DE19633938A1 - Smart card with inductive antenna for contactless data transmission - Google Patents

Abstract

The smart card has a card carrier provided with a milled recess in one of its major surfaces. The recess is for reception of a semiconductor chip (25) with antenna contacts (31,32) for connection to the inductive antenna. The antenna is provided by an antenna coil layer (11) within the card carrier. The antenna coil layer has chip contacts (20,21) cooperating with the antenna contacts of the semiconductor chip. It has thickened sections (16,17) embedded in the card carrier and exposed during milling, to ensure good contact with the antenna contacts.

Description

The invention relates to a chip card for contactless and / or contact-related data transmission, as well as a procedure for their manufacture.

Chip cards for the so-called contact-based data transfer supply have a chip card connected to the card body (CC) module, usually one on a plastic Carrier located semiconductor chip includes a gal vanic contact field is connected. The contact areas are standardized according to ISO 7810 or ISO 7816. In the card reader These contact surfaces are advised by electrical lifting cones clocks sampled.

In the case of contactless systems, the data is transferred via averaging through alternating electromagnetic fields using we  at least one inductive arranged in the chip card Kitchen sink.

With so-called combination cards, both systems are in one card united. The combination card therefore has both a contact field for the galvanic data transmission as well as over a inductively coupled contact. For this it is necessary in addition to the electrically conductive connections from the semiconductor Chip to the system for contact-based data transmission also connections to the system for contactless data transfer to produce averages.

It is therefore an object of the invention to provide a chip card where the required electrically conductive and mechani connections in a particularly simple manner are, as well as a method for producing such smart cards to accomplish.

This problem is solved with an object the features according to claim 1 or the method according to An Proverb 9. Further developments arise from the Un claims.

According to a basic idea of the invention, a chip card for contactless and / or contact-related data transfer supply specified, which a semiconductor chip and contact surface Chen for the contact-related data transmission and besides Connection points and at least one means for contactless Data transmission, usually this will be an induction coil be included. The chip card according to the invention stands out characterized in that the electrically conductive connections between the connection points and the means for contact loose data transmission is made by soldering, whereby the mechanical connection by hot or hot melt gluing, but also by soldering.  

The hot or hot melt adhesive expediently has partial electrical properties trically conductive, solderable particles. Particularly preferred become these electrically conductive, solderable particles already when preparing the adhesive on a carrier film added or applied.

Size and amount of the sections added to the adhesive Soldering particles depend on the type of contact formation or the contact areas of the chip card. The diameter of one between intended contact surfaces and on a hot or Solder ball located hot melt adhesive film is, for example in the range between 15 and 25 µm.

The amount of conductive particles is expediently chosen so that that between the connection points and the means for contact there are enough particles in loose data transmission, for an adequate electrical connection by soldering on to build.

According to the inventive method, the comes electrically conductive connection that the on the Trä adhesive film located at least in the area of the An closure points and / or the connection points of the agent for the contactless data transfer conductive particles or Has layers that an electrically conductive bridge between connection points and the means for contactless Can form data transmission by soldering.

This is predominantly the case in the production of chip cards proceeded that first a module is produced, the comprises a plastic carrier on which a semiconductor chip is ordered. The module is then removed with the card carrier Plastic, e.g. B. polycarbonate. Usually the module into a cavity milled into the card body in the planted.  

The production of the invention is particularly preferably carried out smart chip cards using the above, be already known components and process steps. Expedient ßig so the invention uses a conventional module, the however, a contact level with the connection points for the with tel for contactless data transmission is added. In the module is usually equipped with two further connection points added that ver in the usual way with the semiconductor chip be bound.

The connection points are particularly preferably raised a surface of the module carrier, preferably the side, which carries the semiconductor chip. The high of Junction points depend on the type and dimensions of the Card and can for example be between 1 and 20 microns. The connection points are preferably made of metal and are in a manner known per se, e.g. B. by sticking, printing, Evaporation, electroplating or the like. The additional connection level is particularly preferred by placing a strip of metal on the module carrier laminated and then structured. location and size depends on the size and location of the agent for the contactless data transmission and especially its Joints.

The means for contactless data transmission, preferred as an induction coil, is conveniently in the Integrated card body or arranged on this, the Connection points to the connection points are exposed. For example, in the case of a card body Integrated copper wire coil connection points when milling the cavity for the module are also exposed. At a Such arrangement it is possible to glue module and card carrier simultaneously with the manufacture of the electrically conductive connections between the agent for the contactless data transmission and the connection points of the  Module. A stamp can be used for this be, which both compressive forces and thermal energy to Provides the adhesive and solder connection.

To be able to use the known hotmelt process NEN, the adhesive is, as explained, with conductive and solder provided particles in predetermined contact sections. The mechanical adhesive connection is then produced in a manner known per se, the electrical connection of the contacts through targeted introduction of heat at least into the areas of the contact sections.

The invention will now refer to a drawing Example of a preferred embodiment explained in more detail will. It shows

Fig. 1 shows schematically a cross section through an inventive chip card in the area of an elec trically conductive connection point between a connection point and a means for contactless data transmission and

Fig. 2 is a schematic sketch for explaining the method, namely using the example of the production of the electrically conductive connection, which is shown in Fig. 1.

Fig. 1 shows a cross section through a chip card 1 in the region of an electrically conductive joint between a connection point 2 and a means 3 for contactless data transmission, here a Indukionsspule. The induction coil 3 is in the card carrier 5 , which is usually made of plastic, for. B. polycarbonate, is integrated. A portion of the coil is exposed in the area of the connection point, for example by milling the card carrier surface. One of the two connection points 2 shown in Fig. 1 of the card to the coil 3 is a metal strip on the carrier 6 of the module, for. B. a Kunststoffo lie, formed and is outside the area of the carrier in which the semiconductor chip is arranged. The electrically conductive connection is made between connection point 2 and induction coil 3 by means of soldering in the adhesive layer 4 selectively introduced solder balls 8 . In the case shown, the adhesive is applied to the entire surface of the module, with the conductive and solderable particles selectively present in the adhesive coming to rest between induction coil 3 and connection point 2 .

As mentioned, a hot or hot melt adhesive is used as the preferred adhesive. When using such adhesives, the connection from the module with plastic carrier 6 and connection point 2 to the card body 5 while simultaneously making the solder connection by means of solder balls 8 between connection point 2 and induction coil 3 using the widespread hotmelt process, for which a universal heating and versatility Stamp 9 can be used.

This is schematically illustrated in FIG. 2, where a cross section through the chip card according to FIG. 1 is shown before the module and card body 5 are connected.

In the area of the cavity for the module coated with adhesive card body 5 with integrated induction coil 3 is placed in a suitable position on the module with carrier 6 and connection point 2 . Now pressure and heat is supplied with the help of the heating and pressure stamp 9 . As a result, the adhesive layer 4 softens, and the module and card body 5 are pressed together until the coil 3 , electrically conductive particles 8 and connection point 2 touch and a soldered connection is thus achieved. At the same time, an adhesive connection is created between the surface of the card body cavity and the module. The adhesive is then allowed to harden by cooling.

In the manner described, the module can be glued and card body and making electrically conductive Connections to the contactless data transmission system in one step using known methods.

Claims (10)

1. Chip card ( 1 ) for contactless and / or contact-free data transmission, which comprises a module with a semiconductor chip, a contact body and connection points ( 2 ) and at least one means ( 3 ) for contactless data transmission, characterized in that the electrically conductive connection between connection points len ( 2 ) and the means ( 3 ) for contactless data transmission by means of soldering. 2. Chip card according to claim 1, characterized in that the means ( 3 ) for contactless data transmission is an induction coil. 3. Chip card according to one of claims 1 or 2, characterized in that the means ( 3 ) for contactless data transmission in the region of the card body ( 5 ) is arranged, for example printed on or glued to this or integrated into this. 4. Chip card according to one of claims 1 to 3, characterized in that the connection points ( 2 ) raised on a surface of a carrier ( 6 ) which carries the semiconductor chip and the contact surfaces for contact-based data transmission, are arranged. 5. Chip card according to claim 4, characterized in that the connection points ( 2 ) are arranged on the surface of the carrier ( 6 ) which carries the semiconductor chip. 6. Chip card according to claim 4 or 5, characterized in that the connection points ( 2 ) consist of metal. 7. Chip card according to one of claims 4 to 6, characterized in that the connection points ( 2 ) protrude 1 to 20 microns over the surface of the carrier ( 6 ). 8. Chip card according to one of claims 1 to 7, characterized in that a hot or hot melt adhesive ( 4 ), in particular a phenolic resin-based adhesive is used for the connection, which in the area of the connection point ( 2 ) electrically conductive and solderable particles ( 8 ) are added or these are applied to the adhesive layer. 9. A method for producing a chip card according to one of claims 1 to 8, characterized in that an adhesive ( 4 ) substantially in the area of the entire surface of the chip card module in the card body ( 5 ) which the means ( 3 ) for carries contactless data transmission, is to be implanted, is applied, conductive and solderable particles ( 8 ), which are selectively inserted or applied in the adhesive ( 4 ), being positioned in the area of the connection points ( 2 ). 10. The method according to claim 9, characterized in the connection of connection points ( 2 ) and means ( 3 ) for contactless data transmission and of card body ( 5 ) and carrier ( 6 ), which carries a semiconductor chip and contact areas for contact-based data transmission, by a only common pressure-temperature action step he follows.