-10-23 2013-10-30 オルボテック エルティ ソラー，エルエルシー 処理装置および処理方法
KR101048297B1 (ko) * 2009-06-01 2011-07-13 주식회사 테스 인라인 기판 처리시스템 및 공정챔버
US8749053B2 (en) 2009-06-23 2014-06-10 Intevac, Inc. Plasma grid implant system for use in solar cell fabrications
KR101598798B1 (ko) * 2009-09-01 2016-03-02 주식회사 테스 태양전지 열처리 장치
TWI417984B (zh) * 2009-12-10 2013-12-01 Orbotech Lt Solar Llc 自動排序之多方向性直線型處理裝置
DE102010008233A1 (de) * 2010-02-11 2011-08-11 Schmid Technology GmbH, 68723 Vorrichtung und Verfahren zum Transport von Substraten
JP5730322B2 (ja) * 2010-10-19 2015-06-10 株式会社アルバック 蒸着装置及び蒸着方法
US8459276B2 (en) 2011-05-24 2013-06-11 Orbotech LT Solar, LLC. Broken wafer recovery system
DE102011080202A1 (de) 2011-08-01 2013-02-07 Gebr. Schmid Gmbh Vorrichtung und Verfahren zur Herstellung von dünnen Schichten
KR20140110851A (ko) 2011-11-08 2014-09-17 인테벡, 인코포레이티드 기판 프로세싱 시스템 및 방법
US20150295124A1 (en) * 2012-04-02 2015-10-15 Koji Matsumaru Manufacturing equipment for photovoltaic devices and methods
US9318332B2 (en) 2012-12-19 2016-04-19 Intevac, Inc. Grid for plasma ion implant
KR102098741B1 (ko) 2013-05-27 2020-04-09 삼성디스플레이 주식회사 증착용 기판 이동부, 이를 포함하는 유기층 증착 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
KR102260366B1 (ko) * 2014-05-19 2021-06-03 주식회사 선익시스템 박막 증착 인라인 시스템
CN108368605B (zh) * 2015-12-17 2020-06-19 株式会社爱发科 真空处理装置
WO2017111374A1 (ko) * 2015-12-24 2017-06-29 (주) 에스엔텍 풋 프린트를 줄일 수 있는 인터백 타입의 증착 시스템
JP6336231B1 (ja) * 2016-11-02 2018-06-06 株式会社アルバック 真空処理装置
WO2019052669A1 (en) * 2017-09-18 2019-03-21 Applied Materials, Inc. SYSTEM AND METHOD FOR VACUUM PROCESSING
JP6654741B1 (ja) * 2019-01-08 2020-02-26 株式会社アルバック 真空処理装置
CN114503248B (zh) * 2019-10-07 2023-01-06 平克有限公司热系统 用于连接电子组件的系统和方法
WO2024224139A1 (en) * 2023-04-26 2024-10-31 Applied Materials, Inc. Vacuum deposition system and methods of depositing a stack of layers on a substrate

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4094269A (en) * 1974-06-14 1978-06-13 Zlafop Pri Ban Vapor deposition apparatus for coating continuously moving substrates with layers of volatizable solid substances
JPS61105853A (ja) * 1984-10-30 1986-05-23 Anelva Corp オ−トロ−ダ−
WO2000068118A1 (fr) * 1999-05-06 2000-11-16 Tokyo Electron Limited Systeme de transfert pour substrat de verre d'affichage a cristaux liquides
JP2001043530A (ja) * 1999-07-28 2001-02-16 Anelva Corp 情報記録ディスク用保護膜作成方法及び情報記録ディスク用薄膜作成装置
JP4704605B2 (ja) * 2001-05-23 2011-06-15 淳二 城戸 連続蒸着装置、蒸着装置及び蒸着方法
JP4452029B2 (ja) * 2003-03-24 2010-04-21 株式会社アルバック 酸化マグネシウム被膜の形成方法及び大気リターン型のインライン式真空蒸着装置
KR100501044B1 (ko) * 2003-07-08 2005-07-18 한국전기연구원 대면적 산화마그네슘 박막 증착장치 및 방법
JP4417734B2 (ja) * 2004-01-20 2010-02-17 株式会社アルバック インライン式真空処理装置
JP4613092B2 (ja) 2005-05-02 2011-01-12 株式会社アルバック 成膜装置
JP5014603B2 (ja) * 2005-07-29 2012-08-29 株式会社アルバック 真空処理装置
KR100780041B1 (ko) * 2006-03-06 2007-11-27 (주) 디오브이 유기전계 발광소자 챔버 게이트 개폐장치

Also Published As

Publication number Publication date
JP4842988B2 (ja) 2011-12-21
JP2008231575A (ja) 2008-10-02
US20080233283A1 (en) 2008-09-25
KR20080086261A (ko) 2008-09-25
TW200847217A (en) 2008-12-01
KR100927621B1 (ko) 2009-11-20
EP1973145B1 (de) 2010-03-03
EP1973145A1 (de) 2008-09-24

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