DE29916398U1 - Belt strap for transporting and feeding the components to an assembly device - Google Patents
Belt strap for transporting and feeding the components to an assembly deviceInfo
- Publication number
- DE29916398U1 DE29916398U1 DE29916398U DE29916398U DE29916398U1 DE 29916398 U1 DE29916398 U1 DE 29916398U1 DE 29916398 U DE29916398 U DE 29916398U DE 29916398 U DE29916398 U DE 29916398U DE 29916398 U1 DE29916398 U1 DE 29916398U1
- Authority
- DE
- Germany
- Prior art keywords
- components
- belt
- assembly device
- transporting
- belt strap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010408 film Substances 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229920003043 Cellulose fiber Polymers 0.000 claims description 7
- 239000013039 cover film Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000007600 charging Methods 0.000 description 1
- 238000007786 electrostatic charging Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 229910021653 sulphate ion Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D73/00—Packages comprising articles attached to cards, sheets or webs
- B65D73/02—Articles, e.g. small electrical components, attached to webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D2565/00—Wrappers or flexible covers; Packaging materials of special type or form
- B65D2565/38—Packaging materials of special type or form
- B65D2565/381—Details of packaging materials of special type or form
- B65D2565/382—Details of packaging materials of special type or form made of special paper
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packages (AREA)
Description
richtunqdirection
Beschreibung
Die Erfindung betrifft ein Gurtband gemäß dem Oberbegriff des Anspruchs 1. Description
The invention relates to a belt strap according to the preamble of claim 1.
Derartige Gurtbänder nehmen Halbleiterbauelemente auf, so daß diese Halbleiterbauelemente einfach zu Leiterplatten-Bestückungseinrichtungen transportiert werden können. Darüber hinaus werden die Gurtbänder in Bestückungseinrichtung eingelegt und die Halbleiterbauelemente aus dem Gurtband zur Bestückung der Leiterplatten herausgenommen.Such belts hold semiconductor components so that these semiconductor components can be easily transported to circuit board assembly equipment. In addition, the belts are inserted into the assembly equipment and the semiconductor components are removed from the belt for assembly onto the circuit boards.
Bekannte Gurtbänder bestehen aus Kunststoff oder Papier. Sie besitzen an einer Kante eine Perforierung und mittig Taschen, die durch Ausnehmungen gebildet sind, die beidseitig mittels der Folien abgedeckt werden.Common belt straps are made of plastic or paper. They have a perforation on one edge and pockets in the middle, which are formed by recesses that are covered on both sides by the film.
Diese bekannten Gurtbänder haben ein bestimmtes Schrumpfungsverhalten, insbesondere in feuchter oder heißer Atmosphäre; die Bauteile können in den bekannten Gurtbändern nicht allzu lange aufbewahrt werden. Gurtbänder aus Kunststoff sind darüber hinaus der Gefahr unterworfen, daß sie sich statisch aufladen. Bei Verwendung von Gurtbändern aus Papier besteht das Problem, daß bei der Bestückung Staub entsteht, weswegen die Bestückungseinrichtung häufig gereinigt werden muß.These known belts have a certain shrinkage behavior, especially in humid or hot atmospheres; the components cannot be stored in the known belts for very long. Belts made of plastic are also subject to the risk of static charging. When using belts made of paper, there is the problem that dust is generated during assembly, which means that the assembly device has to be cleaned frequently.
Aufgabe der Erfindung ist es, ein Gurtband der eingangs genannten Art zu schaffen, bei dem die Nachteile vermieden sind.The object of the invention is to provide a belt strap of the type mentioned above in which the disadvantages are avoided.
• ··
Mp.-Nr. 99/679 : .· . : :2..t . \.: *..: 16. September 1999MP no. 99/679: .· . : :2..t . \.: *..: September 16, 1999
Insbesondere soll das Gurtband auch bei extremen Umgebungsbedingungen nicht schrumpfen; es soll antistatisch sein und es soll auch verhindert werden, daß die Bestückungseinrichtung verschmutzt.In particular, the belt should not shrink even under extreme environmental conditions; it should be antistatic and it should also prevent the assembly equipment from becoming dirty.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß das Gurtband aus zu Preßspanmaterial verarbeiteten Zellulosefasern hergestellt ist.This object is achieved according to the invention in that the belt strap is made of cellulose fibres processed into pressboard material.
Weitere vorteilhafte Ausgestaltungen der Erfindung sind den weiteren Unteransprüchen zu entnehmen.Further advantageous embodiments of the invention can be found in the further subclaims.
Anhand der Zeichnung, in der ein Ausführungsbeispiel der Erfindung dargestellt ist, sollen die Erfindung sowie weitere vorteilhafte Ausgestaltungen und Verbesserungen der Erfindung näher erläutert und beschrieben werden.The invention and further advantageous embodiments and improvements of the invention will be explained and described in more detail with reference to the drawing, in which an embodiment of the invention is shown.
Es zeigen:Show it:
Fig. 1 eine Aufsicht auf ein erfindungsgemäßes Gurtband und Fig. 2 eine Schnittansicht gemäß Schnittlinie H-Il nach EJestückung mit Halbleiterbauelementen und beidseitiger Beklebung mit je einer Abdeckfolie.Fig. 1 is a plan view of a belt strap according to the invention and Fig. 2 is a sectional view according to section line H-II after assembly with semiconductor components and both sides with a cover film each.
Das erfindungsgemäße Gurtband 10 besitzt etwa in seiner Mitte eine Reihe von Ausnehmungen 11, die bei der Ausgestaltung gemäß Fig. 1 eine Rechteckform besitzen; anstatt einer Rechteckform kann natürlich auch eine Kreisform oder eine sonstige Umfangsform vorgesehen sein, je nach Art und Gestalt der Halbleiterbauelemente. The belt strap 10 according to the invention has a series of recesses 11 approximately in its middle, which have a rectangular shape in the embodiment according to Fig. 1; instead of a rectangular shape, a circular shape or another circumferential shape can of course also be provided, depending on the type and shape of the semiconductor components.
An einer Längskante zwischen der Reihe der Ausnehmungen 11 und der Längskante befinden sich Perforierungslöcher 12, die zum Transport bzw. Weiterbeförderung des Gurtbandes in einer Bestückungseinrichtung dienen.On a longitudinal edge between the row of recesses 11 and the longitudinal edge there are perforation holes 12 which serve for transporting or further conveying the belt in a loading device.
Aus Fig. 2 ist ersichtlich, daß das Gurtband 10 eine bestimmte Dicke D aufweist; die Dicke D ist so bemessen, daß in die Ausnehmungen 11 Halbleiterbauelemente 13, 14 eingesetzt werden können und das Gurtband 10 nicht überragen.From Fig. 2 it can be seen that the belt strap 10 has a certain thickness D; the thickness D is dimensioned such that semiconductor components 13, 14 can be inserted into the recesses 11 and do not protrude beyond the belt strap 10.
Mp.-Nr. 99/679Mp. No. 99/679
• ··
• ··
16. September 199916 September 1999
Innerhalb der Ausnehmungen 11 werden die Bauelemente 13, 14 dadurch gehalten, daß das Gurtband 10 beidseitig von einer Abdeckfolie 15 und 16 abgedeckt sind. Dadurch bilden sich Höhlungen 17, in denen die Bauteile 13, 14 praktisch luftdicht eingeschlossen sind.The components 13, 14 are held within the recesses 11 by the fact that the belt strap 10 is covered on both sides by a covering film 15 and 16. This forms cavities 17 in which the components 13, 14 are enclosed in a practically airtight manner.
Die Folie 15 kann eine Klarsichtfolie sein, wogegen die Folie 16 eine Abdeckfolie aus Papier ist und als sogenannte Bodenfolie dient. In der Bestückungseinrichtung wird die Folie 15 abgezogen und nach Entnahme der Halbleiterbauelemente 13, 14 kann das Gurtband 10 mit der Abdeckfolie 16 aus Papier weiter verwendet werden.The film 15 can be a transparent film, whereas the film 16 is a cover film made of paper and serves as a so-called base film. In the assembly device, the film 15 is removed and after the semiconductor components 13, 14 have been removed, the belt 10 with the cover film 16 made of paper can be used again.
Das Gurtband 10 besteht aus Preßspan, das heißt aus kalantriertem Preßpapier mit Sulfatzellulosefasern.The belt strap 10 consists of pressboard, i.e. of calendered press paper with sulphate cellulose fibres.
Dadurch ist eine Herstellung des Gurtbandes einfach. Man schlämmt die Zellulosefasern in Wasser auf, leitet die Pulpe durch ein sich drehendes Zylindersieb, wo sich die Zellulosefasern auf der Außenseite absetzen, und nimmt diese Zellulosefasern mittels eine Transportbandes ab. Die sich hierdurch bildende pappenartige Struktur wird einer Preß- und Heizungseinrichtung zugeführt, getrocknet, geschnitten, gestanzt und auf Rollen aufgerollt.This makes the production of the belt simple. The cellulose fibers are suspended in water, the pulp is passed through a rotating cylinder screen, where the cellulose fibers settle on the outside, and these cellulose fibers are removed using a conveyor belt. The cardboard-like structure that is formed in this way is fed into a pressing and heating device, dried, cut, punched and rolled up on rolls.
Das dadurch hergestellte Gurtband bietet eine Reihe von Vorteilen: Zum einen ist der Herstellungsprozeß, der dem Herstellungsprozeß von Papier, insbesondere Elektropapier, sehr ähnlich ist, einfach und umweltfreundlich. Der Preßspan-Gurtband hat ein optimales Schrumpfungsverhalten bei hohen Temperaturen und hoher Luftfeuchtigkeit, insoweit als das Gurtband kaum schrumpft oder sich ausdehnt. Innerhalb des Preßspan-Gurtbandes können die Bauteile lange Zeit aufbewahrt werden und eine elektrostatische Aufladung findet nicht statt. Bei der Verarbeitung der Gurtbänder, d.h. bei dem Bestückungsvorgang, bei dem die Bauelemente aus dem Gurtband herausgenommen und einer Leiterplatte zugeführt werden, entsteht wenig oder praktisch überhaupt kein Staub, so daß die Bestückungseinrichtung sehr selten gereinigt werden muß.The belt tape produced in this way offers a number of advantages: Firstly, the manufacturing process, which is very similar to the manufacturing process for paper, especially electrical paper, is simple and environmentally friendly. The pressboard belt tape has optimal shrinkage behavior at high temperatures and high humidity, in that the belt tape hardly shrinks or expands. The components can be stored for a long time inside the pressboard belt tape and electrostatic charging does not occur. During the processing of the belt tapes, i.e. during the assembly process in which the components are taken out of the belt tape and fed onto a circuit board, little or practically no dust is generated, so that the assembly device rarely needs to be cleaned.
Die Dicke der Gurtbänder beträgt vorzugsweise 0,6 bis 1.1 mm und die Breite 8 mm.The thickness of the straps is preferably 0.6 to 1.1 mm and the width 8 mm.
Mp.-Nr. 99/679 "· .·* . : :*!,.:. \.: \.: . 16. September 1999MP no. 99/679 "· .·* . : :*!,.:. \.: \.: . September 16, 1999
Es ist noch nachzutragen, daß die Reihe der Ausnehmungen 11 außermittig zur einen Längskante hin versetzt wird, so daß zwischen den Ausnehmungen und der anderen Längskante noch ausreichend Platz für die Transporterperforierung 12 vorhanden ist.It should also be added that the row of recesses 11 is offset off-center towards one longitudinal edge so that there is still sufficient space for the transporter perforation 12 between the recesses and the other longitudinal edge.
Das Preßspan-Material ermöglicht durch seine besondere Materialstruktur eine besonders hohe Stanzgenauigkeit, um exakten Vorschub bei Be- und Entladen der Bauteile zu gewährleisten.Due to its special material structure, the pressboard material enables particularly high punching accuracy in order to ensure exact feed when loading and unloading the components.
Außerdem ist die Festigkeit des Gurtbandes hoch, weil die Fasern ungerichtet, kreuz und quer, im Gurtband eingelagert sind.In addition, the strength of the webbing is high because the fibers are embedded in the webbing in an undirected, criss-cross pattern.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE29916398U DE29916398U1 (en) | 1999-09-17 | 1999-09-17 | Belt strap for transporting and feeding the components to an assembly device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE29916398U DE29916398U1 (en) | 1999-09-17 | 1999-09-17 | Belt strap for transporting and feeding the components to an assembly device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE29916398U1 true DE29916398U1 (en) | 2000-01-05 |
Family
ID=8079069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE29916398U Expired - Lifetime DE29916398U1 (en) | 1999-09-17 | 1999-09-17 | Belt strap for transporting and feeding the components to an assembly device |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE29916398U1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10140136A1 (en) * | 2001-08-16 | 2003-03-13 | Preh Elektro Feinmechanik | belt |
| EP1714901A1 (en) * | 2005-04-19 | 2006-10-25 | Hirschmann Automotive GmbH | Packaged igniter for a security device |
| DE102006020513B4 (en) * | 2006-05-03 | 2014-07-03 | Martin Prasch | High-performance standard device for flexible transport and handling of semiconductor components of different sizes |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3644367A1 (en) | 1985-12-28 | 1987-07-02 | Murata Manufacturing Co | ARRANGEMENT OF ELECTRONIC BLOCKS |
| DE3544158C2 (en) | 1984-12-24 | 1988-03-24 | Murata Mfg. Co., Ltd., Nagaokakyo, Kyoto, Jp | |
| US5597074A (en) | 1994-04-25 | 1997-01-28 | Ko; Seung S. | Packing tray of semiconductor devices and a method for manufacturing the same |
| US5857572A (en) | 1995-12-21 | 1999-01-12 | Bird; Gerald C. | Component carrier tape |
-
1999
- 1999-09-17 DE DE29916398U patent/DE29916398U1/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3544158C2 (en) | 1984-12-24 | 1988-03-24 | Murata Mfg. Co., Ltd., Nagaokakyo, Kyoto, Jp | |
| DE3644367A1 (en) | 1985-12-28 | 1987-07-02 | Murata Manufacturing Co | ARRANGEMENT OF ELECTRONIC BLOCKS |
| US5597074A (en) | 1994-04-25 | 1997-01-28 | Ko; Seung S. | Packing tray of semiconductor devices and a method for manufacturing the same |
| US5857572A (en) | 1995-12-21 | 1999-01-12 | Bird; Gerald C. | Component carrier tape |
Non-Patent Citations (2)
| Title |
|---|
| 6-127566 A.,M-1652,Aug. 9,1994,Vol.18,No.424 |
| JP Patents Abstracts of Japan: 4-142263 A.,M-1305,Sept. 4,1992,Vol.16,No.422 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10140136A1 (en) * | 2001-08-16 | 2003-03-13 | Preh Elektro Feinmechanik | belt |
| DE10140136B4 (en) * | 2001-08-16 | 2004-11-11 | Preh Gmbh | belt |
| EP1714901A1 (en) * | 2005-04-19 | 2006-10-25 | Hirschmann Automotive GmbH | Packaged igniter for a security device |
| DE102006020513B4 (en) * | 2006-05-03 | 2014-07-03 | Martin Prasch | High-performance standard device for flexible transport and handling of semiconductor components of different sizes |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R207 | Utility model specification |
Effective date: 20000210 |
|
| R163 | Identified publications notified |
Effective date: 20000217 |
|
| R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20021008 |
|
| R157 | Lapse of ip right after 6 years |
Effective date: 20060401 |