DE3303593A1 - Electronic circuit component - Google Patents

Abstract

A thin-film IC chip (5), a resistor (7) and the like are mounted on a substrate (15) consisting of ceramic material having a low dielectric constant, such as aluminium oxide and the like, which also has a high mechanical strength but a low chemical reactivity. The substrate (15) has electrodes (2, 12) on its circumference. Arranged above the substrate (15) is a capacitor part (1) which has only one connecting electrode (11) and consists of a ceramic material with a high dielectric constant. The capacitor part (1) forms the top layer, the substrate (15) forms a central layer, and a printed-circuit board (9) for wiring and for connection of the above parts to other electronic components is used as the bottom layer. In this way, parasitic capacitances which result from the connection to the printed-circuit board of electrodes which are not connected to the inner electrode of the capacitor part, are to a large extent reduced. <IMAGE>

Description

Electronic circuit component

The invention relates to an electronic circuit component with a ceramic capacitor part with high dielectric constant, which several Has capacitors and is provided on its periphery with a terminal, a Substrate made of a material with a low dielectric constant, on which a semiconductor element is attached and which has electrodes on its periphery, and with a circuit board for wiring and connecting the capacitor part with high dielectric constant and the substrate made of a low dielectric constant material other. electronic parts.

The invention relates in particular to an electronic circuit component, in which a capacitor made of ceramic material with a high dielectric constant in a thick film integrated circuit is included, wherein simultaneously a higher degree of integration and a higher density in housing the electronic circuit components in electronic devices and the like.

is strived for.

According to the prior art is in an integrated circuit component in thick film technology a ceramic layer capacitor 1 is provided, which thereby has been produced that a dielectric member is coated with an electrode in order to obtain a high degree of integration. This film capacitor serves as the base material of the integrated thick film circuit (hereinafter referred to as HIC referred to - high integrated circuit -), as shown in FIGS. 1 to 3. The known circuit component, which has been explained above, also contains a thin-film IC chip 5, which is formed on a laminated ceramic capacitor 1 by printing Electrode is attached by gluing or another connection technology. The as Base material used ceramic layer capacitor 1 has around its circumference distributed electrodes 2 for the HtC wiring, connecting wires 4 for connection of the thin film IC chip 5 with the electrodes 2 and an inner electrode 6, the arranged in the interior of the ceramic layer capacitor 1 and with a connection 11 is connected, which also serves to the thin film IC chip 5 with the to connect corresponding electrodes 8 of a circuit board 9 (Fig. 3). On the bottom of the ceramic layer capacitor 1 is a resistor 7. The bottom of the capacitor 1 is with a layer 21 (or a coating) Made of a material with a low dielectric constant, coated in order to achieve the to reduce parasitic capacitance between the electrodes 2 and the inner Electrode 6 is created, and also between electrodes 2 with one another. These Parasitic capacitance is caused by the high dielectric constant of the dielectric Material for the ceramic layer capacitor 1 caused. A covering 3 made of resin material or the like.

is placed over the thin film IC chip and the electrodes for protection 2 and the connection 11 are soldered to the electrodes 8 of the circuit board 9 at 10.

In the known structure, although the parasitic capacitance is through the layer or layer 21 made of glass material or the like. decreased to some extent nevertheless has a high parasitic capacitance with respect to the side surfaces of the ceramic layer capacitor 1 is generated because there is no layer coating on them is located. As a result, the electronic circuit, in particular the electronic Circuit for the thin film IC chip 5, adversely affected. In detail is the described disadvantage due to the fact that even the electrodes 2, not are connected to the capacitor electrode 6 in the ceramic layer capacitor 1, are formed on the side surfaces of the capacitor 1 so as to adhere to the electrodes 8 of the circuit board 9 can be connected. To eliminate the above Difficulties can also arise on the side surfaces of the ceramic layer capacitor 1 coatings made of glass material or the like. be attached, however, this prepares trouble in the formation of the coating associated with difficulties in manufacture.

The invention is based on the object of an electronic circuit component to create the type mentioned, in which the parasitic capacitance with a simple construction can be greatly reduced, while at the same time the through Printing, sintering or the like. Manufacturing costs caused can be reduced. aside from that the disadvantages caused by the low mechanical strength should be avoided a capacitor made of ceramic material with a high dielectric constant used as a base part result.

To solve this problem, the invention provides that the Capacitor part with a high dielectric constant arranged in a top layer is that the substrate is made of a low dielectric constant material is arranged in a middle layer and that the circuit board is the lowest layer forms, wherein the respective electrodes and connections are connected to one another are that the electronic circuit component is formed.

The invention provides an electronic circuit component which is shown in its dimensions are compact and functionally stable, and it is highly reliable having. The circuit component can be used to achieve circuits with a high packing density easy into various electrical and electronic devices or assemblies of devices can be used.

According to a preferred embodiment of the invention is an electronic Circuit component provided which has a capacitor part made of ceramic material with high Has dielectric constant and consists of several individual capacitances or individual capacitors consists.

This capacitor part is arranged with a on its circumference Provide connection. A substrate made from a low dielectric constant material is connected to a semiconductor element and has electrodes on its periphery on. The capacitor part made of a material with a high dielectric constant and the substrate made of a low dielectric constant material are electrical and mechanically connected to a circuit board to make connections to others Manufacture circuit elements.

The capacitor part forms the upper layer of the circuit component, the substrate of a low dielectric constant material forms one Middle layer and the printed circuit board forms the bottom layer, being the respective Electrodes and connections of the individual layers are connected to one another, to form the electronic circuit component.

In detail are according to a preferred embodiment of the invention a thin film IC chip, a resistor, etc. placed on a substrate made up of ceramic Material with a low dielectric constant, such as aluminum oxide or the like., And that a high mechanical strength, but a low chemical Has reactivity and is provided with electrodes on its periphery. Just the electrode and the connection actually required for the capacitor electrode are at the Capacitor part made of ceramic material with a high dielectric constant is provided. To form the electronic circuit component according to the invention, the capacitor part Made of ceramic material with a high dielectric constant in the top layer arranged, the substrate made of ceramic material with a low dielectric constant is placed in the middle layer and the circuit board for the connection and the connection of the above two parts to other electronic components is arranged in the lowest layer, with the respective connections and electrodes are connected to each other. This eliminates unwanted parasitic capacitances, the connection of not with an inner electrode of the capacitor part connected electrodes with the printed circuit board arise, considerably reduced.

In further preferred embodiments of the invention, in the Substrate formed from material with a low dielectric constant a recess or between the low dielectric constant substrate and the capacitor part with a high dielectric constant is an annular spacer made of ceramic Material with a low dielectric constant arranged so that between the Substrate and the condenser part forms a closed space is, in which the semiconductor element is arranged and sealed accordingly can be.

The arrangement described provides an improved electronic one Circuit component in which the disadvantages of the explained, comparable, known Circuit components are significantly reduced.

In the following, with reference to the drawings, exemplary embodiments the invention explained in more detail.

1 shows a schematic top view of a (already explained) conventional thick film integrated circuit component, Fig. 2 is a schematic Side view of the integrated circuit component according to FIG. 1, FIG. 3 shows a section of the integrated circuit component of Fig. 1 mounted on a printed circuit board Fig. 4 is a section through a preferred embodiment of the invention, and FIGS. 5, 6, 7 and 8 show similar representations as FIG. 4 of further embodiments.

4 shows an electronic component CA according to a first embodiment shown. The electronic component CA according to FIG. 4 has a substrate 15 a low dielectric constant ceramic material such as alumina or the like., which has a high mechanical strength, but a low chemical Has reactivity. The substrate 15 has two electrodes 2 and 12 for HIC connections (Connections in highly integrated circuit technology) and for connection to a Terminal 11 of a ceramic capacitor 1 with high dielectric constant on. On the substrate 15 there is a further electrode 20 on which a chip 5 is arranged with an electronic circuit in thin-film technology, as well as a Resistance element 7.

The chip 5 is connected to the electrodes 2 and 12 via wires 4. The capacitor 1 made of ceramic material with a high dielectric constant is only with an inner capacitor electrode 6 and the terminal 11 for connection to the Electrode 12 of the substrate 15 is provided and as the uppermost part above the substrate 15 arranged. The capacitor 1 is made up of an annular spacer 13 low dielectric constant ceramic material, e.g.

Alumina or the like., Held between the substrate 15 and the Capacitor part 1 is arranged and which has an electrode 14 which the Terminal 11 of capacitor part 1 connects to electrode 12 of substrate 15. The electrodes 2 and 12 of the substrate 15 are attached to corresponding electrodes 8 the circuit board 9 is soldered. The soldering points are labeled 10. The condenser part 1 made of high dielectric constant ceramic material, the annular spacer 13 and the low dielectric constant substrate 15 are bound by a binder 16 firmly and rigidly connected to one another.

The binder 16 that is between the annular spacer 13 and the substrate 15 and also between the spacer 13 and the capacitor part 1 is, for example, made of glass material.

The thin film IC chip 5 is closed in this way Space housed by the capacitor part 1, the annular spacer 13 and the substrate 15 is limited.

As a result of the annular spacer 13 between the capacitor part 1 and the substrate 15 is arranged, the electrode 2 of the substrate 15 is at the electrical Contact in the capacitor part 1 prevented, so that no noteworthy parasitic capacitance arises between the capacitor part 1 and the substrate 15.

Since in the embodiment of FIG. 4, the mechanical strength mainly caused by the substrate 15 made of ceramic material the capacitor part 1 itself does not need to be very strong and needs accordingly to have no additional reinforcement layers. That way will the number of printing and sintering processes required for production in one greatly reduced.

In Fig. 5 is a modification of the electronic circuit component CA of FIG. 4. In the modified component CB of FIG. 5, the ring-shaped Spacer 13 omitted. The substrate 15 has a recess V in which the thin film IC chip 5 is arranged. The electrodes 2 and 12 are extended so far, that they are on the inner wall of the recess V up to the vicinity of the edges of the IC chip 5 extend.

In the electronic component CB of FIG. 5, the electrode 2 becomes of the substrate 15 also from the capacitor part 1 through the binder layer 16 kept separate, so that there is no parasitic capacitance between these parts arises. Since the structure and the Effect of the modified electronic Component CB are otherwise the same as in component CA of FIG. 4, they will not explained again here to avoid repetition.

6 to 8 are further embodiments of the electronic Component CA of FIG. 4 is shown.

In the case of the modified electronic component CC of FIG. 6, this is the case Substrate 15 made of ceramic material with a low dielectric constant according to FIG 4 has been replaced by a laminated capacitor part 22 with a low dielectric constant and an inner electrode 23. The capacitor part 22 is with the electrodes 2 and 12 and the IC chip 5 is connected to the electrodes by wires 4.

The resistor 7, etc. is attached to the capacitor part 22, and the high dielectric constant capacitor part 1 is on the capacitor part 22, separated from this by the annular spacer 13, in the same way arranged as in the embodiment of FIG. 4. In the electronic component CC of Fig. 6, the electrode 2 is used for the layer capacitor part 22 with lower Dielectric constant also for leading out the inner electrode 23, with to which she is connected. The capacitor part 22 is suitable because of the small parasitic Capacity especially as a substrate for semiconductors and generally has a high capacity Mechanic solidity. Furthermore, depending on the respective requirements Coatings made of glass material or the like. on the opposite surfaces of the capacitor part 22 are applied.

In the embodiment of FIG. 6, too, between the capacitor part 1 and the capacitor part 22 no larger parasitic capacitances are formed because these parts are sufficiently separated from one another by the annular spacer 13 are.

In the electronic component CD of FIG. 7, the annular spacer is 13 of low dielectric constant, as in the embodiment CA of FIG Fig. 4, has been replaced by a spacer 25, which consists of a film capacitor consists of ceramic material with a low dielectric constant. This capacitor has an inner electrode 23 'with one on the outside of the capacitor attached electrode 24 is connected and via this with the electrode 2 of the substrate 15 is made of ceramic material with a low dielectric constant in connection. Since the capacitor 1 is made of ceramic material with a high dielectric constant of the ceramic material of the low dielectric constant substrate 15 through the spacer 25 is separated, which consists of a sheet capacitor made of material with a low dielectric constant, the parasitic capacitance is between the ceramic capacitor 1 and the substrate 15, as in the case of the component CC of Fig. 6, sufficiently small.

-The circuit components CC and CD of Figs. 6 and 7 each have two types of capacitor parts, namely the film capacitor 1 with high Dielectric constant and the film capacitor 22 (Fig. 6) or 25 (Fig. 7) with low dielectric constant.

It can therefore be selected circuit elements that have a capacitance have within a very large range. For example, the capacitor has 22 or 25 with a low dielectric constant generally have a capacitance in the range from about 10 to 10 9F (1 pF to 1000 pF), while the layer capacitor 1 with high Dielectric constant has a capacitance in the range of 10 ## 9 to 10 6 F (1000 pF to 1 #F), whereby this only indicates the order of magnitude.

In Fig. 8 is another modification of the electronic component CA of FIG. 4.

In the electronic component CE of FIG. 8, the film capacitor is 1 with a high dielectric constant from the exemplary embodiment in FIG. 4 in addition nor with coatings 21 made of a glass material or the like.

provided on its opposite major surfaces, wherein the electrode 11 and the resistors 26 and 27 in the manner shown on these Coatings are arranged. Usually the size of the resistor 7 needs to be large compared to that of the IC chip 5 and the film capacitor 1. In In many cases, that on the underside of the substrate 15 with a low dielectric constant is sufficient attached resistance. The exemplary embodiment serves to remedy this of FIG. 8.

Especially when the resistors are arranged in the order in which the circuit functions in Danger are through parasitic Capacities to be adversely affected (i.e. in the order of the smaller parasitic capacitance) there is the possibility of several resistances in the form of the To include resistors 7, 26 and 27 in the circuit component CE of FIG.

Since, moreover, the structure and mode of operation of the electronic Components CC to CE of FIGS. 6 to 8 correspond to the exemplary embodiment of component CA of 4, their explanations will not be repeated again.

In the embodiments described, it is not absolutely necessary Coatings made of glass material or the like. on the top and bottom of the condenser part to be attached, as is the case with conventional constructions. To this In this way, unsafe processing steps such as printing and sintering are avoided, while the parasitic capacitance which adversely affects the electronic circuits Tenth to hundredth pressed down and thus made negligibly small will. Furthermore, it is normally required to increase mechanical strength There is no need to increase the thickness of the high dielectric constant material. There is also no sealing with resin, etc.

required to protect the IC chip.

As can be seen from the above description, the invention leads to electronic switching modules with which it is possible to create an improved hybrid integrated circuit with high mechanical strength with simple Achieve structure, with the parasitic capacitance despite the installation of capacitor parts is greatly reduced. At the same time the cost of printing, sintering and the like reduced.

Claims (8)

CLAIMS t Electronic circuit component with a ceramic Capacitor part with high dielectric constant, which has several capacitors and is provided on its periphery with a terminal, a substrate a low dielectric constant material to which a semiconductor element is attached and which has electrodes on its periphery, and with a circuit board for wiring and connecting the capacitor part with high dielectric constant and the substrate made of a low dielectric constant material other electronic parts that are not indicated the capacitor part (1) with a high dielectric constant in a top layer is arranged that the substrate (15) made of a material with a low dielectric constant is arranged in a middle layer, and that the circuit board (9) is the lowermost Layer forms, the respective electrodes and connections to each other so are connected that the electronic circuit component is formed. 2. Electronic circuit component according to claim 1, characterized in that that the substrate (15) made of material with a low dielectric constant has a recess (V) in which the semiconductor element (5) is arranged, and that the semiconductor element (5) is enclosed in the recess (V) by a binder, which the substrate (15) connects to the capacitor part (1). 3. Electronic circuit component according to claim 1 or 2, characterized characterized in that the substrate (15) consists of a ceramic material. 4. Electronic circuit component according to one of claims 1 to 3, characterized in that other elements, such as resistors, Semiconductors and the like are attached, and that the substrate (15) has electrodes on its periphery (2.12). 5. Electronic circuit component according to one of claims 1 to 4, characterized in that between the substrate (15) with a low dielectric constant and the high dielectric constant capacitor part (1) is made of a ceramic material with low dielectric constant existing annular spacers (13) is arranged having only one connection terminal (14) that the semiconductor element (5) in one of the substrate (15), the capacitor part (1) and the spacer (13) enclosed space is arranged and that the enclosed space by a binder (16) is sealed, through which the substrate (15) made of ceramic material with lower Dielectric constant, the capacitor part (1) made of ceramic material with high Dielectric constant and the spacer (13) are interconnected. 6. Electronic circuit component according to one of claims 1 to 5, characterized in that the substrate (15) made of a material with lower Dielectric constant a capacitor consisting of several individual capacitances (22) is made of low dielectric constant ceramic material. 7. Electronic circuit component according to one of claims 1 to 6, characterized in that the spacer consists of one of several individual capacities existing capacitor (25) made of ceramic material with a low dielectric constant consists. 8. Electronic circuit component according to one of claims 1 to 7, characterized in that the existing from emhreren individual capacities Capacitor part (1) resistor elements (26, 27) are attached.