DE3678868D1 - Schutzlackbeschichtungsverfahren. - Google Patents
Schutzlackbeschichtungsverfahren.Info
- Publication number
- DE3678868D1 DE3678868D1 DE8686107872T DE3678868T DE3678868D1 DE 3678868 D1 DE3678868 D1 DE 3678868D1 DE 8686107872 T DE8686107872 T DE 8686107872T DE 3678868 T DE3678868 T DE 3678868T DE 3678868 D1 DE3678868 D1 DE 3678868D1
- Authority
- DE
- Germany
- Prior art keywords
- coating process
- lacquer coating
- protective lacquer
- protective
- lacquer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000576 coating method Methods 0.000 title 1
- 239000004922 lacquer Substances 0.000 title 1
- 230000001681 protective effect Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/136—Coating process making radiation sensitive element
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Formation Of Insulating Films (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60126133A JPS61285716A (ja) | 1985-06-12 | 1985-06-12 | レジスト塗布方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3678868D1 true DE3678868D1 (de) | 1991-05-29 |
Family
ID=14927484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8686107872T Expired - Lifetime DE3678868D1 (de) | 1985-06-12 | 1986-06-10 | Schutzlackbeschichtungsverfahren. |
Country Status (6)
Country | Link |
---|---|
US (1) | US4738910A (de) |
EP (1) | EP0205148B1 (de) |
JP (1) | JPS61285716A (de) |
KR (1) | KR900001665B1 (de) |
CN (1) | CN86103644B (de) |
DE (1) | DE3678868D1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5393624A (en) * | 1988-07-29 | 1995-02-28 | Tokyo Electron Limited | Method and apparatus for manufacturing a semiconductor device |
US4971931A (en) * | 1990-02-12 | 1990-11-20 | Eastman Kodak Company | Diffuser features for spin-coated films |
US5622747A (en) * | 1991-09-18 | 1997-04-22 | National Semiconductor Corporation | Method for dispensing a layer of photoresist on a wafer without spinning the wafer |
US5320918A (en) * | 1992-12-31 | 1994-06-14 | At&T Bell Laboratories | Optical lithographical imaging system including optical transmission diffraction devices |
US6221787B1 (en) * | 1998-04-20 | 2001-04-24 | Tokyo Electron Limited | Apparatus and method of forming resist film |
US6410194B1 (en) * | 1999-02-04 | 2002-06-25 | Tokyo Electron Limited | Resist film forming method and resist coating apparatus |
GB9916730D0 (en) | 1999-07-16 | 1999-09-15 | Mitel Semiconductor Ltd | Integrated circuit manufacture |
KR101074952B1 (ko) * | 2004-08-31 | 2011-10-18 | 엘지디스플레이 주식회사 | 포토레지스트 코팅장치 및 코팅방법 |
JP4621485B2 (ja) * | 2004-11-29 | 2011-01-26 | 株式会社東芝 | パタンデータ検証方法、パタンデータ作成方法、露光用マスクの製造方法およびプログラム |
FR2969772B1 (fr) * | 2010-12-22 | 2012-12-28 | Commissariat Energie Atomique | Procédé de lithographie par nano impression |
KR102212361B1 (ko) | 2019-07-05 | 2021-02-04 | 국방과학연구소 | 레이저음향기기를 이용한 수중표적 공격용 양상태 탐지시스템 및 탐지방법 |
KR102477169B1 (ko) * | 2022-06-10 | 2022-12-14 | 엘아이지넥스원 주식회사 | 해수 유동을 고려한 소화포 제어 방법 및 그를 위한 장치 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50136333A (de) * | 1974-04-17 | 1975-10-29 | ||
JPS53110376A (en) * | 1977-03-09 | 1978-09-27 | Hitachi Ltd | Resist coating method |
JPS5778140A (en) * | 1980-10-31 | 1982-05-15 | Hoya Corp | Forming method for photoresist film |
JPS5851514A (ja) * | 1981-09-22 | 1983-03-26 | Toshiba Corp | ウエハ露光方法及びその装置 |
JPS599919A (ja) * | 1982-07-08 | 1984-01-19 | M Setetsuku Kk | フオトレジストの塗布方法 |
JPS59151424A (ja) * | 1983-02-18 | 1984-08-29 | Hitachi Ltd | 塗布装置 |
JPS59155927A (ja) * | 1983-02-25 | 1984-09-05 | Matsushita Electric Ind Co Ltd | パタ−ン形成方法 |
JPS59155921A (ja) * | 1983-02-25 | 1984-09-05 | Fujitsu Ltd | レジストパタ−ンの形成方法 |
JPS59155925A (ja) * | 1983-02-25 | 1984-09-05 | Matsushita Electric Ind Co Ltd | 塗布装置および塗布方法 |
JPS59155930A (ja) * | 1983-02-25 | 1984-09-05 | Mitsubishi Electric Corp | 微細パタ−ンの形成方法 |
-
1985
- 1985-06-12 JP JP60126133A patent/JPS61285716A/ja active Pending
-
1986
- 1986-06-09 KR KR1019860004552A patent/KR900001665B1/ko not_active IP Right Cessation
- 1986-06-10 DE DE8686107872T patent/DE3678868D1/de not_active Expired - Lifetime
- 1986-06-10 US US06/872,506 patent/US4738910A/en not_active Expired - Fee Related
- 1986-06-10 EP EP86107872A patent/EP0205148B1/de not_active Expired - Lifetime
- 1986-06-11 CN CN86103644A patent/CN86103644B/zh not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0205148A3 (en) | 1988-12-28 |
EP0205148A2 (de) | 1986-12-17 |
KR870000748A (ko) | 1987-02-20 |
EP0205148B1 (de) | 1991-04-24 |
KR900001665B1 (ko) | 1990-03-17 |
CN86103644A (zh) | 1987-04-29 |
JPS61285716A (ja) | 1986-12-16 |
US4738910A (en) | 1988-04-19 |
CN86103644B (zh) | 1988-11-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |