DE60004137D1 - Herstellungsverfahren für einen oberflächen-gekoppelten InGaAs Photodetektor - Google Patents
Herstellungsverfahren für einen oberflächen-gekoppelten InGaAs PhotodetektorInfo
- Publication number
- DE60004137D1 DE60004137D1 DE60004137T DE60004137T DE60004137D1 DE 60004137 D1 DE60004137 D1 DE 60004137D1 DE 60004137 T DE60004137 T DE 60004137T DE 60004137 T DE60004137 T DE 60004137T DE 60004137 D1 DE60004137 D1 DE 60004137D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing process
- ingaas photodetector
- coupled
- coupled ingaas
- photodetector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/221—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction
- H10F30/2215—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction the devices comprising active layers made of only Group III-V materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/62—Electrodes ohmically coupled to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1272—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/70—Surface textures, e.g. pyramid structures
- H10F77/703—Surface textures, e.g. pyramid structures of the semiconductor bodies, e.g. textured active layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/544—Solar cells from Group III-V materials
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Radiation Pyrometers (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/311,673 US6228673B1 (en) | 1999-05-13 | 1999-05-13 | Method of fabricating a surface coupled InGaAs photodetector |
US311673 | 1999-05-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60004137D1 true DE60004137D1 (de) | 2003-09-04 |
DE60004137T2 DE60004137T2 (de) | 2004-04-22 |
Family
ID=23207952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60004137T Expired - Lifetime DE60004137T2 (de) | 1999-05-13 | 2000-05-11 | Herstellungsverfahren für einen oberflächen-gekoppelten InGaAs Photodetektor |
Country Status (4)
Country | Link |
---|---|
US (1) | US6228673B1 (de) |
EP (1) | EP1063709B1 (de) |
JP (1) | JP3662811B2 (de) |
DE (1) | DE60004137T2 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2289983B (en) | 1994-06-01 | 1996-10-16 | Simage Oy | Imaging devices,systems and methods |
US9029793B2 (en) | 1998-11-05 | 2015-05-12 | Siemens Aktiengesellschaft | Imaging device |
DE19956904C2 (de) * | 1999-11-26 | 2003-08-07 | United Monolithic Semiconduct | Integrierter Amplitudenbegrenzer bzw. Limiter und Verfahren zur Herstellung eines integrierten Limiters |
JP5011607B2 (ja) * | 2001-04-16 | 2012-08-29 | 住友電気工業株式会社 | 受光素子 |
US6780750B2 (en) * | 2002-01-08 | 2004-08-24 | Samsung Electronics Co. Ltd. | Photodiode for ultra high speed optical communication and fabrication method therefor |
GB0224689D0 (en) | 2002-10-23 | 2002-12-04 | Simage Oy | Formation of contacts on semiconductor substrates |
JP2006504258A (ja) | 2002-10-25 | 2006-02-02 | ゴールドパワー リミテッド | 回路基板およびその製造方法 |
DE102004037868A1 (de) * | 2004-04-30 | 2005-11-24 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes und/oder -empfangendes Halbleiterbauelement und Verfahren zur strukturierten Aufbringung eines Kontakts auf einen Halbleiterkörper |
US8072041B2 (en) * | 2009-04-08 | 2011-12-06 | Finisar Corporation | Passivated optical detectors with full protection layer |
US9087926B2 (en) * | 2009-12-23 | 2015-07-21 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Low capacitance semiconductor device |
RU2485628C1 (ru) * | 2012-01-19 | 2013-06-20 | Федеральное государственное бюджетное учреждение науки Физико-технический институт им. А.Ф. Иоффе Российской академии наук | Способ изготовления чипов наногетероструктуры и травитель |
RU2530458C1 (ru) * | 2013-04-23 | 2014-10-10 | Российская Федерация, от имени которой выступает государственный заказчик - Министерство промышленности и торговли Российской Федерации | СПОСОБ ИЗГОТОВЛЕНИЯ МНОГОЭЛЕМЕНТНОГО ФОТОПРИЕМНИКА НА ОСНОВЕ ЭПИТАКСИАЛЬНЫХ СТРУКТУР InGaAs/InP |
US10388807B2 (en) | 2014-04-30 | 2019-08-20 | Hewlett Packard Enterprise Development Lp | Mirrors including reflective and second layers disposed on photodetectors |
CN105762226B (zh) * | 2014-12-19 | 2018-04-17 | 中国电子科技集团公司第十八研究所 | 一种多结太阳电池渐变缓冲层的腐蚀方法 |
CN112582262B (zh) * | 2020-11-27 | 2022-10-04 | 中国电子科技集团公司第十三研究所 | 一种多层材料的非选择性湿法腐蚀方法及其应用 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4414561A (en) * | 1979-09-27 | 1983-11-08 | Bell Telephone Laboratories, Incorporated | Beryllium-gold ohmic contact to a semiconductor device |
FR2488049A1 (fr) * | 1980-07-31 | 1982-02-05 | Bouley Jean | Source lumineuse a jonction semiconductrice, notamment source-laser, utilisant des diodes schottky, et procede de fabrication |
US4996163A (en) * | 1988-02-29 | 1991-02-26 | Sumitomo Electric Industries, Ltd. | Method for producing an opto-electronic integrated circuit |
US5250471A (en) * | 1988-12-26 | 1993-10-05 | The Furukawa Electric Co. | Method for manufacturing compound semiconductor devices including a step where the semiconductor is etched without exposure to light |
NL8902292A (nl) * | 1989-09-14 | 1991-04-02 | Philips Nv | Werkwijze voor het vervaardigen van een een mesa bevattende halfgeleiderinrichting. |
US5365087A (en) * | 1992-07-15 | 1994-11-15 | Sumitomo Electric Industries, Ltd. | Photodetector and opto-electronic integrated circuit with guard ring |
US5448099A (en) * | 1993-03-04 | 1995-09-05 | Sumitomo Electric Industries, Ltd. | Pin-type light receiving device, manufacture of the pin-type light receiving device and optoelectronic integrated circuit |
JP3115148B2 (ja) * | 1993-03-31 | 2000-12-04 | 株式会社東芝 | 半導体装置の製造方法 |
JP3191835B2 (ja) * | 1993-05-17 | 2001-07-23 | 住友電気工業株式会社 | 光電子集積回路 |
JPH07211692A (ja) * | 1994-01-12 | 1995-08-11 | Sumitomo Electric Ind Ltd | InP系化合物半導体の加工方法 |
JP2762939B2 (ja) * | 1994-03-22 | 1998-06-11 | 日本電気株式会社 | 超格子アバランシェフォトダイオード |
US5518934A (en) * | 1994-07-21 | 1996-05-21 | Trustees Of Princeton University | Method of fabricating multiwavelength infrared focal plane array detector |
DE69637318T2 (de) * | 1995-02-02 | 2008-09-04 | Sumitomo Electric Industries, Ltd. | PIN lichtempfindliche Vorrichtung und ihr Herstellungsverfahren |
US5646069A (en) * | 1995-06-07 | 1997-07-08 | Hughes Aircraft Company | Fabrication process for Alx In1-x As/Gay In1-y As power HFET ohmic contacts |
US5689122A (en) * | 1995-08-14 | 1997-11-18 | Lucent Technologies Inc. | InP/InGaAs monolithic integrated demultiplexer, photodetector, and heterojunction bipolar transistor |
US5684308A (en) * | 1996-02-15 | 1997-11-04 | Sandia Corporation | CMOS-compatible InP/InGaAs digital photoreceiver |
US6005266A (en) * | 1997-03-13 | 1999-12-21 | The Trustees Of Princeton University | Very low leakage JFET for monolithically integrated arrays |
US5966622A (en) * | 1997-10-08 | 1999-10-12 | Lucent Technologies Inc. | Process for bonding crystalline substrates with different crystal lattices |
-
1999
- 1999-05-13 US US09/311,673 patent/US6228673B1/en not_active Expired - Lifetime
-
2000
- 2000-05-11 DE DE60004137T patent/DE60004137T2/de not_active Expired - Lifetime
- 2000-05-11 EP EP00109952A patent/EP1063709B1/de not_active Expired - Lifetime
- 2000-05-11 JP JP2000138348A patent/JP3662811B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP1063709B1 (de) | 2003-07-30 |
JP2000353819A (ja) | 2000-12-19 |
EP1063709A2 (de) | 2000-12-27 |
JP3662811B2 (ja) | 2005-06-22 |
EP1063709A3 (de) | 2001-09-26 |
DE60004137T2 (de) | 2004-04-22 |
US6228673B1 (en) | 2001-05-08 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8328 | Change in the person/name/address of the agent |
Representative=s name: WITTE, WELLER & PARTNER, 70178 STUTTGART |