DE102011075308A1 - Electronic circuit arrangement for control device in motor car, has electronic components arranged on circuit boards, where regions around components are filled with material, which has heat conductivity larger than heat conductivity of air - Google Patents

Abstract

The arrangement (10) has electronic components (160) e.g. power components, arranged on circuit boards (110, 112). Regions (150) around the electronic components are limited by electrically conductive shields e.g. electrically conductive sheet metal parts (170) and metal frames (180), and the boards. The regions around the components are partially filled with electrically insulating material i.e. mold mass (155), which has heat conductivity larger than heat conductivity of air. The insulating materials include electrically non-conductive filling material such as diamond. The circuit boards have a copper layer, and the sheet metal parts are designed as deep-drawn parts. An independent claim is also included for a method for manufacturing an electronic circuit arrangement.

Description

State of the art

The invention is based on an electronic circuit arrangement according to the preamble of claim 1.

Such devices are known in a variety of configurations and for different applications. When using such circuitry often the problem of shielding electrical and / or magnetic fields occurs. It is necessary to protect the electronic circuit, parts thereof or even individual components, against electrical and / or magnetic interference. In the same way, it may be necessary to prevent the interference radiations arising in an electronic circuit from escaping to the outside. Furthermore, it may also be necessary to protect interference-sensitive components of the circuit from the emission of interfering components of this circuit. In particular, electronic circuit arrangements in control units in motor vehicles must therefore be improved and optimized with regard to their electromagnetic compatibility (EMC).

From the DE 43 17 469 A1 a control device is known in which individual circuit components or the entire circuit are covered with a closed shielding box.

Such electronic circuit arrangements have power components which generate waste heat during operation. Above all, in the case of circuit arrangements which are arranged in a closed housing, it must be ensured that the heat is dissipated reliably in order to avoid heat-related damage to the circuit arrangement. Usually, power devices are cooled in such a way that a cooling slug releases the heat into the printed circuit board on which the power devices are arranged. From the circuit board, the heat is dissipated by means of thermal vias directly to cooling banks, which are arranged on the housing. The location of the cooling banks is usually largely determined by the geometry of the housing, whereby the freedom to place components is severely limited. In addition, due to the thermal vias not all outer and inner layers of the circuit board can be used under the cooling banks for the signal line.

From the DE 102009054517 a control device is known in which a cover-like sheet metal part is used for shielding electromagnetic fields in addition to the cooling of an associated electronic component by the sheet metal part has at least one area which comes to rest on a heat-emitting surface of the component to be cooled. This embodiment has the disadvantage that the sheet metal part must be formed complicated.

Disclosure of the invention

In the circuit arrangement with the features of claim 1, the problem of shielding electrical and / or magnetic fields by the use of one or more electrically conductive shielding solved, each together with the circuit board and possibly other components a Faraday cage around the entire circuit, Groups of components, or individual components form. A Faraday cage is generally understood to mean an all-round or apertured envelope of an electrical conductor whose interior is thereby shielded from external electric fields or electromagnetic waves.

An inventive electrically conductive shielding is for example made of sheet metal or a wire mesh. Such an electrically conductive shielding is simple and inexpensive to manufacture and assembly and takes up little space. Thus, a small and compact structure is possible.

According to the invention, in order to improve the cooling of the electronic power components to be shielded by the shielding element, the region which is bounded by the electrically conductive shielding element around the component or component group is at least partially filled with an electrically insulating material, so that the power component is at least is partially surrounded by the electrically insulating material. The electrically insulating material has a high thermal conductivity compared to air.

The electrically insulating material may advantageously be designed as a thermosetting molding compound or potting compound, which is filled in the liquid state in the area and then cured.

The heat output P which can be dissipated by the electronic component via heat conduction can be calculated according to the formula P = a.l * (T _O -T _i ), where a is the thermal conductivity, l is the path through the thermally conductive material, T _{O is} the temperature at the surface of the electronic component and T _{i represents} the ambient temperature. Since the thermal conductivity of the electrically insulating material, with which the electronic component is surrounded according to the invention, is greater than the thermal conductivity of air, a significant increase the dissipated via heat conduction heat output achieved in comparison to the prior art.

Preferably, the circuit arrangement is arranged in the interior of a housing. The distance of the surface of the inventively formed region which is delimited by the electrically conductive shielding element and which is at least partially filled with an electrically insulating material has a smaller distance to a housing wall, than the surface of the device alone, whereby the heat dissipation to a Housing wall can be done faster than in the prior art.

The insulating material causes a spread of the heat emitted by the device. This means that the heat is absorbed and distributed by the material. Due to the large compared to the electronic component volume, which occupies the insulating material, there is a temperature compensation. Heat peaks are thus avoided and the life of the device is extended. The surface of the area directly emitting heat to the ambient air is considered larger than the surface of the component alone. This also increases the dissipated by convection heat output.

Another advantageous effect of the electrically insulating material is that it increases the reliability of the circuit arrangement according to the invention, since the components surrounded by the electrically insulating material are mechanically stabilized by the material and protected from external influences, such as a shock or a fall.

Preferably, the electrically conductive shielding is formed as an electrically conductive sheet metal part, in particular as a deep-drawn part, and has, for example, a hood or cup-like shape. It is preferably mounted on a metal frame which is arranged on the circuit board and surrounds the components or component groups which are shielded by the electrically conductive sheet metal part. For this purpose, the printed circuit board preferably has a copper layer underneath the metal frame, so that a closed cage is formed. The region which is filled with the insulating material is thus preferably limited by the sheet metal part, the metal frame and the printed circuit board. The sheet metal part and / or the metal frame preferably have openings through which the insulating material can be filled into the area.

The thermal conductivity of the electrically insulating material can be improved by advantageously providing fillers which have an increased thermal conductivity compared to the electrically insulating material alone. These fillers must also be electrically insulating.

Particularly suitable as fillers are materials such as boron nitride, aluminum nitride, diamond, silicon carbide or beryllium oxide. The fillers may be added to the molding compound or potting compound in powder form. It is particularly advantageous if the geometric shape of the individual particles has a large surface in relation to the volume of the particle, for example by a rod-shaped or fibrous geometry. The large surface area optimizes the heat transfer from one particle to the next, as the likelihood of a large interface between adjacent particles increases with the particle surface. Thus, by using fillers in which the particles which have a high surface ratio, a higher thermal conductivity can be achieved with the same filling proportion, or a predetermined thermal conductivity can be achieved with a smaller filling proportion than if particles of approximately spherical geometry are used.

Preferably, the filling fraction is 60 to 90% by volume. At higher fill levels, the flowability of the preferred electrically insulating materials, such as molding compound or casting resin decreases, so that the processing is difficult.

The type of cooling described is very effective, in particular, if at least one power component is present in the so-called slug-up design. Such a device has on its side facing away from the circuit board, a metal element, which dissipates the heat from the interior of the device to the surface thereof, where it is absorbed by the electrically conductive shielding. For this purpose, the electrically conductive shielding element preferably consists of a material which, in addition to its electrical conductivity, also has a high heat capacity and a high thermal conductivity. Suitable materials include copper or aluminum.

The circuit arrangement is preferably arranged in a housing. This may be, for example, a plug-in housing made of metal or plastic, in which the assembled and according to the invention a shielding comprehensive circuit board is inserted. Alternatively, a multi-part housing is conceivable in which the circuit board is mounted in a bottom part and the bottom part is closed with a cover part.

Particularly preferably, a housing is formed by the circuit arrangement according to the invention in a final manufacturing step partially or completely with an electric insulating material is poured around. The electrically insulating material may in particular be a molding material or a potting compound. It may, for example, be the same material with which, according to the invention, a region around an electronic component which is delimited by the printed circuit board and a shielding element is filled. Alternatively, another material may be used to form such a housing.

In particular, when the inventively provided electrically conductive shielding having openings for introducing an electrically insulating material, the inventively required process step of filling the area around the electronic component and the process step of forming a housing by encapsulating the circuit arrangement can be standardized. In a single process step, the circuit arrangement is encapsulated with an electrically insulating material, wherein the electrically insulating material penetrates through the openings in the shielding in the shielded area.

The advantage of such a housing is that the composite of housing and circuit arrangement has a small and compact size. In addition, the heat dissipation from the circuit as a whole is further improved by the encapsulation of the circuit arrangement with a potting material, since the heat of optionally electrical components that are not surrounded by a shielding element can deliver heat directly to the potting compound. Another advantage of such a housing is that all circuit elements are mechanically stabilized by the potting compound and protected from environmental influences such as dirt or moisture.

Further advantages of the invention will become apparent from the dependent claims and the description.

drawings

1 shows a section through a circuit arrangement according to a first embodiment of the invention.

2 shows a section through a circuit arrangement according to a second embodiment of the invention.

3 shows a section through a circuit arrangement according to a third embodiment of the invention.

4 shows a section through a circuit arrangement according to a fourth embodiment of the invention.

In 1 is a circuit arrangement 10 , For example, a control unit shown. It includes a housing 100 , which consists for example of metal or plastic. The housing 100 is completed by at least one lid or plug, not shown in itself. In the case 100 is a circuit board 110 arranged. The circuit board 110 is by a fastening device, not shown, in the housing 100 fixed. The circuit board 110 is equipped on both sides with electrical and / or electronic components. These may be, for example, passive components, such as the capacitor 130 or resistors 140 . 142 , or to active components, such as the power components 160 act. The components are through lateral connections 135 or by solder balls 136 contacted with the running on the circuit board, not visible in the drawing traces, or be, as the example of the capacitor 130 , connected via vias, not shown, with the circuit board.

On top of the circuit board are a capacitor 130 , Resistors 140 , as well as logic components 120 arranged. The logic components 120 have only a low power and therefore only a small heat development.

On the bottom of the circuit board 110 are also various electrical and / or electronic components 142 . 121 arranged. Also on the bottom of the circuit board 110 is a so-called module 190 , also called multi-chip modules (MCM) arranged. Under such a module is generally understood a small, equipped with components circuit board, which may for example be arranged on a larger circuit board and contacted by solder balls with this. In the present example, the module exists 190 from a printed circuit board 112 which is smaller and thinner than the printed circuit board 110 , and on the two components 192 and 194 are arranged. The components 192 and 194 are built in wafer-level package design. The module 190 is about solder balls 154 with the circuit board 110 contacted.

In the device 160 , It is a power device with high performance and correspondingly high heat generation. The power component 160 is constructed in this example in so-called slug-up design. It has a metal plate 161 , a so-called heat-slug, at his the circuit board 110 on the opposite side. This heat-slug serves to dissipate heat from inside the power device 160 on its surface.

On top of the circuit board 110 is an electrically conductive metal frame 180 arranged, which is the component 160 surrounds. On the metal frame 180 is an electrically conductive sheet metal part 170 attached and forms a lid. The sheet metal part 170 is by means of a clip connection 188 attached. This is indicated by the metal frame 180 or the electrically conductive sheet metal part 170 a circumferential groove in which a mounted on the respective other part extension engages in the manner of a tongue and groove connection and so the electrically conductive sheet metal part 170 on the metal frame 180 is fixed.

The metal frame 180 , the electrically conductive sheet metal part 170 and the circuit board 110 together form a Faraday cage for the components 160 . 162 and 142 , resulting in an effective shielding of electrical and / or magnetic interference fields for the device 160 results. The electrically conductive sheet metal part 170 thus serves as a shielding element. This effect can be due to a copper layer 115 in the circuit board 110 under the metal frame 180 be supplemented. The attachment of the sheet metal part 170 on the metal frame 180 takes place touching a clip connection 188 and is thus electrically conductive. As an alternative to a clip connection, the connection between the metal frame 180 and the electrically conductive sheet metal part 170 for example, be produced by welding or soldering.

For optimal cooling of the component 160 to achieve is the area 150 around the device 160 passing through the metal frame 180 , the sheet metal part 170 and the circuit board 110 is limited, with a cured molding material 155 filled. From the component 160 generated heat is therefore first on the heat slug 161 delivered to the surrounding molding compound. Since the heat is distributed over a larger space, a heat spreading takes place. Due to the fact that the surface of the area that radiates heat now compared to the surface of the electronic component 160 When viewed alone, it increases significantly in the interior of the case 100 dissipated heat output. Furthermore, by this measure, the distance l between the component 160 and the housing wall is bridged to a part of the molding compound, whereby the heat conduction improves.

Thermosetting molding compounds 155 , as they can be used according to the invention, are known for example from transfer molding processes. They are filled hot in the liquid state and then harden. The thermal conductivity of conventionally used molding compositions is about 0.35 to 0.7 W / (m · K). This is considerably more than the thermal conductivity of air (about 0.026W / (m · K)). Heat is thus much faster from the component 160 transported to the housing wall. Alternatively it can be used as an electrically insulating material, a potting compound, such as a casting resin. Such casting resins have a thermal conductivity of about 0.65W / (m · K). Cast resins cure slower than molding compound. Alternatively, thermoplastic materials can be used.

To improve the thermal conductivity of the molding compound 155 Contain filling materials made of an electrically insulating material with high thermal conductivity. Suitable examples are boron nitride, aluminum nitride, diamond, silicon carbide, beryllium oxide, which are added to the molding compound in powder form.

In the manufacture of the circuit arrangement 10 First, the circuit board 110 with the electronic components 120 . 121 . 130 . 140 . 141 . 142 . 160 . 190 stocked. In addition, the metal frame 180 on the circuit board 110 attached, for example, soldered. Then the area 150 passing through the metal frame 180 and the circuit board 110 around the device 160 limited, with a liquid molding compound 155 filled in the manner of a "Dam and Fill Dispensing" process, wherein the application of a barrier ("Dam") is not necessary because the metal frame 180 serves as a barrier. After curing the molding compound 155 becomes the electrically conductive shielding element 170 on the frame 180 attached and by means of a clip connection 188 attached. As an alternative to a clip connection, the connection between the metal frame 180 and the electrically conductive sheet metal part 170 for example, be produced by welding or soldering. In this process sequence, care must be taken that not too much molding compound in the area 150 is filled, otherwise the sheet metal part 172 can not be fixed anymore.

In 2 a second embodiment of the invention is shown. The structure of the illustrated circuit arrangement 11 essentially corresponds to the execution 1 , Identical components are provided with the same reference numerals. The circuit arrangement has an electronic component 160 on, which is designed as a power device with high heat development. In the environment of the device 160 are two electronic components 162 and 164 arranged. The components 160 . 162 and 164 form a group of components. This group must be shielded from electrical and / or magnetic interference fields in this example. The components 162 and 164 can also be designed as power components with high heat development.

On top of the circuit board 110 is a metal frame 182 arranged, which is the component group consisting of components 160 . 162 and 164 surrounds. On the metal frame 180 is an electrically conductive sheet metal part 172 by means of a clip connection 188 attached. In this case, the metal frame or the electrically conductive sheet metal part 172 a circumferential groove into which an attached to the other part extension engages in the manner of a tongue and groove connection and so the electrically conductive sheet metal part 172 on the metal frame 182 is fixed. The metal frame 182 , the electrically conductive sheet metal part 172 and the circuit board 110 together form a Faraday cage for the components 160 . 162 and 164 , resulting in an effective shielding of electrical and / or magnetic interference fields for these components 160 . 162 and 142 results. The electrically conductive sheet metal part 172 thus serves as a shielding element. As an alternative to a clip connection, the connection between the metal frame 182 and the electrically conductive sheet metal part 172 for example, be produced by welding or soldering.

To ensure optimal cooling of the group of components 160 . 162 and 164 to achieve is the area 150 around the components 160 . 162 and 164 passing through the metal frame 182 , the sheet metal part 172 and the circuit board 110 is limited, with a molding compound 155 filled. From the components 160 . 162 and 164 generated heat is transferred to the surrounding molding compound 155 issued. Through this structure, analogous to in connection with 1 discussed mechanism in the interior of the housing 100 Dissipated heat output increases and the cooling of the group of components 160 . 162 and 164 optimized.

The sheet metal part 172 has a plurality of openings 174 on, like in 2a is shown in plan view. Through the openings, the shielding effect of the sheet metal part 172 not impaired. They cause the molding compound 155 after assembly of the circuit board 110 , electronic components 160 . 162 . 164 , Metal frame 182 and sheet metal part 172 in a downstream process step in the liquid state through the openings 174 in the area 150 can be introduced and then cured. Thus, height tolerances of the level of the molding compound are not critical. In essence, it is sufficient if an opening 174 in the sheet metal part 172 is available. Several openings 174 However, are advantageous to complete the fullest possible area 150 to achieve. Alternatively, the shielding element forming the cover over the metal frame may be formed as a lattice structure.

The metal frame 182 is formed in this example as a rectangular frame. Alternatively, however, the frame may be formed in any other form, such as the arrangement of the electronic components 160 . 162 . 164 is adjusted. In 2 B is an example of an alternative embodiment of the metal frame in plan view 182 ' represented whose contour framed an approximately L-shaped surface. A shielding element (not shown) designed as a sheet metal part is placed on the metal frame 182 ' put on, leaving the metal frame 182 ' , the sheet metal part and the circuit board together a Faraday cage for the components 160 ' . 162 ' and 164 ' form. The sheet metal part has to one of the contour of the metal frame 182 ' appropriate form.

3 shows a third embodiment of the invention. The structure of the illustrated circuit arrangement 11 essentially corresponds to the execution 2 , Identical components are provided with the same reference numerals. The circuit arrangement has an electronic component 160 on, which is designed as a power device with high heat development. In the environment of the device 160 are two electronic components 162 and 164 arranged, which are also designed as power devices with high thermal output. In this example, there is an electromagnetic shield of the device 160 to the components 162 and 164 , as well as an electromagnetic shielding of the components 160 . 162 and 164 to the remaining electronic components 120 . 121 . 140 . 141 he wishes. This is a first metal frame 182 on the circuit board 110 arranged, the electronic components 160 . 162 and 164 surrounds. A second metal frame 184 is inside the first metal frame 182 arranged and surrounds only the component 160 , A cover in the form of an electrically conductive sheet metal part 172 covers both metal frames 182 and 184 and is on the metal frame 182 through a clip connection 188 fixed electrically conductive. The sheet metal part 172 touches the metal frame with its underside 184 or is connected to this example, by soldering, welding or by means of an electrically conductive adhesive, so that an electrically conductive connection between the sheet metal part 172 and the metal frame 184 consists.

Through the metal frame 182 and 184 are accordingly, as in 3a shown in plan view, two areas 152 and 154 educated. The area 154 is through the metal frame 184 , the circuit board 110 and the sheet metal part 172 (in 3a not shown) limits and surrounds the device 160 , The area 152 is through the metal frame 184 the metal frame 182 , the circuit board 110 and the sheet metal part 172 (in 3a not shown) limits and surrounds the components 162 and 164 , This results in a shield of the device 160 from the components 162 and 164 as well as shielding the group from the components 160 . 162 and 164 from the surroundings. According to the invention, to improve the cooling of the electronic components 160 . 162 and 164 the areas 152 and 154 with an electrically insulating mass 156 . 158 filled, for example, through openings 174 . 176 in the sheet metal part 172 can be introduced. There is at least one opening 174 arranged such that the area 154 can be filled and at least one opening 176 arranged such that the area 152 can be filled. The areas 152 and 154 can with the same insulating mass 156 . 158 be filled. Alternatively, it is also possible to provide different masses or masses with different filling materials in order to optimally match the thermal conductivity with the heat output of the components 160 . 162 and 164 adapt.

Alternatively, as in 3b shown in plan view, the metal frame 182 '' crossbars 183 have, so that a plurality of chambers are formed. Each an electronic component 160 '' . 162 '' and 164 '' is arranged in a chamber. An unillustrated, designed as a sheet metal shielding member is on the metal frame 182 '' attached by a clip connection electrically conductive. The sheet metal part touches with its underside cross braces 183 or is connected to them, for example, by soldering, welding or by means of an electrically conductive adhesive, so that each of the chambers has a separate shielded area 152 '' . 153 '' . 154 '' formed. This is the components 160 '' . 162 '' and 164 '' each shielded from each other and their environment electromagnetically. According to the invention, to improve the cooling of the electronic components 160 . 162 and 164 the areas 152 '' . 153 '' . 154 '' filled with an electrically insulating mass.

In the examples described is the assembled printed circuit board 110 each in a separate housing 100 arranged. Alternatively, it is possible to form a housing by the assembled printed circuit board 110 in a final process step completely ummoldet or potted with a casting resin. In 4 is a circuit arrangement according to the invention 11 with such a trained housing 102 shown. The circuit arrangement 11 is essentially the same as in 2 illustrated circuit arrangement. Identical parts are provided with the same reference numerals. In contrast to 2 is the circuit arrangement 11 with a potting material 104 , for example, surrounded by a cast resin, whereby the housing 102 is formed. In this example, the potting material 104 different from the mold mass 155 in the area 150 , Alternatively, it is also conceivable to use the same material both in the field 150 as well as housing 102 provided.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 4317469 A1 [0003]
• DE 102009054517 [0005]

Claims (17)

Electronic circuit arrangement ( 10 . 11 ), comprising: - at least one printed circuit board ( 110 . 112 ), - at least one electronic component ( 160 . 162 . 164 ) on the printed circuit board ( 110 . 112 ) means for shielding electrical and / or magnetic fields, wherein the means for shielding electrical and / or magnetic fields comprises at least one electrically conductive shielding element ( 170 . 172 . 180 . 182 . 184 ), which is arranged such that at least the electrically conductive shielding element ( 170 . 172 ) and the printed circuit board ( 110 ) a Faraday cage for at least one associated electronic component ( 160 . 162 . 164 ), characterized in that an area ( 150 . 152 . 154 ) around the electronic component ( 160 . 162 . 164 ), which at least by the electrically conductive shielding ( 170 . 172 . 180 . 182 . 184 ) and the printed circuit board ( 110 ) is limited, at least partially with an electrically insulating material ( 155 . 156 . 158 ), wherein the electrically insulating material ( 155 . 156 . 158 ) has a thermal conductivity that is greater than the thermal conductivity of air. Electronic circuit arrangement ( 10 . 11 ) according to claim 1, characterized in that the electrically conductive shielding element as a sheet metal part ( 170 . 172 ), in particular as a deep-drawn part, is formed. Electronic circuit arrangement ( 10 . 11 ) according to claim 1 or 2, characterized in that the means for shielding electrical and / or magnetic fields at least one metal frame ( 180 . 182 . 184 ) mounted on the printed circuit board ( 110 . 112 ), and at least one electronic component ( 160 . 162 . 164 ) framed. Electronic circuit arrangement ( 10 . 11 ) according to claim 3, characterized in that the electrically conductive shielding element ( 170 . 172 ) on the metal frame ( 180 . 182 . 184 ) is electrically conductively attached. Electronic circuit arrangement ( 10 . 11 ) according to one of claims 3 or 4, characterized in that the printed circuit board ( 110 ) below the metal frame ( 180 . 182 . 184 ) has a copper layer. Electronic circuit arrangement ( 10 . 11 ) according to one of claims 1 to 5, characterized in that at least one electrically conductive shielding element ( 170 . 172 ) by means of a clip connection ( 188 ), or is soldered or welded. Electronic circuit arrangement ( 10 . 11 ) according to one of claims 1 to 6, characterized in that the electrically conductive shielding element ( 172 ) at least one opening ( 174 ) for introducing the electrically insulating material ( 155 . 156 . 158 ) having. Electronic circuit arrangement ( 10 . 11 ) according to one of claims 1 to 7, characterized in that the electrically insulating material ( 155 . 156 . 157 ) is a thermosetting material, in particular a molding compound or potting compound, is. Electronic circuit arrangement ( 10 . 11 ) according to claim 8, characterized in that the electrically insulating material is a casting resin ( 155 . 156 . 157 ). Electronic circuit arrangement ( 10 . 11 ) according to one of claims 1 to 9, characterized in that the electrically insulating material ( 155 . 156 . 158 ) contains at least one electrically non-conductive filler whose thermal conductivity is greater than the thermal conductivity of the electrically insulating material ( 155 . 156 . 158 ). Electronic circuit arrangement ( 10 . 11 ) according to claim 10, characterized in that the filling material comprises at least one of the materials boron nitride, aluminum nitride, diamond, silicon carbide, beryllium oxide. Electronic circuit arrangement ( 10 . 11 ) according to claim 10 or 11, characterized in that the proportion of the filling material constitutes 60 to 90% by volume. Electronic circuit arrangement ( 10 . 11 ) according to one of claims 1 to 12, characterized in that the circuit arrangement in a housing ( 100 . 102 ) is arranged. Electronic circuit arrangement ( 10 . 11 ) according to claim 13, characterized in that the housing ( 102 ) by potting the circuit arrangement ( 10 . 11 ) with a plastic material ( 104 ), in particular a molding compound or a casting resin is formed. Method for producing a circuit arrangement ( 10 . 11 ) according to one of claims 1 to 14, comprising the steps: a. Equipping the printed circuit board ( 110 . 112 ) with at least one electronic component ( 160 b. Equipping the printed circuit board ( 110 . 112 ) with at least one electrically conductive shielding element ( 170 . 172 ) c. at least partially filling an area ( 150 . 152 . 154 ) around the electronic component ( 160 . 162 . 164 ), which at least by the shielding ( 170 . 172 ) and the printed circuit board ( 110 ) is limited with an electrically insulating material ( 155 . 156 . 158 . 104 ). The method of claim 15, comprising the step d. At least partially encapsulating the circuit board ( 110 . 112 ) with an electrically insulating material ( 104 ), in particular a molding compound or a casting resin, for producing a housing ( 102 ). Method according to claim 15, characterized in that the shielding element ( 170 . 172 ) Openings ( 174 ), wherein in step c. the circuit board with an electrically insulating material ( 104 ), in particular a molding compound or a casting resin, for producing a housing ( 102 ) and the electrically insulating material ( 104 ) through the openings ( 174 ) in the area ( 150 . 152 . 154 ) is introduced.

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