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DE2737010A1 - Hybrid circuit with adjustable structural component - covered with polyamide cup-shaped cover before application of electrically insulating dip-coating - Google Patents

Hybrid circuit with adjustable structural component - covered with polyamide cup-shaped cover before application of electrically insulating dip-coating

Info

Publication number
DE2737010A1
DE2737010A1 DE19772737010 DE2737010A DE2737010A1 DE 2737010 A1 DE2737010 A1 DE 2737010A1 DE 19772737010 DE19772737010 DE 19772737010 DE 2737010 A DE2737010 A DE 2737010A DE 2737010 A1 DE2737010 A1 DE 2737010A1
Authority
DE
Germany
Prior art keywords
cup
covered
shaped body
layer circuit
hybrid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19772737010
Other languages
German (de)
Other versions
DE2737010C2 (en
Inventor
Rolf Gehrlein
Guenter Hofmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Electronic GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19772737010 priority Critical patent/DE2737010C2/en
Publication of DE2737010A1 publication Critical patent/DE2737010A1/en
Application granted granted Critical
Publication of DE2737010C2 publication Critical patent/DE2737010C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0557—Non-printed masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

Hybrid laminated circuit is covered with an electrically insulating dip-coating. It comprises conductors upon a base and/or resistance lines and/or laminated condensers and further fixed and/or adjustable hybrid structural elements which are conductively mounted upon the conductors. The adjustable hybrid structural elements are covered with a cup-shaped body upon the base. After the circuit has been completely dip-coated, the bottom of the cup-shaped body is removed so that the structural element is freely accessible. The cup-shaped body is glued to the base. It consists of a plastics, specifically a polyamide.

Description

Mit einer elektrisch isolierenden Tauchumhüllung With an electrically insulating immersion cover

bedeckte, hybride Schichtschaltung mit zugänglichen Bauelementen. Covered, hybrid layer circuit with accessible components.

Die Erfindung betrifft eine mit einer elektrisch isolierenden Tauchumhüllung bedeckte, hybride Schichtschaltung, bestehend aus auf einem Trägerkörper auf'gebrachten Leiterbahnen und/ oder Widerstandsbahnen und/oder Schichtkondensatoren und weiteren festen und/oder einstellbaren, hybriden Bauelementen, die auf den Leiterbahnen elektrisch leitend befestigt sind.The invention relates to one with an electrically insulating immersion cover covered, hybrid layer circuit, consisting of applied to a carrier body Conductor tracks and / or resistance tracks and / or layer capacitors and others fixed and / or adjustable, hybrid components that are electrically on the conductor tracks are conductively attached.

Bei umhjjllten Schichtshaltunen war es bislang nicht möglich, nach dem Umhüllvorgang die Schaltung noch zu verändern ( z.B.Up to now it has not been possible to move to a covered shift to change the circuit after the wrapping process (e.g.

#~unktionsabgleich), da die Bauelemente vollständig mit einem Umhüllmaterial bedeckt sind. In manchen Fällen ist es jedoch notwendig, die Schichtschaltung in Verbindung mit peripheren Bauteilen abzugleichen bzw. daran Einstellungen vorzunehmen.# ~ function adjustment), since the components are completely covered with a wrapping material are covered. In some cases, however, it is necessary to switch the layer circuit in Adjust the connection with peripheral components or make settings on them.

Deshalb hat sich die Erfindung die Aufgabe gestellt, eine mit einer elektrisch isolierenden Umhiillung bedeckte, hybride Schichtschaltung zur Verfügung zu stellen, bei der einstellbare Bauelemente auch nach dem Umhüllvorgang für den Abgleich frei zugänglich sind.Therefore, the invention has set itself the task of one with a electrically insulating cover covered, hybrid layer circuit available to ask at the adjustable Components even after the wrapping process are freely accessible for comparison.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die einstellbaren, hybriden Bauelemente mit einem auf dem Trager körper befestigten, becherförmigen Körper zugedeckt sind, von dem nach dem vollständigen Umhüllen der Schichtschaltung der Boden entfernt wird, so daß das Bauelement frei zugänglich ist.This object is achieved according to the invention in that the adjustable, hybrid components with a cup-shaped attached to the support body Bodies are covered, from which after the complete wrapping of the layer circuit the floor is removed so that the component is freely accessible.

Bevorzugte Ausführungsformen der Erfindung sind in den Unteran -sprüchen beschrieben.Preferred embodiments of the invention are in the subclaims described.

Die mit der Erfindung erzielten Vorteile liegen insbesondere darin, daß die becherförmigen Körper einfach auf dem Trägerkörper befestigt werden und nach dem Aushärten der Umhüllung das Entfernen des Bodens des becherförmigen Körpers einfach durch Absägen, Abschneiden oder Abschmelzen möglich ist, so daß einzelne Bauelemente auch nach der Umhüllung abgeglichen oder eingestellt werden können. Für diesen Abgleich bzw. für diese Einstellung kommen alle bekannten Bauelemente wie Schichtwiderstände, Schichtkondensatoren, diskrete Trimmerwiderstände und - kondensatoren udgl. in Betracht.The advantages achieved with the invention are, in particular, that the cup-shaped body are simply attached to the support body and after the casing has hardened, removing the bottom of the cup-shaped body is possible simply by sawing off, cutting off or melting, so that individual Components can also be adjusted or adjusted after being wrapped. All known components are used for this adjustment or for this setting such as film resistors, film capacitors, discrete trimmer resistors and - capacitors and the like. into consideration.

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und wird im folgenden näher beschrieben. Es zeigen Fig.1 einen Querschnitt durch eine vollständig tauchumhüllte Hybridschaltung und Fig.2 einen Querschnitt durch eine entsprechendes umhüllte Hybridschaltung mit einem frei zugänglichen, einstellbaren Bauelement.An embodiment of the invention is shown in the drawing and is described in more detail below. 1 shows a cross section through a completely immersed hybrid circuit and FIG. 2 a cross section through a corresponding covered hybrid circuit with a freely accessible, adjustable Component.

Fig.1 zeigt einen ebenen Trägerkörper 4 mit auf einer Grundfläche angeordneten Leiterbahnen 5. Außer Leiterbahnen 5 können auch Widerstandsbahnen und Schichtdielektrika vorhanden sein.1 shows a planar support body 4 with on a base arranged conductor tracks 5. In addition to conductor tracks 5, resistance tracks can also be used and film dielectrics may be present.

Auf den Leiterbahnen 5 sind diskrete, aktive und/oder passive Bauelemente 2 und 6 befestigt. Das oder die einstellbaren Bauelemente 2 sind mit einem becherförmigen Körper 1 bedeckt, der am Tragerkörper 4 befestigt ist. Eine Umhiillung 3 bedeckt die Hybridschaltung vollständig, so daß nur die Anschlußelemente 7 aus ihr herausragen. Nach dem Ausharten der Umhüllung 3 wird der becherförmige Körper 1 entlang der Schnittlinie xy auseinandergesägt und der Boden 11 des becherförmigen Körpers 1 entfernt. Damit ist das einstellbare Bauelement 2 frei zugänglicb, während die übrige Schaltung - wie in Fig.2 dargestellt -gegen Elnflüßse von Außen geschützt ist.Discrete, active and / or passive components are on the conductor tracks 5 2 and 6 attached. The adjustable component (s) 2 are provided with a cup-shaped Covered body 1, which is attached to the support body 4. A sheath 3 covered the hybrid circuit completely, so that only the connection elements 7 protrude from it. After the casing 3 has hardened, the cup-shaped body 1 is along the cutting line xy sawed apart and the bottom 11 of the cup-shaped body 1 removed. In order to the adjustable component 2 is freely accessible, while the rest of the circuit - as shown in Fig. 2 - is protected against influences from the outside.

L e e r s e i t eL e r s e i t e

Claims (6)

P A T E N T A N S P R tt C H E : 1. Mit einer elektrisch isolierenden Tauchumhüllung tedeckte, hybride Schichtschaltung bestehend aus auf einem Trägerkörper aufgebrachten Leiterbahnen unä/oder Widerstandsbahnen und/oder Schichtkondensatoren und weiterer. festen und/oder einstellbaren, hybri#en Bauelemente* .. , die auf den Leiterbahnen elektrisch leitend befestigt sind, d a d u r c h g e k e !1 n z e i c h n e t daß die einstellbaren hybriden Bauelemente #:-~, T#jtt einem auf dem Trägerkörper (4) befestigten, becherförmigen Körper (1) zugedeckt sind, von dem nach dem vollstandigen Tauchumhüllen der Schichtschaltung der Boden (11) entfernt wird, so daß das Bauelement (2) frei zugänglich ist. P A T E N T A N S P R tt C H E: 1. With an electrically insulating Immersion coating covered, hybrid layer circuit consisting of on a carrier body applied conductor tracks and / or resistance tracks and / or layer capacitors and others. fixed and / or adjustable, hybrid components * .. that are based on are attached to the conductor tracks in an electrically conductive manner, d a d u r c h g e k e! 1 n z e i c h n e t that the adjustable hybrid components #: - ~, T # jtt one on the Carrier body (4) attached, cup-shaped body (1) are covered by the after the layer circuit has been completely immersed, the base (11) is removed so that the component (2) is freely accessible. 2. Hybride Schichtschaltung nach Anspruch 1, dadurch gekennzeichnet, daß der becherförmige Körper (1) mit seinen Querschnittsabmessungen dem abzudeckenden Bauelement (2) angepaßt ist. 2. Hybrid layer circuit according to claim 1, characterized in that that the cup-shaped body (1) with its cross-sectional dimensions to be covered Component (2) is adapted. 3. Hybride Schichtschaltung nach einem der Ansprüche 1 bis 2, dadurch gekennzeichnet, daß der becherförmige Körper (1) auf der Oberfläche des Tragerkörpers (4) mittels eines Klebstoffes befestigt ist.3. Hybrid layer circuit according to one of claims 1 to 2, characterized characterized in that the cup-shaped body (1) on the surface of the support body (4) is attached by means of an adhesive. 4. Hybride Schichtschaltung nach einem der Anspruche 1 bis 2, dadurch gekennzeichnet, daß der becherförmige Körper (1) durch Erhitzen des Trägerkörpers (4) über die Scnmelztemperatur des becherförmigen Körpers (1) anschmilzt und mit dem Trägerkörper (4) eine mechanisch feste Verbindung eingeht.4. Hybrid layer circuit according to one of claims 1 to 2, characterized characterized in that the cup-shaped body (1) by heating the carrier body (4) melts above the melting temperature of the cup-shaped body (1) and with the carrier body (4) enters into a mechanically firm connection. 5. Hybride Schichtschaltung nach einem der vorhergenannten Ansprüche, dadurch gekennzeichnet, daß der becherförmige Körper (1) aus thermoplastischem Kunststoff besteht.5. Hybrid layer circuit according to one of the preceding claims, characterized in that the cup-shaped body (1) is made of thermoplastic material consists. 6. Hybride Schichtschaltung nach Anspruch 5, dadurch gekennzeichnet, daß der becherförmige Körper (1) aus einem Polyamid besteht.6. Hybrid layer circuit according to claim 5, characterized in that that the cup-shaped body (1) consists of a polyamide.
DE19772737010 1977-08-17 1977-08-17 Hybrid layer circuit covered with an electrically insulating immersion cover with accessible components Expired DE2737010C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19772737010 DE2737010C2 (en) 1977-08-17 1977-08-17 Hybrid layer circuit covered with an electrically insulating immersion cover with accessible components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19772737010 DE2737010C2 (en) 1977-08-17 1977-08-17 Hybrid layer circuit covered with an electrically insulating immersion cover with accessible components

Publications (2)

Publication Number Publication Date
DE2737010A1 true DE2737010A1 (en) 1979-03-01
DE2737010C2 DE2737010C2 (en) 1983-06-30

Family

ID=6016576

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19772737010 Expired DE2737010C2 (en) 1977-08-17 1977-08-17 Hybrid layer circuit covered with an electrically insulating immersion cover with accessible components

Country Status (1)

Country Link
DE (1) DE2737010C2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1895583A1 (en) * 2005-06-23 2008-03-05 HONDA MOTOR CO., Ltd. Electronic control unit and manufacturing method thereof
WO2021110362A1 (en) * 2019-12-05 2021-06-10 Mahle International Gmbh Power electronics system

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3425752C2 (en) * 1984-07-12 1986-05-15 Endress U. Hauser Gmbh U. Co, 7867 Maulburg Sealed potentiometer assembly
DE3703727A1 (en) * 1987-02-07 1988-08-18 Bsg Schalttechnik Device for mounting a component on a printed circuit board

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
NICHTS-ERMITTELT *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1895583A1 (en) * 2005-06-23 2008-03-05 HONDA MOTOR CO., Ltd. Electronic control unit and manufacturing method thereof
EP1895583A4 (en) * 2005-06-23 2008-11-19 Honda Motor Co Ltd Electronic control unit and manufacturing method thereof
AU2006260110B2 (en) * 2005-06-23 2010-05-27 Honda Motor Co., Ltd. Electronic control unit and process of producing the same
US7829798B2 (en) 2005-06-23 2010-11-09 Honda Motor Co., Ltd Electronic control unit and process of producing the same
WO2021110362A1 (en) * 2019-12-05 2021-06-10 Mahle International Gmbh Power electronics system

Also Published As

Publication number Publication date
DE2737010C2 (en) 1983-06-30

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: TELEFUNKEN ELECTRONIC GMBH, 7100 HEILBRONN, DE

8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee