DE212023000140U1 - LED component - Google Patents

Abstract

An LED device, characterized in that it comprises an LED holder, an LED chip and an encapsulation layer, the LED holder comprising a base and an insulating holder; at least a part of the insulating holder being provided on the base as a surrounding dam and forming an encapsulation slot with the base, and the LED chip being arranged at the bottom of the encapsulation slot, the encapsulation layer comprising a quantum dot film unit, the quantum dot film unit being arranged above the LED chip and spaced from the LED chip, the quantum dot film unit comprising:
a protective frame having a hollowed-out portion in its central region;
a quantum dot foil disposed in the hollowed-out region;
and a light-transmitting adhesive layer, wherein at least a part of the light-transmitting adhesive layer fills the hollowed-out region to firmly bond the quantum dot film to the protective frame.

Description

technical field

The present invention relates to the field of LED (Light Emitting Diode), and in particular to an LED device.

State of the art

As LED devices become more widely used, they are being used in display and lighting technology and other fields. As the market demand for high color gamut increases significantly, quantum dot films are being used on LED devices more and more. Currently, the quantum dot film in an LED device is mounted by inserting the LED chip into the LED holder and laminating the two quantum dot films onto the LED chip. This construction causes the heat generated by the LED chip to be transferred directly to the quantum dot film, making the quantum dots heat sensitive and affecting their performance.

Content of the invention

Technical Questions

In view of the above-mentioned deficiencies of the relevant technology, an object of the present invention is to provide an LED device aimed at solving the problem that there is a problem that the quantum dot sheet is easily exposed to heat when it is inserted into an existing LED device.

Technical solutions

The present invention provides an LED device comprising an LED holder, an LED chip and an encapsulation layer, the LED holder comprising a base and an insulating holder; at least a portion of the insulating holder being provided on the base as a containment dam and forming an encapsulation slot with the base, and the LED chip being disposed at the bottom of the encapsulation slot, the encapsulation layer comprising a quantum dot film unit, the quantum dot film unit being disposed above the LED chip and spaced from the LED chip.

Beneficial effects:

The LED device provided in this application comprises an LED holder, an LED chip disposed within the LED holder, and an encapsulation layer comprising a quantum dot film unit, wherein the quantum dot film unit is disposed above the LED chip and is spaced from the LED chip; thereby preventing the heat generated by the LED from being directly transferred to the quantum dot film and ensuring the performance of the quantum dots in the quantum dot film.

Description of the drawings

• 1-1 Schematic representation I of a longitudinal section of a quantum dot film unit according to Embodiment I of the present invention;
• 1-2 Schematic representation of a longitudinal section of the quantum dot foil according to embodiment I of the present invention;
• 2 Schematic representation I of the shape of the quantum dot film according to embodiment I of the present invention;
• 3 Schematic representation II of the shape of the quantum dot film according to embodiment I of the present invention;
• 4 Schematic representation III of the shape of the quantum dot film according to embodiment I of the present invention;
• 5 Schematic representation II of a longitudinal section of a quantum dot film unit according to Embodiment I of the present invention;
• 6 Schematic representation III of a longitudinal section of a quantum dot film unit according to Embodiment I of the present invention;
• 7 Schematic representation IV of a longitudinal section of a quantum dot film unit according to embodiment I of the present invention;
• 8 Schematic representation V of a longitudinal section of a quantum dot film unit according to Embodiment I of the present invention;
• 9 Schematic representation VI of a longitudinal section of a quantum dot film unit according to Embodiment I of the present invention;
• 10 Schematic representation VII of a longitudinal section of a quantum dot film unit according to Embodiment I of the present invention;
• 11 Schematic representation VIII of a longitudinal section of a quantum dot film unit according to Embodiment I of the present invention;
• 12 Schematic representation of the structure of a quantum dot film with the same thickness as the protective frame according to Embodiment I of the present invention;
• 13 Schematic representation I of the structure of a quantum dot foil with unequal thickness as the protective frame according to embodiment I of the present invention;
• 14 Schematic representation II of the structure of a quantum dot foil with unequal thickness as the protective frame according to embodiment I of the present invention;
• 15 Schematic flow chart of a manufacturing process of a quantum dot film unit according to Embodiment I of the present invention;
• 16 Schematic representation of the method for producing a quantum dot film unit according to Embodiment I of the present invention;
• 17 Top view of the protective layer in which a first fixing post is provided according to Embodiment I of the present invention;
• 18 Top view of the protective layer in which a second fixing post is provided according to Embodiment I of the present invention;
• 19 Schematic representation of a longitudinal section of the LED component according to embodiment I of the present invention;
• 20 Top view of a single row of the LED device in a backlight module according to Embodiment I of the present invention;
• 21 A -A-sectional view of the backlight module in 20 ;
• 22 Schematic representation I of the longitudinal section of the LED component according to embodiment II of the present invention;
• 23 Schematic representation I of a longitudinal section of the LED holder according to embodiment II of the present invention;
• 24 Schematic representation II of a longitudinal section of the LED holder according to embodiment II of the present invention;
• 25 Schematic representation III of a longitudinal section of the LED holder according to embodiment II of the present invention;
• 26 Schematic representation II of the longitudinal section of the LED component according to embodiment II of the present invention;
• 27 Top view of the LED holder according to Embodiment III of the present invention;
• 28 B -B-sectional view I of the LED holder in 27 ;
• 29 B -B-section view II of the LED holder in 27 ;
• 30 B -B-section view III of the LED holder in 27 ;
• 31 B -B-section view IV of the LED holder in 27 ;
• 32 Top view of the LED device according to Embodiment III of the present invention;
• 33 CC -Sectional view I of the LED component in 32 ;
• 34 CC -Section II of the LED holder in 32 ;

embodiments

In order that the invention may be better understood, the present invention will now be described in more detail with reference to the accompanying drawings. In the accompanying drawings, preferred embodiments of the present invention are shown. However, the invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terms used herein in the specification of this invention are for the purpose of describing particular embodiments only and are not intended to limit this invention.

In order to solve the problem that the quantum dot film in the existing LED device is heat sensitive, the present invention provides an LED device comprising an LED holder, an LED chip and an encapsulation layer, wherein the LED holder comprises a base and an insulating holder; wherein at least a part of the insulating holder is provided on the base as a surrounding dam and forms an encapsulation slot with the base, wherein the side of the base facing the insulating holder serves as the bottom of such encapsulation slot, and wherein the open end of the encapsulation dam is spaced from and connected to the bottom of the encapsulation slot. The LED chip is disposed at the bottom of the encapsulation slot, the encapsulation layer comprising a quantum dot film unit, the quantum dot film unit being disposed above the LED chip and maintaining a distance from the LED chip to prevent the heat generated by the LED from being directly transferred to the quantum dot film and to ensure the performance of the quantum dots in the quantum dot film. For better understanding, the quantum dot film unit, the LED holder and the like provided in the LED device of the present invention are each illustrated by way of example below.

Example I

The present embodiment provides a quantum dot sheet unit comprising a protective frame having a hollowed portion in a central portion, a quantum dot sheet arranged in the hollowed portion, and a light-transmitting adhesive layer at least partially filling the hollowed portion to firmly bond the quantum dot sheet to the protective frame. The quantum dot sheet unit has a simple structure, is easy to manufacture, and is characterized by high reliability, high yield, and low cost. For better understanding, the present embodiment will be explained below with reference to the accompanying drawings as an example of a quantum dot sheet unit, a manufacturing method of the quantum dot sheet unit, and an LED device using the quantum dot sheet unit.

• einen Schutzrahmen 11, dessen mittlerer Bereich einen ausgehöhlten Bereich aufweist;
• eine Quantenpunktfolie 12, die in einem ausgehöhlten Bereich angeordnet ist; in diesem Beispiel weisen der Schutzrahmen 11 und die Quantenpunktfolie 12 einander gegenüberliegende Deckflächen bzw. Bodenflächen auf, wobei die Bodenflächen sowohl des Schutzrahmens 11 als auch der Quantenpunktfolie 12 im Gebrauch auf die Seite des offenen Endes des Umfassungsdamms der LED-Halterung ausgerichtet sind;
• eine lichtdurchlässige Klebeschicht 13, die den ausgehöhlten Bereich ausfüllt, um die Quantenpunktfolie 12 fest mit dem Schutzrahmen 11 zu verbinden. Einerseits ist die Methode der festen Verbindung einfach im Aufbau und Prozess, hoch in der Produktionseffizienz und niedrig in den Kosten; andererseits kann sie die Zuverlässigkeit und Luftdichtheit der festen Verbindung zwischen der Quantenpunktfolie 12 und dem Schutzrahmen 11 gewährleisten. Die Quantenpunkt-Folieneinheit 10 umgibt die Quantenpunktfolie 12 mittels des Schutzrahmens 11, der dazu dient, die Quantenpunktfolie 12 zu schützen und zu stützen, wodurch die nachteiligen Auswirkungen der Umwelt auf die Quantenpunktfolie 12 verringert und
• die Zuverlässigkeit der Quantenpunktfolie 12 erhöht werden.

The quantum dot foil unit provided in this example is in 1 wherein the quantum dot foil unit 10 shown therein comprises:

• a protective frame 11, the central portion of which has a hollowed-out portion;
• a quantum dot sheet 12 disposed in a hollowed-out region; in this example, the protective frame 11 and the quantum dot sheet 12 have opposing top surfaces and bottom surfaces, respectively, with the bottom surfaces of both the protective frame 11 and the quantum dot sheet 12 oriented toward the open end side of the enclosure dam of the LED holder in use;
• a light-transmitting adhesive layer 13 filling the hollowed-out area to firmly bond the quantum dot film 12 to the protective frame 11. On the one hand, the method of firmly bonding is simple in structure and process, high in production efficiency, and low in cost; on the other hand, it can ensure the reliability and airtightness of the firm bonding between the quantum dot film 12 and the protective frame 11. The quantum dot film unit 10 surrounds the quantum dot film 12 by means of the protective frame 11, which serves to protect and support the quantum dot film 12, thereby reducing the adverse effects of the environment on the quantum dot film 12 and
• the reliability of the quantum dot foil 12 can be increased.

In this embodiment, the inner surface of the protective frame 11 may be provided as a light-reflecting surface, the inner surface of the protective frame 11 being a side surface of the hollowed-out portion. Thereby, when the quantum dot sheet unit 10 is mounted on the LED holder and the LED device is manufactured, the light directed onto the inner surface of the protective frame 11 can be reflected back, so that more light is incident on the light-emitting surface of the LED device, which contributes to improving the light-emitting efficiency of the LED device.

There is also no specific limitation on the material of the protective frame 11 in this embodiment, for example, the protective frame 11 may be a white protective frame when the inner surface and other surfaces of the protective frame 11 are light-reflecting surfaces; the protective frame 11 may also be a transparent protective frame or a protective frame with a different colored surface; in this case, an additional reflective layer may be attached to its inner surface as needed. Of course, in some application scenarios, it is also possible not to use an additional reflective layer.

In this embodiment, the quantum dot sheet 12 may be directly taken from an existing quantum dot sheet, e.g. directly from a quantum dot sheet containing a cured adhesive layer and quantum dots mixed into the adhesive layer. In some examples of this embodiment, in order to improve the reliability of the quantum dot sheet 12 (see 1 to 2 ) that the quantum dot film 12 comprises two layers of the transparent protective film 121 and a quantum dot layer 122 arranged between the two layers of the transparent protective film, wherein the quantum dot layer 122 may comprise at least one of red quantum dots and green quantum dots. The quantum dot layer 122 is arranged inside two layers of a transparent protective film 121, so that the airtightness of the quantum dot layer can be ensured and the influence of the external environment on the quantum dot layer can be avoided. Of course, the structure of the quantum dot layer 12 in this embodiment is not limited to the two structures of the above examples, which will not be discussed further here. In some applications, the quantum dot film 12 may be manufactured in the form of sheets or rolls and simply cut or trimmed to the desired size when used.

In this example, the translucent adhesive layer 13 may be made of various materials that enable bonding and curing. For example, the translucent adhesive layer 13 may be made of an adhesive material that is not completely transparent but translucent. Optionally, a transparent adhesive material may also be used. For example, the translucent adhesive layer 13 may be made of an adhesive material that is not completely transparent but translucent. The translucent adhesive layer 13 may be filled only between the sides of the quantum dot sheet 12 and the inner wall of the protective frame 11 (i.e., in the gap between the quantum dot sheet 12 and the protective frame 11) to simply firmly bond the quantum dot sheet 12 to the protective frame 11; or it may be filled simultaneously in the other areas of the hollowed-out area. Here, the light-transmitting adhesive layer 13 may be arranged entirely within the hollowed-out region, or partially within the hollowed-out region and partially outside the hollowed-out region. That is, there are various scenarios for positioning the light-transmitting adhesive layer 13 relative to the protective frame 11 and the quantum dot sheet 12 in this embodiment. For example, the bottom surface of the light-transmitting adhesive layer 13 is flush with the bottom surface of the protective frame 11; or the bottom surface of the light-transmitting adhesive layer 13 protrudes from the protective frame 11 and covers the protective frame 11 and the bottom surface of the quantum dot sheet 12; in another example, the cover surface of the light-transmitting adhesive layer 13 is flush with the cover surface of the protective frame 11, or the cover surface protrudes from the protective frame 11 and covers the protective frame 11 and the cover surface of the quantum dot sheet 12. It will be appreciated that a combination of any number of the above examples may be used in determining the specific position and structure of the light-transmitting adhesive layer 13. For better understanding, further explanations will be given below in conjunction with the accompanying drawings, and it should be understood that the application of the present application is not limited to the following examples.

As in 5 shown, the bottom surface of the translucent adhesive layer 13 is flush with the bottom surface of the protective frame 11, and the top surface of the translucent adhesive layer 13 is flush with the top surface of the protective frame 11; the 5 The quantum dot foil unit 10 shown has the advantage of being thin and light.

As in 6 As shown, the bottom surface of the light-transmitting adhesive layer 13 is flush with the bottom surface of the protective frame 11, and the top surface of the light-transmitting adhesive layer 13 protrudes from the protective frame 11 and covers the protective frame 11 and the top surface of the quantum dot sheet 12. The light-transmitting adhesive layer 13 has relatively good wrapping of the quantum dot sheet 12 and relatively good bonding with the protective frame 11, and the obtained quantum dot sheet unit 10 has an integrated flat top and good airtightness.

As in 7 As shown, the top surface of the translucent adhesive layer 13 extends out from the protective frame 11 and covers the protective frame 11 and the top surface of the quantum dot sheet 12, and the bottom surface of the translucent adhesive layer 13 extends out from the protective frame 11 and covers the protective frame 11 and the bottom surface of the quantum dot sheet 12. The translucent adhesive layer 13 enables better wrapping of the quantum dot sheet 12 and the protective frame 11 and better bonding with the protective frame 11, and also ensures that the top surface and the bottom surface of the quantum dot sheet unit 10 are continuously flat and airtight. As shown, in the present embodiment, the top surface and the bottom surface of the light-transmitting adhesive layer 13 may be arranged flush with the top surface and the bottom surface of the protective frame 11, respectively, or the light-transmitting adhesive layer 13 may be arranged to cover the top surface and/or the bottom surface of the protective frame 11 and the quantum dot sheet 12, so that the flexibility of the structural arrangement of the light-transmitting adhesive layer 13 is increased while satisfying the use of the light-transmitting adhesive layer 13 to securely bond the quantum dot sheet 12 to the protective frame 11, thereby achieving a wider range of application scenarios and higher adaptability.

In this embodiment, the quantum dot film unit 10 can also be adjusted to include a reflective layer based on the specific structure of the light-transmissive based on the adhesive layer 13 as previously described to improve the luminosity. As in 8 For example, as shown, a cover surface of the light-transmitting adhesive layer 13 extends out of the protective frame 11 and covers the cover surface of the protective frame 11 and the cover surface of the quantum dot sheet 12, the region of the light-transmitting adhesive layer 13 covering the cover surface of the protective frame 11 is provided with a first recess connected to the cover surface of the protective frame 11, and the quantum dot sheet unit 10 further includes a first reflection layer 141 disposed within the first recess; a bottom surface of the light-transmitting adhesive layer 13 extends out of the protective frame 11 and covers the bottom surface of the protective frame 11 and the bottom surface of the quantum dot sheet 12, and a portion of the light-transmitting adhesive layer 13 covering the bottom surface of the protective frame 11 is provided with a second recess connected to the bottom surface of the protective frame 11, and the quantum dot sheet unit 10 further includes a second reflection layer 142 disposed within the second recess; in the example shown in this figure, the quantum dot sheet unit 10 includes a first reflection layer 141 and a second reflection layer 142; it is needless to say that the quantum dot sheet unit 10 includes one of the first reflection layer 141 and the second reflection layer 142. It is apparent that the present embodiment may be further provided with a reflective layer in the region where the light-transmitting adhesive layer 13 covers the top surface or the bottom surface of the protective frame in order to further increase the luminance of the LED product by the reflective properties of the reflective layer.

In this embodiment, there is no limitation on the thickness ratio between the quantum dot foil 12 and the protective frame 11. The thickness of the quantum dot foil 12 may be less than or equal to the thickness of the protective frame 11, or the thickness of the quantum dot foil 12 may be greater than or equal to the thickness of the protective frame 11. Due to the aforementioned thickness ratio between the two, it may also be arranged that the top surface and the bottom surface of the quantum dot foil 12 are in a height ratio to the top surface and the bottom surface of the protective frame 11. For better understanding, further explanations will be given below in conjunction with the accompanying drawings, and it should be understood that the application of the present application is not limited to the following examples.

As in 12 As shown, the thickness of the quantum dot film 12 is equal to the thickness of the protective frame 11, and the top surface and the bottom surface of the quantum dot film 12 are flush with the top surface and the bottom surface of the protective frame 11, respectively. The quantum dot film unit 10 becomes lighter and thinner by making the quantum dot film 12 equal in thickness to the protective frame 11 and the light-transmitting adhesive layer 13.

As in 13 As shown, the thickness of the quantum dot film 12 is less than the thickness of the protective frame 11, and the bottom surface of the quantum dot film 12 is flush with the bottom surface of the protective frame 11. The thickness of the protective frame 11 is greater than the thickness of the quantum dot film 12 so that the protective frame 11 can better protect the quantum dot film 12.

As in 14 , the top surface of the protective frame 11 is higher than the top surface of the quantum dot film 12, and the bottom surface of the quantum dot film 12 is higher than the bottom surface of the protective frame 11. The thickness of the protective frame 11 is greater than the thickness of the quantum dot film 12, and the quantum dot film 12 is centered so that the protective frame 11 can better protect the quantum dot film 12. In the present embodiment, the quantum dot film unit 10 shown in each of the examples described above can be inserted into the LED holder when used in conjunction with the LED holder, and kept at a certain distance from the LED chip in the LED holder, thereby preventing the heat generated by the LED from being directly transferred to the quantum dot film and ensuring the performance of the quantum dots in the quantum dot film.

According to a study, according to the prior art, when the quantum dot sheet of the prior art is inserted into the LED holder, a special support structure needs to be inserted into the enclosure dam of the LED holder, and then the quantum dot sheet is inserted into the enclosure dam, and the quantum dot sheet is fixed and supported by the special support structure. This concept first requires customizing specific structures for the LED holder, which is costly and less versatile, so it is difficult to implement. However, the quantum dot sheet unit 10 provided in this embodiment does not need to additionally establish a special support structure within the enclosure dam of the LED holder because it has a protective frame and a light-transmitting adhesive layer to support the quantum dot sheet, resulting in better versatility and lower cost.

In addition, it was found that the small inner diameter of the dam the LED holder makes the installation of the quantum dot sheet difficult when it is inserted into the enclosure dam, resulting in low encapsulation efficiency and yield and further increasing the cost; the quantum dot sheet is arranged inside the enclosure dam and is attached to or adjacent to the LED chip inside the enclosure dam, and the heat generated by the LED chip is transferred to the quantum dot sheet, and since the quantum dot sheet is arranged in the enclosure dam, which is a closed space with poor heat dissipation performance, the quantum dots are caused to further deteriorate the performance of the quantum dots due to poor heat dissipation. In this regard, the quantum dot sheet unit 10 provided in this embodiment can be directly set on the open end of the enclosure dam of the LED holder, which on the one hand does not require a special support structure to be set in the enclosure dam, is versatile, has a lower cost, and is more convenient to install compared with setting in the enclosure dam, which improves the overall manufacturing efficiency and yield of the LED device and is conducive to the popularization of the use of the quantum dot sheet unit 10 in the LED device; on the other hand, the distance between the quantum dot sheet unit 10 and the LED chips in the housing dam can be further increased, whereby the heat generated by the LED chips can be transferred to the quantum dot sheet unit 10, and it is also easier for the quantum dot sheet unit 10 itself to quickly dissipate the heat, which can reduce the effect of the heat on the quantum dots.

In this embodiment, if the quantum dot sheet unit 10 can be directly put on the open end of the peripheral dam of the LED holder, the firm connection between the quantum dot sheet unit 10 and the LED holder can be flexibly adjusted. For example, the quantum dot sheet unit 10 can be directly attached to the LED holder by adhesion without additionally constructing a specific structure on the LED holder, and can be widely used on various LED holders. Various attachment methods can also be used to attach the quantum dot sheet unit 10 to the open end of the peripheral dam of the LED holder. In this embodiment, it is preferable that the quantum dot sheet unit 10 further comprises a fixing post, wherein the quantum dot sheet unit is fixedly attached to the open end of the peripheral dam of the LED holder by the fixing post, furthermore, the height of the fixing post can be adjusted to adjust the distance between the quantum dot sheet unit 10 and the LED chips inside the peripheral dam in order to better regulate and achieve the desired light color of the LED device.

The specific number of the fixing posts in this embodiment is not limited and may be 2, 3, 4 or other values as long as it enables stable fixing of the quantum dot sheet unit 10 to the open end of the peripheral dam of the LED holder. In addition, the fixing post in this embodiment may be mounted entirely on the protective frame 11, entirely on the light-transmitting adhesive layer 13, or partially on the protective frame 11 and partially on the light-transmitting adhesive layer 13. For example, as shown in 9 , the bottom surface of the light-transmitting adhesive layer 13 is flush with the bottom surface of the protective frame 11, and the quantum dot sheet unit 10 further comprises a first fixing post 151 disposed on the bottom surface of the protective frame 11, the first fixing post 151 being configured to be fixedly connected to a first fixing hole at the open end of the enclosure dam. As shown in FIGS. 10 and 11 , the quantum dot sheet unit 10 further includes a second fixing post 152 disposed on a bottom surface of the light-transmissive bonding layer 13, the second fixing post 152 being configured to be fixedly connected to a second fixing hole at an open end of the enclosure dam 31. As can be seen, in this embodiment, the protective frame 11 may be further provided and/or the bottom surface of the light-transmissive bonding layer 13 is provided with a fixing post so that the quantum dot sheet unit 10 can be aligned and fixedly connected to the enclosure dam by means of the fixing post and the fixing holes when it is placed on the LED holder; also, the distance between the quantum dot sheet unit 10 and the LED chips in the enclosure dam can be adjusted by the fixing post to achieve the desired light color of the LED device. With the help of the mounting post and the corresponding mounting hole, the quantum dot sheet unit 10 is firmly attached, which enables convenient installation and later non-destructive disassembly of the quantum dot sheet unit 10 when needed (e.g., during repairs), so that the LED holder and/or the quantum dot sheet unit 10 can be recycled for reuse, which improves the resource utilization rate and reduces the cost.

If the quantum dot foil unit 10 is mounted directly on the open end of the enclosure dam of the LED holder, the The shape and size of the quantum dot sheet 12 included in the quantum dot sheet unit 10 can be adjusted to match the shape and size of the opening of the open end of the enclosure dam to ensure the quality of the light output of the LED device; the advantage of such adjustment is that the utilization rate of the quantum dot sheet 12 can be improved and the cost can be reduced while meeting the requirement that the quantum dot sheet 12 substantially or completely covers the opening of the open end of the enclosure dam. Of course, in other application scenarios, it is also possible that the shape of the quantum dot foil 12 deviates from the shape of the opening of the open end of the enclosing dam, and that the size of the quantum dot foil 12 is larger than the size of the opening of the open end of the enclosing dam, etc. For example, the shape of the quantum dot foil 12 may be the same as the shape of the opening at the open end of the dam, and the shapes of the quantum dot foil 12 and the opening at the open end of the dam may be varied, as an example, the shape of the quantum dot foil 12 is shown below, which may be, but is not limited to, a circle, an oval, a rectangle, a diamond or other irregular shapes, etc.; for example, the shape of the in 2 The quantum dot foil 12 shown is circular, the shape of the 3 The quantum dot foil 12 shown is rectangular and the shape of the 4 The quantum dot sheet 12 shown is rhombic; the specific shape can be flexibly adjusted according to the specific application requirements. For better understanding, a manufacturing method for the quantum dot sheet unit shown in each of the above examples is also described in this embodiment (see 15 ), comprising: S101: providing a protective frame having a hollowed-out portion and a quantum dot film;

S102: Inserting the quantum dot film into the hollowed-out portion, and fixing and bonding the quantum dot film to the protective frame by injecting an adhesive (e.g. glue) having light transmittance into the hollowed-out portion. It can be seen that the manufacturing method is simple, the manufacturing process is convenient, the efficiency is high and the cost is low, and the reliability and versatility of the manufactured quantum dot film unit are good.

• S201: Bereitstellen einer Schutzschicht 110, die mehrere aufeinanderfolgend verbundene Schutzrahmen 11 umfasst, wobei der mittlere Bereich jedes der Schutzrahmen 11 ein ausgehöhlter Bereich 111 ist.

In this embodiment, the quantum dot film unit can be manufactured individually or in bulk to increase the manufacturing efficiency and save costs. For better understanding, an example of a batch production process is described below. As in 16 shown, it includes the following:

• S201: Providing a protective layer 110 comprising a plurality of sequentially connected protective frames 11, wherein the central region of each of the protective frames 11 is a hollowed-out region 111.

Here, the material of the protective layer 110 is not limited, and the protective layer 110 may be a white protective layer, a transparent protective layer, or the like. The shape of the hollowed-out portion 111 of each protective frame 11 may be the same as or different from the shape of the quantum dot sheet 12, and the size of the hollowed-out portion 111 of each protective frame 11 may be larger than the size of the quantum dot sheet 12 to reserve a position for the adhesive, thereby facilitating the subsequent combination of the quantum dot sheet 12 and the protective layer 110 into a whole; of course, the size of the hollowed-out portion 111 may also be smaller than or equal to the size of the quantum dot sheet 12. In this case, the connection of the two can be achieved by simultaneously bonding the top surface and/or the bottom surface of the protective frame 11 and the bonded quantum dot sheet 12. Furthermore, the thickness of the protective layer 110 may be the same or different from the thickness of the quantum dot foil 12.

S202: Providing a plurality of quantum dot sheets 12 and fixing and connecting each quantum dot sheet 12 in a hollowed-out region 111 of a corresponding protective frame 11.

For example, a light-transmitting adhesive layer is formed by injecting adhesive into the hollowed portion 111 of the protective frame 11 to form the light-transmitting adhesive layer, and the quantum dot sheet is firmly bonded to the protective frame through the light-transmitting adhesive layer. As described above, the light-transmitting adhesive layer may be a light-transmitting adhesive layer (see 17 ), and the bottom surface and the top surface of the light-transmitting adhesive layer may be provided so as to be flush with the bottom surface and the top surface of the protective frame 11, respectively, and the first fixing post 151 is provided on the bottom surface of the protective frame 11. Also as in 18 As shown, the bottom surface and the top surface of the transparent adhesive layer may be provided so as to protrude from the protective frame 11 and cover the protective frame 11 and the bottom surface and the top surface of the quantum dot film 12, respectively. A second fixing post 152 is provided on the bottom surface of the transparent adhesive layer. This transparent adhesive layer may be formed integrally with the second fixing post 152. In some applications gen, this is not limited to the formation of a light-transmitting adhesive layer and a fixing post by a metering or molding process. When the light-transmitting adhesive layer formed by the molding process can cover the bottom surface of the protective frame 11, a part of the light-transmitting adhesive layer may be subsequently removed so that the bottom surface of the protective frame 11 covered with the light-transmitting adhesive layer is provided with recesses connected to the bottom surface of such protective frame 11, and then the aforementioned recesses are injected with white glue by the molding process to form the reflection layers (e.g., the above-mentioned first reflection layer and the second reflection layer).

S203: Cutting the protective layer 110 provided with a plurality of quantum dot films 12 to obtain the quantum dot film unit 10. For example, cuts are made along the dashed lines in 17 or 18 to obtain individual quantum dot foil units.

The present embodiment also provides an LED component, see 19 , showing that the LED device 100 comprises one of the quantum dot film assemblies 10 described above and further comprises an LED chip 20 and an LED holder 30; wherein the LED holder 30 comprises an insulating holder 31 forming an encapsulation dam; wherein the LED chip 20 is provided in an encapsulation slot (which may also be referred to as a receiving cavity); wherein the quantum dot film unit 10 is provided at an open end of the encapsulation dam (also known as the insulating holder 31), and wherein the quantum dot film 12 of the quantum dot film unit 10 covers the opening of the open end of the encapsulation dam. It can be seen that the LED device 100 provided in this embodiment, when the quantum dot film unit 10 is used in conjunction with the LED holder 30, does not impose any specific requirements on the specific structure of the LED holder 30, is more versatile and offers a wider range of applications.

Specifically, in an example of this embodiment, the LED mount 30 may include an insulating mount 31 and a base, the base including a first frame (which may also be referred to as a positive substrate) 32 and a second frame (which may also be referred to as a negative substrate) 33, and the insulating mount 31 is provided on both the first frame 32 and the second frame 33 to form an enclosing dam. At this time, the insulating mount 31 forms a bowl-shaped structure with the first frame 32 and the second frame 33 (and the inner hollow part forms an encapsulation slot). The LED chip 20 is provided in the encapsulation slot and is in contact with the first frame 32 and/or the second frame 333. The encapsulation layer of the LED device 100 may also include other encapsulation layers disposed within the encapsulation slot and covering the LED chip 20, such as a polyimide layer. B. a sealing adhesive layer, a nitrogen layer, an inert gas layer, and the like. The type of the LED chip and the encapsulation adhesive is not limited in this embodiment and is used here only as an example to clarify that the encapsulation adhesive may be, but is not limited to, a transparent encapsulation adhesive, a red phosphorus-containing encapsulation adhesive, or a green phosphorus-containing encapsulation adhesive. Based on the above, the quantum dots in the quantum dot sheet 12 may include at least one red or green quantum dot. In practice, in order to enable the LED device 100 to generate mixed white light, a blue light LED chip may be used in conjunction with a transparent encapsulant and a quantum dot sheet 12 containing red and green quantum dots, or a blue light LED chip may be used in conjunction with a red phosphor-containing encapsulant and a quantum dot sheet 12 containing green quantum dots, furthermore, a blue light LED chip with green phosphor containing a quantum dot sheet 12 containing red quantum dots may also be selected for use.

It can also be understood that when the quantum dot sheet unit 10 is provided with a fixing post, the open end of the enclosure dam of the LED holder 30 may also be provided with a corresponding fixing hole for fixing and connecting to the fixing post on one side of the quantum dot sheet unit 10, so that the quantum dot sheet 12 within the LED device 100 maintains a certain distance from the open end of the enclosure dam, thereby also increasing the distance between the quantum dot sheet 12 and the LED chip 20, which further reduces the adverse effects on the quantum dots by the heat generated by the LED chip 20 while achieving color light adjustment.

The present embodiment also provides a backlight module, see 20 and 21 , wherein the backlight module 200 comprises a substrate 40 and a plurality of LED devices 100 arranged on the substrate 40. It is assumed that the LED Devices 100 in the backlight module 200 are all previously described, and the specific structure for the LED devices 100 is not repeated here; the substrate 40 may consist of a plurality of substrates with integrated driver circuits or a plurality of substrates without integrated driver circuits.

It is to be understood that in order to adjust the light output angle of the backlight module 200, the backlight module 200 may further comprise a plurality of lenses 50 disposed on the substrate 40, wherein one lens 50 corresponds to one LED device 100. It may also be provided that the lens 50 comprises a lens portion 51 and a support portion 52, wherein the lens portion 51 has the shape of a spherical projection, the support portion 52 is fixedly connected to the lens portion 51, and the two cooperate to form a receiving cavity. Since the support portion 52 of the lens 50 is fixedly connected to the substrate 40, the LED device 100 is inserted into the receiving cavity of the lens 50 so that the lens 50 can encase the corresponding LED device 100. The height of the support portion 52 can also be flexibly adjusted, for example, the height of the support portion 52 can be set equal to the height of the LED device 100, or the height of the support portion 52 can be set correspondingly larger than the height of the LED device 100, the latter increasing the distance between the lens portion 51 and the LED device 100, which contributes to improving the luminous uniformity of the backlight module 200.

The present embodiment also provides a display device comprising any of the backlight modules described above. The display device of the present embodiment can be mounted on a terminal such as a television, a monitor, or a mobile phone.

Example II

This embodiment is an example of an LED holder used for LED devices. With the increasing application of LED devices, the demand for crack resistance and high airtightness of LED devices is increasing. At present, encapsulation adhesive is also introduced into the encapsulation slot of the LED holder instead to increase the airtightness. However, the slot walls of the existing encapsulation slot are straight-line structures, which causes water vapor from the outside and the like to easily penetrate into the inside of the encapsulation slot directly through the interface between the slot walls of the encapsulation slot and the encapsulation adhesive, resulting in poor airtightness.

The present embodiments, on the other hand, provide LED holders with better airtightness and reliability that can cooperate with the encapsulation layer to form an LED device. The LED holder in this embodiment comprises a base and an insulating holder, wherein at least a part of the insulating holder is provided on the base as a surrounding dam and forms an encapsulation slot together with the base; wherein the encapsulation slot is provided with a step surface on the slot wall, and the encapsulation slot is configured to receive the LED chip. The encapsulation layer in this embodiment comprises a first encapsulation layer and a second encapsulation layer, wherein the second encapsulation layer is attached to the above-mentioned step surface and the first encapsulation layer is arranged under the second encapsulation layer. By providing the encapsulation slot of the LED holder with a step surface, not only can the adhesion strength of the second encapsulation layer and the LED holder be improved on the one hand, but on the other hand, the path for external water vapor and other water vapor to enter along the slot wall of the encapsulation slot can be expanded, so that the hermeticity of the obtained LED device is comprehensively improved.

The second encapsulation layer in this embodiment may adopt, but is not limited to, the quantum dot sheet unit 10 shown in Example I above, wherein the quantum dot sheet unit 10 is provided on the step surface described above and may be integrally arranged in the encapsulation slot. The second encapsulation layer may also be composed of various existing quantum dot sheets or encapsulation adhesive layers such as a transparent adhesive layer, a fluorescent adhesive layer, and the like. In other words, the second encapsulation layer in this embodiment may or may not use the quantum dot sheet unit 10 in Example I above. The first encapsulation layer may be an encapsulation adhesive layer, a nitrogen layer, or an inert gas layer.

For a better understanding, this embodiment will be described below in connection with the 22 The LED component 100 comprises an LED holder 30, an LED chip 20 and an encapsulation layer 7 provided in the LED holder 30; the LED holder 30 has a base 3 and an insulating holder 31, wherein the insulating holder 31 is at least partially provided on the base 3 to form an encapsulation layer with the base 3; wherein the slot wall of the encapsulation layer is provided with a step surface 301;

The LED chip 20 is arranged in the encapsulation slot 35 and electrically connected to the socket 3;

The encapsulation layer 7 includes a first encapsulation layer 71 and a second encapsulation layer 72, wherein the first encapsulation layer 71 is in contact with the LED chip 20 and covers the LED chip, and the second encapsulation layer 72 is attached to the step surface 301.

A in 22 The structure of the LED holder 30 shown is in 23 which comprises a base 3 and an insulating holder 31. The base 3 comprises a first frame 32 and a second frame 33, the first frame 32 and the second frame 33 being separated from one another by an insulating slot; the insulating slot being filled with an insulating element 60; and the insulating holder 31 forming an encapsulation slot 35 with the first frame 32 and the second frame 33; a side wall of the insulating holder 31 forming a slot wall of the encapsulation slot 35, and the side wall of the insulating holder 31 being provided with a step surface 301. Functional surfaces are provided on the cover surfaces of the first frame 32, the second frame 33 and in the region of the encapsulation slot 35, which serve for the electrical connection to the LED chip 20. In this example, the first frame 32 and the second frame 33 may be made of a metal substrate or a printed circuit board, wherein the metal substrate may be made of at least one of, but not limited to, an aluminum substrate, a copper substrate, a silver substrate, or an electrically conductive alloy substrate, etc.; wherein the printed circuit board may be made by using a non-metallic substrate and a corresponding electrically conductive layer disposed thereon. It is to be understood that in this embodiment, the insulating bracket 31 may extend from the top surfaces of the first frame 32 and the second frame 33 toward the bottom surface of the base 3, in addition to the insulating bracket 31 extending from the top surfaces of the first frame 32 and the second frame 33 to the side and/or bottom surfaces thereof. For example, the insulating bracket 31 may be provided so as to be arranged on each of the top surface and the side surface of the first frame 32 and the second frame 33, or the insulating bracket 31 may be provided so as to be arranged on each of the top surface, the side surface, and the bottom surface of the first frame 32 and the second frame 33. When the insulating bracket 31 extends from the top surface of the first frame 32 and the second frame 33 to the side and/or bottom surface, the strength of the connection of the insulating bracket 31 to the base 31 and the airtightness can be further improved.

According to the prior art, a plastic holder is generally used in the manufacture of the LED holder, and when the plastic holder is manufactured by injection molding on the base, the plastic material tends to overflow and flow into the area where the LED chip is mounted on the first frame 32 and the second frame 33, which impairs the connection of the LED chip to the LED holder. In this connection, 24 another structural example of the 22 1, wherein the first frame 32 has a first functional portion 322 for electrically connecting to the LED chip 20 and the second frame 33 has a second functional portion 332 for electrically connecting to the LED chip 20; wherein the first frame 32 is provided with a third recess 321 arranged on the periphery of the first functional portion 322 and the second frame 33 is provided with a fourth recess 331 arranged on the periphery of the second functional portion 332; wherein the first functional portion 322, the third recess 321, the second functional portion 332 and the fourth recess 331 are exposed in the encapsulation slot 35. It is understood that in forming the insulating holder 31 on the base 3, the first frame 32 and the second frame 33 may be attached to predetermined attachment positions of the lower mold, respectively, before the upper mold is assembled to the lower mold. This upper mold has a corresponding shape complementary to the shapes of the insulating holder and the encapsulation slot, while the upper mold also has a raised part complementary to the shapes of the first recess 321 and the second recess 331. During injection molding, the plastic material does not enter the functional areas of the first frame 32 and the second frame 33 due to the blocking of the raised parts. As can be seen, by the first recess 321 and the second recess 331, it is possible to effectively prevent the overflow of the plastic into the functional area of the first frame 32 or the second frame 33 when manufacturing the insulating holder to affect the reliability of the LED chip 20 when it is connected to the base 3. On the other hand, the arrangement of the first recess 321 and the second recess 331 also improve the reliability and airtightness between the first frame 32 and the second frame 33 and the first encapsulation layer 71. In addition, the first recess 321 and the second recess 331 lengthen the path for the entry of water vapor from the outside, thereby increasing the reliability.

Regarding another structural example of the LED holder 30 from 22 , which in 25 As shown, a fifth recess 302 may also be provided on the end surface of the insulating bracket 31 forming the step surface 301, and by providing the fifth recess 302 on the step surface 301, a filling position for the second encapsulation layer may be provided, or a snapping position for the second encapsulation layer may be provided to further improve the bonding strength of the second encapsulation layer and increase the hermetic sealing performance. In addition, the fifth recess 302 widens the path for the intrusion of water vapor from the outside, thereby further increasing the reliability. Moreover, particularly when the LED chip uses a UV chip and the second encapsulation layer is bonded and fixed by the adhesive filled in the fifth recess 302, the adhesive filled in the fifth recess 302 can be prevented from failing due to the UV irradiation, so that the firm fixation of the second encapsulation adhesive layer is ensured and the reliability is improved.

In this embodiment, the LED device 100 may use a two-stage encapsulation scheme, ie, the encapsulation slot 35 is sequentially filled with a first encapsulation layer 71 and a second encapsulation layer 72, as shown in 22 and 26 , the first encapsulation layer 71 is in contact with the LED chip 20, and the second encapsulation layer 72 is attached to the step surface 301. However, the first encapsulation layer 71 may or may not be in direct contact with the second encapsulation layer 72. When the first encapsulation layer 71 is in direct contact with the second encapsulation layer 72, the step surface 301 may be flush or substantially flush with the interface separating the first encapsulation layer 71 and the second encapsulation layer 72. In this embodiment, the hardness of the first encapsulation layer 71 may be set to be lower than the hardness of the second encapsulation layer 72, and the lower hardness of the first encapsulation layer 71 near the LED chip 20 will have high crack resistance; Both high crack resistance and high airtightness of the LED component 100 are achieved, which increases the reliability of the LED component.

For example, the first encapsulation layer 71 may be set as a soft adhesive layer and the second encapsulation layer 72 may be set as a hard adhesive layer or the quantum dot film unit 10 shown in Example I. When the hardness of the encapsulation layer is lower, it is more resistant to cracking and its oxygen and moisture permeability is higher. Therefore, by setting the first encapsulation layer 71 closer to the LED chip 20, the anti-crack ability of its soft rubber layer can be utilized to improve the phenomenon that the encapsulation layer is prone to cracking due to the high radiation and high heat dissipation generated by the LED chip 20, especially when the LED chip 20 is a high-power chip. The second encapsulation layer 72, a hard adhesive layer, is disposed over the first encapsulation layer 71, a soft adhesive layer, to avoid direct contact between the hard adhesive layer and the LED chip while protecting the soft adhesive layer and the underlying LED chip, which has a higher degree of hardness and better airtightness and therefore improves the airtightness of the LED device as a whole and does not have the phenomenon of cracking due to the high radiation and high heat dissipation generated by the LED chip 20. In addition, the specific hardness values of the first encapsulation layer 71 and the second encapsulation layer 72 can be flexibly adjusted as needed, the said hardness degrees being Shore A or Shore D, among others. For example, the first encapsulation layer 71 may be adjusted to a hardness of Shore D ≤ 62 using the Shore D hardness standard and is not limited to values such as 60, 50 or 40, while the second encapsulation layer 72 has a higher hardness than that of the first encapsulation layer. In another embodiment, the second encapsulation layer 72 may be adjusted to have a hardness of Shore D > 50, wherein the hardness of the first encapsulation layer 71 is less than the hardness of the second encapsulation layer 72, without being limited to 60, 75 or 90. Furthermore, the second encapsulation layer 72 may comprise quantum dots and/or phosphors, wherein the light source generated by the LED chip 20 may excite the quantum dots to mix to form a white light with a wide color gamut; the second encapsulation layer 72 may also not comprise quantum dots and/or phosphors.

In this embodiment, the quantum dot film unit 10 shown in Example I can also at the open end of the LED holder 30 of the above example, thereby obtaining an LED device having the corresponding target color. The number of LED chips 20 within a single LED device in this embodiment can be flexibly selected, including but not limited to 1, 2 or more. Meanwhile, the LED chips 20 include, but are not limited to, blue light LED chips, among others. After the LED chip 20 is mounted on the base 3, the entire LED chip 20 may be located below the step surface 301. That is, the step surface 301 is arranged above the respective LED chip 20.

Example III

This embodiment is an example of another LED holder used for LED devices. The LED holder in this embodiment also has the advantage of better airtightness and reliability. As shown in 27 and 28 As shown, the LED holder 30 provided in this embodiment includes at least a base and a metal baffle plate 34, an insulating member 60 and an insulating bracket 31 provided on the base;
wherein the base comprises a first frame 32 and a second frame 33;
wherein the first frame 32 and the second frame 33 are separated by an insulating slot; wherein the metal baffle 34 and the first frame 32 and the second frame 33 both have opposing bottom surfaces and top surfaces, and the bottom surfaces of the metal baffle 34 are in contact with the top surfaces of the first frame 32 and the second frame 33; wherein a first encapsulation slot 351 is provided on the metal baffle 34 through the top surface and the bottom surface of the metal baffle 34, and the first encapsulation slot 351 is connected to the insulating slot; wherein the first encapsulation slot 351 can be used to provide a first encapsulation layer;
The insulating member 60 fills an insulating slot between the first frame 32 and the second frame 33; the insulating holder 31 wraps around an outer wall of the metal baffle plate 34 and forms a second encapsulation slot 352 with at least a part of the top surface of the metal baffle plate 34; and the second encapsulation slot 351 can be used to provide a second encapsulation layer; wherein at least a part of the top surface of the metal baffle plate 34 is a step surface 301 between the first encapsulation slot 351 and the second encapsulation slot 352. By providing the encapsulation slot of the LED holder with a step surface 301, not only can the adhesive strength of the second encapsulation layer and the LED holder be improved on the one hand, but on the other hand, the path for external water vapor and other water vapor to enter along the slot wall of the encapsulation slot can be expanded, so that the hermeticity of the obtained LED device is comprehensively improved.

The second encapsulation layer in this embodiment may adopt, but is not limited to, the quantum dot sheet unit 10 shown in Example I above, wherein the quantum dot sheet unit 10 is provided on the step surface described above and may be integrally arranged in the encapsulation slot. The second encapsulation layer may also be composed of various existing quantum dot sheets or encapsulation adhesive layers such as a transparent adhesive layer, a fluorescent adhesive layer, and the like. In other words, the second encapsulation layer in this embodiment may or may not use the quantum dot sheet unit 10 in Example I above.

According to the prior art, a plastic holder is generally used in the manufacture of the LED holder, and when the plastic holder is manufactured by injection molding on the base, the plastic material tends to overflow and flow into the area where the LED chip is mounted on the first frame 32 and the second frame 33, which impairs the connection of the LED chip to the LED holder. In this regard, the present embodiment provides another LED holder, see FIG. 29 in which a fifth recess 302 is provided on the top surface of the metal baffle 34 (ie, on the step surface 301), the fifth recess 302 being connected to the second encapsulation slot 352.

It is understandable that in some application scenarios, after the base and the metal baffle plate 34 are manufactured by a stamping or etching process, when the insulating mount 31 is manufactured by an injection molding process, the injection mold does not overflow into the base and the metal baffle plate 34 into the area where the LED chips are provided on the first frame 32 and the second frame 33 due to the fact that the mold extends into the fifth recess 302 of the metal baffle plate 34 and forms a blockage, thereby ensuring reliability when the LED chips are bonded to the LED mounts. In addition, the fifth recess 302 can not only improve the bonding strength of the second encapsulation layer and the LED mount, but also widen the path for external water vapor and the like to flow along the slot wall of the encapsulation nut, so that the hermeticity of the resulting LED device is comprehensively improved.

In this embodiment, the materials and structures of the first frame 32 and the second frame 33 may be made of, but are not limited to, the materials shown in Embodiment II. The metal baffle 34 may be made of the same material as the first frame 32 and the second frame 33, and all three may also be made of the same material and made of one piece. After the LED device is manufactured, the heat generated when the LED chip emits light can be dissipated downward by means of the base, and it can also be dissipated by means of the metal baffle 34 to improve the heat conduction effect of the heat generated when the LED device is in operation. Optionally, the height of the metal baffle 34 may also be higher than the height of the LED chip so that more heat can be dissipated by means of the metal baffle 34 and the heat conduction effect of the heat generated when the LED device is in operation is further improved.

As in 29 , a first connection portion 323, a first extension portion 324, and a first functional portion 322 are provided on the top surface of the first frame 32, and a second connection portion 333, a second extension portion 334, and a second functional portion 332 are provided on the top surface of the second frame 33; wherein the first functional portion 322 and the second functional portion 332 are both exposed to the first encapsulation slot 351, the first connection portion 323 may be connected to the first extension portion 324, and the second connection portion 333 may be connected to the second extension portion 334. Optionally, the first frame 32 and the second frame 33 may also be provided with through holes to allow the insulating bracket 31 to extend from the connection portion on the top surface of the first frame 32 and the second frame 33 to the bottom surface of the first frame 32 and the second frame 33; for example, as shown in 30 shown, the first frame 32 is provided with a first through hole through the top surface and the bottom surface of the first frame 32, and the second frame 33 is provided with a second through hole through the top surface and the bottom surface of the second frame 33; and the insulating bracket 31 includes an extension portion 310 extending inwardly into the first through hole and the second through hole. Optionally, the side walls of the first through hole and/or the second through hole may have steps as shown in 31 By adding first and second through holes and a step surface for the first and second through holes, respectively, the contact area of the insulating bracket 31 with the first frame 32 and the second frame 33 is increased, thereby increasing the adhesive force as well as the airtightness between the two.

In order to increase the efficiency of the light output, in this embodiment, the inner side wall of the metal baffle plate 34 exposed to the first encapsulation slot may also be provided as a reflection surface; and/or surfaces on the first frame 32 and the second frame 33 exposed to the first encapsulation slot are reflection surfaces, i.e. the slot walls and/or the slot bottom of the slot of the first encapsulation slot 351 are provided as reflection surfaces, for example, the inner side walls of the metal baffle plate 34 and/or the top surfaces of the first frame 32 and the second frame 33 are coated with a thinner layer of highly reflective metal to form a reflection surface, the material of this highly reflective metal layer consisting of, among others, silver, nickel or gold. In addition, the inner side walls of the metal baffle plate 34 and the cover surfaces of the first frame 32 and the second frame 33 can also be polished to form a reflection surface, which also makes it easier to reflect more light from the LED holder.

In this embodiment, the insulating member 60 and the insulating bracket 31 may be made of the same material, e.g., a thermoplastic, and the insulating member 60 and the insulating bracket 31 may be integrally molded. The insulating bracket 31 provided on the first frame 32 and the second frame 33 also encloses an outer side wall of the metal impact plate 34, with the top surface of the insulating bracket 31 being higher than the top surface of the metal impact plate 34. The insulating bracket 31 and at least a portion of the top surface of the metal impact plate 34 form a second encapsulation slot 352, this second encapsulation slot 352 communicating with both a first encapsulation slot 351 on the metal impact plate 34 and a fifth recess 302 on the top surface of the metal impact plate 34. The opening size of this second encapsulation slot 352 is larger than the opening size of the first encapsulation slot 351, and the opening shape of the second encapsulation slot 352 may be the same as the opening shape of the first encapsulation slot 351, including but not limited to a circle or a rectangle and the like. As shown in 31 As shown, the insulating holder 31 may cover a portion of the top surface of the metal baffle plate 34, and an inner side wall of the insulating holder 31, which corresponds to the second encapsulation slot 352 is near an outer side of the fifth recess 302, this outer side of the fifth recess 302 being a side facing away from the first encapsulation slot 351; at this time, the fifth recess 302 of the metal baffle plate 34 can be used as an insulating slot to form an insulating barrier at the fifth recess 302 of the metal baffle plate 34 during the manufacture of the insulating holder 31, thereby effectively preventing the plastic material from overflowing into the above-mentioned functional region or the inner wall of the metal baffle plate 34, thereby ensuring that the subsequent LED chips can be more securely attached to the LED holder.

As in 31 In this embodiment, in order to increase the light-emitting angle, it may also be provided that the inner side wall of the insulating holder 31 exposed to the second encapsulation slot 352 is provided at a position inclined toward the outside of the insulating holder 31, and/or it may be provided that the inner side wall on the metal baffle plate 34 exposed to the first encapsulation slot 351 is provided at an angle to the outside of the metal baffle plate 34, that is, the slot walls of the first encapsulation slot 351 and/or the second encapsulation slot 352 are set to be inclined surfaces inclined toward the outside of the first encapsulation slot 351 and/or the second encapsulation slot 352 to facilitate formation of the LED device having a larger light-emitting angle. The specific inclination angle can be flexibly set according to actual needs and is not limited here.

As in 32 and 33 As shown in FIG. 1, this embodiment also provides an LED device, this LED device 100 comprising the LED holder shown in each of the above examples, as well as the LED chip 20 and the encapsulation layer 7 provided on the LED holder; the LED chip 20 is inserted into the first encapsulation slot electrically connected to the first frame 32 and the second frame 33; the encapsulation layer 7 is inserted into the first encapsulation slot and the second encapsulation slot enclosing the LED chip 20.

In this embodiment, the LED device may be provided with one or at least two LED chips 20, wherein the LED chips include, among others, blue light LED chips. Furthermore, the height of the metal baffle plate 34 may be higher than the height of the LED chip 20, i.e. the depth of the first encapsulation slot is greater than the height of the LED chip 20.

In this embodiment, specific types of encapsulation layers can be selected as needed, including a low-refractive-index transparent adhesive layer, a high-refractive-index transparent adhesive layer, a fluorescent adhesive layer containing subdots, a high-hardness transparent adhesive layer, or a low-hardness transparent adhesive layer, to meet different application requirements. In addition, two- or multi-stage encapsulation layers can also be provided in the LED holder. As shown in 34 For example, as shown, a first encapsulation layer 71 is filled into a first encapsulation slot of the LED holder, and a second encapsulation layer 72 is filled into a second encapsulation slot of the LED holder. Here, at least a portion of the top surface 301 of the metal baffle 34 may be flush or substantially flush with the interface separating the first encapsulation layer 71 from the second encapsulation layer 72. Since the top surface of the metal baffle 34 is also provided with a fifth recess 302, this fifth recess 302 may provide a filling location for the adhesive used to attach the second encapsulation layer 72 or provide a locking location for the second encapsulation layer 72 to indirectly improve the encapsulation bonding ability and increase the hermetic performance. Moreover, particularly when the LED chip uses a UV chip and the second encapsulation layer 72 is bonded and fixed by the adhesive filled in the fifth recess 302, the adhesive filled in the fifth recess 302 can be prevented from failing due to the UV irradiation, so that the firm fixation of the second encapsulation adhesive layer is ensured and the reliability is improved. Optionally, the first encapsulation layer 71 and the second encapsulation layer 72 in this embodiment may adopt the first encapsulation layer 71 and the second encapsulation layer 72 in the above Example II, but are not limited thereto. The LED chip in this embodiment can also be used as a high-performance LED chip if necessary.

The encapsulation layer in this embodiment can also adopt a two-stage and higher encapsulation scheme, and the use of a multi-stage encapsulation method can effectively enable the encapsulation layer formed on the back surface to avoid direct contact with a heat source to improve safety performance. In addition, it meets the dual needs of high crack resistance and high airtightness protection for light-emitting devices, as well as insulation for applications in packages made of non-heat-resistant material. For example, the quantum dot film unit 10 shown in Example I may be added to the above-described first encapsulation layer 71 and the second encapsulation layer 72 at the open end of the peripheral dam of the LED holder.

In the LED device in this embodiment, by providing a fifth recess on the metal baffle plate and on the top surface of the metal baffle plate, the plastic material can be effectively prevented from overflowing into the functional area on the base, whereby the reliability of the LED chip when bonded to the LED holder can be ensured. Also, by having the LED holder having a first encapsulation slot and a second encapsulation slot, at least a part of the top surface of the metal baffle plate is a step surface between the first encapsulation slot and the second encapsulation slot to facilitate the use of a multi-layer encapsulation scheme to meet different application requirements. The fifth recess can also increase the contact area between the encapsulation adhesive and the LED holder to bond the two more firmly, and can also provide a filling position for the adhesive used to fix this layer of encapsulation adhesive in the case of a multi-stage encapsulation scheme, or it provides the clamping position for this layer of encapsulation adhesive, thereby indirectly improving the encapsulation ability and increasing the airtightness, and at the same time, it can increase the expansion path for external water vapor to penetrate into the interior of the LED device and further improve the reliability of the LED device.

• S301: Bereitstellen eines Sockels, wobei der Sockel einen ersten Rahmen und einen zweiten Rahmen umfasst, wobei der erste Rahmen durch einen Isolierschlitz vom zweiten Rahmen getrennt ist.

For ease of understanding, this embodiment also provides a manufacturing method for an LED holder, including, among others, the following steps:

• S301: Providing a base, the base comprising a first frame and a second frame, the first frame separated from the second frame by an insulating slot.

In this embodiment, the first frame and the second frame may be manufactured by punching or etching, and the material and structure thereof may refer to, but are not limited to, the structure of the first frame and the second frame in the above examples.

S302: forming a metal baffle on the base; wherein the metal baffle is provided with a first encapsulation slot passing through a top surface and a bottom surface of the metal baffle, and the first encapsulation slot is connected to an insulating slot; and a fifth recess is provided on the top surface of the metal baffle.

The material and structure of the metal baffle plate and the connection with the first frame and the second frame may be as shown in the above examples, but are not limited thereto and are not repeated here. S303: Forming an insulating member and an insulating bracket on the base.

In this embodiment, the insulating member and the insulating bracket may be made of the same material, such as a thermoplastic resin, and the insulating member and the insulating bracket may be integrally molded. An insulating bracket molded onto the base also encloses the outer side wall of the metal baffle plate, with the upper surface of the insulating bracket being higher than the upper surface of the metal baffle plate. The fifth recess of the metal baffle plate prevents the plastic material from overflowing onto the functional surfaces of the first and second frames or onto the reflective surface of the metal baffle plate, thus ensuring that subsequent LED chips can be more securely mounted on the LED bracket.

It can be seen that the method of manufacturing the LED holder in this embodiment is a simple process, the process of manufacturing is convenient, the efficiency is high and the cost is low, and the resulting LED has the advantages of good airtightness and reliability.

Example IV

This embodiment also provides a light emitting device, the light emitting device comprising an LED component as provided in any of the preceding embodiments. This light emitting device comprises, inter alia, a lighting device, a light signal display device or a backlight device. In particular, the LED component provided in the preceding embodiments can be used in various light emitting fields, e.g. it can be processed into a backlight module used in the field of backlighting of displays (which can be a backlight module for a terminal such as a television, a monitor, a mobile phone, etc.). In this case, it can be used for backlight modules In addition to display backlighting, it can also be used for keyboard backlighting, filming, household lighting, medical lighting, decoration, automotive and transportation fields. In the application in the field of key backlighting, it can be used as a backlight source for mobile phones, calculators, keyboards and other devices with buttons; in the application in the field of photography, it can be made into a camera flash; in the application in the field of household lighting, it can be made into floor lamps, table lamps, lighting lamps, ceiling lamps, ceiling lamps, projector lamps and so on; in the medical lighting, it can make surgical lamps, low-level electromagnetic lighting, etc.; in the decorative field, it can make various decorative lamps, such as various colored lamps, landscape lighting, advertising lamps; in the automotive field, it can make car lamps, car lights, etc.; in the traffic field, it can make various traffic lights and street lamps. The above applications are only some of the applications exemplified in this embodiment, and it should be understood that the applications of the LED devices in this embodiment are not limited to the various fields mentioned above.

It is to be understood that the application of the present invention is not limited to the above examples and that it can be improved or modified in accordance with the above description by a person of ordinary skill in the art, and that all such improvements and modifications fall within the scope of the appended claims of the present invention.

Claims (12)

An LED device characterized by comprising an LED holder, an LED chip, and an encapsulation layer, the LED holder comprising a base and an insulating holder; at least a portion of the insulating holder is provided on the base as a surrounding dam and forms an encapsulation slot with the base, and the LED chip is arranged at the bottom of the encapsulation slot, the encapsulation layer comprises a quantum dot film unit, the quantum dot film unit is arranged above the LED chip and is spaced from the LED chip, the quantum dot film unit comprising: a protective frame whose central region has a hollowed-out region; a quantum dot film arranged in the hollowed-out region; and a light-transmitting adhesive layer, at least a portion of the light-transmitting adhesive layer fills the hollowed-out region to firmly bond the quantum dot film to the protective frame. LED component according to claim 1 , characterized in that the quantum dot foil unit is arranged at an open end of the enclosing dam; wherein the shape and size of the quantum dot foil is adapted to the shape and size of the opening of the open end; wherein the protective frame and the quantum dot foil comprise top surfaces and bottom surfaces opposite to each other, and wherein the bottom surfaces of the protective frame and the quantum dot foil are both aligned towards the open end. LED component according to claim 2 , characterized in that the light-transmitting adhesive layer is a light-transmitting adhesive layer; wherein the bottom surface of the light-transmitting adhesive layer is flush with the protective frame or protrudes from the protective frame and covers the protective frame and the bottom surface of the quantum dot film; wherein the top surface of the light-transmitting adhesive layer is flush with the top surface of the protective frame or protrudes from the protective frame and covers the top surface of the protective frame and the quantum dot film. LED component according to claim 3 , characterized in that a top surface of the light-transmitting adhesive layer protrudes from the protective frame and covers the protective frame and the top surface of the quantum dot film, wherein in the region in which the light-transmitting adhesive layer covers the top surface of the protective frame, a first recess is provided which is connected to the top surface of the protective frame, wherein the quantum dot film unit further comprises a first reflection layer arranged within the first recess; or wherein a bottom surface of the light-transmitting adhesive layer protrudes from the protective frame and covers the protective frame and the bottom surface of the quantum dot film, wherein in the region in which the light-transmitting adhesive layer covers the bottom surface of the protective frame, a second recess is provided which is connected to the bottom surface of the protective frame, wherein the quantum dot film unit further comprises a second reflection layer arranged within the second recess; LED component according to claim 3 , characterized in that the bottom surface of the light-transmitting adhesive layer is flush with the bottom surface of the protective frame, the quantum dot film unit further comprising a first fixing post arranged on the bottom surface of the protective frame, the first fixing post being fixedly connected to a first fixing hole at the open end; or the quantum dot film unit further comprising a second fixing post arranged on a bottom surface of the light-transmitting adhesive layer, the second fixing post being fixedly connected to a second fixing hole at the open end. LED component according to claim 1 , characterized in that the inner surface of the protective frame is a light-reflecting surface. LED component according to claim 1 , characterized in that a step surface is provided on a slot wall of the encapsulation slot, wherein the encapsulation layer comprises a first encapsulation layer and a second encapsulation layer, wherein the second encapsulation layer is attached to the step surface, the first encapsulation layer is arranged under the second encapsulation layer; and wherein the second encapsulation layer is the quantum dot film unit or adhesive layer. LED component according to claim 7 , characterized in that the base comprises a first frame, a second frame and an insulating member, wherein an insulating slot is provided between the first frame and the second frame to insulate the two, the insulating member is filled in the insulating slot; wherein the insulating holder together with the first frame and the second frame forms the encapsulation slot; wherein a slot wall of the encapsulation slot is formed on an inner wall of the insulating holder, and the step surface is provided on the inner wall of the insulating holder. LED component according to claim 8 , characterized in that the first frame comprises a first functional region electrically connected to the LED chip, and the second frame comprises a second functional region electrically connected to the LED chip; wherein the first frame is provided with a third recess arranged on the periphery of the first functional region, and the second frame is provided with a fourth recess arranged on the periphery of the second functional region; wherein the first functional region, the third recess, the second functional region and the fourth recess are exposed to the encapsulation slot. LED component according to claim 7 , characterized in that the base comprises a first frame, a second frame, a metal baffle plate and an insulating member, the first frame and the second frame having an insulating slot between the first frame and the second frame that insulates the two, the insulating member being filled in the insulating slot; the metal baffle plate being arranged on the first frame and the second frame and having a first encapsulation slot through its own top surfaces and bottom surfaces; the first encapsulation slot being connected to the insulating slot, the slot wall of the first encapsulation slot being an inner side wall of the metal baffle wall and the bottom of the slot being the top surface of the first frame and the second frame; and the insulating member being filled in the insulating slot; the insulating bracket enclosing an outer side wall of the metal baffle plate and forming together with at least a portion of the top surface of the metal baffle plate a second encapsulation slot connected to the first encapsulation slot; at least a portion of the top surface of the metal baffle plate being formed as the step surface; wherein the encapsulation slot comprises the first encapsulation slot and the second encapsulation slot, the first encapsulation slot being provided for receiving the first encapsulation layer and the second encapsulation slot being provided for receiving the second encapsulation layer. LED component according to claim 7 , characterized in that a fifth recess is provided on the step surface, which forms a filling position or snap-in position for the second encapsulation layer. LED component according to claim 7 , characterized in that the hardness of the first encapsulation layer is lower than the hardness of the second encapsulation layer.

Images