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DE602004015020D1 - Harzverkapselter elektronischer Bauteil und Verfahren zu seiner Herstellung - Google Patents

Harzverkapselter elektronischer Bauteil und Verfahren zu seiner Herstellung

Info

Publication number
DE602004015020D1
DE602004015020D1 DE602004015020T DE602004015020T DE602004015020D1 DE 602004015020 D1 DE602004015020 D1 DE 602004015020D1 DE 602004015020 T DE602004015020 T DE 602004015020T DE 602004015020 T DE602004015020 T DE 602004015020T DE 602004015020 D1 DE602004015020 D1 DE 602004015020D1
Authority
DE
Germany
Prior art keywords
manufacture
resin
electronic component
encapsulated electronic
encapsulated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE602004015020T
Other languages
English (en)
Inventor
Ryuichi Kimata
Tsutomu Wakitani
Kousei Yamashita
Hironori Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003161448A external-priority patent/JP2004363410A/ja
Priority claimed from JP2003161444A external-priority patent/JP2004363406A/ja
Priority claimed from JP2003161445A external-priority patent/JP4080954B2/ja
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Publication of DE602004015020D1 publication Critical patent/DE602004015020D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE602004015020T 2003-06-06 2004-06-07 Harzverkapselter elektronischer Bauteil und Verfahren zu seiner Herstellung Expired - Lifetime DE602004015020D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003161448A JP2004363410A (ja) 2003-06-06 2003-06-06 樹脂封止電子部品ユニット及びその製造方法
JP2003161444A JP2004363406A (ja) 2003-06-06 2003-06-06 樹脂封止電子部品ユニット及びその製造方法
JP2003161445A JP4080954B2 (ja) 2003-06-06 2003-06-06 樹脂封止電子部品ユニットの製造方法

Publications (1)

Publication Number Publication Date
DE602004015020D1 true DE602004015020D1 (de) 2008-08-28

Family

ID=33303704

Family Applications (1)

Application Number Title Priority Date Filing Date
DE602004015020T Expired - Lifetime DE602004015020D1 (de) 2003-06-06 2004-06-07 Harzverkapselter elektronischer Bauteil und Verfahren zu seiner Herstellung

Country Status (4)

Country Link
US (1) US20050000726A1 (de)
EP (1) EP1487246B1 (de)
CN (1) CN100397626C (de)
DE (1) DE602004015020D1 (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7576991B2 (en) * 2004-01-13 2009-08-18 Taisei Plas Co., Ltd. Electrical equipment for junction and method of manufacturing the same
PT1718283E (pt) * 2004-01-22 2013-05-03 Univ Miami Formulações tópicas da co-enzima ql0 e métodos de utilização
JP2006032490A (ja) * 2004-07-13 2006-02-02 Hitachi Ltd エンジン制御回路装置
JP4478007B2 (ja) * 2004-12-16 2010-06-09 日立オートモティブシステムズ株式会社 電子回路装置及びその製造方法
KR20080016863A (ko) * 2005-05-17 2008-02-22 페더럴-모걸 코오포레이숀 Ｂｌｄｃ 모터 및 캡슐화된 회로 보드를 가진 펌프어셈블리
JP4744947B2 (ja) * 2005-06-23 2011-08-10 本田技研工業株式会社 電子制御ユニット及びその製造方法
US7931448B2 (en) 2006-08-01 2011-04-26 Federal Mogul World Wide, Inc. System and method for manufacturing a brushless DC motor fluid pump
EP3607937A1 (de) 2007-03-22 2020-02-12 Berg LLC Topische formulierungen mit erhöhter bioverfügbarkeit
US7847457B2 (en) 2007-05-09 2010-12-07 Federal-Mogul World Wide, Inc BLDC motor assembly
JP4638923B2 (ja) * 2008-03-31 2011-02-23 日立オートモティブシステムズ株式会社 制御装置
DE102008040501A1 (de) * 2008-07-17 2010-01-21 Robert Bosch Gmbh Verbesserte Wärmeabfuhr aus einem Steuergerät
US8011950B2 (en) * 2009-02-18 2011-09-06 Cinch Connectors, Inc. Electrical connector
CN101898393B (zh) * 2009-05-25 2013-10-09 鸿富锦精密工业（深圳）有限公司 模具
JP2011100718A (ja) * 2009-10-05 2011-05-19 Yazaki Corp コネクタ
JP5592215B2 (ja) * 2010-09-22 2014-09-17 ダイセル・エボニック株式会社 粉末状封止剤及び封止方法
US20140079405A1 (en) * 2011-04-21 2014-03-20 The Flewelling Ford Family Trust Overmoulding method and overmoulded electronic device
DE102012201177A1 (de) * 2012-01-27 2013-08-01 Robert Bosch Gmbh Kunststoffummantelter Bauelementeträger mit Leiterplatten-Vias
US9561604B2 (en) 2012-02-28 2017-02-07 Dialight Corporation Method and apparatus for sky-line potting
WO2013189026A1 (en) * 2012-06-19 2013-12-27 Johnson Controls (China) Investment Co., Ltd Vehicle instrument cluster assembly and method of manufacturing the same
DE102012112736A1 (de) * 2012-12-20 2014-06-26 Conti Temic Microelectronic Gmbh Anordnung und Verfahren zum Aufbringen von Kunststoff
CN103824821B (zh) * 2014-03-11 2016-04-06 湖南进芯电子科技有限公司 一种塑料密闭封装的开关电源模块及其制备方法
US10939544B2 (en) 2018-05-10 2021-03-02 Dura Operating, Llc Multiple resin over-mold for printed circuit board electronics and light guide
US10688916B2 (en) 2018-05-10 2020-06-23 Dura Operating, Llc Multiple resin over-mold for printed circuit board electronics and light guide
US20210020587A1 (en) * 2019-06-11 2021-01-21 Skyworks Solutions, Inc. Moisture barrier for metal insulator metal capacitors and integrated circuit having the same
CN111645271B (zh) * 2020-06-12 2022-04-29 瑞声科技(新加坡)有限公司 一种用于制作发声装置盆架结构的注塑模具
US11416081B1 (en) * 2021-09-08 2022-08-16 Tactotek Oy Integral 3D structure for creating UI, related device and methods of manufacture and use
CN114801032B (zh) * 2022-04-07 2023-04-25 无锡市科虹标牌有限公司 Ime工艺中线路出线位置的防护工艺
US12008202B2 (en) * 2022-05-12 2024-06-11 Ligitek Electronics Co., Ltd. Touch light-emitting module having hollowed portion for incapsulation resin and manufacturing method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0744320B2 (ja) * 1989-10-20 1995-05-15 松下電器産業株式会社 樹脂回路基板及びその製造方法
JPH0422762A (ja) * 1990-05-16 1992-01-27 Mitsubishi Electric Corp イグナイタ
US5046966A (en) * 1990-10-05 1991-09-10 International Business Machines Corporation Coaxial cable connector assembly
US5319522A (en) * 1992-12-17 1994-06-07 Ford Motor Company Encapsulated product and method of manufacture
US5945130A (en) * 1994-11-15 1999-08-31 Vlt Corporation Apparatus for circuit encapsulation
FR2753044B1 (fr) * 1996-08-27 1998-10-30 Siemens Automotive Sa Procede d'assemblage de composants electroniques sur une carte de circuit imprime
US6596947B1 (en) * 2000-01-28 2003-07-22 Sony Chemicals Corp. Board pieces, flexible wiring boards, and processes for manufacturing flexible wiring boards
JP3756691B2 (ja) * 1999-03-18 2006-03-15 株式会社日立製作所 内燃機関用の樹脂封止形電子装置
JP3876109B2 (ja) * 2000-03-29 2007-01-31 松下電器産業株式会社 電子回路形成品の製造方法
US6433285B2 (en) * 2000-03-30 2002-08-13 Matsushita Electronics Corporation Printed wiring board, IC card module using the same, and method for producing IC card module
TW585015B (en) * 2001-06-28 2004-04-21 Sanyo Electric Co Hybrid integrated circuit device and method for manufacturing same
JP4614584B2 (ja) * 2001-06-28 2011-01-19 三洋電機株式会社 混成集積回路装置およびその製造方法
US6657134B2 (en) * 2001-11-30 2003-12-02 Honeywell International Inc. Stacked ball grid array

Also Published As

Publication number Publication date
US20050000726A1 (en) 2005-01-06
CN100397626C (zh) 2008-06-25
EP1487246B1 (de) 2008-07-16
EP1487246A1 (de) 2004-12-15
CN1574313A (zh) 2005-02-02

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Legal Events

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8364 No opposition during term of opposition