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DE3107079A1 - Partial coating of contact components with noble metals - Google Patents

Partial coating of contact components with noble metals

Info

Publication number
DE3107079A1
DE3107079A1 DE19813107079 DE3107079A DE3107079A1 DE 3107079 A1 DE3107079 A1 DE 3107079A1 DE 19813107079 DE19813107079 DE 19813107079 DE 3107079 A DE3107079 A DE 3107079A DE 3107079 A1 DE3107079 A1 DE 3107079A1
Authority
DE
Germany
Prior art keywords
contact
contact components
partial coating
pastes
electrical contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813107079
Other languages
German (de)
Inventor
Günther Dr.-Ing. 8000 München Menzel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19813107079 priority Critical patent/DE3107079A1/en
Publication of DE3107079A1 publication Critical patent/DE3107079A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/06—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
    • H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
    • H01H11/041—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts by bonding of a contact marking face to a contact body portion

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

Method of automatably and controllably producing locally limited electrical contact surface on contact components using the known, freely programmable recording mechanism of the ink-jet printer. The noble metal is applied to the contact components to form locally limited electrical contact areas in the form of an organometallic compound or as an oxide- or metal-containing screen-printing paste, conductor-track paste, resistor paste or glass solder.

Description

Partielle Beschichtung von Kontaktbauteilen mit Edel-Partial coating of contact components with noble

metallen.metals.

Die Erfindung betrifft ein Verfahren zur automatisierbaren und steuerbaren Herstellung lokal begrenzter elektrischer Kontaktflächen auf Kontaktbauteilen.The invention relates to a method for automatable and controllable Production of locally limited electrical contact surfaces on contact components.

Bisher werden Stromkontakte in Edelmetall - bevorzugt Gold, Silber, Platin, Palladium - ausgeführt. Diese Werkstoffe verbinden weitgehende Beständigkeit gegen die Einwirkung der AtmosphEre mit guter elektrischer Leitfähigkeit. Die oft angewendete kostensparende VerdUnnung des Goldes durch Legierung mit Unedelmetallen oder die galvanische Aufbringung in dünner Schicht beeinträchtigen Leitfähigkeit und Anlauffestigkeit des Kontaktwerkstoffes ohne Verschleißfestigkeit und Haftverhalten entscheidend zu verbessern. Dies gilt sinngemäß auch für die Gruppe der Platinmetalle, bei denen als störend ihre katalytische Wirksamkeit auf organische Dämpfe (Polymerisation zu isolierenden Deckschichten) hinzukommt.So far, current contacts are made of precious metal - preferably gold, silver, Platinum, palladium - executed. These materials combine extensive durability against the influence of the atmosphere with good electrical conductivity. Often applied cost-saving dilution of gold by alloying it with base metals or the galvanic application in a thin layer impair conductivity and tarnish resistance of the contact material without wear resistance and adhesive behavior to improve decisively. This also applies analogously to the group of platinum metals, in which their catalytic effectiveness on organic vapors (polymerisation to insulating cover layers) is added.

Elektrische Kontakte müssen einen niedrigen Übergangs- -widerstand besitzen und dürfen auch bei langem Einsatz keine den elektrischen Widerstand vergrößernde Reaktionen durch Umwelteinflüsse eingehen (z. B. Oxidation). Um durch Materialeinsparungen im Falle der Verwendung von Edelmetallen die Kosten zu senken, werden deshalb z. B.Electrical contacts must have a low transition resistance have and must not have any increase in electrical resistance even after long periods of use Enter into reactions through environmental influences (e.g. oxidation). To through material savings to reduce costs in the case of the use of precious metals, z. B.

folgende Maßnahmen durchgeführt: Die Größe der elektrischen Kontakte wird auf ein Minimum reduziert.The following measures are carried out: The size of the electrical contacts is reduced to a minimum.

Bisher massive Edelmetallkontakte werden nach Mög- lichkeit so ausgeführt, daß nur die Oberflächenbeschichtung aus Edelmetall ist. Previously massive precious metal contacts will be opportunity designed so that only the surface coating is made of precious metal.

Es werden bei galvanischen Beschichtungsverfahren nur diejenigen Flächen mit Edelmetall beschichtet, die zur elektrischen Kontaktierung unbedingt notwendig sind, z. B. durch verschieden tiefes Eintauchen des Kontaktbauteiles in das galvanische Bad oder durch Belackung der nicht zu beschichtenden Flächen der Kontaktbauteile (Fotolack, Maskentechnik). In the case of electroplating processes, only those are used Surfaces coated with precious metal, which are essential for electrical contact are necessary, e.g. B. by immersing the contact component in different depths the galvanic bath or by varnishing the surfaces that are not to be coated Contact components (photoresist, mask technology).

Diese letztgenannte partielle galvanische Abscheidung von Edelmetallen ist ein sehr aufwendiges Verfahren, da der galvanischen Beschichtung viele Prozeßschritte wie Belackung, Belichtung über Masken usw. vorangehen.This last-mentioned partial electrodeposition of precious metals is a very complex process, as the electroplating process involves many process steps such as varnishing, exposure via masks, etc. proceed.

In der DE-OS 1 802 932 ist ein Verfahren zur Herstellung eines elektrischen Schaltkontaktes beschrieben und dargestellt. Dabei wird ein metallischer Werkstoff oder eine Legierung mittels einer Hochfrequenz-Plasma-Entladung in einem gasdicht abgeschlossenen Gehäuse, in dem z. B. eine reine Edelgasatmosphäre aufrechterhalten wird, zerstäubt und auf dem Träger eine Kontaktschicht aus dem zerstäubten Material niedergeschlagen. Das Aufstäubeverfahren bietet den Vorteil, daß die zu beschichtenden Flächen keinen erhöhten Temperaturen ausgesetzt zu werden brauchen. Thermisch empfindliche Materialien (z. B.In DE-OS 1 802 932 a method for producing an electrical Switching contact described and shown. A metallic material is used or an alloy by means of a high-frequency plasma discharge in a gas-tight closed housing in which z. B. maintain a pure inert gas atmosphere is, atomized and a contact layer made of the atomized material on the carrier dejected. The sputtering process has the advantage that the to be coated Surfaces do not need to be exposed to elevated temperatures. Thermally sensitive Materials (e.g.

Kunststoffe) und wärmebehandelte Werkstoffe, wie gehärtete Stähle, ausgehärtete Legierungen, wie Kupfer-Beryllium und ähnliche, die zu auf Ausscheidungshärtung beruhen, werden damit einem Beschichtungsprozeß zur Oberflächenvergütung zugänglich. Nachteile des Verfahrens: Alle in der Apparatur vorhandenen Teile werden beschichtet, sofern sie nicht abgedeckt sind (Materialverlust); darüberhinaus erfolgt die Schichtabscheidung sehr langsam und damit unrationell.Plastics) and heat-treated materials such as hardened steels, Hardened alloys, such as copper beryllium and the like, which are subject to precipitation hardening are based, thus a coating process for surface finishing are accessible. Disadvantages of the process: All parts in the equipment are coated, if they are not covered (loss of material); in addition, the layer is deposited very slowly and therefore inefficient.

Der Erfindung liegt die Aufgabe zugrunde, mit möglichst einfachen Mitteln das eingangs beschriebene Verfahren zu realisieren. Diese Aufgabe wird dadurch gelöst, daß zur partiellen Beschichtung von Kontaktbauteilen mit Edelmetallen ein an sich bekanntes Schreibwerk eines Tintenstrahldruckers Anwendung findet.The invention is based on the object with the simplest possible Means to implement the method described above. This is what makes this job solved that for the partial coating of contact components with precious metals known writing mechanism of an inkjet printer is used.

Unter einem im Sinne der Erfindung verwendeten Tintenstrahldrucker soll im folgenden ein an sich zum. Schnelldrucken auf Papier mittels computergesteuerter Schreibstationen (sogenannten Terminals) entwickeltes Druckgerät verstanden werden. Eine Ubersicht über die bisher entwickelten Typen, ihren Aufbau und ihre Arbeitsweise findet man in der "Siemens Zeitschriftn 51. Jahrgang, Heft 4, Seiten 219 bis 221 vom April 1977.Among an inkjet printer used in the context of the invention should in the following be an in itself to. Fast printing on paper by means of computer-controlled Writing stations (so-called terminals) developed printing device are understood. An overview of the types developed so far, their structure and how they work can be found in the "Siemens Zeitschriftn 51st volume, issue 4, pages 219 to 221 dated April 1977.

Abgesehen davon, daß ein Verfahren nach der Erfindung die in der Aufgabe festgehaltenen Anforderungen erfüllt, besteht ein weiterer Vorteil der Erfindung darin, daß durch die Verwendung eines Schreibwerks für Tintendruck die Zuverlässigkeit eines ausgereiften Serienproduktes übernommen werden kann.Apart from the fact that a method according to the invention in the task meets the specified requirements, there is a further advantage of the invention in that by using a writing mechanism for ink printing the reliability of a mature series product can be taken over.

Nach einer Weiterbildung der Erfindung werden mit dem.According to a development of the invention with the.

Schreibwerk metallorganische Verbindungen bzw. oxid- oder metallhaltige Siebdruckpasten, Leiterbahnpasten, Widerstandspasten oder Glaslote in geeigneter Verdünnung auf die Kontaktbauteile, die z. B. aus Federwerkstoff oder Keramik bestehen, zu lokal begrenzten elektrischen Kontaktflächen aufgebracht.Writing organometallic compounds or those containing oxides or metals Screen printing pastes, conductor track pastes, resistance pastes or glass solders in suitable Dilution on the contact components, the z. B. consist of spring material or ceramic, applied to locally limited electrical contact surfaces.

Nach der Erfindung befindet sich das Kontaktbauteil auf höherer Temperatur, so daß sich die metallorganische Verbindung beim Auftreffen auf das Bauteil zersetzt und das Edelmetall als Kontaktmaterial zurückbleibt.According to the invention, the contact component is at a higher temperature, so that the organometallic compound decomposes when it hits the component and the noble metal remains as a contact material.

Der Vorteil des Verfahrens liegt insbesondere darin be- gründe, daß die Abmessungen der zu beschichtenden elektrischen Kontaktflächen über einen mit dem Schreibwerk gekoppelten Rechner exakt steuerbar sind und deshalb in Jedem Fall minimal gehalten werden können. Die elektrische Kontaktfläche wird daher nur so groß, wie die elektrische Kontaktierung es unbedingt erfordert.The particular advantage of the process is that it reasons, that the dimensions of the electrical contact surfaces to be coated over a computers coupled with the writing unit are precisely controllable and therefore in everyone Fall can be kept to a minimum. The electrical contact area is therefore only as large as the electrical contact absolutely requires.

Somit lassen sich wesentliche Edelmetalleinsparungen im Vergleich zu bisherigen Verfahren erzielen.Thus, significant precious metal savings can be compared to achieve previous procedures.

Im Falle. des Glaslotes' ist die partielle Aufbringung bevorzugt in Zusammenhang mit der Herstellung von Flüssigkristallanzeigen (display) zu sehen.In the event of. of the glass solder, the partial application is preferred in To be seen in connection with the production of liquid crystal displays (display).

3 Patentansprüche 3 claims

Claims (3)

Patentansprüche.Claims. Verfahren zur automatisierbaren und steuerbaren Herstellung lokal begrenzter elektrischer Kontaktflächen auf Kontaktbauteilen, d a d u r c h g e k e n n z e i c h -n e t , daß zur partiellen Beschichtung von Kontaktbauteilen mit Edelmetallen ein an sich bekanntes Schreibwerk eines Tintenstrahldruckers Anwendung findet. Process for automatable and controllable production locally limited electrical contact areas on contact components, d u r c h g e k e n n z e i c h -n e t that for the partial coating of contact components with Precious metals a known writing mechanism of an inkjet printer application finds. 2. Verfahren nach Anspruch 1, d a d ur c h g e -k e n n z e i c h n e t , daß mit dem Schreibwerk metallorganische Verbindungen bzw. oxid- oder metallhaltige Siebdruckpasten, Leiterbahnpasten, Widerstandspasten oder Glaslote verarbeitet werden.2. The method according to claim 1, d a d ur c h g e -k e n n z e i c h n e t that with the writing mechanism organometallic compounds or oxide or metal-containing compounds Screen printing pastes, conductor track pastes, resistance pastes or glass solder can be processed. 3. Verfahren nach den AnsprUchen 1 und 2, d a d u r c h g e k e n n z e i c h n e t , daß sich das Kontaktbauteil auf höherer Temperatur befindet.3. The method according to claims 1 and 2, d a d u r c h g e k e n It should be noted that the contact component is at a higher temperature.
DE19813107079 1981-02-25 1981-02-25 Partial coating of contact components with noble metals Withdrawn DE3107079A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813107079 DE3107079A1 (en) 1981-02-25 1981-02-25 Partial coating of contact components with noble metals

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Application Number Priority Date Filing Date Title
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0110641A1 (en) * 1982-11-19 1984-06-13 E.I. Du Pont De Nemours And Company Process for electrical terminal contact metallisation
DE3434334A1 (en) * 1984-09-19 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart METHOD FOR APPLYING SUSPENSIONS OF BURNABLE SOLIDS TO CERAMIC OR GLASS SUBSTRATES, AND DEVICE FOR CARRYING OUT THE METHOD
DE3804483A1 (en) * 1987-02-16 1988-08-25 Crouzet Sa PRESSURE GAUGE WITH PIEZOMETER STRIP
US5114744A (en) * 1989-08-21 1992-05-19 Hewlett-Packard Company Method for applying a conductive trace pattern to a substrate
DE19529928A1 (en) * 1995-08-01 1997-02-06 Wago Verwaltungs Gmbh Mfg. electrotechnical components provided with contact coating - with selective induction heating of predetermined contact regions of the component before contact materials are melted onto them
WO2001003183A2 (en) * 1999-07-06 2001-01-11 Ekra Eduard Kraft Gmbh Method for applying connecting materials for connecting a microchip and a substrate and utilization of a printing head working according to the ink printing principle
WO2005087497A2 (en) * 2004-03-12 2005-09-22 Siemens Aktiengesellschaft 3d-ink jet structuring of highly topographic surfaces
EP1845382A1 (en) * 2005-01-31 2007-10-17 National Institute of Advanced Industrial Science and Technology Probe card and method for manufacturing same

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0110641A1 (en) * 1982-11-19 1984-06-13 E.I. Du Pont De Nemours And Company Process for electrical terminal contact metallisation
DE3434334A1 (en) * 1984-09-19 1986-03-27 Robert Bosch Gmbh, 7000 Stuttgart METHOD FOR APPLYING SUSPENSIONS OF BURNABLE SOLIDS TO CERAMIC OR GLASS SUBSTRATES, AND DEVICE FOR CARRYING OUT THE METHOD
DE3804483A1 (en) * 1987-02-16 1988-08-25 Crouzet Sa PRESSURE GAUGE WITH PIEZOMETER STRIP
US5114744A (en) * 1989-08-21 1992-05-19 Hewlett-Packard Company Method for applying a conductive trace pattern to a substrate
DE19529928A1 (en) * 1995-08-01 1997-02-06 Wago Verwaltungs Gmbh Mfg. electrotechnical components provided with contact coating - with selective induction heating of predetermined contact regions of the component before contact materials are melted onto them
WO2001003183A2 (en) * 1999-07-06 2001-01-11 Ekra Eduard Kraft Gmbh Method for applying connecting materials for connecting a microchip and a substrate and utilization of a printing head working according to the ink printing principle
WO2001003183A3 (en) * 1999-07-06 2001-05-25 Ekra Eduard Kraft Gmbh Method for applying connecting materials for connecting a microchip and a substrate and utilization of a printing head working according to the ink printing principle
WO2005087497A2 (en) * 2004-03-12 2005-09-22 Siemens Aktiengesellschaft 3d-ink jet structuring of highly topographic surfaces
WO2005087497A3 (en) * 2004-03-12 2006-05-04 Siemens Ag 3d-ink jet structuring of highly topographic surfaces
EP1845382A1 (en) * 2005-01-31 2007-10-17 National Institute of Advanced Industrial Science and Technology Probe card and method for manufacturing same
EP1845382A4 (en) * 2005-01-31 2010-06-23 Nat Inst Of Advanced Ind Scien Probe card and method for manufacturing same

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