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DE3366648D1 - Thermally conducting filler for enclosing electrical components - Google Patents

Thermally conducting filler for enclosing electrical components

Info

Publication number
DE3366648D1
DE3366648D1 DE8383307923T DE3366648T DE3366648D1 DE 3366648 D1 DE3366648 D1 DE 3366648D1 DE 8383307923 T DE8383307923 T DE 8383307923T DE 3366648 T DE3366648 T DE 3366648T DE 3366648 D1 DE3366648 D1 DE 3366648D1
Authority
DE
Germany
Prior art keywords
electrical components
thermally conducting
conducting filler
enclosing electrical
enclosing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383307923T
Other languages
German (de)
Inventor
Charles Lien
Derek Wayne Whitehead
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ferranti International PLC
Original Assignee
Ferranti PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23815819&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3366648(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ferranti PLC filed Critical Ferranti PLC
Application granted granted Critical
Publication of DE3366648D1 publication Critical patent/DE3366648D1/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • H01B3/465—Silicone oils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8383307923T 1983-01-11 1983-12-22 Thermally conducting filler for enclosing electrical components Expired DE3366648D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US45719983A 1983-01-11 1983-01-11

Publications (1)

Publication Number Publication Date
DE3366648D1 true DE3366648D1 (en) 1986-11-06

Family

ID=23815819

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383307923T Expired DE3366648D1 (en) 1983-01-11 1983-12-22 Thermally conducting filler for enclosing electrical components

Country Status (2)

Country Link
EP (1) EP0114000B1 (en)
DE (1) DE3366648D1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3446585A1 (en) * 1984-12-20 1986-07-03 Stanley Electric Co Ltd METHOD FOR PRODUCING A PUSHED ELECTRONIC CIRCUIT ARRANGEMENT
US5098609A (en) * 1989-11-03 1992-03-24 The Research Foundation Of State Univ. Of N.Y. Stable high solids, high thermal conductivity pastes
DE69709978T2 (en) * 1996-04-30 2002-11-21 Denki Kagaku Kogyo K.K., Tokio/Tokyo Heat dissipating spacers for electronic devices
EP0951207B1 (en) * 1998-03-23 2000-12-20 Di Boer Fabrizio & C. SNC Negesat Protective housing for space applications
TWI251320B (en) * 2003-07-04 2006-03-11 Fuji Polymer Ind Thermal conductive composition, a heat-dissipating putty sheet and heat-dissipating structure using the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE565347A (en) * 1957-03-04
US3137665A (en) * 1960-11-28 1964-06-16 Dow Corning Highly filled vinyl polysiloxane potting composition
DE1439456A1 (en) * 1964-10-15 1969-05-29 Siemens Ag Semiconductor component with housing
BE755079A (en) * 1969-08-21 1971-02-22 Ciba Geigy Method and device for impregnating articles or parts, in particular electrical windings, by means of hardenable masses of cast resin
US3885984A (en) * 1973-12-18 1975-05-27 Gen Electric Methyl alkyl silicone thermoconducting compositions
US4265775A (en) * 1979-08-16 1981-05-05 International Business Machines Corporation Non-bleeding thixotropic thermally conductive material

Also Published As

Publication number Publication date
EP0114000B1 (en) 1986-10-01
EP0114000A1 (en) 1984-07-25

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8331 Complete revocation