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DE102012111489A1 - Device for cooling power electronic for use in motor vehicle e.g. hybrid vehicle, has separating elements that are fluidly connected to each other, and electronic components that are arranged in respective cooling chambers - Google Patents

Device for cooling power electronic for use in motor vehicle e.g. hybrid vehicle, has separating elements that are fluidly connected to each other, and electronic components that are arranged in respective cooling chambers Download PDF

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Publication number
DE102012111489A1
DE102012111489A1 DE201210111489 DE102012111489A DE102012111489A1 DE 102012111489 A1 DE102012111489 A1 DE 102012111489A1 DE 201210111489 DE201210111489 DE 201210111489 DE 102012111489 A DE102012111489 A DE 102012111489A DE 102012111489 A1 DE102012111489 A1 DE 102012111489A1
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Germany
Prior art keywords
electronic components
cooling
separating elements
cooling chambers
fluidly connected
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Withdrawn
Application number
DE201210111489
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German (de)
Inventor
Stefan Bender
Hartmut Chodura
Uwe Möhrstädt
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Dr Ing HCF Porsche AG
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Dr Ing HCF Porsche AG
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Priority to DE201210111489 priority Critical patent/DE102012111489A1/en
Publication of DE102012111489A1 publication Critical patent/DE102012111489A1/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/44—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements the complete device being wholly immersed in a fluid other than air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The device (2) has a housing (3) that is provided with a heat exchanger (4), electronic components (12,14,16,18) and cooling unit (29) having a cooling chambers (20,22,24,26). The cooling chambers are assigned with the electronic component. The separating elements (28,30,32) are formed and are fluidly connected to each other. The electronic components are arranged in the respective cooling chambers.

Description

Kühlvorrichtung für eine Leistungselektronik zum Einsatz im Kraftfahrzeugbereich mit einem Gehäuse, das einen Wärmetauscher, mindestens zwei Elektronikbauteile der Leistungselektronik sowie mindestens zwei mit Kühlmittel gefüllte Kühlkammern, die einen Kühlraum bilden, aufweist, wobei die Kühlkammern mindestens einem Elektronikbauteil zugeordnet sind. Cooling device for power electronics for use in the automotive sector with a housing having a heat exchanger, at least two electronic components of the power electronics and at least two filled with coolant cooling chambers, which form a cooling chamber, wherein the cooling chambers are associated with at least one electronic component.

Derartige Kühlvorrichtungen sind aus dem Stand der Technik hinlänglich bekannt. So ist es aus der JP 2006114603 A bekannt, drei Kühlkammern jeweils an der Außenseite ein Halbleiterbauelement zuzuordnen, das durch die jeweilige Kühlkammer gekühlt wird. Um auch im Falle einer Neigung, wie sie beispielsweise bei einer Kurvendurchfahrt auftreten kann, eine ausreichende Kühlung vorzusehen, sind Trennelemente vorgesehen, die gewährleisten sollen, dass der Bodenbereich der jeweiligen Kühlkammer auch bei einer entsprechenden Neigung flüssigkeitsbedeckt ist. Insbesondere vor dem immer geringer werdenden Bauraum und den damit immer größeren Anforderungen an einen effizienten Wärmeaustausch hat es sich jedoch gezeigt, dass eine derartige Anordnung einen unzureichenden Wärmeaustausch bedingt. Such cooling devices are well known in the art. So it is from the JP 2006114603 A known to assign three cooling chambers each on the outside of a semiconductor device, which is cooled by the respective cooling chamber. In order to provide sufficient cooling even in the case of an inclination, as may occur, for example, during a curve passage, separating elements are provided which are intended to ensure that the bottom region of the respective cooling chamber is covered with liquid even at a corresponding inclination. In particular, before the ever-decreasing space and thus the ever greater demands on efficient heat exchange, it has been found that such an arrangement requires insufficient heat exchange.

Aufgabe der Erfindung ist es daher, eine Kühlvorrichtung bereitzustellen, die in kompakter Form eine ausreichende Kühlung für eine Leistungselektronik mit mehreren Elektronikbauteilen gewährleistet. The object of the invention is therefore to provide a cooling device that ensures sufficient cooling for power electronics with multiple electronic components in a compact form.

Diese Aufgabe wird dadurch gelöst, dass die Elektronikbauteile in den jeweiligen Kühlkammern angeordnet sind. Eine besonders vorteilhafte Ausführungsform wird dadurch geschaffen, dass die Höhe hTr eines Trennelementes mindestens 80% der Höhe hKa einer Kühlkammer beträgt. Auch kann es aus fertigungstechnischer Hinsicht vorteilhaft sein, wenn die Elektronikbauteile auf den Trennelementen angeordnet sind. This object is achieved in that the electronic components are arranged in the respective cooling chambers. A particularly advantageous embodiment is provided in that the height h Tr of a separating element is at least 80% of the height h Ka of a cooling chamber. It may also be advantageous from a manufacturing point of view, if the electronic components are arranged on the separating elements.

Die Erfindung wird nachfolgend anhand der Zeichnung näher erläutert, hierbei zeigt: The invention will be explained in more detail with reference to the drawing, in which:

1 eine schematische Schnittansicht einer erfindungsgemäßen Kühlvorrichtung bei horizontaler Ausrichtung des Fahrzeugs, und 1 a schematic sectional view of a cooling device according to the invention in the horizontal orientation of the vehicle, and

2 eine schematische Schnittansicht der Kühlvorrichtung aus 1 in geneigter Ausrichtung des Fahrzeuges. 2 a schematic sectional view of the cooling device 1 in inclined orientation of the vehicle.

1 zeigt in einer Schnittansicht in schematischer Weise eine Kühlvorrichtung 2 mit einem Gehäuse 3, das unter anderem einen Wärmetauscher 4 beinhaltet, der auf bekannte Weise über einen Vorlaufanschluss 6 und einen Rücklaufanschluss 8 mit Kühlmittel versorgt wird. Insbesondere vor dem Hintergrund der Entwicklung von Hybrid- und/oder Elektrofahrzeugen ist der Einsatz von elektrischen Antriebseinrichtungen und damit verbundenen Aggregaten im Kraftfahrzeugbereich stark gestiegen. Zur optimalen Leistungsentfaltung dieser elektrischen Aggregate ist eine Temperierung dieser Bauelemente absolut erforderlich. Hierzu wird in 1 beispielhaft eine Leistungselektronik 10 gezeigt, die vier Elektronikbauteile 12, 14, 16, 18 aufweist, die in einem durch Kühlkammern 20, 22, 24, 26 gebildeten Kühlraum 28 angeordnet sind. Der Kühlraum 28 und damit auch die Kühlkammern 20, 22, 24, 26 sind mit Kühlmittel 29 gefüllt und bewirken aufgrund des Wärmeaustausches mit dem Wärmetauscher 4 eine optimale Temperierung der Elektronikbauteile 12, 14, 16, 18. Die Kühlkammern 20, 22, 24, 26 werden hierbei im Wesentlichen gebildet durch Trennelemente 28, 30, 32, auf die im vorliegenden Ausführungsbeispiel auch noch die Elektronikbauteile 12, 14, 16, 18 angeordnet sind. Durch eine derartige Ausführungsform ist eine sehr einfach herzustellende und kompakte Kühlvorrichtung 2 bereitgestellt, die darüber hinaus noch einen optimalen Wärmeaustausch gewährleistet. Die Höhe hTr eines Trennelementes 28, 30, 32 sollte hierbei mindestens 80% der Höhe hKa einer Kühlkammer 20, 22, 24, 26 betragen. Durch dieses Höhenverhältnis ist sichergestellt, dass bei einer Neigung des Fahrzeuges (siehe hierzu 2), wie beispielsweise bedingt durch eine Kurvenfahrt oder durch ein besonders dynamisches Fahrverhalten, die jeweiligen Elektronikbauteile 12, 14, 16, 18 ausreichend mit Kühlmittel 29 umgeben sind. 1 shows in a sectional view schematically a cooling device 2 with a housing 3 , including a heat exchanger 4 includes, in a known manner via a flow connection 6 and a return port 8th is supplied with coolant. Especially against the background of the development of hybrid and / or electric vehicles, the use of electric drive devices and associated units in the automotive sector has risen sharply. For optimum power delivery of these electrical units, a temperature of these components is absolutely necessary. This is done in 1 an example of power electronics 10 shown the four electronic components 12 . 14 . 16 . 18 that in through a cooling chambers 20 . 22 . 24 . 26 formed refrigerator 28 are arranged. The fridge 28 and therefore also the cooling chambers 20 . 22 . 24 . 26 are with coolant 29 filled and cause due to the heat exchange with the heat exchanger 4 optimum temperature control of the electronic components 12 . 14 . 16 . 18 , The cooling chambers 20 . 22 . 24 . 26 are essentially formed by separating elements 28 . 30 . 32 , in the present embodiment, even the electronic components 12 . 14 . 16 . 18 are arranged. By such an embodiment is a very easy to manufacture and compact cooling device 2 provided, which also ensures optimal heat exchange. The height h Tr of a separating element 28 . 30 . 32 should here at least 80% of the height h Ka a cooling chamber 20 . 22 . 24 . 26 be. This height ratio ensures that at a tilt of the vehicle (see 2 ), such as due to cornering or by a particularly dynamic driving behavior, the respective electronic components 12 . 14 . 16 . 18 sufficiently with coolant 29 are surrounded.

2 verdeutlicht eine derartige Fahrsituation in einer extremen Darstellung. Jedoch können insbesondere bei Geländefahrten derartige Neigungswinkel erzielt werden, wobei, wie hier deutlich zu erkennen ist, die Elektronikbauteile 12, 14, 16, 18 noch stets ausreichend mit Kühlmittel 29 umgeben sind. 2 illustrates such a driving situation in an extreme representation. However, such inclination angles can be achieved in particular in off-road driving, wherein, as can be clearly seen here, the electronic components 12 . 14 . 16 . 18 still always sufficient with coolant 29 are surrounded.

ZITATE ENTHALTEN IN DER BESCHREIBUNG QUOTES INCLUDE IN THE DESCRIPTION

Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Zitierte PatentliteraturCited patent literature

  • JP 2006114603 A [0002] JP 2006114603 A [0002]

Claims (3)

Kühlvorrichtung für eine Leistungselektronik (10) zum Einsatz im Kraftfahrzeugbereich mit einem Gehäuse (3), das einen Wärmetauscher (4), mindestens zwei Elektronikbauteile (12, 14, 16, 18) sowie mindestens zwei mit Kühlmittel (29) gefüllte Kühlkammern (20, 22, 24, 26), die einen Kühlraum (28) bilden, aufweist, wobei die Kühlkammern (20, 22, 24, 26) mindestens einem Elektronikbauteil (12, 14, 16, 18) zugeordnet sind, durch Trennelemente (28, 30, 32) ausgebildet sind und fluidisch miteinander verbunden sind, dadurch gekennzeichnet, dass die Elektronikbauteile (12, 14, 16, 18) in den jeweiligen Kühlkammern (20, 22, 24, 26) angeordnet sind. Cooling device for power electronics ( 10 ) for use in the motor vehicle sector with a housing ( 3 ), which has a heat exchanger ( 4 ), at least two electronic components ( 12 . 14 . 16 . 18 ) and at least two with coolant ( 29 ) filled cooling chambers ( 20 . 22 . 24 . 26 ), which have a cold room ( 28 ), wherein the cooling chambers ( 20 . 22 . 24 . 26 ) at least one electronic component ( 12 . 14 . 16 . 18 ) are assigned by separating elements ( 28 . 30 . 32 ) are formed and fluidly connected to each other, characterized in that the electronic components ( 12 . 14 . 16 . 18 ) in the respective cooling chambers ( 20 . 22 . 24 . 26 ) are arranged. Kühlvorrichtung nach Anspruch 1, dadurch gekennzeichnet, dass die Höhe hTr eines Trennelementes (28, 30, 32) mindestens 80% der Höhe hKa einer Kühlkammer (20, 22, 24, 26) beträgt. Cooling device according to claim 1, characterized in that the height h Tr of a separating element ( 28 . 30 . 32 ) at least 80% of the height h Ka of a cooling chamber ( 20 . 22 . 24 . 26 ) is. Kühlvorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass die Elektronikbauteile (12, 14, 16, 18) auf den Trennelementen (28, 30, 32) angeordnet sind. Cooling device according to claim 1 or 2, characterized in that the electronic components ( 12 . 14 . 16 . 18 ) on the separating elements ( 28 . 30 . 32 ) are arranged.
DE201210111489 2012-11-27 2012-11-27 Device for cooling power electronic for use in motor vehicle e.g. hybrid vehicle, has separating elements that are fluidly connected to each other, and electronic components that are arranged in respective cooling chambers Withdrawn DE102012111489A1 (en)

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DE201210111489 DE102012111489A1 (en) 2012-11-27 2012-11-27 Device for cooling power electronic for use in motor vehicle e.g. hybrid vehicle, has separating elements that are fluidly connected to each other, and electronic components that are arranged in respective cooling chambers

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020138081A1 (en) * 2018-12-27 2020-07-02 川崎重工業株式会社 Evaporator and loop heat pipe
DE102020105925A1 (en) 2020-03-05 2021-09-09 Bayerische Motoren Werke Aktiengesellschaft Cooling arrangement for a motor vehicle
DE102020216137A1 (en) 2020-12-17 2022-06-23 Zf Friedrichshafen Ag Half bridge for an electric drive of an electric vehicle or a hybrid vehicle, power module for an inverter and inverter
DE102022115995A1 (en) 2022-06-28 2023-12-28 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Device with a pulse inverter
EP4174937A4 (en) * 2020-06-24 2024-07-24 Kawasaki Heavy Ind Ltd Evaporator and loop heat pipe

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835948A (en) * 1981-08-28 1983-03-02 Fujitsu Ltd Liquid cooling type module
JPS61253843A (en) * 1985-05-07 1986-11-11 Hitachi Ltd Semiconductor device
JP2000349213A (en) * 1999-03-26 2000-12-15 Toyota Motor Corp Cooling device for heating element
DE20020270U1 (en) * 2000-11-29 2001-03-29 Harting Automotive Gmbh & Co Hermetically sealed housing
DE10201557A1 (en) * 2002-01-17 2003-07-31 Modine Mfg Co Container with liquid for evaporation cooling of electronics/electrics has bearer plate with opening to which evacuation/filling port is connected as hydraulic connection to container interior
JP2006114603A (en) 2004-10-13 2006-04-27 Toshiba Corp Semiconductor cooling apparatus for vehicle
JP2008218718A (en) * 2007-03-05 2008-09-18 Toyota Motor Corp Cooling structure of electron device, and cabinet for electron device cooling
US20110049976A1 (en) * 2009-08-28 2011-03-03 Hitachi, Ltd. Electric Power Converter
EP2555606A1 (en) * 2011-08-03 2013-02-06 Siemens Aktiengesellschaft Cooling assembly for cooling a frequency converter module

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835948A (en) * 1981-08-28 1983-03-02 Fujitsu Ltd Liquid cooling type module
JPS61253843A (en) * 1985-05-07 1986-11-11 Hitachi Ltd Semiconductor device
JP2000349213A (en) * 1999-03-26 2000-12-15 Toyota Motor Corp Cooling device for heating element
DE20020270U1 (en) * 2000-11-29 2001-03-29 Harting Automotive Gmbh & Co Hermetically sealed housing
DE10201557A1 (en) * 2002-01-17 2003-07-31 Modine Mfg Co Container with liquid for evaporation cooling of electronics/electrics has bearer plate with opening to which evacuation/filling port is connected as hydraulic connection to container interior
JP2006114603A (en) 2004-10-13 2006-04-27 Toshiba Corp Semiconductor cooling apparatus for vehicle
JP2008218718A (en) * 2007-03-05 2008-09-18 Toyota Motor Corp Cooling structure of electron device, and cabinet for electron device cooling
US20110049976A1 (en) * 2009-08-28 2011-03-03 Hitachi, Ltd. Electric Power Converter
EP2555606A1 (en) * 2011-08-03 2013-02-06 Siemens Aktiengesellschaft Cooling assembly for cooling a frequency converter module

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020138081A1 (en) * 2018-12-27 2020-07-02 川崎重工業株式会社 Evaporator and loop heat pipe
DE102020105925A1 (en) 2020-03-05 2021-09-09 Bayerische Motoren Werke Aktiengesellschaft Cooling arrangement for a motor vehicle
DE102020105925B4 (en) 2020-03-05 2024-09-12 Bayerische Motoren Werke Aktiengesellschaft Cooling arrangement for a motor vehicle
EP4174937A4 (en) * 2020-06-24 2024-07-24 Kawasaki Heavy Ind Ltd Evaporator and loop heat pipe
DE102020216137A1 (en) 2020-12-17 2022-06-23 Zf Friedrichshafen Ag Half bridge for an electric drive of an electric vehicle or a hybrid vehicle, power module for an inverter and inverter
DE102022115995A1 (en) 2022-06-28 2023-12-28 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Device with a pulse inverter

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