DE2537362C2 - Device for holding small parts for the purpose of galvanic surface treatment - Google Patents
Device for holding small parts for the purpose of galvanic surface treatmentInfo
- Publication number
- DE2537362C2 DE2537362C2 DE19752537362 DE2537362A DE2537362C2 DE 2537362 C2 DE2537362 C2 DE 2537362C2 DE 19752537362 DE19752537362 DE 19752537362 DE 2537362 A DE2537362 A DE 2537362A DE 2537362 C2 DE2537362 C2 DE 2537362C2
- Authority
- DE
- Germany
- Prior art keywords
- parts
- frame
- magnets
- surface treatment
- contact strips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Description
Galvanisierprozesses ist ausgeschlossen, da sie durch die Magnete festgehalten werden. Besonders gut werden die Teile in ihrer Position gehalten, wenn sie gleichzeitig von mehreren, vorzugsweise zwei Magneten angezogen werden. Zusätzlich werden die Teile durch die Magnete an die Kontaktleisten angedrückt, so daß eine gute und gleichmäßige Aufnahme des Galvanisierstromes gewährleistet ist Dadurch erhält man bei der galvanischen Metallabscheidung einheitliche Schichtdicken und damit ein konstantes Lötverhalten. ι οElectroplating process is excluded because they are held in place by the magnets. Get particularly good the parts held in place when attracted by several, preferably two magnets at the same time will. In addition, the parts are pressed against the contact strips by the magnets, so that a good and uniform absorption of the electroplating current is guaranteed Metal deposition uniform layer thicknesses and thus constant soldering behavior. ι ο
Durch dip- Verwendung von mit einem Profil versehenen, z.B. gerändelten oder sägezahnartig gestalteten Kontaktleisten kann die Fixierung der Teile noch weiter verbessert werden. Die Auflageflächen werden dadurch gleichzeitig auf ein Minimum reduziertBy dip use of profiled, e.g. knurled or sawtooth shaped contact strips can fix the parts even further be improved. At the same time, the contact surfaces are reduced to a minimum
Die Fixierung der empfindlichen Kleinteile ermöglicht schließlich auch noch eine stärkere Elektrolytbewegung, so daß höhere Stromdichten angewandt werden können. Diese führen zu kürzeren Expositionszeiten und damit zu höheren Durchsätzen.The fixation of the sensitive small parts also enables a stronger electrolyte movement, so that higher current densities can be used. These lead to shorter exposure times and thus to higher throughputs.
Die Beschickung und Entleerung der erfindungsgemäßen Vorrichtung erfolgt in üblicher Weise. Sie kann auch automatisch durchgeführt werden.The device according to the invention is charged and emptied in the usual way. she can can also be performed automatically.
So können zur Beschickung z. B. Dioden durch eine Gurtmaschine auf einen Elektromagneten aufgebracht und mit diesem an die Magnete der erfindungsgemäßen Vorrichtung herangeführt werden. Wird dann der Strom dieses Elektromagneten unterbrochen, so haften die Dioden an der erfindungsgemäßen Vorrichtung.So can for loading z. B. Diodes applied by a belt machine to an electromagnet and with this are brought up to the magnets of the device according to the invention. Then the If the current of this electromagnet is interrupted, the diodes adhere to the device according to the invention.
Die Entleerung kann ebenfalls durch einen Elektromagneten erfolgen, indem z. B. die Dioden durch diesen von der erfindungsgemäßen Vorrichtung abgezogen und den automatischen Sortier- und Meßgeräten zugeführt werden.The emptying can also be done by an electromagnet take place by z. B. subtracted the diodes through this from the device according to the invention and fed to the automatic sorting and measuring devices.
Der Rahmen und die Aufhängevorrichtung der erfindungsgemäßen Vorrichtung dienen gleichzeitig als Stromzuführung. Sie bestehen aus üblicherweise für diesen Zweck benutzten Metallen, z. B. Kupfer oder Messing, und sind mit einem Schutzüberzug versehen.The frame and the suspension device of the device according to the invention serve at the same time as Power supply. They consist of metals commonly used for this purpose, e.g. B. copper or Brass, and are provided with a protective coating.
Als Magnete werden bevorzugt übliche Dauermagnete benutzt, die mit einem Isolierüberzug versehen werden, der gleichzeitig als Magnethalterung dient.Usual permanent magnets, which are provided with an insulating coating, are preferably used as magnets which also serves as a magnetic holder.
Die Magnethalterungen und die Kontaktleisten werden vorzugsweise auswechselbar befestigt, da dadurch im Bedarfsfall ein schneller Austausch ermöglicht wird. Die Befestigung kann z. B. durch Schrauben erfolgen. Sie kann aber auch durch übliche Klemmvorrichtungen erreicht werden.The magnet holders and the contact strips are preferably fastened interchangeably, as this if necessary, a quick exchange is made possible. The attachment can, for. B. be done by screws. But it can also be achieved by conventional clamping devices.
Zur Herstellung der Schutz- bzw. Isolierüberzüge können übliche Kunststoffe, z. B. Polyvinylchlorid, benutzt werden.To produce the protective or insulating coatings, conventional plastics such. B. polyvinyl chloride used will.
Die erfindungsgemäße Vorrichtung eignet sich auch zum Einsatz in üblichen Galvanisierautomaten.The device according to the invention is also suitable for use in conventional electroplating machines.
In der Zeichnung ist eine Ausführungsforni der Erfindung dargestellt, die zur näheren Erläuterung dienen soll.In the drawing is an embodiment of the invention shown, which is intended to provide a more detailed explanation.
F i g. 1 zeigt die Vorderansicht einer Vorrichtung, die teilweise mit Dioden (1) bestückt ist. In einem rechtecki- ' gen Rahmen (2) mit Aufhängevorrichtung (3) sind in mehreren Reinen Magnethalterungen (4) auswechselbar befestigt Diese Magnethalterungen (4) sind so angeordnet, daß die Dioden (i) gleichzeitig von zwei magneten gehalten werden.F i g. 1 shows the front view of a device which is partially equipped with diodes (1). In a rectangular ' The frame (2) with suspension device (3) can be exchanged in several rows of magnetic holders (4) attached These magnet holders (4) are arranged so that the diodes (i) are held by two magnets at the same time being held.
Fig.2 zeigt einen Schnitt durch eine Magnethalterung (4), die aus einem Dauermagneten (5) besteht, der zur Fixierung des Magnetfeldes beidseitig mit Stahlplatten (6) versehen ist und einen Isolierüberzug (7) besitzt Beiderseits von den Magnethalterungen sind Kontaktleisten (8) auswechselbar befestigt Diese sind mit dem Rahmen (2) leitend verbunden und dienen der Stromübertragung auf das GalvanisiergutFig. 2 shows a section through a magnet holder (4), which consists of a permanent magnet (5), which is used to fix the magnetic field on both sides with steel plates (6) is provided and has an insulating cover (7). Both sides of the magnet holders are contact strips (8) exchangeably attached These are conductively connected to the frame (2) and are used for Power transmission to the electroplated item
Hierzu 2 Blatt ZeichnungenFor this purpose 2 sheets of drawings
Claims (2)
verbunden sind, aufweist, dadurch gekenn- Durch die überwiegende Verwendung von Kupfer-Claims: which the electronic components can be adjusted. In these magazines, the one current device for receiving mechanical feed is first treated, then the magazine is rotated 180 °, see small parts that are sensitive to stress, and finally the second current supply has magnetic properties for the purpose of galvanizing it The procedure does not result in a niche surface treatment that causes a right-hand bend, but it has the disadvantage that the thickness of the layers of separated metal on two opposite sides of this frame are very uneven due to the kigen frame with suspension device, between mutual shielding, which is why magnets are attached and both sides are parallel This leads to the fact that the parts do not have a constant soldering behavior. Magnets outside the frame plane are indicated. In addition, turning the magazine requires arranged contact strips, which lead to the frame, a greater technical effort,
connected, has, characterized by the predominant use of copper
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752537362 DE2537362C2 (en) | 1975-08-19 | 1975-08-19 | Device for holding small parts for the purpose of galvanic surface treatment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19752537362 DE2537362C2 (en) | 1975-08-19 | 1975-08-19 | Device for holding small parts for the purpose of galvanic surface treatment |
Publications (2)
Publication Number | Publication Date |
---|---|
DE2537362A1 DE2537362A1 (en) | 1977-03-03 |
DE2537362C2 true DE2537362C2 (en) | 1986-12-04 |
Family
ID=5954561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19752537362 Expired DE2537362C2 (en) | 1975-08-19 | 1975-08-19 | Device for holding small parts for the purpose of galvanic surface treatment |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2537362C2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4419982C1 (en) * | 1994-06-08 | 1995-10-26 | Mtu Muenchen Gmbh | Holding and contacting device for the galvanic coating of components |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4419984C2 (en) * | 1994-06-08 | 1996-10-24 | Mtu Muenchen Gmbh | Electroplating magazine for coating components |
DE10313818A1 (en) * | 2003-03-24 | 2004-10-07 | Wieland Dental + Technik Gmbh & Co. Kg | Device and its parts for the galvanic deposition of dental molded parts |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2766194A (en) * | 1953-04-15 | 1956-10-09 | Philco Corp | Method of plating |
US2911347A (en) * | 1957-04-01 | 1959-11-03 | Intercompany Corp | Plating rack |
-
1975
- 1975-08-19 DE DE19752537362 patent/DE2537362C2/en not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4419982C1 (en) * | 1994-06-08 | 1995-10-26 | Mtu Muenchen Gmbh | Holding and contacting device for the galvanic coating of components |
EP0690151A3 (en) * | 1994-06-08 | 1998-11-11 | Mtu Motoren- Und Turbinen-Union MàNchen Gmbh | Electrode for electroplating components |
Also Published As
Publication number | Publication date |
---|---|
DE2537362A1 (en) | 1977-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
D2 | Grant after examination | ||
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |