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DE60005118D1 - Durchführvorrichtungen - Google Patents

Durchführvorrichtungen

Info

Publication number
DE60005118D1
DE60005118D1 DE60005118T DE60005118T DE60005118D1 DE 60005118 D1 DE60005118 D1 DE 60005118D1 DE 60005118 T DE60005118 T DE 60005118T DE 60005118 T DE60005118 T DE 60005118T DE 60005118 D1 DE60005118 D1 DE 60005118D1
Authority
DE
Germany
Prior art keywords
insulating material
ferrule
gap
coupled
ground wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60005118T
Other languages
English (en)
Other versions
DE60005118T2 (de
Inventor
David Joseph Bealka
Costa Pedro Henrique Da
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Morgan Advanced Ceramics Inc
Original Assignee
Morgan Advanced Ceramics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morgan Advanced Ceramics Inc filed Critical Morgan Advanced Ceramics Inc
Publication of DE60005118D1 publication Critical patent/DE60005118D1/de
Application granted granted Critical
Publication of DE60005118T2 publication Critical patent/DE60005118T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/26—Lead-in insulators; Lead-through insulators
    • H01B17/30—Sealing
    • H01B17/303—Sealing of leads to lead-through insulators
    • H01B17/305—Sealing of leads to lead-through insulators by embedding in glass or ceramic material
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/372—Arrangements in connection with the implantation of stimulators
    • A61N1/375—Constructional arrangements, e.g. casings
    • A61N1/3752—Details of casing-lead connections
    • A61N1/3754—Feedthroughs

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Electrotherapy Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Insulating Bodies (AREA)
  • Glass Compositions (AREA)
  • Paper (AREA)
  • Cable Accessories (AREA)
DE60005118T 1999-12-03 2000-12-04 Durchführvorrichtungen Expired - Lifetime DE60005118T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US16893799P 1999-12-03 1999-12-03
US168937P 1999-12-03
US557336 2000-04-24
US09/557,336 US6586675B1 (en) 1999-12-03 2000-04-24 Feedthrough devices

Publications (2)

Publication Number Publication Date
DE60005118D1 true DE60005118D1 (de) 2003-10-16
DE60005118T2 DE60005118T2 (de) 2004-07-08

Family

ID=26864603

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60005118T Expired - Lifetime DE60005118T2 (de) 1999-12-03 2000-12-04 Durchführvorrichtungen

Country Status (5)

Country Link
US (1) US6586675B1 (de)
EP (1) EP1107264B1 (de)
AT (1) ATE249679T1 (de)
DE (1) DE60005118T2 (de)
ES (1) ES2203401T3 (de)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6874423B2 (en) * 2002-10-21 2005-04-05 Schott Glas Hermetically sealed electrical feed-through device with a straight isolated pin in an offset oval glass seal
US6877431B2 (en) * 2002-10-21 2005-04-12 Schott Glas Hermetically sealed electrical feed-through device with a bent isolated pin in a circular glass seal
US6768629B1 (en) * 2003-06-02 2004-07-27 Greatbatch-Hittman, Inc. Multipin feedthrough containing a ground pin passing through an insulator and directly brazed to a ferrule
DE10329261A1 (de) * 2003-06-23 2005-01-13 Biotronik Meß- und Therapiegeräte GmbH & Co. Ingenieurbüro Berlin Gehäusedurchführung für implantierbare elektronische Geräte
US6989200B2 (en) * 2003-10-30 2006-01-24 Alfred E. Mann Foundation For Scientific Research Ceramic to noble metal braze and method of manufacture
US7046499B1 (en) 2004-10-04 2006-05-16 Pacesetter, Inc. Internally grounded filtering feedthrough
US8329314B1 (en) 2004-10-12 2012-12-11 Boston Scientific Neuromodulation Corporation Hermetically bonding ceramic and titanium with a palladium braze
US7771838B1 (en) 2004-10-12 2010-08-10 Boston Scientific Neuromodulation Corporation Hermetically bonding ceramic and titanium with a Ti-Pd braze interface
US8560079B2 (en) * 2005-12-23 2013-10-15 Cochlear Limited Braze join
US8160707B2 (en) * 2006-01-30 2012-04-17 Medtronic, Inc. Method and apparatus for minimizing EMI coupling in a feedthrough array having at least one unfiltered feedthrough
US7498516B1 (en) * 2006-06-14 2009-03-03 Boston Scientific Neuromodulation Corporation Feedthru assembly
US7915527B1 (en) * 2006-08-23 2011-03-29 Rockwell Collins, Inc. Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings
US8076185B1 (en) 2006-08-23 2011-12-13 Rockwell Collins, Inc. Integrated circuit protection and ruggedization coatings and methods
US8581108B1 (en) 2006-08-23 2013-11-12 Rockwell Collins, Inc. Method for providing near-hermetically coated integrated circuit assemblies
US8617913B2 (en) 2006-08-23 2013-12-31 Rockwell Collins, Inc. Alkali silicate glass based coating and method for applying
US7969712B2 (en) * 2007-04-19 2011-06-28 Oracle America, Inc. Power integrity circuits with EMI benefits
US8550974B2 (en) * 2008-11-13 2013-10-08 Robert Jarvik Sub-miniature electromechanical medical implants with integrated hermetic feedthroughs
US8698006B2 (en) * 2009-06-04 2014-04-15 Morgan Advanced Ceramics, Inc. Co-fired metal and ceramic composite feedthrough assemblies for use at least in implantable medical devices and methods for making the same
DE102009035971B4 (de) * 2009-08-04 2013-01-17 Heraeus Precious Metals Gmbh & Co. Kg Elektrische Durchführung für eine medizinisch implantierbare Vorrichtung
DE102009035972B4 (de) * 2009-08-04 2011-11-17 W.C. Heraeus Gmbh Cermethaltige Durchführung für eine medizinisch implantierbare Vorrichtung
US8487187B2 (en) * 2009-09-09 2013-07-16 Emerson Electric Co. Solid core glass bead seal with stiffening rib
AU2009213037A1 (en) * 2009-09-09 2011-03-24 Cochlear Limited Braze join
DE102010006690B4 (de) * 2010-02-02 2013-03-28 Heraeus Precious Metals Gmbh & Co. Kg Verfahren zum Herstellen einer elektrischen Durchführung, elektrische Durchführung sowie implantierbare Vorrichtung
DE102010006689B4 (de) 2010-02-02 2013-04-18 Heraeus Precious Metals Gmbh & Co. Kg Verfahren zum Herstellen einer elektrischen Durchführung, elektrische Durchführung sowie implantierbare Vorrichtung
US8604341B2 (en) 2010-07-08 2013-12-10 Cardiac Pacemakers, Inc. Feedthrough assembly for an implantable device
EP2527000B1 (de) * 2011-04-15 2015-11-25 LITRONIK Entwicklungs GmbH Leitungs-Durchführung und elektrische Funktionseinheit
US8872035B2 (en) 2011-08-02 2014-10-28 Medtronic, Inc. Hermetic feedthrough
US9724524B2 (en) 2011-08-02 2017-08-08 Medtronic, Inc. Interconnection of conductor to feedthrough
US8670829B2 (en) 2011-08-02 2014-03-11 Medtronic, Inc. Insulator for a feedthrough
US8588916B2 (en) 2011-08-02 2013-11-19 Medtronic, Inc. Feedthrough configured for interconnect
US9008779B2 (en) 2011-08-02 2015-04-14 Medtronic, Inc. Insulator for a feedthrough
US9627833B2 (en) 2011-08-02 2017-04-18 Medtronic, Inc. Electrical leads for a feedthrough
US8841558B2 (en) 2011-08-02 2014-09-23 Medtronic Inc. Hermetic feedthrough
WO2014049089A1 (en) * 2012-09-28 2014-04-03 Csem Centre Suisse D'electronique Et De Microtechnique Sa - Recherche Et Developpement Implantable devices
US20140178185A1 (en) * 2012-12-21 2014-06-26 United Technologies Corporation Egress seal assembly
US9478959B2 (en) 2013-03-14 2016-10-25 Heraeus Deutschland GmbH & Co. KG Laser welding a feedthrough
US9431801B2 (en) 2013-05-24 2016-08-30 Heraeus Deutschland GmbH & Co. KG Method of coupling a feedthrough assembly for an implantable medical device
US9403023B2 (en) 2013-08-07 2016-08-02 Heraeus Deutschland GmbH & Co. KG Method of forming feedthrough with integrated brazeless ferrule
FR3012965B1 (fr) 2013-11-14 2016-01-08 Commissariat Energie Atomique Dispositif de traversee notamment pour systeme d'implant medical et procede de realisation.
US9610452B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing by sintering
US9504841B2 (en) 2013-12-12 2016-11-29 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing with ultrasonic welding
US9610451B2 (en) 2013-12-12 2017-04-04 Heraeus Deutschland GmbH & Co. KG Direct integration of feedthrough to implantable medical device housing using a gold alloy
US9138821B2 (en) 2014-01-17 2015-09-22 Medtronic, Inc. Methods for simultaneously brazing a ferrule and lead pins
EP3069758A1 (de) * 2015-03-20 2016-09-21 BIOTRONIK SE & Co. KG Gestanzte flansche für elektrische durchführungen mit integriertem massestift
DE102015117935A1 (de) * 2015-10-21 2017-04-27 Biotronik Se & Co. Kg Durchführung eines medizinelektronischen Gerätes und medizinelektronisches Gerät
DE102016103485A1 (de) * 2016-02-26 2017-08-31 Schott Ag Durchführungen für Anwendungen bei hohem Aussendruck sowie Verfahren zu deren Herstellung
WO2019090301A1 (en) 2017-11-06 2019-05-09 Avx Corporation Emi feedthrough filter terminal assembly containing a resin coating over a hermetically sealing material
US11648408B2 (en) * 2018-11-07 2023-05-16 Pacesetter, Inc. Filtered feedthrough assembly for use in implantable medical device and method of manufacturing the same
EP3900783B1 (de) 2020-02-21 2023-08-16 Heraeus Medical Components, LLC Hülse für ein nicht-planares gehäuse einer medizinischen vorrichtung
EP3900782B1 (de) 2020-02-21 2023-08-09 Heraeus Medical Components, LLC Hülse mit zugentlastendem abstandshalter für implantierbare medizinische vorrichtung
EP4169570A1 (de) * 2021-10-20 2023-04-26 BIOTRONIK SE & Co. KG Verfahren zur herstellung einer elektrischen durchführung

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4180700A (en) 1978-03-13 1979-12-25 Medtronic, Inc. Alloy composition and brazing therewith, particularly for _ceramic-metal seals in electrical feedthroughs
US5046242A (en) * 1982-07-27 1991-09-10 Commonwealth Of Australia Method of making feedthrough assemblies having hermetic seals between electrical feedthrough elements and ceramic carriers therefor
DE3434086A1 (de) 1984-09-17 1986-03-27 Siemens Ag Bauelementegehaeuse
US4835365A (en) * 1986-09-29 1989-05-30 Etheridge David R De-ionized fluid heater and control system
EP0277645A1 (de) * 1987-02-02 1988-08-10 Sumitomo Electric Industries Limited Verbindung metallischer und keramischer Gegenstände
US4940858A (en) 1989-08-18 1990-07-10 Medtronic, Inc. Implantable pulse generator feedthrough
US4991582A (en) 1989-09-22 1991-02-12 Alfred E. Mann Foundation For Scientific Research Hermetically sealed ceramic and metal package for electronic devices implantable in living bodies
US5455206A (en) * 1990-09-14 1995-10-03 Kaun; Thomas D. Corrosion resistant ceramic materials
US5368220A (en) 1992-08-04 1994-11-29 Morgan Crucible Company Plc Sealed conductive active alloy feedthroughs
US5440447A (en) 1993-07-02 1995-08-08 The Morgan Crucible Company, Plc High temperature feed-through system and method for making same
US5700724A (en) * 1994-08-02 1997-12-23 Philips Electronic North America Corporation Hermetically sealed package for a high power hybrid circuit
US5817984A (en) 1995-07-28 1998-10-06 Medtronic Inc Implantable medical device wtih multi-pin feedthrough
US5750926A (en) 1995-08-16 1998-05-12 Alfred E. Mann Foundation For Scientific Research Hermetically sealed electrical feedthrough for use with implantable electronic devices
US5681172A (en) * 1995-11-01 1997-10-28 Cooper Industries, Inc. Multi-pole electrical connector with ground continuity
US5650759A (en) 1995-11-09 1997-07-22 Hittman Materials & Medical Components, Inc. Filtered feedthrough assembly having a mounted chip capacitor for medical implantable devices and method of manufacture therefor
US5833714A (en) * 1996-01-18 1998-11-10 Loeb; Gerald E. Cochlear electrode array employing tantalum metal
US5825608A (en) 1996-10-18 1998-10-20 Novacap, Inc. Feed-through filter capacitor assembly
US5896267A (en) 1997-07-10 1999-04-20 Greatbatch-Hittman, Inc. Substrate mounted filter for feedthrough devices
US5905627A (en) 1997-09-10 1999-05-18 Maxwell Energy Products, Inc. Internally grounded feedthrough filter capacitor

Also Published As

Publication number Publication date
EP1107264A2 (de) 2001-06-13
ES2203401T3 (es) 2004-04-16
DE60005118T2 (de) 2004-07-08
EP1107264A3 (de) 2002-08-21
EP1107264B1 (de) 2003-09-10
ATE249679T1 (de) 2003-09-15
US6586675B1 (en) 2003-07-01

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Legal Events

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8364 No opposition during term of opposition