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DE2527213C2 - Process for producing conductive through-connections within bores in flexible printed circuits using connecting elements in the form of hollow rivets - Google Patents

Process for producing conductive through-connections within bores in flexible printed circuits using connecting elements in the form of hollow rivets

Info

Publication number
DE2527213C2
DE2527213C2 DE19752527213 DE2527213A DE2527213C2 DE 2527213 C2 DE2527213 C2 DE 2527213C2 DE 19752527213 DE19752527213 DE 19752527213 DE 2527213 A DE2527213 A DE 2527213A DE 2527213 C2 DE2527213 C2 DE 2527213C2
Authority
DE
Germany
Prior art keywords
bores
connections
flexible printed
connecting elements
printed circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE19752527213
Other languages
German (de)
Other versions
DE2527213A1 (en
Inventor
Giuseppe Quattordio Alessandria Codrino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CAVIS CAVETTI ISOLATI SpA TORINO IT
Original Assignee
CAVIS CAVETTI ISOLATI SpA TORINO IT
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CAVIS CAVETTI ISOLATI SpA TORINO IT filed Critical CAVIS CAVETTI ISOLATI SpA TORINO IT
Publication of DE2527213A1 publication Critical patent/DE2527213A1/en
Application granted granted Critical
Publication of DE2527213C2 publication Critical patent/DE2527213C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00—Insulated conductors or cables characterised by their form
    • H01B7/08—Flat or ribbon cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/06—Riveted connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0367—Metallic bump or raised conductor not used as solder bump
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metallurgy (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Insulated Conductors (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
  • Laminated Bodies (AREA)

Description

Die Erfindung betrifft ein Verfahren zur Herstellung leitfähiger Durchverbindungen innerhalb von Bohrungen in flexiblen gedruckten Schaltungen durch Verbindungselemente in Form von Hohlnieten.The invention relates to a method for producing conductive through-connections within bores in flexible printed circuits by connecting elements in the form of hollow rivets.

Trägerfolien mit gedruckten Schaltungen, die zwei- oder mehrfach übereinander gelegt sind, wobei die elektrische Verbindung zwischen den verschiedenen Leiterbahnen durch besondere Verbindungselemente hergestellt ist, die durch die Trägerfolien hindurchgreifen, sind bekannt. Die Verbindung wird dabei durch Ösen, Nieten oder andere leitende Halteelemente herbeigeführt, die durch entsprechende Bohrungen in den Leiterbahnen und den Trägerfolien hindurchgreifen.Carrier foils with printed circuits, which are placed two or more times on top of one another, with the electrical Connection between the various conductor tracks made by special connecting elements which reach through the carrier films are known. The connection is made by eyelets, rivets or other conductive holding elements brought about by corresponding holes in the conductor tracks and reach through the carrier foils.

Ein Nachteil derartiger flexibler Leitung ist jedoch der während der Gebrauchsdauer zunehmende elektrische Widerstand der Verbindungen infolge thermischer Veränderungen und/oder Alterung des Materials.A disadvantage of such a flexible line, however, is the increasing electrical power during the service life Resistance of the connections due to thermal changes and / or aging of the material.

Der Erfindung liegt die Aufgabe zugrunde, leitfähige Durchverbindungen für derartige flexible gedruckte Schaltungen herzustellen, die ihren Widerstandswert auch nach langen Betriebszeiten nicht verändern.The invention is based on the object of providing conductive through connections for flexible printed connections of this type To produce circuits that do not change their resistance value even after long periods of operation.

Erfindungsgemäß wird diese Aufgabe durch ein Verfahren der eingangs geschilderten Art dadurch gelöst, daß die Hohlniete durch Auftrag von Lot in den Bohrungen erzeugt werden und aus einem gewölbten Kopf auf den Enden von Leiterbahnen und mit einem Stiel, der die Bohrungen vollständig ausfüllt, bestehen und daß längs der Achse des Lotes in den Bohrungen Löcher eingebracht werden.According to the invention, this object is achieved by a method of the type described in the introduction, that the hollow rivets are produced by applying solder in the holes and from a domed head on the ends of conductor tracks and with a stem that completely fills the holes, and that holes are made in the bores along the axis of the solder.

In Weiterbildung der Erfindung werden die Kanten der gewölbten Köpfe mit einer Schutzstoffschicht abgedeckt. In a further development of the invention, the edges of the curved heads are covered with a protective layer.

Die Erfindung wird im folgenden unter Bezugnahme auf das in der Zeichnung dargestellte Ausführungsbeispiel von Teilen flexibler gedruckter Schaltungen näher erläutert. Es zeigtThe invention is described below with reference to the exemplary embodiment shown in the drawing of parts of flexible printed circuits explained in more detail. It shows

F i g. 1 das Ende einer Leiterbahn mit einer Durchgangsbohrung für die Verbindung,F i g. 1 the end of a conductor track with a through-hole for the connection,

F i g. 2 einen Querschnitt durch mehrere Leiterbahnen, die auf einer Trägerfolie befestigt sind, während des Aufbringens des Lotmaterials,F i g. 2 shows a cross section through several conductor tracks which are attached to a carrier film during the Applying the solder material,

F i g. 3 den Endabschnitt einer Leiterbahn, dessen Bohrung mit Lot gefüllt ist,F i g. 3 the end section of a conductor track whose hole is filled with solder,

Fig. 4 den gleichen Endabschnitt wie F i g. 3, nachdem das Lot durchbohrt worden ist und4 shows the same end section as FIG. 3, after the solder has been pierced and

F i g. 5 die Durchverbindung eines Paketes aus mehreren Trägerfolien und Leiterbahnen.F i g. 5 the connection of a packet from several Carrier foils and conductor tracks.

Gemäß Fig. 1 ist die Leiterbahn 10 an ihrem Ende ringförmig erweitert und enthält dort eine Durchgangsbohrung 11, die durch die Trägerfolie 14 geht According to FIG. 1, the conductor track 10 is widened in the shape of a ring at its end and contains a through-hole 11 there which goes through the carrier film 14

Um die Leiterbahn 10 mit elektrischen Verbindungselementen ausstatten zu können, ist die zugehörige Trägeri'olie 14 mit einer Verstärkung 12 ausgerüstet, die durch eine Beschichtung 13 thermisch isoliert und gegen Beschädigung geschützt ist.In order to be able to equip the conductor track 10 with electrical connection elements, the associated carrier film is required 14 equipped with a reinforcement 12, which is thermally insulated by a coating 13 and against Damage is protected.

In die Durchgangsbohrungen 11 wird Lot so eingebracht, daß sich innerhalb der Bohrung der Stiel 16 bildet, während auf der Leiterbahn 10 ein gewölbter Kopf 15 entsteht. Anschließend wird, wie aus F i g. 4 ersichtlich, eine Bohrung 17, die sich in Richtung der Längsachse des Stiels 16 erstreckt, eingearbeitet. Der Umfang der Köpfe 15 wird, wie ebenfalls aus F i g. 4 ersichtlich, mit einer Schutzstoffschicht 18 abgedeckt.Solder is introduced into the through-holes 11 in such a way that that the stem 16 is formed within the bore, while on the conductor track 10 a curved head 15 is created. Then, as shown in FIG. 4 can be seen, a bore 17, which extends in the direction of the longitudinal axis of the stem 16 extends, incorporated. The circumference of the heads 15 is, as is also shown in FIG. 4 can be seen with a protective layer 18 covered.

Durch die miteinander fluchtenden Bohrungen 17 mehrerer aufeinander liegender Leiterbahnen 10 wird, wie F i g. 5 zeigt, ein Hohlniet gesteckt und entsprechend verformt, so daß ein guter Preßkontakt zwischen den Rändern der Köpfe 15 und den ringförmigen Enden der Stiele 16 entsteht. Ein derartiger Hohlniet besteht zweckmäßig aus einer Kupferlegierung, wobei der umgebördelte Rand desselben eine Dicke von etwa 0,13 mm hat.Through the aligned holes 17 of several superimposed conductor tracks 10, like F i g. 5 shows a tubular rivet inserted and deformed accordingly, so that a good press contact between the edges of the heads 15 and the annular ends of the stems 16 is formed. Such a hollow rivet exists expediently made of a copper alloy, the beaded edge of the same having a thickness of approximately 0.13 mm.

Für das Aufschmelzen des Lotes empfiehlt sich die Hochfrequenzerhitzung desselben.High-frequency heating is recommended for melting the solder.

Hierzu 1 Blatt Zeichnungen1 sheet of drawings

Claims (2)

Patentansprüche:Patent claims: 1. Verfahren zur Herstellung leitfähiger Durchverbindungen innerhalb von Bohrungen in flexiblen gedruckten Schaltungen durch Verbindungselemente in Form von Hohlnieten, dadurch gekennzeichnet, daß die Hohlniete durch Auftrag von Lot (15,16) in den Bohrungen erzeugt werden und aus einem gewölbten Kopf (15) auf den Enden von Leiterbahnen (10) und einem Stiel (16), der die Bohrungen (11) vollständig ausfüllt, bestehen und daß längs der Achse des Lotes in den Bohrungen Löcher eingebracht werden.1. Process for the production of conductive through connections within bores in flexible printed circuits by connecting elements in the form of hollow rivets, characterized in, that the hollow rivets are generated in the holes by applying solder (15, 16) and from a curved head (15) on the ends of conductor tracks (10) and a stem (16), which the holes (11) completely filled, and that along the axis of the plumb bores in the holes be introduced. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Kante des gewölbten Kopfes (15) mit einer Schutzstoffschicht (18) bedeckt wird.2. The method according to claim 1, characterized in that the edge of the curved head (15) is covered with a protective layer (18).
DE19752527213 1974-06-17 1975-06-16 Process for producing conductive through-connections within bores in flexible printed circuits using connecting elements in the form of hollow rivets Expired DE2527213C2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2677774 1974-06-17

Publications (2)

Publication Number Publication Date
DE2527213A1 DE2527213A1 (en) 1976-01-02
DE2527213C2 true DE2527213C2 (en) 1984-06-14

Family

ID=10249028

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752527213 Expired DE2527213C2 (en) 1974-06-17 1975-06-16 Process for producing conductive through-connections within bores in flexible printed circuits using connecting elements in the form of hollow rivets

Country Status (5)

Country Link
JP (1) JPS5112680A (en)
BR (1) BR7503809A (en)
DE (1) DE2527213C2 (en)
ES (1) ES213168Y (en)
FR (1) FR2275001A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2205202A (en) * 1987-05-29 1988-11-30 Allied Corp Improved electrical connection devices for use with flat cable
DE19757719C2 (en) * 1997-12-23 2001-08-16 Delphi Automotive Systems Gmbh Method and device for connecting flexible printed circuits

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2937358A (en) * 1955-04-18 1960-05-17 Gen Electric Printed circuit sandwiched in glass
US2883447A (en) * 1958-04-28 1959-04-21 Frank L Dahl Universally adaptable conductivecircuit board
US3501831A (en) * 1968-06-17 1970-03-24 Rogers Corp Eyelet
DE1951778B2 (en) * 1969-10-14 1971-08-15 Multilayer flexible printed circuit
JPS49114774A (en) * 1973-03-10 1974-11-01
JPS5194560A (en) * 1975-02-17 1976-08-19

Also Published As

Publication number Publication date
ES213168Y (en) 1976-11-01
JPS5112680A (en) 1976-01-31
FR2275001B1 (en) 1981-06-19
DE2527213A1 (en) 1976-01-02
BR7503809A (en) 1976-07-06
FR2275001A1 (en) 1976-01-09
ES213168U (en) 1976-06-16

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8128 New person/name/address of the agent

Representative=s name: DIEHL, P., DIPL.-ING., PAT.-ANW., 1000 BERLIN

8125 Change of the main classification

Ipc: H05K 3/42

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee