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DE602008004757D1 - Oximesther-fotoinitiatoren - Google Patents

Oximesther-fotoinitiatoren

Info

Publication number
DE602008004757D1
DE602008004757D1 DE602008004757T DE602008004757T DE602008004757D1 DE 602008004757 D1 DE602008004757 D1 DE 602008004757D1 DE 602008004757 T DE602008004757 T DE 602008004757T DE 602008004757 T DE602008004757 T DE 602008004757T DE 602008004757 D1 DE602008004757 D1 DE 602008004757D1
Authority
DE
Germany
Prior art keywords
formula
c20alkyl
hydrogen
direct bond
phenyl
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE602008004757T
Other languages
English (en)
Inventor
Akira Matsumoto
Junichi Tanabe
Hisatoshi Kura
Masaki Ohwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of DE602008004757D1 publication Critical patent/DE602008004757D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D401/00—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom
    • C07D401/02—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings
    • C07D401/12—Heterocyclic compounds containing two or more hetero rings, having nitrogen atoms as the only ring hetero atoms, at least one ring being a six-membered ring with only one nitrogen atom containing two hetero rings linked by a chain containing hetero atoms as chain links
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07D—HETEROCYCLIC COMPOUNDS
    • C07D417/00—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00
    • C07D417/02—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00 containing two hetero rings
    • C07D417/06—Heterocyclic compounds containing two or more hetero rings, at least one ring having nitrogen and sulfur atoms as the only ring hetero atoms, not provided for by group C07D415/00 containing two hetero rings linked by a carbon chain containing only aliphatic carbon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B15/00—Acridine dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B55/00—Azomethine dyes
    • C09B55/002—Monoazomethine dyes
    • C09B55/003—Monoazomethine dyes with the -C=N- group attached to an heteroring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B55/00—Azomethine dyes
    • C09B55/005—Disazomethine dyes
    • C09B55/006—Disazomethine dyes containing at least one heteroring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B55/00—Azomethine dyes
    • C09B55/008—Tri or polyazomethine dyes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09B—ORGANIC DYES OR CLOSELY-RELATED COMPOUNDS FOR PRODUCING DYES, e.g. PIGMENTS; MORDANTS; LAKES
    • C09B57/00—Other synthetic dyes of known constitution
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • G03F7/2016—Contact mask being integral part of the photosensitive element and subject to destructive removal during post-exposure processing
    • G03F7/202—Masking pattern being obtained by thermal means, e.g. laser ablation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Ceramic Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Polymerisation Methods In General (AREA)
  • Indole Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Plural Heterocyclic Compounds (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
  • Medicines That Contain Protein Lipid Enzymes And Other Medicines (AREA)
DE602008004757T 2007-05-11 2008-04-28 Oximesther-fotoinitiatoren Active DE602008004757D1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07108030 2007-05-11
EP07110649 2007-06-20
PCT/EP2008/055127 WO2008138733A1 (en) 2007-05-11 2008-04-28 Oxime ester photoinitiators

Publications (1)

Publication Number Publication Date
DE602008004757D1 true DE602008004757D1 (en) 2011-03-10

Family

ID=39620202

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602008004757T Active DE602008004757D1 (en) 2007-05-11 2008-04-28 Oximesther-fotoinitiatoren

Country Status (10)

Country Link
US (1) US8349548B2 (de)
EP (1) EP2144894B1 (de)
JP (1) JP5535065B2 (de)
KR (1) KR101604873B1 (de)
CN (1) CN101687846B (de)
AT (1) ATE496910T1 (de)
CA (1) CA2684931A1 (de)
DE (1) DE602008004757D1 (de)
TW (1) TWI465433B (de)
WO (1) WO2008138733A1 (de)

Families Citing this family (52)

* Cited by examiner, † Cited by third party
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JP5455898B2 (ja) 2008-05-30 2014-03-26 アドバンスト・ソフトマテリアルズ株式会社 ポリロタキサン、水系ポリロタキサン分散組成物、及びポリロタキサンとポリマーとの架橋体、並びにこれらの製造方法
EP2285836B1 (de) * 2008-06-06 2012-01-18 Basf Se Fotoinitiatormischungen
KR101626172B1 (ko) * 2008-06-06 2016-05-31 바스프 에스이 옥심 에스테르 광개시제
KR101648996B1 (ko) * 2008-11-03 2016-08-17 바스프 에스이 광개시제 혼합물
US8507569B2 (en) 2009-03-23 2013-08-13 Basf Se Photoresist compositions
KR101678028B1 (ko) * 2009-06-17 2016-11-21 토요잉크Sc홀딩스주식회사 옥심에스테르 화합물, 라디칼 중합개시제, 중합성 조성물, 네가티브형 레지스트 및 화상 패턴
CN103435722B (zh) 2009-12-07 2015-07-01 爱克发印艺公司 用于uv-led可固化组合物和墨水的光引发剂
AU2010330040B2 (en) 2009-12-07 2013-12-19 Agfa Nv UV-LED curable compositions and inks
JP5640722B2 (ja) * 2010-02-05 2014-12-17 Jsr株式会社 新規化合物及びそれを含有する感放射線性組成物
JP5767630B2 (ja) * 2010-03-31 2015-08-19 太陽ホールディングス株式会社 光硬化性樹脂組成物
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EP2788325B1 (de) 2011-12-07 2016-08-10 Basf Se Oximester-fotoinitiatoren
JP5976523B2 (ja) * 2011-12-28 2016-08-23 富士フイルム株式会社 光学部材セット及びこれを用いた固体撮像素子
JP5978670B2 (ja) * 2012-03-15 2016-08-24 住友化学株式会社 着色硬化性樹脂組成物
EP2963016B1 (de) 2012-05-09 2017-10-11 Basf Se Oximester-photoinitiatoren
KR20130139106A (ko) * 2012-06-12 2013-12-20 삼성디스플레이 주식회사 커버 글라스 가공 방법
JP6323007B2 (ja) * 2012-07-09 2018-05-16 東レ株式会社 感光性樹脂組成物、導電性配線保護膜及びタッチパネル部材
KR20160030233A (ko) * 2013-07-08 2016-03-16 바스프 에스이 옥심 에스테르 광개시제
EP3044208B1 (de) 2013-09-10 2021-12-22 Basf Se Oximester-photoinitiatoren
KR101435652B1 (ko) 2014-01-17 2014-08-28 주식회사 삼양사 신규한 β-옥심에스테르 플루오렌 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
JP6464764B2 (ja) * 2015-01-16 2019-02-06 Jsr株式会社 感放射線性着色組成物、スペーサー、その形成方法及び液晶表示素子
KR101824429B1 (ko) 2015-01-26 2018-02-06 주식회사 삼양사 신규한 디옥심에스테르 화합물 및 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
KR101828927B1 (ko) 2015-02-06 2018-02-14 주식회사 삼양사 신규한 옥심에스테르 화합물, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
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KR101777845B1 (ko) 2015-06-08 2017-09-12 주식회사 삼양사 신규한 플루오란텐 옥심 에스테르 유도체, 이를 포함하는 광중합 개시제 및 포토레지스트 조성물
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JP6858591B2 (ja) * 2016-03-01 2021-04-14 株式会社Ｄｎｐファインケミカル カラーフィルタ用着色組成物、カラーフィルタ及び表示装置
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JP7095676B2 (ja) * 2017-02-23 2022-07-05 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、硬化パターンの製造方法、硬化物、層間絶縁膜、カバーコート層、表面保護膜、及び電子部品
KR102545326B1 (ko) * 2017-03-16 2023-06-21 가부시키가이샤 아데카 옥심에스테르 화합물 및 상기 화합물을 함유하는 광중합 개시제
CN110536908B (zh) * 2017-06-06 2022-04-19 日本化药株式会社 光固化性组合物及电子部件用粘接剂
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KR20240156619A (ko) 2022-03-29 2024-10-30 후지필름 가부시키가이샤 수지 조성물, 경화물, 적층체, 경화물의 제조 방법, 적층체의 제조 방법, 반도체 디바이스의 제조 방법, 및, 반도체 디바이스

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CN101687846B (zh) 2015-12-02
CN101687846A (zh) 2010-03-31
US20100086881A1 (en) 2010-04-08
TW200904801A (en) 2009-02-01
ATE496910T1 (de) 2011-02-15
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US8349548B2 (en) 2013-01-08
EP2144894A1 (de) 2010-01-20
CA2684931A1 (en) 2008-11-20
WO2008138733A1 (en) 2008-11-20
JP5535065B2 (ja) 2014-07-02

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