DE112011102278T8 - Piezoelektrisches Filmelement und piezoelektrische Filmvorrichtung - Google Patents

Piezoelektrisches Filmelement und piezoelektrische Filmvorrichtung Download PDF

Info

Publication number: DE112011102278T8
Authority: DE; Germany
Prior art keywords: piezoelectric film; film device; film element; piezoelectric; film
Prior art date: 2010-07-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Active

Application number

DE201111102278

Other languages

English (en)

Other versions

DE112011102278T5 (de

DE112011102278B4 (de

Inventor

Kazutoshi Watanabe

Akira Nomoto

Kazufumi Suenaga

Fumimasa Horikiri

Kenji Shibata

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Sumitomo Chemical Co Ltd

Original Assignee

Hitachi Cable Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2010-07-07

Filing date

2011-03-30

Publication date

2013-08-01

2011-03-30 Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd

2013-05-23 Publication of DE112011102278T5 publication Critical patent/DE112011102278T5/de

2013-08-01 Application granted granted Critical

2013-08-01 Publication of DE112011102278T8 publication Critical patent/DE112011102278T8/de

2020-02-06 Publication of DE112011102278B4 publication Critical patent/DE112011102278B4/de

Status Active legal-status Critical Current

2031-03-31 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/853—Ceramic compositions
- H10N30/8542—Alkali metal based oxides, e.g. lithium, sodium or potassium niobates
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/495—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on vanadium, niobium, tantalum, molybdenum or tungsten oxides or solid solutions thereof with other oxides, e.g. vanadates, niobates, tantalates, molybdates or tungstates
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
- H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
- H10N30/2041—Beam type
- H10N30/2042—Cantilevers, i.e. having one fixed end
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3201—Alkali metal oxides or oxide-forming salts thereof
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3251—Niobium oxides, niobates, tantalum oxides, tantalates, or oxide-forming salts thereof
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/658—Atmosphere during thermal treatment
- C04B2235/6588—Water vapor containing atmospheres
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/76—Crystal structural characteristics, e.g. symmetry
- C04B2235/761—Unit-cell parameters, e.g. lattice constants
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/76—Crystal structural characteristics, e.g. symmetry
- C04B2235/768—Perovskite structure ABO3
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
- C04B2235/74—Physical characteristics
- C04B2235/79—Non-stoichiometric products, e.g. perovskites (ABO3) with an A/B-ratio other than 1

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Ceramic Engineering (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Structural Engineering (AREA)
Organic Chemistry (AREA)
Physical Vapour Deposition (AREA)
Particle Formation And Scattering Control In Inkjet Printers (AREA)
Compositions Of Oxide Ceramics (AREA)

DE112011102278.6T 2010-07-07 2011-03-30 Piezoelektrisches Filmelement und piezoelektrische Filmvorrichtung Active DE112011102278B4 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP2010155165A JP5056914B2 (ja)	2010-07-07	2010-07-07	圧電薄膜素子および圧電薄膜デバイス
JP2010-155165		2010-07-07
PCT/JP2011/057950 WO2012005032A1 (ja)	2010-07-07	2011-03-30	圧電膜素子および圧電膜デバイス

Publications (3)

Publication Number	Publication Date
DE112011102278T5 DE112011102278T5 (de)	2013-05-23
DE112011102278T8 true DE112011102278T8 (de)	2013-08-01
DE112011102278B4 DE112011102278B4 (de)	2020-02-06

Family

ID=45441018

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE112011102278.6T Active DE112011102278B4 (de)	2010-07-07	2011-03-30	Piezoelektrisches Filmelement und piezoelektrische Filmvorrichtung

Country Status (5)

Country	Link
US (1)	US20130106242A1 (de)
JP (1)	JP5056914B2 (de)
CN (1)	CN102959751B (de)
DE (1)	DE112011102278B4 (de)
WO (1)	WO2012005032A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP5531653B2 (ja) *	2010-02-02	2014-06-25	日立金属株式会社	圧電薄膜素子、その製造方法及び圧電薄膜デバイス
WO2012141105A1 (ja) *	2011-04-15	2012-10-18	株式会社村田製作所	圧電体薄膜素子
JP5553099B2 (ja) *	2012-09-20	2014-07-16	日立金属株式会社	圧電体薄膜付き基板の製造方法、及び圧電体薄膜素子の製造方法
WO2015033791A1 (ja) *	2013-09-09	2015-03-12	株式会社村田製作所	圧電薄膜素子及びその製造方法
WO2015178197A1 (ja) *	2014-05-19	2015-11-26	株式会社村田製作所	圧電薄膜、圧電薄膜素子及びターゲット並びに圧電薄膜及び圧電薄膜素子の製造方法
JP6558526B2 (ja) *	2015-03-27	2019-08-14	セイコーエプソン株式会社	圧電素子及び圧電素子応用デバイス並びに圧電素子の製造方法
JP6239566B2 (ja) *	2015-10-16	2017-11-29	株式会社サイオクス	圧電薄膜付き積層基板、圧電薄膜素子およびその製造方法
JP2018133458A (ja) *	2017-02-15	2018-08-23	セイコーエプソン株式会社	圧電素子、及び圧電素子応用デバイス
JP2018160535A (ja)	2017-03-22	2018-10-11	セイコーエプソン株式会社	圧電素子、及び圧電素子応用デバイス
JP6904101B2 (ja) *	2017-06-26	2021-07-14	セイコーエプソン株式会社	液体噴射ヘッド、液体噴射装置および圧電デバイス
JP2019021994A (ja) *	2017-07-12	2019-02-07	株式会社サイオクス	圧電膜を有する積層基板、圧電膜を有する素子および圧電膜を有する積層基板の製造方法
JP6502460B2 (ja) *	2017-11-01	2019-04-17	株式会社サイオクス	圧電薄膜付き積層基板および圧電薄膜素子
US10566180B2 (en) *	2018-07-11	2020-02-18	Thermo Finnigan Llc	Adjustable multipole assembly for a mass spectrometer
JP7352347B2 (ja) *	2018-12-07	2023-09-28	住友化学株式会社	圧電積層体、圧電素子および圧電積層体の製造方法
JP6758444B2 (ja) *	2019-03-20	2020-09-23	住友化学株式会社	圧電薄膜付き積層基板および圧電薄膜素子
JP7528556B2 (ja) *	2020-06-17	2024-08-06	セイコーエプソン株式会社	圧電素子、圧電素子応用デバイス
JP7320091B2 (ja) *	2021-02-10	2023-08-02	住友化学株式会社	圧電薄膜付き積層基板、圧電薄膜付き積層基板の製造方法、圧電薄膜素子、スパッタリングターゲット材、およびスパッタリングターゲット材の製造方法
JP7588007B2 (ja) *	2021-03-09	2024-11-21	Tdk株式会社	圧電薄膜、圧電薄膜素子及び圧電トランスデューサ
CN118359435B (zh) *	2024-06-18	2024-08-16	湖南省美程陶瓷科技有限公司	一种高压电性能的knn基压电陶瓷材料及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4735840B2 (ja)	2005-12-06	2011-07-27	セイコーエプソン株式会社	圧電体積層体、表面弾性波素子、薄膜圧電共振子および圧電アクチュエータ
CN100539228C (zh) *	2005-12-06	2009-09-09	精工爱普生株式会社	压电层压体、表面声波元件、压电谐振器及压电传动装置
JP2008159807A (ja)	2006-12-22	2008-07-10	Hitachi Cable Ltd	圧電薄膜素子及び圧電薄膜素子を用いて製造したアクチュエータとセンサ
JP2009049065A (ja) *	2007-08-14	2009-03-05	Hitachi Cable Ltd	圧電薄膜素子
JP4724728B2 (ja) *	2008-03-31	2011-07-13	株式会社デンソー	積層型圧電素子の製造方法
JP5525143B2 (ja) *	2008-06-05	2014-06-18	日立金属株式会社	圧電薄膜素子及び圧電薄膜デバイス
JP2010053021A (ja) *	2008-07-28	2010-03-11	Ngk Insulators Ltd	圧電／電歪セラミックス焼結体及び散漫散乱強度比の算出方法
JP5264673B2 (ja) *	2009-01-12	2013-08-14	株式会社デンソー	圧電セラミックス、その製造方法、積層型圧電素子、及びその製造方法
DE102010000783A1 (de) *	2009-01-12	2010-09-16	Denso Corporation, Kariya-City	Piezokeramik, kristallorientierte Keramik, mehrlagiges Piezoelement sowie Verfahren zu dessen Herstellung
JP5572998B2 (ja) *	2009-05-22	2014-08-20	Ｔｄｋ株式会社	圧電磁器組成物及び圧電素子

2010
- 2010-07-07 JP JP2010155165A patent/JP5056914B2/ja active Active
2011
- 2011-03-30 CN CN201180029026.3A patent/CN102959751B/zh active Active
- 2011-03-30 DE DE112011102278.6T patent/DE112011102278B4/de active Active
- 2011-03-30 US US13/808,718 patent/US20130106242A1/en not_active Abandoned
- 2011-03-30 WO PCT/JP2011/057950 patent/WO2012005032A1/ja active Application Filing

Also Published As

Publication number	Publication date
DE112011102278T5 (de)	2013-05-23
CN102959751B (zh)	2014-04-16
CN102959751A (zh)	2013-03-06
JP5056914B2 (ja)	2012-10-24
WO2012005032A1 (ja)	2012-01-12
DE112011102278B4 (de)	2020-02-06
US20130106242A1 (en)	2013-05-02
JP2012019050A (ja)	2012-01-26

Publication	Publication Date	Title
DE112011102278T8 (de)	2013-08-01	Piezoelektrisches Filmelement und piezoelektrische Filmvorrichtung
BR112013004175A2 (pt)	2016-05-10	aparelho e conjunto atuado piezoelétrico
RS57368B1 (sr)	2018-08-31	Intraprediktivni uređaj
BR112012033478A2 (pt)	2016-11-29	dispositivo médico
IT1403628B1 (it)	2013-10-31	Dispositivo assicuratore e discensore
UA22023S (uk)	2011-07-11	Електронний медіа пристрій
DK2795210T3 (da)	2021-06-28	Køleelement og køleindretning
BRPI1015404A2 (pt)	2016-08-09	pastilha adesiva e dispositivo de ostonomia
EP2587665A4 (de)	2014-12-24	Verstärkervorrichtung
DE112011103755A5 (de)	2013-09-26	Abzugvorrichtung
BR112012029165A2 (pt)	2017-02-21	película de multicamadas e estruturas de película de cobertura esticada
EP2667613A4 (de)	2016-12-07	Bilddekodierungsvorrichtung und bilddekodierungsvorrichtung
DE112013001655A5 (de)	2014-12-31	Filterelement und Filtereinrichtung
EP2382787A4 (de)	2015-03-18	Bildgebungselement und bildgebungsvorrichtung damit
DK2596488T3 (da)	2014-09-22	Reklameindretning
FI20116089L (fi)	2013-05-05	Järjestely ja laite
EP2535888A4 (de)	2013-10-23	Anzeigevorrichtung
EP2876668A4 (de)	2015-07-29	Halbleiterfolie und halbleiterelement
DK2550649T3 (da)	2014-06-30	Optisk visningselement og visningsindretning
DE112010002053A5 (de)	2012-06-06	Wärmespeicherelement und Wärmespeichereinrichtung
EP2833406A4 (de)	2015-10-28	Abbildungselement und abbildungsvorrichtung
EP2549742A4 (de)	2013-09-25	Bildaufnahmevorrichtung und bildaufnahmesystem
BR112012030878A2 (pt)	2016-11-08	dispositivo
DE102011002941B8 (de)	2012-10-18	Positioniereinheit und Beobachtungsvorrichtung
FI20105903A0 (fi)	2010-08-30	Laite

Legal Events

Date	Code	Title	Description
2013-03-28	R083	Amendment of/additions to inventor(s)
2013-06-12	R082	Change of representative	Representative=s name: KUHNEN & WACKER PATENT- UND RECHTSANWALTSBUERO, DE
2013-11-26	R082	Change of representative	Representative=s name: KUHNEN & WACKER PATENT- UND RECHTSANWALTSBUERO, DE
2014-01-16	R081	Change of applicant/patentee	Owner name: SCIOCS COMPANY LIMITED, JP Free format text: FORMER OWNER: HITACHI CABLE, LTD., TOKYO, JP Effective date: 20130612 Owner name: SCIOCS COMPANY LIMITED, JP Free format text: FORMER OWNER: HITACHI CABLE, LTD., TOKYO, JP Effective date: 20131126 Owner name: SUMITOMO CHEMICAL COMPANY, LIMITED, TOKYO, JP Free format text: FORMER OWNER: HITACHI CABLE, LTD., TOKYO, JP Effective date: 20131126 Owner name: SUMITOMO CHEMICAL COMPANY, LIMITED, TOKYO, JP Free format text: FORMER OWNER: HITACHI CABLE, LTD., TOKYO, JP Effective date: 20130612 Owner name: HITACHI METALS, LTD., JP Free format text: FORMER OWNER: HITACHI CABLE, LTD., TOKYO, JP Effective date: 20130612 Owner name: HITACHI METALS, LTD., JP Free format text: FORMER OWNER: HITACHI CABLE, LTD., TOKYO, JP Effective date: 20131126
2014-01-16	R082	Change of representative	Representative=s name: KUHNEN & WACKER PATENT- UND RECHTSANWALTSBUERO, DE Effective date: 20131126 Representative=s name: KUHNEN & WACKER PATENT- UND RECHTSANWALTSBUERO, DE Effective date: 20130612
2015-06-16	R081	Change of applicant/patentee	Owner name: SCIOCS COMPANY LIMITED, JP Free format text: FORMER OWNER: HITACHI METALS, LTD., TOKIO/TOKYO, JP Owner name: SUMITOMO CHEMICAL COMPANY, LIMITED, TOKYO, JP Free format text: FORMER OWNER: HITACHI METALS, LTD., TOKIO/TOKYO, JP
2015-06-16	R082	Change of representative	Representative=s name: KUHNEN & WACKER PATENT- UND RECHTSANWALTSBUERO, DE
2015-10-29	R012	Request for examination validly filed
2015-12-17	R081	Change of applicant/patentee	Owner name: SUMITOMO CHEMICAL COMPANY, LIMITED, TOKYO, JP Free format text: FORMER OWNER: SCIOCS COMPANY LIMITED, HITACHI-SHI, JP
2015-12-17	R082	Change of representative	Representative=s name: KUHNEN & WACKER PATENT- UND RECHTSANWALTSBUERO, DE
2019-10-23	R016	Response to examination communication
2019-10-28	R018	Grant decision by examination section/examining division
2020-11-07	R020	Patent grant now final
2022-11-25	R079	Amendment of ipc main class	Free format text: PREVIOUS MAIN CLASS: H01L0041187000 Ipc: H10N0030853000