DE102012021169A1 - Laser amplifier system with solid-state disk - Google Patents

Abstract

The invention relates to a laser amplifier system (1) with a solid body disc (2) comprising a laser medium with two flat sides (3, 4), functional layers (5) comprising a reflector for a pump radiation field (6) on the first flat side (3), and a reflector for a laser radiation field (7), and the functional layers (5) for dissipating heat are thermally and mechanically coupled to a cooling surface (8) of a heat sink (9), the coupling being at least partially via a heat sink (9 ) and functional layer (5) arranged adhesive layer (10) is realized. The laser amplifier system is characterized in that the adhesive layer (10) is formed by an adhesive which undergoes a substantial change in volume during the transition from the liquid to the solid state. The invention further relates to a method for producing the laser amplifier system (1) according to the invention.

Description

The invention relates to a laser amplifier system comprising a solid-state disk with two flat sides, wherein on the first flat side functional layers comprising a reflector for a pump radiation field, and a reflector for a laser radiation field are arranged and the functional layers for dissipating heat thermally and mechanically with a cooling surface of a heat sink are coupled, wherein the coupling is at least partially realized via an arranged between the heat sink and functional layer adhesive layer. The invention further relates to a method for producing the laser amplifier system.

Such laser amplifier systems are known, for example, from the patents EP 1 178 579 B1 . EP 0 632 551 B1 . EP 0 869 592 B1 and EP 0 869 591 B1 ,

In the EP 0 632 551 B1 , of the EP 0 869 592 B1 and the EP 0 869 591 B1 a laser amplifier system is described in which the heat sink is made of a thermally conductive metal and the thermal contact is made via a solder between the heat sink and solid state disk. Likewise, there is described another laser amplifier system in which the heat sink of a transparent material, such as. As diamond, silicon carbide, or other carbon-containing compounds. However, there are no precise details about the thermal coupling of solid-state disk and heat sink.

In the EP 1 178 579 B1 describes a laser amplifier system in which the solid state disk is mechanically and thermally coupled to the heat sink by means of an adhesive layer. As the adhesive layer, an adhesive is used, with a volume change in the transition from the liquid to the solid state, which is less than 5%. This is intended to prevent misadjustment of the optical system during curing of the adhesive.

Solid-state disks have the advantage that a linear temperature gradient is built up by flat uniform cooling and thus the formation of a thermal lens in the solid-state medium is minimized. Good cooling of the solid disk is therefore essential.

In the case of the initially mentioned conventional laser systems, the adhesive layer substantially determines the thermal resistance between the solid-state disk and the heat sink. The thickness of the adhesive layer can be minimized in the still liquid state of the adhesive by pressing the solid-state disk onto the heat sink. The time required to extrude the adhesive grows disproportionately with decreasing layer thickness. For a good thermal coupling of the heat sink and the solid-state disk, adhesive layers with thicknesses in the range of a few micrometers to a few hundred nanometers are favorable. Such a thin adhesive layer over the entire surface can not be produced in conventional laser amplifier systems or only with great expenditure of time.

One solution is the use of a convexly curved solid body towards the heat sink in combination with a planar heat sink, as it is in the EP 1 178 579 B1 is described. Such a curved disc can be pressed with little pressure on a wetted with adhesive planar heat sink, since the adhesive layer increases according to the curvature of the solid disk radially outward, the adhesive can be easily displaced into the edge regions. At the apex of the convexly curved disk, a minimum distance between the heat sink and the solid disk can be realized. Ultimately, however, this contact region is very small, so that the heat resistance in the edge regions of the adhesive layer adjacent to the active region of the solid-state disk interspersed by the active pump radiation field is greater, especially in the case of pump radiation fields having a large diameter.

The output power of solid-state laser amplifier systems can basically be scaled up by increasing the diameter of the pump radiation field while maintaining the pump power density on the solid-state disk.

The production of a uniformly thin layer between the cooling surface of the heat sink and the functional layers arranged on the solid-state disk becomes more difficult as the diameter of the disk increases.

The invention has for its object to provide a laser amplifier system according to the preamble of claim 1, which has the lowest possible thermal thermal resistance between the solid disk and heat sink over the entire surface and can be produced as time and cost.

The object is achieved by a laser amplifier system according to the preamble of claim 1, which is characterized in that the adhesive layer is formed by an adhesive which undergoes a significant volume change in the transition from liquid to solid state.

Such an adhesive has the advantage that the thickness of the adhesive layer in addition to z. B. one on the second surface of the solid disk for Heat sink directed acting force for pressing out excess adhesive from the present between functional layers and heat sink gap, can also be minimized by an independent variation of the thickness of the adhesive layer during curing. The thickness of the adhesive layer is therefore larger in the still liquid state than in the solid state, which leads to a time savings in the production of the layer and facilitates a final adjustment in the still liquid state of the adhesive.

According to the invention, a "substantial change in volume" is understood to mean a volume change which is at least 5%.

In particular, it is advantageous if the adhesive is an adhesive which has as uniform a volume change as possible from the liquid to the solid state. It is advantageous if an adhesive is used which has a homogeneous composition over the entire adhesive layer. With a uniform supply of activation energy to activate the liquid to solid state transition of the adhesive, then the difference in relative volume change of the adhesive in any two areas of the adhesive volume should be less than 10% throughout the transition from liquid to solid state A similar proportion of activation energy is supplied to areas.

It is favorable for the power scaling of the laser amplifier system if the solid-state disk has a diameter that is greater than 15 mm, preferably greater than 20 mm.

It can be increased with appropriate scaling of the pump radiation field diameter, the total power of the pump radiation field without having to raise the pump power density.

In particular, the use of a substantially planar solid-state disk is advantageous, since then the thermal coupling to a planar, flat heat sink is the same everywhere. The latter is easier to manufacture compared to a heat sink with, for example, a curved cooling surface.

The heat sink can be made of any material with good heat conduction. For example, a copper alloy is conceivable. But is particularly advantageous a transparent heat sink, for. As diamond, or silicon carbide.

In a particularly advantageous variant of the invention, the adhesive layer comprises, in addition to the adhesive, a filler with a thermal conductivity of more than 1 W / cm / K.

It is particularly advantageous if the filler comprises solid particles with a degree of filling of more than 10%, wherein the solid particles having a diameter in the nanometer or micrometer range have substantially the same diameter.

As the adhesive hardens, the volume of the adhesive decreases, causing the solid disk to become the heat sink. It is advantageous if the volume change of the adhesive is so great that the layer thickness after curing of the adhesive just corresponds to the diameter of the solid particles. The solid particles improve the thermal contact between the heat sink and solid disk, since the layer thickness of the adhesive between solid particles and heat sink or functional layers is minimized and in the best case, the solid particles by the volume change of the adhesive in direct contact with the heat sink and applied to the solid state functional layers , such as B. the reflector come.

Preferably, the solid particles are not round, but provided with a flat surface, for example in the form of a polyhedron, so that the best possible contact due to a surface contact with the surfaces of the solid particles can be produced.

Advantageously, the diameters of the solid particles are substantially the same. Favorable are maximum deviations of a few 10 nm, a maximum of 150 nm. It is particularly advantageous if the distribution of the diameters of the solid particles have a maximum at the desired layer thickness, wherein the number of solid particles with a larger diameter approaches zero with the aforementioned maximum deviation , in the range of smaller diameter, the distribution of the diameter but can behave arbitrarily.

The solid-state disk is partially penetrated by a pump radiation field, as well as a laser radiation field. This area is also referred to below as the "active area" of the solid state disk.

Conveniently, the substantial portion of the adhesive is distributed over a cross section covering less than 50% of the cooling area between the heat sink and the active area of the solid state disk. For example, this is the case when the adhesive contains solid particles whose degree of filling in this area corresponds to at least 50% and whose diameter corresponds approximately to the layer thickness of the adhesive layer.

Also advantageous is the use of a grid as a filler. In this case, the grid between the heat sink and the solid disk is arranged flat and is penetrated by the adhesive. The solid disk can be easily adjusted with not yet cured adhesive, however, whereas the transition from liquid to solid state of the adhesive, the solid state disk is pressed with their functional layers on the grid to improve the thermal contact between functional layers and heat sink.

Also favorable is a heat sink with a cooling surface with recesses for receiving the adhesive. These recesses or channels may, for example, have been produced by means of a laser. Before curing of the adhesive, the recesses provide for the removal of the solid disk for a good removal of the then still liquid adhesive to the outside. It can be so full-surface distances between the solid disk and the heat sink can be realized, which can not be generated at completely flat surfaces without recesses, or only with much greater expenditure of time.

Conveniently, the recesses have a triangular cross section or a cross section with rounded edges. In the transition from the liquid to the solid state of the adhesive, the adhesive from areas outside of the recesses is drawn into the recesses.

The recesses may be arranged radially parallel to one another or starting from the center. Other arrangements are conceivable.

Appropriately, no recess in the heat sink are provided in the center of the active region of the solid-state disk. For example, then the adhesive may be arranged exclusively in the recesses, so that there is a direct contact between the heat sink and the functional layers of the solid state disk in the areas of the solid disk in which no recesses are provided. If the surfaces of the heat sink and the functional layers are sufficiently well prepared, a direct contact between the two surfaces can be produced by "bonding" in these areas. The adhesive layer arranged in the recesses ensures by the change in volume of the adhesive for a favorable contact pressure for the production of this contact.

The adhesive can be performed, for example, only after the "bonding" in the recesses.

It is advantageous in a design of the laser amplifier system with a filler in the adhesive layer or recesses in the heat sink, if the absolute change in length of the adhesive layer in the transition from liquid to solid state in a direction perpendicular to the surface of the heat sink at least as large as the surface roughness of the surface of the filler or the heat sink is.

This has the advantage that the surfaces before the curing of the adhesive layer are so far apart that they can be moved freely to each other. After curing of the adhesive, the surfaces interlock, so that a free movement is no longer possible.

A volume change of 5% corresponds to a change in length of approximately 20 nm for a layer thickness of the adhesive of one micron. This change in length corresponds approximately to the surface roughness of an extremely finely polished surface.

Conveniently, the still liquid adhesive has a high resistance for conducting the activation energy, so that when initiating the activation energy a gradient in the distribution of the activation energy is generated within the adhesive layer. In the case of an adhesive which is activated by ultraviolet light, this can be realized for example by an increased absorption in the ultraviolet wavelength range.

This ensures that the adhesive first cures in the bottom of the recesses, so that the then still liquid adhesive is drawn into the recesses in the area of the functional layers.

In an advantageous variant of the laser amplifier system, the filler has a high resistance with regard to the energy transport of the activation energy, so that when the activation energy is initiated, the area between filler and functional layers is shaded with regard to the activation energy. In this case, the adhesive in these areas hardens less quickly, so that the adhesive is "sucked" by the change in volume of the adhesive in other areas from the areas between functional layer and filler. Appropriately, in such a case, the adhesive is not activated by thermal energy, but for example by ultraviolet light. It is beneficial if the filler absorbs ultraviolet light.

It is particularly advantageous if the energy transport with respect to the activation energy is better with cured adhesive than with not cured adhesive. This is the case, for example, with an adhesive whose absorption in the ultraviolet wavelength range is greater in the liquid state than in the solid state.

In the case of a laser amplifier system with recesses in the cooling surface of the heat sink only the bottoms of the recesses are permeable to the activation energy, but not the walls and / or webs between the recesses.

If the recesses are produced by structuring the cooling surface, this can be achieved, for example, by coating the cooling surface with an activation-energy-impermeable layer before structuring. It is conceivable z. B. an ultraviolet light-impermeable absorption layer. This is favorable in particular in the structuring of the heat sink with laser light, since then a laser light absorptive layer which is also used for the corresponding structuring can be selected in order to reduce the laser power required for the structuring by an increased absorption on the coated cooling surface.

It is also advantageous if the recesses have a larger cross-section with increasing distance to the active region of the solid-state disk and / or whose number increases.

In a further development of the laser amplifier system, an additional thermal homogenization layer is arranged between the solid-state disk and the adhesive layer, wherein the homogenization layer has a higher thermal conductivity than the other functional layers which are applied to the solid-state disk, as well as the solid-state disk itself.

The use of a thermal homogenization layer is particularly useful in combination with a filler in the adhesive or in recesses in the cooling surface of the heat sink. In such an embodiment of the laser amplifier system, the adhesive has a lower thermal conductivity than the filler. This results in an inhomogeneous heat resistance between the heat sink and the solid-state disk considered over the surface. In this case, the thermal homogenization layer serves to uniformly distribute the heat generated in the solid-state disk. Any resulting from the inhomogeneous thermal resistance temperature increases, especially in areas where the adhesive layer has the largest extent are minimized.

The invention further relates to a method for producing the aforementioned laser amplifier system. In the method, an adhesive with a substantial volume change in the transition from solid to liquid state is applied to a cooling surface of a heat sink and pressed the solid disk with their functional layers on the heat sink, wherein the curing energy of the adhesive, the activation energy is passed through the heat sink to the adhesive. The method is characterized in that recesses for receiving adhesive in the cooling surface of the heat sink are generated before pressing the solid-state disk onto the heat sink.

Since the adhesive over the enlarged cross-section through the recesses can flow away easily to the outside, the adhesive layer can be minimized in selected areas between the functional layers of the solid disk and the heat sink in comparison to the time required for the compression of solid disk and heat sink without recesses time required with less time become.

In an advantageous variant of the method according to the invention, the recesses are structured in the cooling surface of the heat sink. Such structuring can be done for example by means of a laser.

It is favorable if the irradiation of the activation energy takes place at such an angle to the recesses, in which the recesses shadow a rectilinear propagation of the activation energy to the webs between the recesses. This can ensure that the adhesive layer first cures in the recesses.

Conveniently, an adhesive is used which hardens upon irradiation with ultraviolet light.

Advantageously, in a further variant of the method according to the invention, a layer absorptive of the activation energy is additionally applied to the heat sink surface and / or the grid. In contrast to the case described above, in which the irradiation takes place at an angle, when an absorptive layer is applied, the irradiation of the activation energy can also take place at a vertical angle.

Conveniently, the absorptive layer is applied to the cooling surface of the heat sink prior to structuring. If the cooling surface is subsequently patterned with a laser, the absorptive layer can also be used for increased absorption and therefore provide higher processing efficiency during patterning.

Another embodiment of the method for producing the laser amplifier system provides that the solid-state disk with its functional layers is pressed onto the heat sink, so that the heat sink and the functional layers of the solid-state disk enter into a material closure, the adhesive only being introduced from the outside into the recesses.

This has the advantage that the contact between the functional layers of the solid-state disk and the heat sink can take place without contamination by the adhesive. The adhesive is then z. B. conducted capillary forces in the recesses and cured. During curing, the change in the volume of the adhesive ensures that the force with which the functional layers are pressed onto the heat sink is further increased. The material connection and thus the thermal contact between the heat sink and functional layers can be further improved.

The invention further relates to a further method for producing the aforementioned laser amplifier system. In this case, just as in the previous method, an adhesive is applied with a substantial change in volume in the transition from solid to liquid state on a cooling surface of a heat sink and pressed the solid disk with their functional layers on the adhesive layer and the heat sink, wherein for curing of the adhesive, the activation energy through the heat sink passed through to the adhesive. The method is characterized by the fact that a solid-state disk is selected as a solid disk whose thickness is greater than the thickness of the layer which is later used as an active layer during operation of the laser amplifier system.

The active layer is according to the invention z. Example, characterized in that the solid state disk is doped in this area with ions to produce a population inversion upon irradiation of a corresponding pump radiation field.

In this case, in an additional step, the thickness of a fully doped solid disk after sticking and curing of the adhesive can be reduced and then an antireflection layer for the pump and laser radiation field are applied to the solid state disk.

The thickness of the solid-state disk can be reduced, for example, by lapping and / or polishing.

In such a variant of the method, the thickness of the solid-state disk before being pressed onto the heat sink can be selected such that it has a mechanical stability sufficient to coat the solid-state disk without changing the shape with the functional layers and even when glued to the heat sink Form change leads. When lapping and / or polishing, the thickness of the disk is adjusted so that it is optimized for operation in the laser amplifier system depending on the doping.

On the other hand, it is also conceivable that a solid-state disk is used which is doped with the laser-active ions only in a certain range with the corresponding desired layer thickness.

An advantageous embodiment of the laser amplifier system according to the invention will be explained with reference to the embodiments illustrated in the drawings.

Show it:

1 a schematic representation of the laser amplifier system according to the invention,

2 a schematic representation of the laser amplifier system according to the invention without radiation fields, in which the adhesive layer includes a filler of solid particles and the adhesive is not cured yet,

3 a schematic representation of the laser amplifier system according to the invention according to 2 in which the adhesive has cured,

4 a schematic representation of the laser amplifier system according to the invention, in which a grid is arranged flat between functional layers of the solid state disk and the heat sink, wherein the adhesive is not cured yet,

5 a schematic representation of the laser amplifier system according to the invention according to 4 , in which case the adhesive has hardened,

6 a schematic representation of a laser amplifier system according to the invention with recesses in the heat sink, wherein the adhesive is not cured,

7 a schematic representation of the laser amplifier according to the invention according to 6 Here, the adhesive is also shown in the uncured state, and unlike in 6 was introduced only in the recesses,

8th a schematic representation of the laser amplifier system according to 6 or 7 , in which case the adhesive has hardened,

9 1 is a schematic representation of a laser amplifier system according to the invention with recesses in the heat sink and an additional thermal homogenization layer, wherein the adhesive in the illustration has not yet cured,

10 a schematic representation of the laser amplifier system 9 , where now the adhesive is shown cured,

11 a schematic representation of the laser amplifier system with an additional absorption layer on the webs between the introduced into the heat sink recesses for ultraviolet light,

12 a schematic representation of the laser amplifier system as a cross-sectional view with a vertical view of the cooling surface and

13 a schematic representation of the laser amplifier system as a cross-sectional view with a vertical view of the cooling surface, in which case the recesses are shown radially outward.

In 1 is a schematic representation of an embodiment of the laser gain system ( 1 ), in which the solid-state disk ( 2 ) in an active area ( 16 ) from a vertically incident laser radiation field ( 7 ) and a laterally incident pump radiation field ( 6 ) is interspersed. Both radiation fields ( 6 . 7 ) by functional layers ( 5 ) reflected reflectors, wherein the reflectors on a first flat side ( 3 ) of the solid state disk ( 2 ) are arranged.

The solid-state disk ( 2 ) with its functional layers ( 5 ) via an adhesive layer ( 10 ) with the cooling surface ( 8th ) of a heat sink ( 9 ) connected. The adhesive layer ( 10 ) ensures thermal and mechanical contact between the functional layers ( 5 ) of the solid state disk ( 2 ) and the heat sink ( 9 ).

In the illustration, the adhesive layer ( 10 ) in the not yet cured state. When the adhesive is cured, the adhesive layer undergoes ( 10 ) a volume change, so that this layer contracts accordingly.

In the following figures, exemplary embodiments are shown in which the volume of the adhesive in the adhesive layer (FIG. 10 ) either by a filler ( 11 . 15 ), or by recesses ( 12 ) in the cooling surface ( 8th ) of the heat sink ( 9 ) is reduced.

In 2 are solid particles ( 15 ) in the adhesive layer ( 10 ). These solid particles ( 15 ) have substantially the same diameter. While in 2 the adhesive is not yet cured, this is in 3 shown in the cured state.

During curing, the adhesive undergoes ( 10 ) a volume change, so that the volume of the adhesive layer ( 10 ) is reduced. The solid-state disk ( 2 ) on the heat sink ( 9 ) drawn. The solid particles ( 15 ) limit the layer thickness between the functional layers ( 5 ), which on the solid disk ( 2 ) are applied and the cooling surface ( 8th ) of the heat sink ( 9 ). In the best case, a uniform thermal contact over the solid particles ( 15 ) built up.

The volume changes of the adhesive ( 10 ), as shown in the figures, are to be understood purely schematically. The actual volume changes are much smaller according to the invention, but in principle produce the same effects described here.

In 4 is used instead of the solid particles ( 15 ) a filling grid ( 11 ) between the solid-state disk ( 2 ) and the heat sink ( 9 ) brought. The adhesive ( 10 ) fills the individual plots of the grid ( 11 ). The solid-state disk ( 2 ) with its functional layers ( 5 ) on the grid ( 11 ) pressed. Either the adhesive ( 10 ) peripherally from the gap between functional layers ( 5 ) and cooling surface ( 8th ) or grid ( 11 ) and partly in the parcels of the grid ( 11 ) pressed together under pressure. Due to the change in volume of the adhesive ( 10 ) from the liquid to the solid state, the pressure in the parcels is compensated and, if necessary, the solid-state disk ( 2 ) by the pressure change even on the grid ( 11 ) pressed.

The corresponding situation with cured adhesive ( 10 ) is in 5 shown.

Instead of a grid ( 11 ) can also recesses ( 12 ) in the cooling surface ( 8th ) of the heat sink ( 9 ) for receiving adhesive ( 10 ) be provided. The corresponding situation is in 6 represented where the adhesive ( 10 ) is shown in the not yet cured state. A cross-sectional view with a vertical view of the cooling surface ( 8th ) is in 11 shown.

The recesses ( 12 ) can also be applied in a different way to the cooling surface ( 8th ) can be arranged. For example, a radial orientation, as in 12 is shown, conceivable.

The recesses ( 12 ) are in 6 formed in the form of mutually parallel channels. Cures the adhesive ( 10 ), the solid state disk ( 2 ) with their functional layers ( 5 ) on the heat sink ( 9 ) pressed. The adhesive ( 10 ) is thereby inserted into the recesses ( 12 ), as it is in 8th is shown.

The adhesive ( 10 ) can be used, for example, with light ( 16 ), preferably at ultraviolet wavelengths. In 6 For this purpose, an advantageous illumination direction is shown. While the UV irradiation ( 16 ) arbitrarily from the heat sink ( 9 ) on the adhesive layer ( 10 ) can be addressed, is like in 6 illustrated lateral irradiation particularly advantageous. The direction of the irradiation is chosen so that the recesses ( 12 ) with the adhesive layer ( 10 ) the webs between the recesses ( 12 ) shade. So it can be ensured that the adhesive first in the recesses ( 12 ) hardens. The volume change realized there then ensures that the rest of the functional layer ( 5 ) Adjacent adhesive ( 10 ) into the recesses ( 12 ) is drawn in, as it is then in 8th is shown.

A slightly different approach is according to 7 recognizable. In 7 is the glue ( 10 ) like in 6 shown in the not yet cured state. Here was the glue ( 10 ) but only in the recesses ( 12 ) brought in. Such an approach in the manufacture of the laser amplifier system ( 1 ) is particularly useful when working in a vacuum. It can thus even without the risk of adhesive residue direct contact between heat sink ( 9 ) and functional layers ( 5 ) getting produced.

In addition to the recesses ( 12 ), a thermal homogenization layer ( 13 ) on the functional layers ( 5 ) can be arranged. Such a homogenization layer ( 13 ) is in 9 shown. This homogenization layer can consist, for example, of a metal or another material with high thermal conductivity. On the one hand, this layer serves the heat energy, in particular in the regions of the recesses ( 12 ) so that, in order to counteract any increase in temperature, they are separated from the webs between the recesses ( 12 ) is derived. Once the glue ( 10 ) is cured, as in 10 shown, the homogenization layer ( 13 ) on the webs between the recesses ( 12 ) of the heat sink ( 9 ) pressed.

Instead of an oblique illumination with ultraviolet light ( 16 ), as it is in 6 an additional absorption layer on the heat sink can ensure that even with a vertical irradiation with ultraviolet light ( 16 ) first the adhesive in the recesses ( 12 ) is cured. Such an absorption layer is in 11 shown.

LIST OF REFERENCE NUMBERS

1

Laser amplifier system

2

Solid state disk

3

first flat side of the solid-state disk

4

second flat side of the solid-state disk

5

Functional layers comprising reflectors for laser and pump radiation field

6

Pump radiation field

7

Laser radiation field

8th

Cooling surface of the heat sink

9

heatsink

10

adhesive

11

Lattice of material with high thermal conductivity

12

Recesses in the cooling surface

13

thermal homogenization layer

14

absorbing layer

15

Solid particles as filler

16

active area of the solid-state disk

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• EP 1178579 B1 [0002, 0004, 0007]
• EP 0632551 B1 [0002, 0003]
• EP 0869592 B1 [0002, 0003]
• EP 0869591 B1 [0002, 0003]

Claims (10)

Laser amplifier system ( 1 ), with a solid-state disk comprising a laser medium ( 2 ) with two flat sides ( 3 . 4 ), wherein on the first flat side ( 3 ) Functional layers ( 5 ) comprising a reflector for a pump radiation field ( 6 ), and a reflector for a laser radiation field ( 7 ), and the functional layers ( 5 ) for dissipating heat thermally and mechanically with a cooling surface ( 8th ) of a heat sink ( 9 ), wherein the coupling at least partially via an between heat sink ( 9 ) and functional layer ( 5 ) arranged adhesive layer ( 10 ), characterized in that the adhesive layer ( 10 ) is formed by an adhesive, which undergoes a significant change in volume in the transition from the liquid to the solid state. Laser amplifier system ( 1 ) according to claim 1, characterized in that the solid-state disk ( 2 ) is flat and has a diameter which is at least 20 mm, preferably larger. Laser amplifier system ( 1 ) according to one of the preceding claims, characterized in that the filler contains solid particles ( 15 ) with a degree of filling of more than 10%, whereby the solid particles ( 15 ) have a thermal conductivity greater than 1 W / cm / K and a substantially equal diameter in the nanometer or micrometer range. Laser amplifier system ( 1 ) according to one of the preceding claims, characterized in that in the heat sink surface ( 8th ) Recesses ( 12 ) are provided for receiving the adhesive. Laser amplifier system ( 1 ) according to claim 4, characterized in that the recesses ( 12 ) with increasing distance to the active area ( 16 ) of the solid state disk have a larger cross section and / or their number increases. Laser amplifier system ( 1 ) according to one of the preceding claims, characterized in that an additional thermal homogenization layer ( 13 ) between the functional layers ( 5 ) of the solid-state disk and the adhesive layer, wherein the homogenization layer ( 13 ) one compared to the solid state disk ( 2 ) and the functional layers ( 5 ) has higher thermal conductivity. Laser amplifier system ( 1 ), according to one of claims 4 to 6, characterized in that on the cooling surface ( 8th ) of the heat sink ( 9 ) an absorption layer ( 14 ) for the curing of the adhesive ( 10 ) is arranged necessary activation energy. The invention further relates to a method for producing the laser amplifier system according to one of claims 4 to 7, wherein an adhesive is applied with a substantial change in volume in the transition from solid to liquid state on a cooling surface of a heat sink and pressed the solid disk with their functional layers on the heat sink is, wherein for curing of the adhesive, the activation energy is passed through the heat sink to the adhesive and the method is characterized in that recesses are formed for receiving adhesive in the cooling surface of the heat sink before pressing the solid disk on the heat sink. A method for producing the laser amplifier system according to claim 8, characterized in that the solid-state disk is pressed with its functional layers on the heat sink, so that the heat sink and the functional layers of the solid disk infer a material, and only then the adhesive is introduced from the outside into the recesses. The invention further relates to a further method for producing the laser amplifier system according to one of claims 1 to 7, wherein an adhesive with a substantial change in volume in the transition from solid to liquid state is applied to a cooling surface of a heat sink and then the solid state disk with their functional layers on the Adhesive layer and the heat sink is pressed, wherein for curing of the adhesive, the activation energy is passed through the heat sink to the adhesive and the method is characterized in that the method additionally steps to reduce the thickness of the solid disk and to apply an antireflection layer for the pump and Laser radiation field on the solid state disk comprises.

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