DE102013009146A1 - Light module with LED - Google Patents
Light module with LED Download PDFInfo
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- DE102013009146A1 DE102013009146A1 DE201310009146 DE102013009146A DE102013009146A1 DE 102013009146 A1 DE102013009146 A1 DE 102013009146A1 DE 201310009146 DE201310009146 DE 201310009146 DE 102013009146 A DE102013009146 A DE 102013009146A DE 102013009146 A1 DE102013009146 A1 DE 102013009146A1
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- Prior art keywords
- heat sink
- led
- light module
- board
- module according
- Prior art date
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- 229910052751 metal Inorganic materials 0.000 abstract description 7
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000001746 injection moulding Methods 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 5
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- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
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- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
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- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012549 training Methods 0.000 description 1
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Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Bei einem Lichtmodul (12) mit wenigstens einer LED (23) auf einem gut wärmeleitenden, insbesondere metallenen Kühlkörper (11) ist dieser im Kunststoff-Spritzguss wenigstens teilweise von einer den Kühlkörper (11) formschlüssig aufnehmenden Einfassung (13) umgeben, die mit Stecker-Stiften (16) bestückt ist. Die LED (23) ist mittels Wärmeleitklebers auf den Kühlkörper (11) montiert, gegebenenfalls auf oder in eine Aussparung (21), die in der Einfassung (13) freigespart oder in diese eingearbeitet ist. In unterschiedlichen Ebenen einander kreuzende pastöse Leitungszüge (20) aus elektrischem Leitkleber im Verlaufe von elektrischen Verbindungen zwischen Stiften (16) und LEDs (23) können auf Spuren (30) aus elektrischer Isolierpaste über den Kühlkörper (11) hinweg verlaufen. Das führt zu einer beträchtlichen Reduktion des Aufwandes für die Montage des Lichtmodules (12) und dessen Raumbedarfes.In the case of a light module (12) with at least one LED (23) on a highly heat-conductive, in particular metal heat sink (11), this is at least partially surrounded in plastic injection molding by a bezel (13) which positively accommodates the heat sink (11) and which has a plug Pins (16). The LED (23) is mounted on the heat sink (11) by means of heat-conducting adhesive, optionally on or in a recess (21) which is left free in the enclosure (13) or is incorporated into it. Pasty cable runs (20) made of electrical conductive adhesive and crossing one another at different levels in the course of electrical connections between pins (16) and LEDs (23) can run on traces (30) made of electrical insulating paste over the heat sink (11). This leads to a considerable reduction in the effort for the assembly of the light module (12) and its space requirements.
Description
Die Erfindung betrifft einen LED-Lichtmodul gemäß dem Oberbegriff des Hauptanspruches.The invention relates to a LED light module according to the preamble of the main claim.
Ein derartiger Modul ist aus der
In Erkenntnis solcher Gegebenheiten liegt vorliegender Erfindung die technische Problemstellung zugrunde, durch Verkürzen der überkommenen Prozesskette die Kosten zu senken und dennoch die Fertigungszuverlässigkeit zu steigern.In recognition of such circumstances, the present invention is based on the technical problem of reducing the costs by shortening the traditional process chain and nevertheless increasing the manufacturing reliability.
Diese Aufgabe ist erfindungsgemäß durch die im Hauptanspruch angegebenen wesentlichen Merkmale gelöst; wobei zur Vereinfachung der Darstellung stets nur von einem Lichtmodul mit einer LED die Rede ist, obwohl im Rahmen vorliegender Erfindung eine Ausstattung mit mehreren LEDs gleichermaßen in Betracht kommt.This object is achieved by the essential features specified in the main claim; wherein for the sake of simplicity of illustration always only one light module with an LED is mentioned, although in the context of the present invention, an equipment with multiple LEDs equally comes into consideration.
Die LED kann auf eine kleine Schaltungs-Platine montiert sein; und ihr, aus gut thermisch leitendem Material wie Metall, vorzugsweise im Druckguss aus Leichtmall gefertigter Kühlkörper ist zumindest bereichsweise mit einer elektrisch isolierenden Kunststoff-Einfassung umspritzt. In der sind von außerhalb des Lichtmodules für Kontaktierungen zugängliche Stifte angeordnet, insbesondere eingeschossen oder aus einem eingegossenen Stanzgitter abgetrennt. Parallel zueinander distanziert aus der elektrisch isolierenden Einfassung herausragende freie Stirnenden der Stifte, etwa eines Stanzgitters, sind von einem Steckerkorb als mechanischem Schutz umgeben, welcher vorzugsweise der Einfassung angeformt ist. Die Stifte dienen insbesondere als Anschlußstifte zur externen Stromversorgung der LED. Dafür sind die rückwärtigen Endabschnitte dieser Stifte, etwa stirnflächig oder längs abgewinkelten Verlaufes, an der Oberfläche der Einfassung zur Kontaktierung zugänglich.The LED can be mounted on a small circuit board; and you, of good thermally conductive material such as metal, preferably in mild metal die-cast heat sink is at least partially encapsulated with an electrically insulating plastic enclosure. In the available from outside the light module for contacts pins, in particular shot or separated from a cast-stamped grid. Parallel to each other distanced from the electrically insulating enclosure outstanding free ends of the pins, such as a stamped grid are surrounded by a plug basket as a mechanical protection, which is preferably formed of the enclosure. The pins are used in particular as pins for external power to the LED. For the rear end portions of these pins, such as end face or longitudinally angled course, accessible on the surface of the enclosure for contacting.
Von jenen Stift-Enden, zur LED hin, erstrecken sich Leitungszüge, die aufgedruckt oder, vorzugsweise, aus pastöser, insbesondere wärmeaushärtender Leitmasse etwa mittels einer Hohlnadel aufgebracht sind. In Kreuzungsbereichen ist zum Vermeiden von Kurzschlüssen einer der Leitungszüge in Relation zum anderen, insbesondere infolge Verlaufes durch eine in die Einfassungs-Oberfläche eingesenkte Nut, höhenversetzt.From those pin ends, towards the LED, extending cable runs, which are printed or, preferably, pasty, in particular thermosetting conductive material applied approximately by means of a hollow needle. In crossing areas, to avoid short circuits, one of the cable runs is offset in height relative to the other, in particular as a result of running through a groove sunk into the surround surface.
Die Einfassung des Kühlkörpers weist vor einem Oberflächenbereich eines sich über Kühlrippen erstreckenden Gurtes eine den Kunststoff wenigstens teilweise durchdringende Aussparung auf. Die kann etwa von einer auf der Einfassung aufliegenden LED-Platine überbrückt werden, bei Auffüllen des Raumes unter der Platine mit wärmeleitendem, vorzugsweise pastösem und klebendem Material.The enclosure of the heat sink has a plastic at least partially penetrating recess in front of a surface region of a belt extending over cooling ribs. This can be bridged by a resting on the mount LED board, when filling the space under the board with thermally conductive, preferably pasty and adhesive material.
Ein kompakterer Aufbau ergibt sich, wenn eine mit der LED bestückte Platine in die erwähnte Aussparung hinein montiert wird, nämlich praktisch bis auf den gewöhnlich metallenen Kühlkörper hinab eingesenkt. Erforderlichenfalls liegt unter der Platine eine wärmeleitende elektrische Isolierschicht. Als die kann auch etwa eine Spritzhaut dienen, welche die Aussparung in der aus Kunststoff gespritzten Einfassung als Boden abschließt. Zum Vermeiden wärmeisolierender Hohlräume ist es zweckmäßig, über und jedenfalls unter der Isolierschicht, sowie gegebenenfalls in eine die Isolierschicht durchquerende Öffnung, eine handelsübliche Wärmeleitpaste einzubringen, die vorzugsweise auch Klebereigenschaften aufweist.A more compact construction results when a board equipped with the LED is mounted in the mentioned recess, namely practically sunk down to the usually metal heat sink. If necessary, there is a heat-conducting electrical insulating layer under the board. As that can also serve as a spray skin, which closes the recess in the plastic-molded enclosure as a floor. To avoid heat-insulating cavities, it is expedient, above and at least under the insulating layer, and optionally in a the insulating layer crossing opening to introduce a commercially available thermal paste, which preferably also has adhesive properties.
Noch zweckmäßiger hinsichtlich Logistik und Bauvolumens ist eine Direktmontage der LED, also ohne einen Zwischenträger in Form einer Schaltungs-Platine. Dafür eignet sich besonders eine LED des Hochleistungs-Typs, der bereits mit einem integrierten aber elektrisch isolierten Kühlkontakt ausgestattet ist. Der kann mittels eines Wärmeleitklebers unmittelbar auf eine Oberfläche des Kühlkörpers montiert werden. Die elektrische Kontaktierung der LED ist über Leiterbahnen möglich, die über die Oberfläche der Kunststoff-Einfassung herangeführt sind, oder über die Oberfläche des metallenen Kühlkörpers unter Zwischenlage einer Isolierung etwa in Form von Strängen aus elektrischer Isolierpaste.Even more practical in terms of logistics and construction volume is a direct mounting of the LED, so without an intermediate carrier in the form of a circuit board. Particularly suitable for this purpose is a LED of the high-performance type, which is already equipped with an integrated but electrically insulated cooling contact. The can be mounted directly on a surface of the heat sink by means of a Wärmeleitklebers. The electrical contacting of the LED is possible via conductor tracks, which are guided over the surface of the plastic enclosure, or over the surface of the metal heat sink with the interposition of insulation in the form of strands of electrical insulating paste.
Durch derartiges Aufbringen der LED auf den Kühlkörper entfällt für die Montage der LED die gesonderte Bestückung und Verschraubung einer Schaltungs-Platine oder dergleichen Kontaktplatte vorbekannter Art. Die LED ist mittels der stromführenden Leitungszüge unmittelbar an der Einfassung des Kühlkörpers oder in der Einfassung, bevorzugt unter Zwischenlage einer thermisch leitenden elektrischen Trennschicht, auf dem Kühlkörper befestigt und bestromt.By such application of the LED on the heat sink eliminates the separate assembly and screwing a circuit board or the like contact plate of known type for the installation of the LED. The LED is by means of the current-carrying lines directly to the enclosure of the heat sink or in the enclosure, preferably with an intermediate layer a thermally conductive electrical separation layer, mounted on the heat sink and energized.
Die Festlegung der LED beziehungsweise gegebenenfalls ihrer Platine erfolgt, wie vorstehend erwähnt, bevorzugt stoffschlüssig, wofür die elektrische Leitmasse als Klebstoff dienen kann. Als solcher Leitkleber findet etwa Silikon mit anorganischen, elektrisch leitfähigen Füllstoffen Verwendung. Gewisse metallische Füllstoffe (wie insbesondere Silber oder Nickel) führen zu einem auch gut wärmeleitenden elektrischen Leitkleber.The determination of the LED or possibly its board is, as mentioned above, preferably cohesively, for which the electrical conductive material can serve as an adhesive. When Such conductive adhesive is about silicone with inorganic, electrically conductive fillers use. Certain metallic fillers (such as in particular silver or nickel) lead to an electrically conductive adhesive which also conducts heat well.
Zusätzliche Weiterbildungen und Abwandlungen im Rahmen vorliegender Erfindung ergeben sich aus den weiteren Ansprüchen und, auch unter Berücksichtigung von deren Vorteilen, aus nachstehender Beschreibung von in der Zeichnung unter Beschränkung auf das Funktionswesentliche stark abstrahiert und nicht maßstabsgerecht skizzierten bevorzugten Ausführungsbeispielen zur erfindungsgemäßen Lösung. Die Zeichnung zeigt einen mit einer thermisch und elektrisch isolierenden Kunststoff-Einfassung teilumspritzten Kühlkörper aus gut wärmeleitendem Material inAdditional refinements and modifications in the context of the present invention will become apparent from the other claims and also taking into account the advantages thereof, from the following description of the drawing in which limited to the functional essentials strongly abstracted and not to scale outlined preferred embodiments of the invention. The drawing shows a partially thermally molded with a thermally and electrically insulating plastic enclosure heat sink made of good heat conducting material in
Ein, zur Oberflächenvergrößerung mit kräftigen Rippen an einem sich über jene hinweg erstreckenden Gurt ausgebildeter, Kühlkörper
Auf die Oberfläche
Wenigstens eine LED
Die Positionierung der Platine
Die Aussparung
Die Weiterbildung nach
Vorzugsweise liegt bei einer Anordnung gemäß
Der in
Der geringste Aufwand an zu montierenden Einzelteilen fällt bei der Weiterbildung des erfindungsgemäßen Lichtmodules
Bei einem Lichtmodul
BezugszeichenlisteLIST OF REFERENCE NUMBERS
- 1111
-
Kühlkörper (für
23 )Heat sink (for23 ) - 1212
-
Lichtmodul (mit
11 und23 )Light module (with11 and23 ) - 1313
-
Einfassung (von
11 )Mount (from11 ) - 1414
-
Überstand (von
13 über11 hinaus)Supernatant (from13 above11 addition) - 1515
-
Steckerkorb (an
14 )Plug basket (at14 ) - 1616
-
Stift (in
15 , beispielsweise an17 )Pen (in15 , for example17 ) - 1717
-
Stanzgitter (für
16 ; in14 )Punching grid (for16 ; in14 ) - 1818
-
Endabschnitt (von
16 hinter15 )End section (from16 Behind15 ) - 1919
-
Oberfläche (von
13 )Surface (from13 ) - 2020
-
pastöse Leitungszüge (zwischen
18 und23 )Pasty cable runs (between18 and23 ) - 2121
-
Aussparung (in
13 )Recess (in13 ) - 2222
-
Außenfläche (von
11 )Outer surface (from11 ) - 2323
-
LED (von
12 )LED (from12 ) - 2424
-
gedruckte Leiterbahnen (auf
25 )Printed circuit traces (on25 ) - 2525
-
Platine (mit
24 und23 )Board (with24 and23 ) - 2626
-
Abstandshalter (zwischen
25 und19 )Spacer (between25 and19 ) - 2727
-
Überbrückung (unter
25 , nach22 )Bridging (under25 , to22 ) - 2828
-
Isolierschicht (auf
22 )Insulating layer (on22 ) - 2929
-
Anschlussfläche (auf
25 )Terminal surface (on25 ) - 3030
-
pastöse Spur (unter
20 )pasty trace (under20 )
ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- DE 102010048595 A1 [0002] DE 102010048595 A1 [0002]
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013009146.2A DE102013009146B4 (en) | 2013-05-31 | 2013-05-31 | Light module with LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013009146.2A DE102013009146B4 (en) | 2013-05-31 | 2013-05-31 | Light module with LED |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102013009146A1 true DE102013009146A1 (en) | 2014-12-04 |
DE102013009146B4 DE102013009146B4 (en) | 2016-04-21 |
Family
ID=51899104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102013009146.2A Active DE102013009146B4 (en) | 2013-05-31 | 2013-05-31 | Light module with LED |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102013009146B4 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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CN107062114A (en) * | 2015-11-18 | 2017-08-18 | 株式会社小糸制作所 | Light fixture and its manufacture method |
DE102017113673A1 (en) * | 2017-06-21 | 2018-12-27 | HELLA GmbH & Co. KGaA | Lighting device for vehicles and fastening methods |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
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EP3171681A1 (en) * | 2015-11-18 | 2017-05-24 | Koito Manufacturing Co., Ltd | Lamp and manufacturing method thereof |
CN107062114A (en) * | 2015-11-18 | 2017-08-18 | 株式会社小糸制作所 | Light fixture and its manufacture method |
US10036546B2 (en) | 2015-11-18 | 2018-07-31 | Koito Manufacturing Co., Ltd. | Lamp and manufacturing method thereof |
CN107062114B (en) * | 2015-11-18 | 2020-05-29 | 株式会社小糸制作所 | Lamp and manufacturing method thereof |
DE102017113673A1 (en) * | 2017-06-21 | 2018-12-27 | HELLA GmbH & Co. KGaA | Lighting device for vehicles and fastening methods |
US10697609B2 (en) | 2017-06-21 | 2020-06-30 | HELLA GmbH & Co. KGaA | Shrink fit fastening of heat sink and light source carrier |
DE102017113673B4 (en) | 2017-06-21 | 2024-10-24 | HELLA GmbH & Co. KGaA | Lighting device for vehicles and fastening method |
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