DE202009016945U1 - Cleaning agent for electronic components - Google Patents

Abstract

Detergent for electronic components, containing
(a) amides of optionally hydroxysubstituted mono- or dicarboxylic acids and
(b) amine compounds.

Description

Field of the invention

The Invention is in the field of detergents for Hard surfaces and special detergents for electronic components.

State of the art

The Production of electronic components, especially of microelectronic Components such as processors, memory chips, printed circuits and the like, requires the use of special solvents on the one hand waste materials that are produced during the production (z. As organic polymers), and the sensitive Surfaces to clean. Although a lot of solvents known for this application not only come into consideration, but actually too are used, but they are always characterized by the fact that the one does not have sufficient Löseeigenschaften and the others either toxicologically questionable, not sufficient are biodegradable or not on renewable resources are based - all the characteristics of the manufacturers However, such components are required.

So far, mainly powerful, but environmentally harmful solvents are used, such. B. - halogenated hydrocarbons (trichlorethylene, perchlorethylene), acetone, isopropyl alcohol and in particular N-methylpyrrolidone. The use of NMP is the subject of numerous publications such. B. US 5,399,464 , From the patent US 5,236,552 the use of NMP and other solvents (formamide, dimethylacetamide, N-cyclohexylpyrrolidone) for the cleaning of circuits is known. An NMP-containing solvent mixture is marketed, eg under the name Microposit® ^® Remover 1165 in trade; under the name Posistrip ^® 830 Diglycolamine is sold for the same purpose.

The The object of the present invention has therefore been new water-soluble or at least water-dispersible Detergent for electronic components available to provide a high solvent capacity for Waste products of the manufacturing process as well as fat residues without attacking the sensitive surfaces, At the same time, they are characterized by a high biodegradability aufwei sen, are toxicologically harmless, have a low vapor pressure and at least predominantly made from renewable raw materials.

Description of the invention

• (a) Amide von gegebenenfalls hydroxysubstituierten Mono- oder Dicarbonsäuren und
• (b) Aminverbindungen

The invention relates to cleaning agents for electronic components, containing

• (a) amides of optionally hydroxysubstituted mono- or dicarboxylic acids and
• (b) amine compounds

Surprisingly It was found that amides of fatty acids, hydroxycarboxylic acids or dicarboxylic acids, preferably in combination with amine compounds, such as amines or amino alcohols the requirement profile described above in an excellent way. The substances or mixtures of substances are characterized by the fact that they have a sufficient solubility in water or water dispersibility and a high cleaning power They behave towards the sensitive ones Surfaces inert. Especially the amides are biologically light degradable, toxicologically harmless and become predominantly Made on the basis of renewable raw materials. Of particular note are amides, especially dimethylamides based on short-chain Fatty acids or lactic acid, which in particular be used in combination with amino alcohols and especially provide good performance results.

amides

Amides which are component (a) can in principle be derived from three groups of acyl compounds, namely monocarboxylic acids, especially fatty acids, hydroxycarboxylic acids and dicarboxylic acids. In a first embodiment of the invention, the amides of the general formula (I) follow R ¹ CO-NR ² R ³ (I) in the R ¹ for a linear or branched, saturated or unsaturated acyl radical having 6 to 22, vorzugswei se 8 to 12 and in particular 8 to 10 carbon atoms and R ² and R ³ independently of one another represent hydrogen or an alkyl radical having 1 to 8 carbon atoms with the proviso that R ² and R ^{3 may} not simultaneously be hydrogen. Typical examples of suitable fatty acids from which the acyl moiety R ¹ CO is derived are caproic, caprylic, capric, lauric, myristic, palmitic, palmitic, stearic, oleic, elaidic, linoleic, conjugated linoleic, linolenic, gadoleic, arachidonic, behenic, Erucic acid and their technical mixtures such as coconut oil fatty acid, palm oil fatty acid, soybean fatty acid, sunflower fatty acid or tallow fatty acid. Particularly preferred are technical mixtures of fatty acids having 6 to 12, or 8 to 10 carbon atoms, in particular the so-called C ₈ -C ₁₀ precursor fatty acid, which is obtained as a by-product in the production of coconut fatty acid.

in der R⁴ und R⁵ unabhängig voneinander für Wasserstoff oder einen Alkylrest mit 1 bis 8 Kohlenstoffatomen mit der Maßgabe stehen, dass R⁵ und R⁶ nicht gleichzeitig Wasserstoff bedeuten dürfen. Sofern die Hydroxycarbonsäuren mehrbasig sind, können alle Carboxylfunktionen, vorzugsweise aber nur eine amidiert vorliegen.In a second embodiment, the amides can be derived from hydroxycarboxylic acids. These may be short-chain species such as malic acid or citric acid, but there are also hydroxy fatty acids into consideration, especially 12-hydroxystearic acid or ricinoleic acid. However, preference is given to amides of the formula (II)

in which R ⁴ and R ⁵ independently of one another are hydrogen or an alkyl radical having 1 to 8 carbon atoms, with the proviso that R ⁵ and R ^{6 may} not simultaneously be hydrogen. If the hydroxycarboxylic acids are polybasic, all carboxyl functions, but preferably only one amidated, may be present.

Finally, in a third embodiment of the invention, the amides can be derived from dicarboxylic acids, wherein they then usually follow the formula (III). R ⁶ R ⁷ N-CO- [A] _x -CO-NR ⁸ R ⁹ (III) in which A is a [CH ₂ ] or [CH = CH] group, x is 0 or numbers from 1 to 12 and R ⁶ , R ⁷ , R ⁸ and R ⁹ independently of one another represent hydrogen or an alkyl radical having 1 to 8 carbon atoms with the proviso that R ⁶ , R ⁷ , R ⁸ and R ^{9 may} not simultaneously be hydrogen. Typical examples are amides based on malonic acid, succinic acid or adipic acid, which may be present as full amides or hemiamides.

In terms of the amide component, the nitrogen may have one or two alkyl substituents having 1 to 8, preferably 1 to 4 carbons. typical Examples are methylamides, ethylamides, propylamides, butylamides, Propylamides, hexylamides, heptylamides and octylamides, and amides, in which the alkyl radicals are different or an alkyl radical replaced by hydrogen. From an application point of view Amides having the same alkyl radicals, in particular dimethyl, Dibutyl and di-2-ethylhexylamides.

Thus, in total preference is given to those agents which contain as component (a) amides selected from the group formed by caprylic acid dimethylamide, caprylic acid dibutylamide, caproic acid di-2-ethylhexylamide, caprylic acid dimethylamide, caprylic acid dibutylamide, caprylic acid di-2-ethylhexylamide , Capric acid, capric dibutylamide, capric di-2-ethylhexylamide, lactic acid dimethylamide, lactic acid dibutylamide, lactic acid di-2-ethylhexylamide, and mixtures thereof. With regard to the production of these substances is an example of the document EP 1916268 A1 (Cognis).

amine compounds

The amine compounds which comprise component (b) are preferably primary, secondary or tertiary C ₃ -C ₁₀ amines or polyamines or C ₂ -C ₆ alkanolamines. Typical examples are isopropylamine, hydroxyethylmorpholine, diethylenetriamine, aminoethylpiperadine, monoethanolamine, diethanolamine, triethanolamine, methylaminoethanol, 1-amino-2-propanol, 2- (2-aminoethoxy) ethanol and mixtures thereof. The agents may contain the two components (a) and (b) in a weight ratio of 10:90 to 99: 1, preferably 50:50 to 95: 5 and especially 60:40 to 90:10.

Other additives

Optionally, the compositions according to the invention may also be used in minor amounts as customary additives such as mild low-foam surfactants such. B. mixed ethers, chelating agents such. As EDTA or weak acids such. B. contain citric acid.

Industrial Applicability

• (i) von Amiden von gegebenenfalls hydroxysubstituierten Mono- oder Dicarbonsäuren, ausgenommen Amide der Ameisensäure und der Essigsäure, sowie zum anderen
• (ii) von Gemischen enthaltend (a) Amide von gegebenenfalls hydroxysubstituierten Mono- oder Dicarbonsäuren und (b) Aminverbindungen

zur Reinigung von Elektronikbauteilen.In two further embodiments, the invention relates to the one hand, the use

• (i) of amides of optionally hydroxy-substituted mono- or dicarboxylic acids, excluding amides of formic acid and of acetic acid, and on the other hand
• (ii) mixtures containing (a) amides of optionally hydroxysubstituted mono- or dicarboxylic acids and (b) amine compounds

for cleaning electronic components.

Examples

Examples 1 to 5, Comparative Examples V1 to V3

Commercially available silicone wafers were first coated with hexamethyldisilazane and then with 1000 nm of an opaque platinum paint (JT Baker 1-PR-21). The wafers were first annealed at 95 ° C for 30 minutes and then at 200 ° C for 60 minutes, producing a highly cross-linked coating. Subsequently, the wafers were immersed in the various cleaning agents at 80 ° C and measured the time until adherent residues disappear completely on visual inspection and the boards were completely cleaned. The results are summarized in Table 1. Indicated is the mean of a double determination. Table 1 Cleaning of silicon wafers (amounts in% by weight) cleaning supplies 1 2 3 4 5 V1 V2 V3 C ₈ / C ₁₀ -Fettsäuredimethylamid Agnique ^® 810 100 - - 90 - - - - C ₁₀ -Fettsäuredimethylamid Agnique ^® KE 3308 - 100 - - 90 - - - Milchsäuredimethylamid Agnique ^® AMD3L - - 100 - - - - - 1-amino-2-propanol - - - 10 - - - 10 2- (2-aminoethoxy) ethanol - - - - 10 - - - NMP - - - - - 100 - 90 diglycolamine - - - - - - 100 - Cleaning time [s] 78 80 70 65 63 79 85 69

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• US 5399464 [0003]
• US 5236552 [0003]
• EP 1916268 A1 [0011]

Claims (12)

Cleaning products for electronic components, containing (a) amides of optionally hydroxy-substituted Mono- or dicarboxylic acids and (b) amine compounds. Composition according to Claim 1, characterized in that they contain, as component (a), amides of the formula (I), R ¹ CO-NR ² R ³ (I) in which R ^{1 is} a linear or branched, saturated or unsaturated acyl radical having 6 to 22 carbon atoms and R ² and R ^{3 are} independently hydrogen or an alkyl radical having 1 to 8 carbon atoms, with the proviso that R ² and R ^{3 are} not simultaneously Hydrogen may mean. Composition according to Claim 1, characterized in that they contain, as component (a), amides of the formula (II)

in which R ⁴ and R ⁵ independently of one another are hydrogen or an alkyl radical having 1 to 8 carbon atoms, with the proviso that R ⁵ and R ^{6 may} not simultaneously be hydrogen. Composition according to claim 1, characterized in that they contain as component (a) amides of the formula (III). R ⁶ R ⁷ N-CO- [A] _x -CO-NR ⁸ R ⁹ (III) in which A represents a [CH _2] - or [CH = CH] represents group, x is 0 or a number of from 1 to 12 and R ^6, R ^7, R ⁸ and R ⁹ independently represent hydrogen or an alkyl radical with 1 to 8 carbon atoms with the proviso that R ⁶ , R ⁷ , R ⁸ and R ^{9 may} not simultaneously be hydrogen. Means according to at least one of the claims 1 to 4, characterized in that they as component (a) amides contain, ranging from fatty acids with 8 to 12 carbon atoms or derive the lactic acid. Means according to at least one of the claims 1 to 5, characterized in that they are used as component (a) dimethyl, Dibutyl or di-2-ethylhexylamides included. Means according to at least one of the claims 1 to 6, characterized in that they as component (a) amides included, which are selected from the group that formed is derived from caproic acid dimethylamide, caproic acid dibutylamide, Caproic acid di-2-ethylhexylamide, caprylic acid dimethylamide, Caprylic acid dibutylamide, caprylic acid di-2-ethylhexylamide, Caprylic acid dimethylamide, capric acid dibutylamide, Capric acid di-2-ethylhexylamide, lactic acid dimethylamide, Milk acid dibutylamide, lactic acid di-2-ethylhexylamide as well as their mixtures. Composition according to at least one of claims 1 to 7, characterized in that they contain as component (b) amine compounds which are selected from the group of primary, secondary or tertiary C ₃ -C ₁₀ amines or polyamines or C ₂ -C _6- alkanolamines. Means according to at least one of the claims 1 to 8, characterized in that they as component (b) amine compounds from the group formed by isopropylamine, hydroxyethylmorpholine, Diethylenetriamine, aminoethylpiperadine, monoethanolamine, diethanolamine, Triethanolamine, methylaminoethanol, 1-amino-2-propanol, 2- (2-aminoethoxy) ethanol as well as their mixtures. Means according to at least one of the claims 1 to 9, characterized in that they comprise the components (a) and (b) in a weight ratio of 10:90 to 99: 1 included. Use of amides of optionally hydroxysubstituted mono- or dicarboxylic acids, from taken amides of formic acid and acetic acid, for cleaning electronic components. Use of mixtures containing (a) amides of optionally hydroxy-substituted mono- or dicarboxylic acids and (b) amine compounds for cleaning electronic components.