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DE4439239A1 - Circuit board carrier with double-sided laminated foil system e.g. for signals transmission applications - Google Patents

Circuit board carrier with double-sided laminated foil system e.g. for signals transmission applications

Info

Publication number
DE4439239A1
DE4439239A1 DE19944439239 DE4439239A DE4439239A1 DE 4439239 A1 DE4439239 A1 DE 4439239A1 DE 19944439239 DE19944439239 DE 19944439239 DE 4439239 A DE4439239 A DE 4439239A DE 4439239 A1 DE4439239 A1 DE 4439239A1
Authority
DE
Germany
Prior art keywords
circuit carrier
channels
circuit board
conductive
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19944439239
Other languages
German (de)
Inventor
Jan Dipl Ing Kostelnik
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Technische Universitaet Dresden
Original Assignee
Technische Universitaet Dresden
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Technische Universitaet Dresden filed Critical Technische Universitaet Dresden
Priority to DE19944439239 priority Critical patent/DE4439239A1/en
Publication of DE4439239A1 publication Critical patent/DE4439239A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09836—Oblique hole, via or bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A double sided circuit board (1) has a pattern of circular channels formed and the outer surfaces have laminated foils (3) that support conductor tracks (4) and connection points (5). The walls of the channels are metallised and the interconnection between these and the connection points (5) are made using releasable contacts with solder or conductive adhesive. The circuit board can be produced as a thermoplastic moulding or by a stereo lithographic process.

Description

Die Erfindung betrifft einen recyclingfähigen Schaltungsträger mit beidseitig laminierten Foliensystem.The invention relates to a recyclable circuit carrier film system laminated on both sides.

Aus DE 30 08 143 ist beispielsweise ein Verfahren zur Herstellung von gedruckten Leiterplatten mit Lochungen bekannt, deren Wandungen metallisiert sind. Nach dem Herstellen des Lochmusters wird der Schaltungsträger einem Ätz- oder Lösungsmittel für die Haftvermittlerschicht ausgesetzt. Als Ätzmittel werden Chromsäuren, alkalische Permanganatlösungen sowie Alkalimetallhydroxyd-Lösungen beschrieben. Die Ätzlösung baut die Haftvermittlerschicht unterhalb der Abdeckfolie in einem bestimmten Abstand vom betreffenden Lochrand ab. Nach dem Entfernen der Abdeckfolie erfolgt der Aufbau der Oberfläche, einschließlich der Lochwandungen mittels bekannter stromloser Metallabscheidung. Am Ende steht eine feste metallische Verbindung zur Verfügung, die über die Lochwandmetallisierung zwei Leitbahnebenen miteinander verbindet.DE 30 08 143, for example, describes a method of manufacture known from printed circuit boards with perforations, the walls are metallized. After the hole pattern has been made, the Circuit carrier an etching or solvent for the Bonding agent layer exposed. As an etchant Chromic acids, alkaline permanganate solutions as well Alkali metal hydroxide solutions described. The etching solution builds the Adhesion layer below the cover film in a certain Distance from the edge of the hole in question. After removing the Cover film is used to build up the surface, including the Hole walls using known electroless metal deposition. At the A solid metallic connection is available at the end, the Two interconnect levels with each other via the perforated wall metallization connects.

Werden derartige Verfahren bei laminierten Foliensystemen angewendet, so können diese im Recyclingfall nicht einwandfrei vom Schaltungsträger entfernt werden. Es kommt zum Zerreißen des Foliensystems, zumindest bleiben Folienstücke am Lochrand haften. Der Schaltungsträger ist damit nicht wiederverwendbar.Such processes are used in laminated film systems applied, so they can not flawlessly from the Circuit carriers are removed. There is tearing of the Film system, at least pieces of film stick to the edge of the hole. The circuit carrier is therefore not reusable.

Aufgabe der Erfindung ist es, eine lösbare Durchverbindung zwischen beidseits eines Trägers befindlichen Schaltungen anzugeben.The object of the invention is to provide a releasable through connection between to indicate circuits located on both sides of a carrier.

Erfindungsgemäß wird die Aufgabe mit den in den Ansprüchen genannten und in den Ausführungsbeispielen näher erläuterten Mitteln gelöst.According to the invention the task with the in the claims mentioned and explained in more detail in the exemplary embodiments  Means solved.

Beidseits des Schaltungsträgers sind Folien mit Schaltungen und Bauelementen laminiert. Die Durchverbindung von einem zum anderen Foliensystem erfolgt über Kanäle, die im Schaltungsträger nahezu beliebig angeordnet sind. Die elektrische Leitfähigkeit im Kanal wird durch leitfähige Pasten und/oder Metallisierung der Kanalwand realisiert. Der Übergang von der Leitbahn im Kanal zum Anschlußpunkt an der Folie erfolgt durch eine lösbare Verbindung. Die lösbare Verbindung kann durch Leitkleber, leitfähige Pasten oder in der z-Achse leitfähige Klebefolien realisiert werden.Films with circuits and are on both sides of the circuit carrier Components laminated. The connection from one to the other Foil system takes place via channels that are almost in the circuit carrier are arranged arbitrarily. The electrical conductivity in the sewer is by conductive pastes and / or metallization of the channel wall realized. The transition from the channel in the channel to The connection point on the film is made by a detachable connection. The detachable connection can be made using conductive adhesive, conductive pastes or conductive adhesive films can be realized in the z-axis.

Der Vorteil der erfindungsgemäßen Lösung besteht darin, daß das auflaminierte Foliensystem mit Durchkontaktierung durch den Schaltungsträger vollständig von diesem gelöst werden kann. Danach steht der Schaltungsträger zur Wiederverwendung zur Verfügung. Beim Abtrennen der Folie sind nur die Kräfte der Folienhaftung auf dem Schaltungsträger zu überwinden.The advantage of the solution according to the invention is that laminated film system with through-hole through the Circuit carrier can be completely detached from this. After that the circuit carrier is available for reuse. At the Removing the film are only the forces of film adhesion on the Circuit carriers to overcome.

Die Erfindung wird nachstehend an 3 Ausführungsbeispielen näher erläutert. In den Zeichnungen zeigenThe invention is illustrated below with 3 exemplary embodiments explained. Show in the drawings

Fig. 1 einen Schaltungsträger mit im wesentlichen senkrecht verlaufenden Kanälen und beidseits laminierten Foliensystem, Fig. 1 is a circuit carrier having substantially perpendicularly running channels and on both sides of the laminated film system,

Fig. 2 einen Schaltungsträger mit senkrecht und schräg durch den Schaltungsträger und im Schaltungsträger verlaufenden Kanälen Fig. 2 shows a circuit carrier with vertically and obliquely through the circuit carrier and channels running in the circuit carrier

Fig. 3 einen Schaltungsträger mit im wesentlichen senkrecht verlaufenden Kanälen und deren matrixförmige Anordnung. Fig. 3 shows a circuit carrier with essentially perpendicular channels and their matrix-shaped arrangement.

Der Schaltungsträger 1 in Fig. 1 weist im wesentlichen senkrecht verlaufende Kanäle 2 auf. Die Folie 3 ist auf dem Träger 1 beidseits laminiert und trägt Leiter 4 und Anschlußpunkte 5. Der Anschlußpunkt wird durch die Folie kontaktierte metallische Kontakte oder durch die Leitbahn selbst gebildet. Im Kanal 2 sind an der Wand Metallisierungen 6 aufgebracht. Der Übergang von der Metallisierung 6 im Kanal zum Anschlußpunkt 5 wird durch eine lösbare Verbindung 7 hergestellt. Diese Verbindung wird durch leitfähige Pasten, Leitkleber oder in z-Achse leitfähige Klebefolien realisiert. An Stelle der Metallisierung der Kanalwand, können leitfähige Pasten oder Leitkleber in den Kanal eingefüllt werden.The circuit carrier 1 in FIG. 1 has essentially perpendicular channels 2 . The film 3 is laminated on both sides of the carrier 1 and carries the conductor 4 and connection points 5 . The connection point is formed by the foil-contacted metallic contacts or by the interconnect itself. Metallization 6 is applied to the wall in channel 2 . The transition from the metallization 6 in the channel to the connection point 5 is made by a detachable connection 7 . This connection is realized using conductive pastes, conductive adhesives or adhesive films that are conductive in the z-axis. Instead of metallizing the duct wall, conductive pastes or conductive adhesives can be filled into the duct.

Gemäß Fig. 2 sind neben den senkrecht zur Schaltungsträgerfläche verlaufenden Kanälen schräg oder im Schaltungsträger angeordnet. Kanalverläufe im Schaltungsträger lassen sich vorteilhaft durch stereolithografische Verfahren herstellen. In den Kanälen können sowohl elektrische als auch optische Signalübertragungswege (optische Fasern) angeordnet sein.According to FIG. 2, in addition to the channels running perpendicular to the circuit carrier surface, they are arranged obliquely or in the circuit carrier. Channel profiles in the circuit carrier can advantageously be produced by stereolithographic processes. Both electrical and optical signal transmission paths (optical fibers) can be arranged in the channels.

Fig. 3 zeigt einen Schaltungsträger bei dem die Kanäle im wesentlichen senkrecht matrixförmig über die gesamte Fläche des Schaltungsträgers angeordnet sind. Für schaltungstechnisch notwendige Durchkontaktierungen werden bestimmte Kanäle metallisiert oder mit leitfähiger Paste aufgefüllt. Auf den Schaltungsträger kann eine in z-Achse leitfähige Folie laminiert werden. Daran schließt sich das Foliensystem an. Fig. 3 shows a circuit substrate in which the channels are arranged substantially vertically in matrix form over the entire surface of the circuit carrier. Certain channels are metallized or filled with conductive paste for plated-through holes. A film that is conductive in the z-axis can be laminated onto the circuit carrier. This is followed by the film system.

Claims (7)

1. Schaltungsträger zur beidseitigen Laminierung von Folien mit Schaltungen und Bauelementen, dadurch gekennzeichnet, daß der Schaltungsträger (1) Kanäle (2) aufweist, die Kanäle (2) elektrische und/oder optische Signalübertragungswege beinhalten, und zwischen Anschlußpunkten (5) an der Folie und den Signalübertragungswegen lösbare Verbindungen (7) zur Signalleitung angeordnet sind.1. Circuit carrier for double-sided lamination of films with circuits and components, characterized in that the circuit carrier ( 1 ) has channels ( 2 ), the channels ( 2 ) contain electrical and / or optical signal transmission paths, and between connection points ( 5 ) on the film and detachable connections ( 7 ) to the signal line are arranged for the signal transmission paths. 2. Schaltungsträger nach Anspruch 1, gekennzeichnet dadurch, daß die Kanäle (2) wenigstens an der Wand durchgehende elektrisch leitfähige Pasten, Folien oder Metallisierungen aufweisen.2. Circuit carrier according to claim 1, characterized in that the channels ( 2 ) at least on the wall have continuous electrically conductive pastes, foils or metallizations. 3. Schaltungsträger nach Anspruch 1, gekennzeichnet dadurch, daß die lösbaren Verbindungen (7) zwischen den Anschlußpunkten (5) an der Folie und den Signalübertragungswegen in den Kanälen leitfähige Pasten und/oder leitfähige Kleber sind.3. Circuit carrier according to claim 1, characterized in that the releasable connections ( 7 ) between the connection points ( 5 ) on the film and the signal transmission paths in the channels are conductive pastes and / or conductive adhesives. 4. Schaltungsträger nach Anspruch 3, gekennzeichnet dadurch, daß der leitfähige Kleber eine in der z-Achse leitfähige Klebefolie ist.4. Circuit carrier according to claim 3, characterized in that the conductive adhesive is an adhesive film that is conductive in the z-axis is. 5. Schaltungsträger nach Anspruch 1, gekennzeichnet dadurch, daß die Kanäle (2) senkrecht und/oder schräg zur Schaltungsträger­ fläche und/oder innerhalb des Schaltungsträgers verlaufen.5. Circuit carrier according to claim 1, characterized in that the channels ( 2 ) perpendicular and / or obliquely to the circuit carrier surface and / or extend within the circuit carrier. 6. Schaltungsträger nach Anspruch 1, gekennzeichnet dadurch, daß der Schaltungsträger mit den Kanälen (2) aus thermoplastischem Material spritzgegossen ist. 6. Circuit carrier according to claim 1, characterized in that the circuit carrier with the channels ( 2 ) is injection molded from thermoplastic material. 7. Schaltungsträger nach Anspruch 1, gekennzeichnet dadurch, daß der Schaltungsträger mit den Kanälen (2) stereolithografisch hergestellt ist.7. Circuit carrier according to claim 1, characterized in that the circuit carrier with the channels ( 2 ) is stereolithographically produced.
DE19944439239 1994-11-03 1994-11-03 Circuit board carrier with double-sided laminated foil system e.g. for signals transmission applications Withdrawn DE4439239A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19944439239 DE4439239A1 (en) 1994-11-03 1994-11-03 Circuit board carrier with double-sided laminated foil system e.g. for signals transmission applications

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19944439239 DE4439239A1 (en) 1994-11-03 1994-11-03 Circuit board carrier with double-sided laminated foil system e.g. for signals transmission applications

Publications (1)

Publication Number Publication Date
DE4439239A1 true DE4439239A1 (en) 1996-05-09

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ID=6532379

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19944439239 Withdrawn DE4439239A1 (en) 1994-11-03 1994-11-03 Circuit board carrier with double-sided laminated foil system e.g. for signals transmission applications

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19649454A1 (en) * 1996-11-28 1998-06-04 Alcan Gmbh Circuit board for integrated electronic circuits and method for manufacturing a circuit board
DE19738550A1 (en) * 1997-09-03 1998-10-22 Siemens Ag Multiple layer conductor structure e.g. for electronic circuit
DE19739591A1 (en) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclable circuit board, consisting of a foil and carrier system
EP1814372A1 (en) * 2004-10-22 2007-08-01 Ibiden Co., Ltd. Multilayer printed wiring board
EP2621254A1 (en) * 2012-01-25 2013-07-31 In2Tec Limited Recyclable circuit assembly

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305399A1 (en) * 1992-03-25 1993-09-30 Dyconex Ag Zuerich PCB reinforcement
EP0575292A1 (en) * 1992-06-15 1993-12-22 Dyconex Patente Ag Process for manufacturing substrates with through-holes
EP0620702A2 (en) * 1993-04-16 1994-10-19 Dyconex Patente Ag Core for electrical interconnection substrates and electrical interconnection substrates with core, and method for manufacturing the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4305399A1 (en) * 1992-03-25 1993-09-30 Dyconex Ag Zuerich PCB reinforcement
EP0575292A1 (en) * 1992-06-15 1993-12-22 Dyconex Patente Ag Process for manufacturing substrates with through-holes
EP0620702A2 (en) * 1993-04-16 1994-10-19 Dyconex Patente Ag Core for electrical interconnection substrates and electrical interconnection substrates with core, and method for manufacturing the same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
SCHMIDT,W. *
u.a.: Dimensionen in der Leiterplat- tentechnik. In: Metalloberfläche 48, 1994, 4, S.260-264 *

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19649454A1 (en) * 1996-11-28 1998-06-04 Alcan Gmbh Circuit board for integrated electronic circuits and method for manufacturing a circuit board
EP0851721A2 (en) * 1996-11-28 1998-07-01 Alcan Deutschland Gmbh Separable plate for integrated electronic circuits, process for manufacturing a plate, and its use
EP0851721A3 (en) * 1996-11-28 1999-11-17 Alcan Deutschland Gmbh Separable plate for integrated electronic circuits, process for manufacturing a plate, and its use
DE19649454B4 (en) * 1996-11-28 2005-11-17 Alcan Deutschland Gmbh Integrated circuit board and method of manufacturing a circuit board
DE19738550A1 (en) * 1997-09-03 1998-10-22 Siemens Ag Multiple layer conductor structure e.g. for electronic circuit
DE19739591A1 (en) * 1997-09-10 1999-03-11 Wuerth Elektronik Gmbh & Co Kg Recyclable circuit board, consisting of a foil and carrier system
EP1814372A1 (en) * 2004-10-22 2007-08-01 Ibiden Co., Ltd. Multilayer printed wiring board
EP1814372A4 (en) * 2004-10-22 2010-04-14 Ibiden Co Ltd Multilayer printed wiring board
US8238700B2 (en) 2004-10-22 2012-08-07 Ibiden Co., Ltd. Multilayer printed circuit board
EP2621254A1 (en) * 2012-01-25 2013-07-31 In2Tec Limited Recyclable circuit assembly
US9706693B2 (en) 2012-01-25 2017-07-11 In2Tec Limited Recyclable circuit assembly

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