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DE1765037U - CIRCUIT BOARD WITH TRACKS APPLIED IN THE TECHNIQUE OF PRINTED CIRCUITS. - Google Patents

CIRCUIT BOARD WITH TRACKS APPLIED IN THE TECHNIQUE OF PRINTED CIRCUITS.

Info

Publication number
DE1765037U
DE1765037U DE1958G0017130 DEG0017130U DE1765037U DE 1765037 U DE1765037 U DE 1765037U DE 1958G0017130 DE1958G0017130 DE 1958G0017130 DE G0017130 U DEG0017130 U DE G0017130U DE 1765037 U DE1765037 U DE 1765037U
Authority
DE
Germany
Prior art keywords
circuit board
technique
printed circuits
current paths
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1958G0017130
Other languages
German (de)
Inventor
Max Grundig
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE1958G0017130 priority Critical patent/DE1765037U/en
Publication of DE1765037U publication Critical patent/DE1765037U/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Description

Schaltungsplatte mit in der Teohnik der gedruokt. a Schaltungen afebyaehtn Strombahnen j nil, IlIn""'fll ! In, < n I 11 J,"1'[ 1 1 I r J Be sind Schaltungsplatten mit in der !. ohnik der gedruokten Sohaltungen au : teebrachten Strombahnen aus elektrisch leitendum Laok auf (Iraphitbasie b n Stt stS bekennt, deren Strombahnen 3edoch relat1Y hohe W1d. stände(ca. M OhN pro q) a. ufwi « n. Xw aijaa fersr Scho. ltungsplatten mit in der ! echnik der gedruckte e nden Lake re ol** Schaltungenaufgebr, :, chten Strombahnen aue 81u- elektrisch leitenden Lacke auf Bronnebasie ait einge- bauten Elektrolyten (vermutlich Baig&urw) b$k<nant, derenStro. Mbahnen nach einiger Zeit durob tlußert Bin- flusee-z. B* Zultteuchtigkeit oder Trockenheit- ihre Leitfähigkeit verlieren. eind weit<y Sohltana- plattenmit In der Technik der gedruakt*n SohaltuU*n auf- gebrachten Strombahnen mit elektrisch le : Ltond « laok aut M ilberb&cic kamnt, dessen hoher Pr$i< winwr wirt" sehziftliehert Fertigung dieser schaltungeplatten ott bj » dernd imege steht. M<ßee Mangel werden dnrch di Nruns vermieden, die eineSohaltungepltie sit in dwr Technik dp « tdru. ton üohaltungen aufgebrachten Strombabuen aus tin « elektrisoh leitenden Lack betrifft. Diese 1n Rede 8tehend. 8obaltuac8- plßtte zichnet sich neuerunggemäB dadurch aue, 4a8 in 41. lackschicht sich gegenseitig berührend Partikelchen au » Kupfer oder einer Kufervrbindun (Kupferbrenz*) dty<oi Oberfläche aus einer r tieer K nert ert re Silbreohicht-besteht, eingelagert sind. ß r er nd Im tolgenden wird anhand der riguren 1 bin 3 *in Aunfahrun410.- beispiel der Neuerung beschrieben. Von ie<en Figarn Migt dieFigur l einen Teilquereohnitt durch eine SahltUBe- platte mit in der Tecbnik der gedruckten Schaltunaea auf- gebrachten Strombahnen aue einest elektrieoh leitem&en ck b<sw* eine Schaltungeplatte mit iaolierender Obey flchenscthioht a. uf den der elektrieoh leitende Laok aufgebracht 1et. Auf die elektrisch leiten ! e Laokeohioht ka= bedartsweies ein* Bertihrungssehutzlaokaohloht 4 oder k dadg ein szckutxla**¢ht olor Schutzschicht auß einem anderen Xuneidoff (e. B. in liwafcxwt) a ra¢H sek an ant aufgebracht lein. Wie aus der figur 1 eniohtlich aid in die elektrisch leitende Bacwohicht 1 P&rt1keloh..... Eup". oder einer Kupterterbindung (Kupterbrozme) dy&rt wiagwl<<t da ade sich gegenseitig berühren. Di< Ausbildung dsr sijMKl- nen partikelchen ist in den Figuren 2 und'darge. tellt. Die Fiur 2 zsißt im Quersohnitt ein ku$lf8rmiw PMrti-. dem mit dem Kupterkem 2 und der Oberfläohenehicht 3 aus einem Edelmetall, insbesondere Bei sohicht ait artikelchen dieser Art iwt in der Figay 1 linksaßedutet. In der Pigur 3 iwt ein lins<n-bww. achuppenfrmir KSyper gezeigt d « Ma. linawn*. b<w, sohuppenfSmigy Xa. $ unter sieh gleicher oder unte- sohledlicher Plattheit bzw* unterechiedlicher Größe aus einer Kupfeyverbindung Bronze) und deesen Oberflächen- ß eT Gdelet oa*r Wr schicht 6 ebenfalleaus einem JEdelMetßll, inebeeo&d. ere Silber, besteht. Bei den lio. aen-' bzw echuppenfrmigen Irtikelohea. beträgtda. a (DiceDurchmeecer)-Verhältnie vorwoeweiwe 1<100 bin lt300* Eine leitlaokochicht 1 mit ? artikelch « dieserweiteren Art iet in der Figur l rechte engedeutet* Auasngsaateri&l für den vorgeschlagenen elektrieeh leitendes. ao& ist vo-rasugeweiae handeieübli-ohee Kupfer inulver-oder Bronßfora Bekanntlioh werden von den Herstellern die schuppen-bzw. linsenförmigen Produkte (Figur3) als"Bronze"bezeichnet. Die in die eretarrte Mackochicht 1 eingebetteten Partikelchen 2, 3 bw. 5t $ werden durch Vorsilbe= von Xupter-oder Bronsepartikel- chen im lonen&uetausehverfahren hergestellte Bie Haftfähig- keit und die technologischen JBigeneohaften tHitxwbeteig- kelt der Laakoohioht) der eingelagerten Partikelchen » ter sich und auf dem leolierendon Trägerlcörpor 7 kann durob Auswahl geeigneter Lacke oder Lackverbindungen 8 variiert werden. Circuit board with printed in the Teohnik. a Circuits afebyaehtn current paths j nil, IlIn ""'fll! In, <n I 11 J, "1 '[1 1 I r J Be are circuit boards with!. ohnik the printed positions brought out current paths from electrically conductiveum Laok on (Iraphitbasie bn Stt stS confesses whose current paths 3yut relat1Y high W1d. levels (approx. M OhN per q) a. ufwi «n. Xw aijaa fersr Already. ventilation plates with in the! technology of the printed e nden Lake re ol ** Circuits abandoned:, right current paths aue 81- electrically conductive paints on Bronnebasie ait built electrolytes (probably Baig & urw) b $ k <nant, whoseStro. After some time river-z. B * Cult humidity or drought- lose their conductivity. and far <y Sohltana- plates with In the technology of the pressed SohaltuU * n on- brought current railways with electrical le: Ltond «laok aut M ilberb & cic came, whose high pr $ i <winwr host " The manufacture of these circuit boards ott bj »dernd is deciphered imege stands. M <ßee deficiencies are avoided by the numbers that A maintenance pltie is in dwr technology dp «tdru. volume electricity buildings made of tin «elektrisoh Conductive paint concerns. This 1n speech 8tending. 8obaltuac8- According to the innovation, plste draws itself as a result, 4a8 in 41. paint layer touching each other. Copper or a buyer bond (Kupferbrenz *) dty <oi Surface from a deeper core Silbreohicht-consists, are stored. ß r er nd In the following, based on the rigorous 1 bin 3 * in Aunfahrun410.- example of the innovation described. From ie <en Figarn Migt dieFigur l a partial cross-clearance through a steel tube plate with in the technology of the printed circuit Bred current paths aue one electrically conductive & en ck b <sw * a circuit board with an iaolating obey flchenscthioht a. uf the electrically conductive Laok applied 1et. On the electrical lead! e Laokeohioht ka = bedartsweies ein * Bertihrungssehutzlaokaohloht 4 or k dadg a szckutxla ** ¢ ht olor Protective layer from another Xuneidoff (e.g. in liwafcxwt) a ra ¢ H sec an ant upset lein. As shown in Fig. 1: aid in the electrically conductive Bacwohicht 1 P & rt1keloh ..... Eup ". or a copper bond (copper brozme) dy & rt wiagwl << t since goodbye touching each other. Di <training dsr sijMKl- NEN particle is in Figures 2 und'darge. tells. The Fiur 2 zsiß a ku $ lf8rmiw PMrti- in the cross-son. the one with the copper core 2 and the surface layer 3 made of a precious metal, in particular Bei Sohicht ait article of this kind iwt in Figay 1 left assedutet. In Pigur 3 iwt a lins <n-bww. achuppenfrmir KSyper shown d «Ma. linawn *. b <w, sohuppenfSmigy Xa. $ under see same or different sole flatness or different sizes a copper copper compound) and its surface ß eT Gdelet oa * r Wr Layer 6 also from a JEdelMetßll, inebeeo & d. ere silver, consists. With the lio. a- 'or scaly Irtikelohea. amounts to a (DiceDurchmeecer) -behavior vorwoeweiwe 1 <100 bin lt300 * A Leitlaokochicht 1 with? articlech « this further type is indicated in the figure on the right * Auasngsaateri & l for the proposed elektrieeh senior. ao & is vo-rasugeweiae handeieübli-ohee copper inulver- or Bronßfora are known from the Manufacturers of the shed or. lenticular products (Figure 3) referred to as "bronze". The one frozen in the Mackochicht 1 embedded particles 2, 3 bw. 5t $ are given by the prefix = from Xupter- or Bronseparticle- Bie adhesives produced in the ion-forming process and the technological aspects of the celts the laakoohioht) of the embedded particles itself and on the lined support body 7 can durob Selection of suitable paints or paint compounds 8 can be varied.

Claims (1)

(Neu.)SchutjMMprCahe
l plafte r tee ged 1.Schaltungspl&tt adt &$r Teh&i dr gwdra. oMom Schaltunga. aufjgebrachten Strombahnen au< eiawm elektrisch leitenden Laekt daduroh tmuttiahM daß n di$ &cechicht (3.) sih ggtaewtig rUhrwaA aytk&lbn &ua Hpfay odar nex* Kupfrvrbiada (Kupterbronte)d$ren OberfSeh au einer Xdotla<t<ll- schicht(3} *-n&b$ « onye Silberaohiht b$<t<ht, eintelagertsind.
2. Schaltungsplatte nach Anspruch dadurch gtk<anwiehat, da * ¢t ertn Pa : z *126 n* 2) daß die <ingsl&g<yt<m ? ari<ch<s. mglfSxwi (ig'X) oderschHppn bzw linsnfSxaig ( ? ig. 3) <. % wbiM « t wiaA.
3. Solialtungeltlatte nach Ansprach 1 oder 2# daduzeh gekennteiohnetp daß die obe : rflächige Edel » tallechieht t,)-1na'beondere S11ber8oh1oht-dar Pariikeloha 18 lonenauetauchverfahren auf die Kernteile (2) &nf$ebyeM ist, *
(New.) SchutjMMprCahe
l plafte r tee ged 1. Circuit board & tt adt & $ r Teh & i dr gwdra. oMom Circuit a. applied current paths au <eiawm electrically conductive laekt daduroh tmuttiahM that n di $ & cechicht (3.) sih ggtaewtig rUhrwaA aytk & lbn & ua Hpfay odar nex * Kupfrvrbiada (Kupterbronte) their surface on a Xdotla <t <ll- layer (3} * -n & b $ «onye Silberaohiht b $ <t <ht, are stored.
2. Circuit board according to claim, thereby gtk <anwiehat, da * ¢ t ertn Pa: z * 126 n * 2) that the <ingsl & g <yt <m? ari <ch <s. mglfSxwi (ig'X) orerschHppn or linsnfSxaig (? ig. 3) <. % wbiM «t wiaA.
3. Solialtungeltlatte after address 1 or 2 # daduzeh acknowledged without the fact that the upper surface of the precious metal appears t,) - 1na'be special S11ber8oh1oht-dar Pariikeloha 18 ion immersion process on the core parts (2) & nf $ ebyeM is, *
DE1958G0017130 1958-02-14 1958-02-14 CIRCUIT BOARD WITH TRACKS APPLIED IN THE TECHNIQUE OF PRINTED CIRCUITS. Expired DE1765037U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE1958G0017130 DE1765037U (en) 1958-02-14 1958-02-14 CIRCUIT BOARD WITH TRACKS APPLIED IN THE TECHNIQUE OF PRINTED CIRCUITS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1958G0017130 DE1765037U (en) 1958-02-14 1958-02-14 CIRCUIT BOARD WITH TRACKS APPLIED IN THE TECHNIQUE OF PRINTED CIRCUITS.

Publications (1)

Publication Number Publication Date
DE1765037U true DE1765037U (en) 1958-04-17

Family

ID=32784261

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1958G0017130 Expired DE1765037U (en) 1958-02-14 1958-02-14 CIRCUIT BOARD WITH TRACKS APPLIED IN THE TECHNIQUE OF PRINTED CIRCUITS.

Country Status (1)

Country Link
DE (1) DE1765037U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3217480A1 (en) * 1981-06-05 1982-12-23 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka CONDUCTIVE PASTE
DE3545989A1 (en) * 1984-12-31 1986-07-03 Asahi Chemical Research Laboratory Co., Ltd., Hachioji, Tokio/Tokyo METHOD FOR PRODUCING A MULTI-LAYERED CIRCUIT BOARD
DE3631632A1 (en) * 1985-09-29 1987-04-02 Asahi Chem Res Lab METHOD FOR CREATING ELECTRICALLY CONDUCTIVE CIRCUITS ON A BASE

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3217480A1 (en) * 1981-06-05 1982-12-23 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka CONDUCTIVE PASTE
DE3545989A1 (en) * 1984-12-31 1986-07-03 Asahi Chemical Research Laboratory Co., Ltd., Hachioji, Tokio/Tokyo METHOD FOR PRODUCING A MULTI-LAYERED CIRCUIT BOARD
DE3631632A1 (en) * 1985-09-29 1987-04-02 Asahi Chem Res Lab METHOD FOR CREATING ELECTRICALLY CONDUCTIVE CIRCUITS ON A BASE

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