DE2828231A1 - Electronic component with adapted terminal wire - has ring-shaped bead section with asymmetric underside and cavity to suit printed circuit board connection - Google Patents
Electronic component with adapted terminal wire - has ring-shaped bead section with asymmetric underside and cavity to suit printed circuit board connectionInfo
- Publication number
- DE2828231A1 DE2828231A1 DE19782828231 DE2828231A DE2828231A1 DE 2828231 A1 DE2828231 A1 DE 2828231A1 DE 19782828231 DE19782828231 DE 19782828231 DE 2828231 A DE2828231 A DE 2828231A DE 2828231 A1 DE2828231 A1 DE 2828231A1
- Authority
- DE
- Germany
- Prior art keywords
- component according
- component
- circuit board
- annular bead
- underside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000011324 bead Substances 0.000 title claims abstract description 31
- 238000003780 insertion Methods 0.000 claims abstract description 7
- 230000037431 insertion Effects 0.000 claims abstract description 7
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 3
- 238000007654 immersion Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000003618 dip coating Methods 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 238000005538 encapsulation Methods 0.000 claims 1
- 238000000926 separation method Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/12—Protection against corrosion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1078—Leads having locally deformed portion, e.g. for retention
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10871—Leads having an integral insert stop
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10878—Means for retention of a lead in a hole
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Elektrisches Bauelement mit Anschlußdrähten zum Einstecken inElectrical component with connecting wires to be plugged into
Bohrungen einer Schaltungsplatte.Holes in a circuit board.
Die vorliegende Erfindung bezieht sich auf ein elektrisches Bauelement mit Anschlußdrähten zum Einstecken in Bohrungen einer Schaltungsplatte, wobei die Anschlußdrähte eilen Wulst zur ne-Begrenzung der Einstecktiefe aufweisen, insbesondere Keramikkondenstator, Derartige Bauelemente mit einem Ringwulst sind z.B. aus der DT-OS 23 46 340 bekannt. Bei diesem Wulst ist die untere Seite infolge der Art der Herstellung durch Tauchen in ein Zinnbad und gezielte Abkühlung und Erstarren des anhaftenden Zinns in Form einer umlaufenden Kehle ausgebildet.The present invention relates to an electrical component with connecting wires for insertion into holes in a circuit board, the Connecting wires rush to have bead to limit the insertion depth, in particular Ceramic capacitor, such components with an annular bead are e.g. from the DT-OS 23 46 340 known. In this bead, the lower side is due to the nature of the Production by immersion in a tin bath and targeted cooling and solidification of the adhering tin in the form of a circumferential groove.
Aus den DT-GN 77 09 932 ist es weiterhin bekannt, die Unterseite des Wulstes in Form eines Konus auszubilden und die Tauchumhüllung bis zur Oberseite des Wulstes vorzusehen.From the DT-GN 77 09 932 it is also known, the underside of the Form the bead in the form of a cone and the dip coating to the top of the bead to be provided.
Bei diesen Ausführungen wird infolge der konischen Ausbildung der Unterseite des Wulstes beim Einstecken der Anschlußdrähte in eine Bohrung einer gedruckten Schaltungsplatte, die Bohrung von eben wie durch eine konische Ventilscheibe abgedichtet.In these designs, due to the conical design of the Underside of the bead when inserting the connecting wires into a hole of a printed circuit board, the bore of just like through a conical valve disc sealed.
Dadurch können beim nachfolgenden Lötvergang, insbesondere beim Tauchlöten, die entstehenden Gase und Reste der Löthilfsnittel nicht nach oben entweishen. Die Folge davon können kalte Lötstellen sein, da die Gase ein Polster bilden, das die Zufuhr von Lötaetall zwischen Anschlußdraht und Leiterbahn verhindern kann.As a result, during the subsequent soldering process, especially when Dip soldering, Do not expose the resulting gases and residues of the soldering aid upwards. the This can result in cold solder joints, as the gases form a cushion that the Can prevent the supply of solder between the connecting wire and the conductor track.
Aufgabe der vorliegenden Erfindung ist es daher, Maßnahmen anzugeben, wie eine einwandfreie Lötung bei der Anordnung eines Wulstes am Anschlußdraht erreicht werden kann.The object of the present invention is therefore to specify measures how to achieve a perfect soldering when arranging a bead on the connecting wire can be.
Erfindungsgemäß wird dies dadurch erreicht, daß zumindest die Unterseite des Ringwulstes wenigstens eine Erhöhung aufweist.According to the invention this is achieved in that at least the underside of the annular bead has at least one increase.
Durch diese Maßnahme wird zwischen der oberen Kante der Bohrung und dem Wulstragd ein Spalt geschaffen, durch den beim Lötprozess entstehende Gase und Dämpfe entweicken können, sodaß das Lötmetall unten zum Anschlußdraht fließen und bei durchkontaktierten Schaltungsplatten in der Bohrung hochsteigen und bis zur Oberfläche der Schaltungsplatte gelangen kann.This measure is between the upper edge of the hole and the bead support created a gap through the gases and Vapors can escape, so that the solder flow down to the connecting wire and in the case of plated-through circuit boards rise up in the hole and up to Surface of the circuit board can get.
Weitere vorteilhafte Einzelheiten der Erfindung sind nachfolgend anhand der in der Zeichnung dargestellten Ausführungsbeispiele beschrieben.Further advantageous details of the invention are based on the following of the embodiments shown in the drawing.
Die Fig. 1; 3; 5 und 8 zeigen je eine Seitenansicht eines erfinddungsgemäßen Ausführungsbeispiels einen mit einem Ringwulst versehenen Anschlußdrahtes, eingesteckt in eine Bohrung einer gedruckten Schaltungsplatte, und die Fig. 2; 4; 6; 7 und 9 die jeweils zugehörige Ansicht des Anschlußdrahtes von unten.Fig. 1; 3; 5 and 8 each show a side view of an inventive Exemplary embodiment of a connecting wire provided with an annular bead, inserted in a hole of a printed Circuit board, and Fig. 2; 4; 6; 7 and 9 the respective associated view of the connecting wire from below.
In Fig. 1 ist mit 1 ein Anschlußdraht eines elektrischen Baueleients 2 bezeichnet, dessen Ende 3 in eine Bohrung 4 einer gedruckten Schaltungsplatte 5 eingesteckt ist und durch Löten mit dem leitenden Belag 6 verbunden wird. Bei Verwendung durchverkupferter Bohrungen mit dem Innenbelag 6' und gegebenenfalls von oberen Kontaktzonen (Lötungen) oder leitenden Belägen 6" wird auch eine einwandfreie Lötung derselben mit dem Anschlußdrahtende 3 ermöglicht.In Fig. 1, 1 is a connecting wire of an electrical component 2, the end 3 of which in a bore 4 of a printed circuit board 5 is inserted and connected to the conductive coating 6 by soldering. at Use of copper-plated holes with the inner lining 6 'and, if necessary of upper contact zones (soldering) or conductive coverings 6 "will also be flawless Soldering the same with the connecting wire end 3 allows.
Oberhalb der Bohrung 4 ist der Anschlußdraht mit einem Ringwulst 7 versehen, der erfindungsgemäß auf der Unterseite 8 Erhöhungen, in diesen Fall in Form von Warzen 9 aufweist, die so angeordnet sind, daß sie zurinlest teilweise auf der Oberseite 10 bzw. Kontaktzone 6" der gedruckten Schaltungsplatte 5 aufliegen. Hierdurch wird erreicht, daß beim Einstecken des Bauteils bzw. dessen Anschlußdrahtes 1 in die gedruckte Schaltungsplatte zwischen der Unterseite 8 des Ringwulstes 7 und der Oberseite 10 bzw. der Kontaktzone 6" ein Spalt 11 entsteht. Dieser ermöglicht, daß beim Löten entstehende Gase oder das Flußnittel selbst nach oben entweichen kann und daher das Lot leicht den Belag 6 oder bis zur Kontaktzone 6" hochziehen kann. Dadurch werden sowohl bei einseitig als auch bei zweiseitig kaschierten Leiterbahnen einwandfreie Lötungen erzielt, da z.B. Blasenbildungen, die entstehen, wenn die Flußaitteldämpfe nach unten entweichen müssen, nicht mehr auftreten können.The connecting wire with an annular bead 7 is located above the bore 4 provided, according to the invention on the underside 8 elevations, in this case in Has the form of warts 9, which are arranged so that they zurinlest partially rest on the upper side 10 or contact zone 6 ″ of the printed circuit board 5. This ensures that when the component or its connecting wire is inserted 1 into the printed circuit board between the underside 8 of the annular bead 7 and the top 10 or the contact zone 6 ″ creates a gap 11. that gases produced during soldering or the flux itself escape upwards and therefore the solder can easily pull up the covering 6 or up to the contact zone 6 ″ can. As a result, both one-sided and two-sided laminated conductor tracks flawless soldering is achieved, as e.g. blistering that occurs when the Flußaitteldampf must escape downwards, can no longer occur.
An sich ist es bereits ausreichend, wenn eine einzige Erhöhung 9 an der Unterseite 8 vorgesehen ist. Da jedoch die Bohrungen 4 manchmal zu groß und/oder diese nicht genau zentrisch zum eingesteckten Anschlußdraht 1 liegen, kann es vorkommen, daß die gewünschte Wirkung zufällig nicht ganz eintritt. Vorzugsweise werden daher mehrere Erhöhungen 9 an Umfang der Unterseite 8 verteilt vorgesehen. Dadurch ist gewährleistet, daß immer der gewünschte Spalt 11 entsteht. Beim Ausführungsbeispiel sind daher, wie Fig. 2 zeigt, drei Warzen 9 um jeweils 12CP versetzt angeordnet, die auf einem zum Anschlußdraht 1 bzw. dessen Ende 3 konzentrischen Kreis liegen.In itself it is already sufficient if a single increase 9 is on the bottom 8 is provided. However, since the holes 4 are sometimes too large and / or If these are not exactly centered on the inserted connecting wire 1, it can happen that the desired effect does not happen entirely by chance. Preferably, therefore several elevations 9 are provided distributed on the circumference of the underside 8. This is ensures that the desired gap 11 is always produced. In the exemplary embodiment therefore, as Fig. 2 shows, three lugs 9 are arranged offset by 12CP each, which lie on a circle which is concentric to the connecting wire 1 or its end 3.
Ein weiteres vorteilhaftes Ausführungsbeispiel zeigt die Fig. 3.Another advantageous embodiment is shown in FIG. 3.
Hierbei bestehen die Erhöhungen aus linienförmigen radialen Stegen 12, die beim Einstecken in die Bohrung 4 den Spalt 11 garantieren.Here, the elevations consist of linear radial webs 12, which guarantee the gap 11 when inserted into the bore 4.
Hierbei würde bereits ein einziger Steg 12 ausreichen. Die Fig. 4 zeigt die Ausführung mit drei um 12XP versetzten Stegen 12 von unten.A single web 12 would be sufficient here. The Fig. 4 shows the design with three webs 12 offset by 12XP from below.
Außer der Begrenzung der Einstecktiefe des Bauelements 2 und der Erzielung des Spaltes 11 durch die Erhöhungen kann, wie anhand der Fig. 3 gezeigt ist, der Ringwulst 7 noch dazu dienen, daß beim Tauchen des Bauteils in eine Uxhüllungsmasse 13 der Ringwulst 7 als Begrenzung für das Hochsteigen der Umhüllnngsnasse 13 am Anschlußdraht 1 dient. Dadurch werden die bekannten Nachteile, die z.B. entstehen, wenn der Lack als sogenannte "Lackhose" in die Bohrung 4 reicht, vermieden. Der Ringwulst 7 kann daher sehr nahe an der Unterkante 14 des Bauelements 2 angeordnet sein.Except for the limitation of the insertion depth of the component 2 and the achievement of the gap 11 through the elevations, as shown with reference to FIG. 3, the Annular bead 7 also serve to ensure that when the component is dipped into a Uxhüllungsmasse 13 of the annular bead 7 as a limit for the rise of the Umhüllnngsnasse 13 on Connecting wire 1 is used. This eliminates the known disadvantages that arise e.g. if the paint as so-called "paint pants" in the hole 4 enough, avoided. The annular bead 7 can therefore be very close to the lower edge 14 of the component 2 be arranged.
Eine weitere Möglichkeit der Anordnung und Lage der Erhöhungen in Form von Stegen 12 ist in den Fig. 5 und 7 gezeigt. Dort sind die Stege gemäß Fig. 6 in Umfangsrichtung auf einem Kreis angeordnet und sind beispielsweise der Kreisform angepaßt, wogegen die Fig. 7 Stege 12 zeigen, die von innen nach außen verlaufend angebracht sind.Another possibility for the arrangement and location of the elevations in The shape of webs 12 is shown in FIGS. There are the webs according to Fig. 6 arranged in the circumferential direction on a circle and are, for example, of the circular shape adapted, whereas FIG. 7 shows webs 12 which extend from the inside to the outside are appropriate.
Die Erhöhungen sind vorzugsweise gleichzeitig beim Herstellen des Ringwulstes 7 mit angeformt, z.B. beir Stauch- und/oder Preßvorgang.The elevations are preferably at the same time when making the Annular bead 7 molded on, e.g. during the upsetting and / or pressing process.
In weiterer vorteilhafter Ausgestaltung der Erfindung können die Erhöhungen bei der Herstellung des Ringwulstes 7 dadurch angeformt werden, daß das mehrteilige Preß- oder Stauchwerkzeug einen Preßgrat 15 geeigneter Form bildet, wie dies beispielsweise anhand der Fig. 8 von der Seite und in Fig. 9 von unten gezeigt ist. Hier ist z.B. eine zweiteilige Form verwendet worden, deren Preßnaht zumindest an der Unterseite des Ringwulstes 7 zwei gegenüberliegende Preßgrate 15 entstehen läßt, die beim Einstecken des Anschlußdrahtes 1 die Entstehung des Spaltes 11 garantieren, da sie auf der Oberseite 10 bzw. der Kentaktiene 6" aufliegen können. Die Preßgrate 15 könsen sich vorteilhaft noch etwa nach unten erstrecken, sodaß eine gewisse Zentrierung des Anschlußdrahtendes 3 in der Bohrung 4 rreicht wird. Zusätzlich können sie bei entsprechend abstehender Weite zur klemmenden B ug dienen, wie durch die gestrichelte Linie 16 in Fig. 8 angedeutet.In a further advantageous embodiment of the invention, the elevations are formed in the manufacture of the annular bead 7 in that the multi-part Pressing or upsetting tool forms a press burr 15 of suitable shape, such as this, for example is shown on the basis of FIG. 8 from the side and in FIG. 9 from below. Here is e.g. a two-part mold has been used, the press seam at least on the underside of the annular bead 7 two opposing press burrs 15 can arise, which when inserted of the connecting wire 1 guarantee the formation of the gap 11, since they are on the Top 10 or the Kentaktiene 6 "can rest. The press burrs 15 can be advantageously extend approximately downwards, so that a certain centering of the Terminal wire end 3 in the hole 4 is reached. In addition, they can be used accordingly the protruding width to serve as the clamping bend, as indicated by the dashed line 16 indicated in FIG. 8.
Zweckmäßig sind die gegenüberliegenden Preßgrate 15 quer, insbesondere etwa senkrecht zur Längserstreckung des Bauelements 2 angeordnet, um ein Kippen desselben in der Bohrung 4 möglichst zu vermeiden.The opposite press burrs 15 are expediently transverse, in particular Arranged approximately perpendicular to the longitudinal extension of the component 2 to prevent tilting to avoid the same in the bore 4 as possible.
Bei elektrischen Bauelementen mit mehr als zwei Anschlußdrähten, z.B. bei noduleinheiten, sind mindestens zwei Anschlußdrähte mit einem erfindungsgemäßen Ringwulst versehen. Sollen derartige Bauteile mit einer Tauchumhüllung versehen werden, dann werden alle, oder wenigstens zwei Anschlußdrähte, mit einer Ringwulst gemäß der Erfindung bzw. die übrigen mit einem einfachen Ringwulst versehen, um zu verhindern, daß sich beim Tauchen Lackhosen bilden, die in die Bohrung 4 hineinragenwwürden und damit den Lötanschluß verschlechtem könnten. Die Iingwhlste 7 liegen dann alle in einer Hohe.In the case of electrical components with more than two connecting wires, e.g. in the case of module units, at least two connecting wires are connected to one according to the invention Ring bead provided. Should such components be provided with an immersion coating are, then all, or at least two connecting wires, with an annular bead according to the invention or the rest provided with a simple annular bead to to prevent the formation of patent leather pants which would protrude into the bore 4 during diving and thus the solder connection could deteriorate. The selected 7 are then all at a height.
Claims (14)
Priority Applications (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782828231 DE2828231A1 (en) | 1978-06-28 | 1978-06-28 | Electronic component with adapted terminal wire - has ring-shaped bead section with asymmetric underside and cavity to suit printed circuit board connection |
IT21109/79A IT1111291B (en) | 1978-03-23 | 1979-03-19 | ELECTRIC BUILDING ELEMENT WITH CONNECTION WIRES FOR THE INSERTION INTO HOLES OF A CIRCUIT PLATE |
GB7909550A GB2019093B (en) | 1978-03-23 | 1979-03-19 | Electrical assemblies or components having connecting wires for insertion into bores of circuit boards |
BR7901713A BR7901713A (en) | 1978-03-23 | 1979-03-19 | ELECTRICAL MODULE WITH CONNECTION WIRES FOR CONNECTION TO A SWITCHING BOARD |
YU669/79A YU41481B (en) | 1978-03-23 | 1979-03-19 | Electric component with connection wires for insertion into bores of a printed circuit |
ES478769A ES478769A1 (en) | 1978-03-23 | 1979-03-20 | Improvements in or relating to electrical assemblies or components having connecting wires for insertion into bores of circuit boards |
MX17700079A MX146321A (en) | 1978-03-23 | 1979-03-20 | IMPROVEMENTS TO ELECTRICAL ELEMENT WITH CONNECTION WIRE TO INSERT IN CONNECTION PLATE HOLES |
FR7907025A FR2420898A1 (en) | 1978-03-23 | 1979-03-20 | ELECTRICAL COMPONENT CONTAINING CONNECTION WIRES FOR PLUGGING IN THE HOLES OF A CIRCUIT BOARD |
DD79211719A DD142637A1 (en) | 1978-03-23 | 1979-03-21 | ELECTRICAL COMPONENT WITH CONNECTING WIRES FOR INSERTING IN DRILLING CIRCUITS |
NL7902267A NL7902267A (en) | 1978-03-23 | 1979-03-22 | ELECTRICAL BUILDING ELEMENT WITH CONNECTING WIRES FOR PLUGING IN BORE OF A CIRCUIT BOARD. |
HU79SE1933A HU179060B (en) | 1978-03-23 | 1979-03-22 | Electric componenthaving outlets for connecting into the openings of printed circuits |
AR275931A AR217151A1 (en) | 1978-03-23 | 1979-03-23 | ELECTRICAL CONSTRUCTION ELEMENT WITH CONNECTION CABLES FOR PLUGGING INTO PERFORATIONS OF A CONNECTION PLATE |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19782828231 DE2828231A1 (en) | 1978-06-28 | 1978-06-28 | Electronic component with adapted terminal wire - has ring-shaped bead section with asymmetric underside and cavity to suit printed circuit board connection |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2828231A1 true DE2828231A1 (en) | 1980-01-03 |
Family
ID=6042910
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19782828231 Ceased DE2828231A1 (en) | 1978-03-23 | 1978-06-28 | Electronic component with adapted terminal wire - has ring-shaped bead section with asymmetric underside and cavity to suit printed circuit board connection |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2828231A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0086532A1 (en) * | 1982-02-12 | 1983-08-24 | Koninklijke Philips Electronics N.V. | Electric component with upset connection wires |
EP2034809A3 (en) * | 2007-09-10 | 2011-08-31 | Denso Corporation | Electronic device including printed circuit board and electronic element mounted on the printed circuit board |
-
1978
- 1978-06-28 DE DE19782828231 patent/DE2828231A1/en not_active Ceased
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0086532A1 (en) * | 1982-02-12 | 1983-08-24 | Koninklijke Philips Electronics N.V. | Electric component with upset connection wires |
EP2034809A3 (en) * | 2007-09-10 | 2011-08-31 | Denso Corporation | Electronic device including printed circuit board and electronic element mounted on the printed circuit board |
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