DE102017219310A1 - Plasma edge encapsulation of adhesive tapes - Google Patents

Abstract

The invention relates to a method for reducing the permeation in a bonding of an organic-electronic element on a surface of a substrate (21), comprising at least the following three method steps, which take place in any order in chronological order or of which occur in any combination at least two at the same time An adhesive tape having an adhesive layer (22) is adhered to the surface of the substrate (21) with a first adhesive side, and the adhesive tape (22) is adhered to the opposite second adhesive side and / or around the organic electronic element Outside along at least one side edge (20) of the adhesive layer (22), a hydrophobic passivation layer (31) is applied by means of a plasma stream.

Description

The invention relates to a method for reducing the moisture Hinterwanderung in a bonding of an organic-electronic element on a surface of a substrate. The invention also relates to a structure with an organic-electronic element and an adhesive tape and a surface of a substrate.

In the US 2016/0028041 A1 an organic electronic element with a sealing layer is disclosed. The sealing layer completely surrounds the organic electronic element, such as OLEDs, deposited on a substrate surface. For sealing the organic electronic element, a liquid coating containing a silicon component is applied to the outer surface; Thereafter, plasma ions are implanted in the coating. The resulting sealing layer has excellent gas barrier properties. In addition, it is transparent to visible light. The plasma causes these liquid-applied silicon compounds to react and form a solid film. A disadvantage of the method, however, is that first a liquid layer must be applied, which is then subsequently treated in a second process step with a plasma. The layer thickness can not be controlled exactly disadvantageously, and the process is relatively complex.

It is an object of the present invention to simplify an aforementioned method for reducing the moisture Hinterwanderung in a bond.

It is in a second aspect the object of the present invention to provide an initially mentioned adhesive tape which is easy to produce and prevents or at least reduces any moisture migration back into an adhesive bond.

The object is achieved with regard to the method by a method for reducing the moisture Hinterwanderung in a bond with the features of claim 1.

Adhesive tapes are available in various embodiments. The adhesive tape is usually provided as a section of a long adhesive tape; the adhesive tape can be provided, for example, as a sheet or as a section of a roll or, conveniently, as a stamped product or as an endless product on rolls (Archimedean spiral). The adhesive tape may simply be continuous, or holes or openings may also be provided in the adhesive tape. The adhesive tape can therefore either completely cover the area bounded by its outer circumference or, if it has openings, also cover or release only parts thereof. The adhesive tape is significantly larger in two dimensions than in a third dimension. The significantly larger dimensions are the length expansion and width expansion, and the third and significantly smaller dimension is the thickness or height of the adhesive tape. However, the two first dimensions can also be formed of the same size and thus have a circular, square or other type of surface. An adhesive tape can be formed in one or more layers, it has usual thicknesses of about 1 .mu.m up to 5 mm.

In a single-layered construction, the adhesive tape preferably consists of an adhesive layer; In a multi-layered construction, the adhesive tape may also comprise a carrier material disposed in a carrier layer. The carrier material may be provided on one side and on another side with an adhesive layer or even on one side with an adhesive layer. The carrier material comprises all planar structures, for example films or film sections which are expanded in two dimensions, strips of extended length and limited width, strip sections, diecuts (for example in the form of borders or boundaries of an (opto) electronic arrangement), multilayer arrangements or the like. Different carriers such as films, fabrics, nonwovens and papers with different plastics can be combined for different applications.

The material used for the carrier layer of the adhesive tape is preferably polymer films, film composites or films or film composites provided with organic and / or inorganic layers. Such films / film composites may consist of all common plastics used for film production, by way of example but not by way of limitation:

Polyethylene, polypropylene, in particular oriented polypropylene (OPP) produced by mono- or biaxial stretching, cyclic olefin copolymers (COC), polyvinyl chloride (PVC), polyesters, in particular polyethylene terephthalate (PET) and polyethylene naphthalate (PEN), ethylene vinyl alcohol (EVOH), Polyvinylidene chloride (PVDC), polyvinylidene fluoride (PVDF), polyacrylonitrile (PAN), polycarbonate (PC), polyamide (PA), polyethersulfone (PES) or polyimide (PI).

The backing layer may also be combined with organic or inorganic coatings or layers. This can be done by conventional methods such as painting, printing, evaporation, sputtering, co-extrusion or lamination. By way of example, but not by way of limitation, oxides or nitrides of silicon and of aluminum, indium-tin oxide (ITO) or sol-gel coatings may be mentioned here.

According to the invention, the adhesive layer may likewise be all common adhesive layers.

The term "gluing" generally describes a manufacturing process for materially joining substrates. When gluing the adhesive adheres to the substrates by physical interaction - occasionally by chemical interaction - the so-called adhesion, and connects them mostly permanently. Since bonding on the one hand allows a large-area and non-positive connection of the parts to be joined and on the other hand, due to its material-friendly properties is suitable to connect almost all materials together, bonding methods are widely used both for home use and for industrial application. More and more often other joining methods, such as welding or soldering, but also screwing, be replaced by adhesive bonding.

Preferably, a pressure-sensitive adhesive layer is used as the adhesive layer. Adhesive adhesives are adhesives which, even under relatively slight pressure, permit a permanent bond with the primer; they have an adhesive force greater than 1 N / cm and, after use, can be removed again from the primer without leaving any residue. Pressure-sensitive adhesives are permanently tacky at room temperature and therefore have a sufficiently low viscosity and high tack, so that they wet the surface of the respective adhesive base even at low pressure. The adhesiveness of corresponding adhesives is based on their adhesive properties and the removability on their cohesive properties.

As a basis for PSAs, various materials, in particular nonpolar elastomers come into question.

Non-polar elastomers such as vinyl aromatic block copolymers are characterized in that they can be dissolved in nonpolar solvents, that is, in solvents and / or solvent mixtures whose polarity corresponds to ethyl acetate or which are more nonpolar. These are in particular solvents and / or solvent mixtures with a dielectric constant of less than 6.1 [http://en.wikipedia.org/wiki/Solvent of 11 October 2017] and / or with Hansen parameters δP Polar ≤ 5.3; δH Hydrogen bonding ≤ 7.2 [ Abbott, Steven and Hansen, Charles M. (2008) Hansen Solubility Parameters in Practice, ISBN 0-9551220-2-3 or Hansen, Charles M. (2007) Hansen solubility parameters: a user's handbook CRC Press, ISBN 0-8493-7248-8 ].

Coming as elastomeric block copolymers are used, then these contain at least one type of block with a softening temperature greater than 40 ° C such as vinyl aromatics (also partially or fully hydrogenated variants), methyl methacrylate, cyclohexyl methacrylate, isobornyl methacrylate and isobornyl.

More preferably, the block copolymer contains a block cake having a softening temperature of less than -20 ° C.

Examples of polymer blocks with low softening temperatures ("soft blocks") are polyethers such as polyethylene glycol, polypropylene glycol or polytetrahydrofuran, polydienes such as polybutadiene or polyisoprene, (partially) hydrogenated polydienes such as polyethylene butylene, polyethylene propylene or polybutylene butadiene, polybutylene, polyisobutylene, polyalkyl vinyl ethers, Polymer blocks α, β-unsaturated esters such as in particular acrylate copolymers.

The soft block is constructed in a non-polar configuration and then preferably contains butylene or isobutylene or hydrogenated polydienes as Homopolymerblock or copolymer block, the latter preferably copolymerized with itself or with each other or with other particularly preferred nonpolar comonomers. As non-polar comonomers, for example (partially) hydrogenated polybutadiene, (partially) hydrogenated polyisoprene and / or polyolefins are suitable.

In order to achieve the best possible sealing, special barrier adhesives (also known as water vapor barrier adhesives) are used. A good adhesive for the sealing of (opto) electronic components has a low permeability to oxygen and in particular to water vapor, has sufficient adhesion to the assembly and can flow well on this.

To characterize the barrier effect, the oxygen transmission rate OTR (Oxygen Transmission Rate) and the water vapor transmission rate WVTR (Water Vapor Transmission Rate) are usually specified. The respective rate indicates the area- and time-related flow of oxygen or water vapor through a film under specific conditions of temperature and partial pressure and optionally other measurement conditions such as relative humidity. The lower these values are, the better the respective material is suitable for encapsulation. The specification of the permeation is based not only on the values for WVTR or OTR, but always includes an indication of the mean path length of the permeation such as the thickness of the material or a normalization to a certain path length.

The permeability P is a measure of the permeability of a body to gases and / or liquids. A low P value indicates a good barrier effect. The permeability P is a specific value for a defined material and a defined permeate under steady state conditions at a given permeation path length, partial pressure and temperature. The permeability P is the product of diffusion term D and solubility term S: P = D * S.

The solubility term S predominantly describes the affinity of the barrier adhesive to the permeator. For example, in the case of water vapor, a small value for S of hydrophobic materials is achieved. The diffusion term D is a measure of the mobility of the permeate in the barrier material and is directly dependent on properties such as molecular mobility or free volume. Often relatively low values are achieved for strongly cross-linked or highly crystalline D materials. However, highly crystalline materials tend to be less transparent, and greater crosslinking results in less flexibility. The permeability P usually increases with an increase in molecular mobility, such as when the temperature is increased or the glass transition point is exceeded.

Approaches to increase the barrier effect of an adhesive must consider the two parameters D and S in particular with regard to the influence on the permeability of water vapor and oxygen. In addition to these chemical properties, effects of physical influences on the permeability must also be considered, in particular the mean permeation path length and interfacial properties (flow behavior of the adhesive, adhesion). The ideal barrier adhesive has low D values and S values with very good adhesion to the substrate.

A low solubility term S alone is usually insufficient to achieve good barrier properties. A classic example of this is in particular siloxane elastomers. The materials are extremely hydrophobic (small solubility term), but have a comparatively low barrier to water vapor and oxygen due to their freely rotatable Si-O bond (large diffusion term). For a good barrier effect, therefore, a good balance between solubility term S and diffusion term D is necessary.

• • WO 2013/057265 A1 (Copolymere aus Isobutylen oder Butylen)
• • US 8,557,084 B2 (vernetzte Vinylaromaten-blockcopolymere)
• • EP 2 200 105 A1 (Polyolefine)
• • US 8,460,969 B2 (Butylen-Block-copolymer)
• • WO 2007/087281 A1 (hydrierte Cycloolefin Polymere mit PIB)
• • WO 2009/148722 A1 (PIB mit Acrylatreaktivharz)
• • EP 2 502 962 A1 (PiB-Epoxy)
• • JP 2015 197 969 A1 (PIB).

Disclosed are barrier adhesives based on styrene block copolymers and as hydrogenated as possible (see DE 10 2008 047 964 A1 ).
Permeation values (WVTR) of widely used adhesive systems are also reported here (measured at 37.5 ° C. and 90% relative humidity). Typical acrylate-based pressure-sensitive adhesives are in the range between 100 g / m ² d and 1000 g / m ² d. Silicone PSAs, due to the high mobility of the chains, have even higher permeation values for water of more than 1000 g / m ² d. When styrene block copolymers are used as the elastomer component, for WVTR values in the range of 50 to 100 g / m ² d and for hydrogenated systems (for example SEBS) values below 50 g / m ² d are achieved for non or incompletely hydrogenated systems. Particularly low WVTR values of less than 15 g / m ² d are achieved with pure poly (isobutylene) elastomeric or block copolymers of styrene and isobutylene. Other barrier adhesives are found, for example, in the following publications:

• • WO 2013/057265 A1 (Copolymers of isobutylene or butylene)
• • US 8,557,084 B2 (crosslinked vinylaromatic block copolymers)
• • EP 2 200 105 A1 (Polyolefins)
• • US Pat. No. 8,460,969 B2 (Butylene block copolymer)
• • WO 2007/087281 A1 (hydrogenated cycloolefin polymers with PIB)
• • WO 2009/148722 A1 (PIB with acrylate reactive resin)
• • EP 2 502 962 A1 (PIB-epoxy)
• • JP 2015 197 969 A1 (PIB).

The pressure-sensitive adhesive preferably comprises a base and a crosslinkable component, also referred to as a reactive resin.

The crosslinkable component, also referred to as a reactive resin, preferably consists of a cyclic ether and is suitable for radiation-chemical and optionally thermal crosslinking with a softening temperature of less than 40 ° C., preferably less than 20 ° C.

The reactive resins based on cyclic ethers are, in particular, epoxides, ie compounds which carry at least one oxirane group, or oxetanes. They may be aromatic or in particular aliphatic or cycloaliphatic nature.

Useful reactive resins can be monofunctional, difunctional, trifunctional, tetrafunctional or higher functional to polyfunctional, with functionality relating to the cyclic ether group.

Examples, without intending to be limiting, are 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate (EEC) and derivatives, dicyclopendadiene dioxide and derivatives, 3-ethyl-3-oxetanemethanol and derivatives, tetrahydrophthalic acid diglycidyl ester and derivatives, hexahydrophthalic acid diglycidyl ester and derivatives, 1,2-Ethanediglycidyl ethers and derivatives, 1,3-propanediglycidyl ethers and derivatives, 1,4-butanediol diglycidyl ethers and derivatives, higher 1,1-n-alkanediglycidyl ethers and derivatives, bis - [(3,4-epoxycyclohexyl) methyl] adipate and derivatives, Vinylcyclohexyl dioxide and derivatives, 1,4-cyclohexanedimethanol bis (3,4-epoxycyclohexanecarboxylate) and derivatives, 4,5-epoxytetrahydrophthalic acid diglycidyl ester and derivatives, bis [1-ethyl (3-oxetanyl) methyl) ether and derivatives, pentaerythritol tetraglycidyl ether and Derivatives, Bisphenol A Digylcidyl Ether (DGEBA), Hydrogenated Bisphenol A Diglycidyl Ether, Bisphenol F Diglycidyl Ether, Hydrogenated Bisphenol F Diglycidyl Ether, Epoxyphenol Novolacs, Hydrogenated Epoxyphenol Novola ks, epoxycresol novolaks, hydrogenated epoxycresol novolaks, 2- (7-oxabicyclo) spiro [1,3-dioxanes-5,3 '- [7] oxabicyclo [4.1.0] heptanes], 1,4-bis ( (2,3-epoxypropoxy) methyl) cyclohexanes.

Reactive resins can be used in their monomeric or dimeric, trimeric, etc., up to their oligomeric form.

Mixtures of reactive resins with one another but also with other coreactive compounds such as alcohols (monofunctional or polyfunctional) or vinyl ethers (monofunctional or multifunctional) are also possible.

The method according to the invention serves to reduce the moisture back migration in a bonding of an organic-electronic element, which is glued to a substrate surface by means of the bond.

The concept of the organic-electronic element is very general. In principle, an organic element preferably comprises a first and a second electrode, which are opposite one another and between which an organic functional layer is arranged. With regard to the structure of an organic-electronic element is, for example, on the US 2016/0028041 A1 directed. The organo-electronic elements are usually encapsulated, that is, they are provided on their upper outer surface and on their side surfaces by a passivation layer.

(Opto) electronic devices are increasingly used in commercial products. Such arrangements include inorganic or organic electronic structures, such as organic, organometallic or polymeric semiconductors or combinations thereof. These arrangements and products are rigid or flexible depending on the desired application, whereby there is an increasing demand for flexible arrangements. The production of such arrangements is effected for example by printing processes such as high-pressure, intaglio, screen printing, planographic printing or as well as so-called "non-impact printing" such as thermal transfer inkjet printing or digital printing. In many cases, however, vacuum processes such as chemical vapor deposition (CVD), physical vapor deposition (PVD), plasma-assisted chemical or physical deposition (PECVD), sputtering, (plasma) etching or vapor deposition used, the structuring is usually done by masks.
Electrophoretic or electrochromic structures or displays, organic or polymeric light-emitting diodes (OLEDs or PLEDs) in display and display devices or as illumination, electroluminescent lamps, light-emitting electrochemical devices may be mentioned as examples of (commercial) electronic applications which are already interesting in their market potential Cells (LEECs), organic solar cells, preferably dye or polymer solar cells, organometallic solar cells, for example based on organometallic frameworks (MOFs) with crystalline porphyrin coatings, inorganic solar cells, preferably thin-film solar cells, in particular based on silicon, germanium, copper, indium and selenium, Perovskite solar cells, organic field effect transistors, organic switching elements, organic optical amplifiers, organic laser diodes, organic or inorganic sensors or organic or inorganic-based RFID transponder listed.

The organic-electronic element is glued to a substrate surface according to the invention. For this purpose, between the substrate surface and organic-electronic element, an adhesive tape with at least one adhesive layer is provided, which produces a bond. In order to prevent or at least reduce moisture migration back into the bond, the side edge of the adhesive layer is encapsulated by means of a hydrophobic passivation layer according to the invention in an atmospheric pressure plasma process. The hydrophobic passivation layer is applied by means of the plasma stream.

Plasma is called the 4th state of matter. It is a partial or fully ionized gas. By supplying energy, positive and negative ions, electrons, other excited states, radicals, electromagnetic radiation and chemical reaction products are generated. Many of these species can cause changes in the surface to be treated. In sum, this treatment results in activation or coating of the adherend surface. The gas used can be enriched with other gaseous or liquid reactants, in particular to achieve a coating.

The widespread corona treatment, also known as corona discharge or dielectric barrier discharge, constitutes a filamentary plasma and takes place predominantly as a high-voltage discharge with direct contact with the adherend surface to be treated. The discharge converts gas from the ambient air and / or supplied process gas into a reactive form. Due to the impact of the incident electrons, molecular cleavages occur at the adherend surface. The resulting free valences allow an addition of the reaction products of the corona discharge or downstream, supplied gaseous or liquid reactants. These deposits allow for improved adherence properties of the adherend surface, but can also cause damage to the surface due to the immediate action of the discharge.

In addition to chemical species, different radiation components (eg VUV, UV, visible, IR, ...) can also be generated.
The plasma generation can be carried out according to the invention in principle with all common plasma sources. Preferred in accordance with the invention are methods such as dielectric barrier discharge (DBE), corona discharge or the generation of expelled plasmas. The excitation by microwaves can be used in many cases.
The expelled plasma should be understood as meaning all systems in which the plasma is expelled by a gas flow from the electrode geometry in which it is produced. Such methods are known, inter alia, under the name PlasmaJet®, Plasma-Pen®, plasma blaster, corona gun (as expelled corona), to name only a few, not limiting.
In principle, low pressure plasmas, atmospheric pressure plasmas (normal pressure plasmas) and high pressure plasmas can be used. Advantageously, at a pressure in the range between 500 and 1200 hPa, particularly preferably in atmospheric pressure, worked At atmospheric pressure plasma, the pressure substantially corresponds to that of the surrounding atmosphere, without it being increased or decreased apparativ, so usually depending on weather conditions in the range 1013 ± 60 hPa (sea level, normal pressure = 1013.25 hPa).
In the case of low-pressure plasmas, care should be taken to ensure that the frequently liquid monomers do not boil. Typical low-pressure technical plasmas operate in the pressure range of less (to a few hundred) pascals, that is to say at pressures which are lower by a factor of 100 to 10,000 than the normal air pressure.
Depending on the source and conditions of the plasma generation, a distance of a few tenths of a millimeter to a few centimeters between the adhesive composition to be treated with plasma, More specifically, their surface area - and the plasma source selected or the adhesive composition passes through the electrode assembly of the plasma source.
As process gases for the plasma treatment, the common process gases can be used. Particularly advantageous, oxygen-containing process gases can be used, such as (pure) oxygen, air, water vapor or mixtures of two or more of the aforementioned gases and / or with other gases, such as nitrogen, noble gases (such as argon) and the like. Particularly advantageous, moist gases (ie gas mixtures containing water vapor) are used.
The plasma treatment should preferably be performed in such a way that the process gas does not heat above 150 ° C., preferably not above 60 ° C., in order to protect the adhesive system and / or the substrates to be bonded. This can be achieved in particular in that the generation of the plasma is carried out such that the electrodes do not heat beyond these temperatures.
The duration of the plasma treatment for the efficient initiation of the polyreaction is usually a few seconds, for example up to 60 seconds. A treatment time of the surface with plasma for a duration of up to 15 seconds, in particular from 3 to 10 seconds, has proved to be very favorable in order to ensure optimum strength of the bond. There are several plasma generators on the market that differ in plasma generation technology and gas atmosphere. Although the treatments differ, inter alia, in terms of efficiency, the basic effects are usually similar and are mainly determined by the gas atmosphere used. The choice of plasma generator according to the invention is not limited in principle, if the above conditions can be realized.
In principle, reactive gaseous substances such as oxygen, hydrogen, ammonia, ethylene, CO.sub.2, siloxanes, acrylic acids and / or solvents as well as coating or polymerizing constituents can also be added to the atmosphere.

As substrates for, for example, inflexible structures, glass or metal substrates are used. For flexible arrangements, however, surface substrates such as transparent or non-transparent films are used, which can be designed in multiple layers. Here, both combinations of different polymers, as well as inorganic or organic layers can be used. The use of such surface substrates allows a flexible, extremely thin structure. A wide variety of substrates such as films, fabrics, nonwovens and papers or combinations thereof are possible for the various applications.

• • Ein Klebeband mit einer Klebmasseschicht wird mit einer ersten Klebseite auf die Oberflache des Substrats aufgeklebt.
• • Das Klebeband mit der Klebmasseschicht wird mit der gegenüberliegenden zweiten Klebseite auf und/oder um das organisch-elektronische Element aufgeklebt.
• • Außen entlang wenigstens einer Seitenkante der Klebmasseschicht wird eine hydrophobe Passivierungsschicht mittels eines Plasmastromes aufgebracht.

Accordingly, the invention describes a method for reducing the permeation in a bonding of an organic-electronic element on a surface of a substrate comprising at least the following three steps, which take place in any order in chronological order or of which in any combination at least two can take place simultaneously :

• • An adhesive tape with an adhesive layer is glued to the surface of the substrate with a first adhesive side.
• • The adhesive tape with the adhesive layer is adhered to the opposite second adhesive side and / or around the organic-electronic element.
• • Outside along at least one side edge of the adhesive layer, a hydrophobic passivation layer is applied by means of a plasma stream.

It is essential to the process of the invention that a hydrophobic passivation layer is applied by means of a plasma stream, in particular on the outside edges of the adhesive tape during the production of the adhesive tape, after a converting step for production on the organic electronics of suitable diecuts or even after sticking the adhesive tape to a substrate surface ,

In this case, the application of the hydrophobic passivation layer by means of a plasma stream can take place on the adhesive layer, after the adhesive tape or, in particular, a punched piece produced therefrom or a piece of adhesive tape cut to length, has first been adhesively bonded between substrate and organic-electronic element. In one variant, the adhesive tape, the diecut, the piece, etc. are first treated with a plasma stream and then glued only between substrate and organic-electronic element. Furthermore, it is also possible to glue the adhesive tape, the blank or the piece only on the substrate or the organic-electronic element, to carry out the plasma treatment and only finally to perform the second bonding to substrate or organic-electronic element.
As mentioned, any desired sequence of said steps is possible in order to achieve the goal desired according to the invention.

It is preferred that the bonding between substrate and organic-electronic element takes place first, so that the plasma treatment of the adhesive tape takes place on site. The adhesive tape can completely or partially cover the electronic arrangement or cover only the edge region encompassing the arrangement.
It is further preferred that the adhesive tape, the diecut or the piece of adhesive tape is first treated with the plasma stream and only then glued to it. It can be given between treatment and bonding a spatial separation, that is, that the treatment and bonding in different places (different companies) can take place. And there may also be a time interval of up to several days (preferably up to ten days). The adhesive tape, the diecut or the piece of adhesive tape in this time preserve the property of reducing residual moisture migration in a bond.

The risk of moisture migration back into a bond is prevented by the fact that outside of the side edge of the adhesive layer, a hydrophobic passivation layer is applied by means of a plasma stream. Usually, after the application of the adhesive tape between two substrate surfaces which are glued together, only the outside of the adhesive tape circumferential side edge is exposed and exposed to the risk of rear moisture migration by water and humidity.

The free margin is provided with a hydrophobic passivation layer. For this purpose, a plasma method is used according to the invention. The treatment of the side edge of the adhesive layer takes place at or near atmospheric pressure.

In order to carry out the plasma process, it is preferable to use a structure with a plasma nozzle to which a process gas to be ionized, preferably in the form of ambient air, is supplied. Furthermore, a precursor is supplied to the output of the plasma nozzle. The precursor is preferably silanes or siloxanes or silazanes which are vaporized and introduced into the plasma stream by means of a carrier gas, for example nitrogen or inert gas. The precursor is conveniently aminopropyltriethoxysilane, perfluorooctyltriethoxysilane, hexamethyldisilazane or hexamethyldisiloxane. A pure silicon oxide layer is not to be expected in the polymerization, ie the application of the plasma stream to the substrate surface. The proportion of carbon by unreacted hydrocarbon chains from the precursor molecule, ie hexamethyl chains in the case of hexamethyldisiloxane, can be up to 12% by weight of the coating. By this additional weight fraction in the Silizumoxidschicht a hydrophobing effect is achieved. The non-water-loving layer leaves the adhesive tape sides and boundary layers of an adhesion anhydrous by the beading of water droplets. As a result, the liquid medium, that is, the condensed water, is removed from the bonding adhesion zone, and migration of the water can not take place due to the polarity of the water in the bond.

The object is met in its second aspect by an aforementioned construction with the features of claim 16.

The structure comprises a surface of a substrate, an organic-electronic element and an adhesive tape, wherein the organic-electronic element is adhesively bonded to the surface of the substrate with the adhesive tape. Organic-electronic elements are usually very sensitive to moisture, therefore it is known to provide the organic-electronic elements along their outer surfaces with a hydrophobic passivation layer, for example a paint according to the US 2016/0028041 A1 to encapsulate.

If the organic-electronic element is adhered to a substrate surface with an adhesive tape, there is a risk of rearward moisture migration at the side edges of the adhesive tape.

Therefore, it is provided according to the invention that at least one side edge of the adhesive layer of the adhesive tape is provided with a hydrophobic passivation layer applied to the side edge of the adhesive layer. It may be provided as in the above-described inventive method, the adhesive tape is provided as a roll and already provided on the roll, the longitudinal sides of the adhesive layer with the hydrophobic passivation layer It may also be provided to separate pieces of the adhesive tape and to adhere the organic-electronic element to the substrate surface and only then to provide the side edges of the adhesive layer with the hydrophobic passivation layer.

The hydrophobic passivation layer is applied to at least one, preferably all, side edges of the adhesive layer according to one of the abovementioned plasma methods.

• 1 einen prinzipiellen Aufbau einer verwendeten Plasmadüse,
• 2 eine Balkengrafik zur Bewertung des Effektes der Plasmarandverkapselung,
• 3 einen schematischen Aufbau eines Calciumtest-Aufbaus,
• 4 eine perspektivische Ansicht des detaillierten Aufbaus des Calciumtests,
• 5 eine Graphik, die eine Transmission des Calciumtest-Aufbaus ohne Plasmarandverkapselung gegen die Zeit darstellt,
• 6 eine Graphik, die die Transmission des Calciumtest-Aufbaus mit und ohne Plasmarandverkapselung gegen die Zeit im Vergleich darstellt.

The invention will be described with reference to an embodiment in six figures. Showing:

• 1 a basic structure of a plasma nozzle used,
• 2 a bar graph for evaluating the effect of plasma edge encapsulation,
• 3 a schematic structure of a calcium test structure,
• 4 a perspective view of the detailed structure of the calcium test,
• 5 a graph showing a transmission of the calcium test setup without plasma edge encapsulation versus time,
• 6 a graph comparing the transmission of the calcium test setup with and without plasma edge encapsulation versus time.

1 shows the basic view of a plasma nozzle 1 , this is an OpenAir system from Plasmatreat GmbH.

The plasma nozzle 1 comprises a precursor unit 2 in the 1 is shown on the left and a plasma unit 3 , The precursor unit 2 generates one with a precursor 4 enriched carrier gas 6 while the plasma unit 3 a plasma 7 generated. The precursor 4 and the plasma 7 be in a nozzle head 8th merged.

Under the plasma 7 Here is a high-energy process gas 11 , In particular an excited and ionized air-nitrogen mixture understood. To generate the plasma unit is first 3 through an inlet 9 the process gas 11 fed. At the process gas 11 this is air or nitrogen or a mixture thereof. The process gas 11 is through the inlet 9 into the plasma unit 3 initiated and passes through an aperture 12 with holes in a discharge zone 13 through which the process gas 11 flowing. In the discharge zone 13 becomes the process gas 11 at an electrode tip 14 passed by a high-frequency AC voltage with a few kilovolts and a frequency of 10 kHz is connected. Between the electrode tip 14 and a counter electrode, for example, a grounded stainless steel housing 16 can be, creates a strong alternating electric field, which leads to a so-called coronary discharge, which by the plasma unit 3 at the electrode tip 14 passing process gas 11 ionized and into a stream of plasma 7 transforms. The plasma 7 gets through the nozzle head 8th led, on which at a lateral inlet 17 the precursor unit 2 connected.

The lateral inlet 17 of the nozzle head 8th is with the precursor unit 2 connected. The precursor unit 2 includes a first feed for the precursor 4 and a second supply for the carrier gas 6 , As a carrier gas 6 Here, too, air or nitrogen or a mixture of air and nitrogen can be used. The precursor 4 is atomized and the carrier gas 6 supplied in droplets, the mixture passes into an evaporator 18 in which temperatures are above the boiling point of the precursor 4 to rule. As a precursor 4 For example, an organic polyfunctional silane may be used, for example, octyltriethoxysilane (OCS), (3-glycidyloxypropyl) trimethoxysilane (GLYMO) and hexamethyldisiloxane (HMDSO).

For the precursor used here 4 it is hexamethyldisiloxane (HMDSO), which is the carrier gas 6 in the order of 10, 20, 40 g / h up to 150 g / h is supplied. The temperature in the evaporator 18 is about 120 ° C, ie above the boiling point of HMDSO, which is about 100 ° C.

A the evaporator 18 escaping precursor gas 19 gets the nozzle head 8th fed and there with the plasma 7 mixed. The precursor 4 gets so with the plasma 7 on a side edge 20 an adhesive layer 22 ,

The plasma nozzle 1 is at a vertical angle to the side edge 20 the adhesive layer 22 and flows into the nozzle head 8th ,

The treatment of the side edge 20 the adhesive layer 22 takes place at or near atmospheric pressure, the pressure in the electrical discharge zone 13 the plasma nozzle 1 can also be higher. Under the plasma 7 For example, in this embodiment, it is meant an atmospheric pressure plasma that is an electrically activated homogeneous reactive gas that is not in thermal equilibrium, with a pressure close to the ambient pressure within its effective range. In general, the pressure is 0.5 bar more than the ambient pressure. By the electrical discharges or by the ionization processes in the electric field of the discharge zone 13 becomes the process gas 11 activated, and it is highly excited States generated in the gas components. The process gas 11 is then in the nozzle head 8th via a gas duct over the side inlet 17 the precursor 4 supplied in gaseous form or as an aerosol containing the actual silicon oxide layer on the surface of the side edge 20 formed.

As a process gas 11 ambient air is used here.

• Plasmadüse: Generator FG 5001, feste Düse 216028WE (Firma Plasmatreat)
• Präkursor: Hexamethyldisiloxan (HMDSO),
• Präkursormenge: 10 bis 150 g/Stunde
• Behandlungsgeschwindigkeit: 40 m/min
• Abstand der Düse: 15 mm
• PCT (Pulse-Cycle-Time): 20 % und 100 %
• Verdampfertemperatur: 120 °C

In one embodiment, plasma plating was used for plasma sealing 31 the following structure is used with the following conditions and parameters:

• Plasma nozzle: generator FG 5001, fixed nozzle 216028WE (Plasmatreat)
• Precursor: hexamethyldisiloxane (HMDSO),
• Precursor quantity: 10 to 150 g / hour
• Treatment speed: 40 m / min
• Distance of the nozzle: 15 mm
• PCT (Pulse Cycle Time): 20% and 100%
• Evaporator temperature: 120 ° C

Adhesive joints are normally permanently wetted with a water layer under the test conditions mentioned, since the ingredients of the adhesive products contain sufficiently polar groups. This promotes the migration of water molecules into the bulk of the adhesive product as well as the migration of moisture into the boundary layer. Hydrophobic properties of a glue joint provoke the "removal" of water as drops and prevent the formation of a closed water film. Initial results with hydrophobically acting precursors can bring about a significant improvement in wet heat resistance, showing higher lagtimes / breakthrough times than the reference without edge encapsulation. The precursors octyltriethoxysilane (OCS), (3-glycidyloxypropyl) trimethoxysilane (GLYMO) and hexamethyldisiloxane (HMDSO) were used. By modifying the plasma parameters (power, distance, speed and pulse cycle time) it is possible to influence the organic content of the applied layer. When deactivating adhesives, the choice of parameters is deliberately aligned with the total turnover of the precursor in order to remove the predominantly organic fraction for a vitreous layer by the plasma polymerization. Here one follows the opposite target to set the hydrophobing high. In addition, the flow rate of the precursor was increased.

Coatings with an atmospheric pressure plasma, for example, lead to glassy layers on a substrate in HMDSO 21 , However, with suitable parameter guidance (pulse-width modulation), it is possible to influence the implementation of the HMDSO. A pure SiOx layer is not expected in this polymerization. The proportion of carbon by unreacted HC chains from the precursor molecule (in the case of HMDSO the hexamethyl chain) can be up to 12% by weight of the coating. This leads to a hydrophobization. This non-water-loving layer leaves the adhesive tape sides and the boundary layers of an adhesion water-free by the dripping of water droplets. Finally, the liquid medium is removed from the zone of influence where the negative impact on adhesion occurs, and migration can not occur due to polarity (see film with hydrophobized pulp and no treatment).

Determining the lifetime of an electronic structure

As a measure of determining the lifetime of an electronic design, a calcium test design was used. The structure is schematic in the 4 shown.

It is in vacuum, a 10 × 10 mm ² large, thin calcium level 23 on the substrate 21 deposited and then stored under a nitrogen atmosphere. The substrate 21 is designed here as a glass plate. The thickness of the calcium level 23 is about 100 nm. For the encapsulation of the calcium level 23 is an adhesive tape (23 × 23 mm ² ) with the adhesive layer to be tested 22 as well as a thin glass pane 24 (35 microns, Schott) used as a carrier material. To stabilize the thin glass pane 24 with a 100 μm thick PET film 26 by means of a 50 μm thick transfer adhesive tape 25 laminated to an optically highly transparent acrylic PSA. The adhesive layer 22 becomes so on the substrate 21 applied that the adhesive layer 22 the calcium level 23 covered with an all-round protruding edge of 6.5 mm (AA). Due to the impermeable thin glass pane 24 Only the permeation through the adhesive layer is 22 or along the interfaces. The deposition of thin layers for plasma edge encapsulation 31 from the plasma takes place on all four side edges 20 , as in 3 shown schematically.
The test is based on the reaction of calcium with water vapor and oxygen, such as AG Erlat et. al. in "47th Annual Technical Conference Proceedings-Society of Vacuum Coaters", 2004, pages 654-659 , and from ME Gross et al. in "46th Annual Technical Conference Proceedings-Society of Vacuum Coaters", 2003, pages 89-92 , described. In the process, the light transmission of the calcium level becomes 23 monitored, which increases by the conversion into calcium hydroxide and calcium oxide. This takes place in the described test setup from the edge, so that the visible surface of the calcium level 23 reduced. It will take time to halve the light absorption of the calcium level 23 referred to as life. By doing so, both the degradation of the area of the calcium level 23 from the edge and by selective degradation in the area as well as the homogeneous reduction of the layer thickness of the calcium level 23 covered by full-scale degradation.
The measuring conditions used were 60 ° C and 90% relative humidity. The samples were coated with a layer thickness of the adhesive layer 22 of 50 microns fully bonded and free of bubbles. The degradation of the calcium level 23 is tracked via transmission measurements. The breakthrough time (lag-time) is defined as the time that moisture takes to travel the route to the calcium level 23 to be covered according to 5 , Until reaching this time at 60 ° C 90% r. F. the transmission of the calcium level changes 23 only marginal. The measured value (in h) is the average of three individual measurements.
The effect of plasma sand encapsulation 31 through the plasma 7 is determined by first the lag time at 60 ° C and 90% r. F. with and without plasma edge encapsulation 31 determined by the method described above. The effect is the percentage change in lag time with plasma edge encapsulation 31 compared to the lag time without plasma edge encapsulation 31 ,

transmission

The transmission of the adhesive was analogous to ASTM D1003-11 (Procedure A (Hazard Byk Haze-gard Dual), standard illuminant D65 ) certainly. A correction of interfacial reflection losses is not made.

HAZE (scattering)

The HAZE value describes the proportion of transmitted light, which is scattered by the irradiated sample forward at a large angle. Thus, the HAZE value quantifies material defects in the surface or structure that interfere with clear vision.

The method for measuring the Haze value is described in the Standard ASTM D 1003-11 described. The standard requires the measurement of four transmission measurements. For each transmission measurement, the light transmittance is calculated. The four transmittances are charged to the percentage of HAZE. The HAZE value is measured using a Haze-gard Dual from Byk-Gardner GmbH.

adhesive power

The bond strengths were determined analogously to ISO 29862 (Method 3 ) at 23 ° C and 50% relative humidity at a take-off speed of 300 mm / min and a deduction angle of 180 °. The thickness of the adhesive layer 22 was in each case 50 microns. As a PET film 26 was an etched PET film 26 used with a thickness of 50 microns, as available from the company Coveme (Italy).
As a substrate 21 Steel plates were used according to the standard. The gluing of the measuring strip was carried out by means of a coiling machine at a temperature of 23 ° C. The tapes were after a storage time of 24 h at 23 ° C and 50% r. F. measure. The measured value (in N / cm) was the average of three individual measurements.

Water vapor permeation rate (WVTR)

The WVTR is measured at 38 ° C and 90% relative humidity according to ASTM F-1249. In each case a double determination is carried out and the mean value is formed. The specified value is normalized to a thickness of 50 μm.

The transfer adhesive tapes are bonded to a high permeability polysulfone membrane (available from Sartorius) for measurements, which itself does not contribute to the permeation barrier. The measurements are made on cross-linked adhesive tapes, as long as they are cross-linkable.

In the following, the invention is explained in more detail by means of a few examples, without wishing to restrict the invention thereby.

adhesive layers

For the preparation of the adhesive layers 22 Various adhesives were applied from a solution to a conventional liner (siliconized polyester film) by means of a laboratory coater and dried. The adhesive layer thickness after drying is 50 ± 5 μm. The drying was carried out in each case initially at RT for 10 minutes and 10 minutes at 120 ° C. in a laboratory drying cabinet. The dried adhesive layers 22 were immediately laminated after drying with a second liner (siliconized polyester film with lower release force) on the open side.

Raw materials used:

Sibstar 62M

SiBS (Polystyrol-block-Polyisobutylen-Blockcopolymer) der Firma Kaneka mit 20 Gew.-% Blockpolystyrolgehalt. Enthält zum Teil auch Diblockcopolymere.

Oppanol B150

Polyisobutylen mit einem mittleren Molekulargewicht von > 800.000 g/mol

Oppanol B10

Polyisobutylen mit einem mittleren Molekulargewicht von 40.000 g/mol

Uvacure 1500

cycloaliphatisches Diepoxid der Firma Cytec (3,4-Epoxycyclohexan) methyl 3,4-epoxycyclohexylcarboxylat)

Escorez 5300

ein vollhydriertes Kohlenwasserstoffharz der Firma Exxon (Ring and Ball 105 °C, DACP = 71, MMAP = 72)

Escorez 5600

Hydriertes KW-Harz (Kohlenwasserstoffharz) mit einem Erweichungspunkt von 100 °C der Firma Exxon. Triethoxysilan mit polarer Aminogruppe

Aminopropyltriethoxysilan

CAS: 919-30-2 Triethoxysilan mit unpolarer Perfluoroctylgruppe

Perfluoroctyltriethoxysilan

CAS: 51851-37-7

Hexamethylendisiloxan

CAS: 107-46-0

Triarylsulfoniumhexa- fluoroantimonat

kationischer Fotoinitiator von der Firma Sigma-Aldrich Der Photoinitiator weist ein Absorptionsmaximum im Bereich 320 nm bis 360 nm auf und lag als 50 Gew.-%-ige Lösung in Propylencarbonat vor

Tab. 2 Beispiel: K1 K2 K3 Gew.-Teile Gew.-Teile Gew.-Teile Sibstar 62M 50 40 Oppanol B150 70 Oppanol B10 100 Uvacure 1500 - 20 Escorez 5300 50 40 Escorez 5600 100 Triarylsulfoniumhexafluoroantimonat - 0,1

Sibstar 62M

SiBS (polystyrene block polyisobutylene block copolymer) from Kaneka with 20 wt .-% block polystyrene content. Contains partly also diblock copolymers.

Oppanol B150

Polyisobutylene having an average molecular weight of> 800,000 g / mol

Oppanol B10

Polyisobutylene having an average molecular weight of 40,000 g / mol

Uvacure 1500

cycloaliphatic diepoxide from Cytec (3,4-epoxycyclohexane) methyl 3,4-epoxycyclohexylcarboxylate)

Escorez 5300

a fully hydrogenated hydrocarbon resin from Exxon (Ring and Ball 105 ° C, DACP = 71, MMAP = 72)

Escorez 5600

Hydrogenated hydrocarbon resin (hydrocarbon resin) with a softening point of 100 ° C from Exxon. Triethoxysilane with polar amino group

aminopropyltriethoxysilane

CAS: 919-30-2 triethoxysilane with nonpolar perfluorooctyl group

perfluorooctyltriethoxysilane

CAS: 51851-37-7

hexamethylenedisiloxane

CAS: 107-46-0

Triarylsulfonium hexafluoroantimonate

cationic photoinitiator from Sigma-Aldrich The photoinitiator has an absorption maximum in the range from 320 nm to 360 nm and was present as a 50% strength by weight solution in propylene carbonate

Tab. 2 Example: K1 K2 K3 Parts by weight Parts by weight Parts by weight Sibstar 62M 50 40 Oppanol B150 70 Oppanol B10 100 Uvacure 1500 - 20 Escorez 5300 50 40 Escorez 5600 100 triarylsulfonium - 0.1

Properties of the adhesives used: Tab. 3 Example: K1 K2 K3 KK (glass)> 1N / cm Yes Yes Yes Removable without residue Yes Yes Yes transparency > 90% > 90% > 90% Haze <4% <4% <4% WVTR [g / m ² d] 7 11 6

In the method, an atmospheric plasma is used to deposit plasma polymerized layers in which the precursor unit 2 and the plasma nozzle 1 be used. In this technology, an evaporation of the liquid at room temperature precursor 4 made, then by means of the carrier gas 6 into the plasma 7 is initiated.

The methods for separating atmospheric pressure plasma have been described above. As a precursor 4 were in a plasma 1 Aminopropyltriethoxysilane, in a plasma 2 Perfluorooctyltriethoxysilane and in a plasma 3 Hexamethyldisiloxane (HMDSO) used.

• Plasmadüse: Generator FG 5001, feste Düse 216028WE (Firma Plasmatreat)
• Präkursor: Plasma 1 Aminopropyltriethoxysilan, Plasma 2 Perfluoroctyltriethoxysilan, Plasma 3 Hexamethyldisiloxan (HMDSO),
• Präkursormenge: 10 bis 150 g/Stunde
• Behandlungsgeschwindigkeit: 40 m/min
• Abstand der Düse: 15 mm
• PCT (Pulse-Cycle-Time): 20 % und 100 %
• Verdampfertemperatur: 120 °C

For the plasma sand encapsulation 31 For example, the following equipment, conditions and parameters were used:

• Plasma nozzle: Generator FG 5001 fixed nozzle 216028WE (Plasmatreat)
• Precursor: plasma 1 Aminopropyltriethoxysilane, plasma 2 Perfluorooctyltriethoxysilane, plasma 3 Hexamethyldisiloxane (HMDSO),
• Precursor quantity: 10 to 150 g / hour
• Treatment speed: 40 m / min
• Distance of the nozzle: 15 mm
• PCT (Pulse Cycle Time): 20% and 100%
• Evaporator temperature: 120 ° C

Evaluation of plasma edge encapsulation 31 effect:

As described in detail in the section entitled "Determination of Breakthrough Time", specimens containing the adhesives were used K1 to K3 manufactured. On all four side edges of the adhesive layer 22 A thin layer of the reactive component was deposited via plasma polymerization. The name P2 - 1 refers to specimens with adhesive K2 and plasma plasma 1 were manufactured. The test specimens with reactive adhesive K2 were exposed immediately after preparation to a UV dose of at least 400 mJ / m 2 to initiate cationic polymerization of the epoxide component. As an effect, Table 4 shows the increase in the lag time in percent compared to an uncoated pattern with the same adhesive. Tab. 4 Example: P1-1 P1-2 P1-3 P2-1 P2-2 P2-3 P3-1 P3-2 P3-3 Effect /% 23 37 27 27 40 32 25 36 24

The examples demonstrate the effect of plasma polymerization on breakthrough time. It could be shown that additional barrier layers can be applied both with more polar reactive components (aminopropyltriethoxysilane) and with nonpolar ones such as perfluorooctyltriethoxysilane. Here, the nonpolar reactive components are slightly superior to the more polar, but surprisingly little. Even with glassy layers of siloxane precursors, significant effects can be achieved.

6 contains a representation of the degradation behavior of a Ca test specimen with plasma edge encapsulation 31 (P2-1) compared to the untreated test specimen ( P2 ) with the same adhesive. The Breakthrough time increases from 750 h without the plasma rim encapsulation 31 at 950 h with plasma sand encapsulation 31 after the plasma 1 -Method. The effect is therefore 27%.

Treatment of die-cuts:

In the preparation of the Ca test, the thin glass PET K2 -Laminate discharged from the glove box and with the procedure plasma 2 treated on all four edges. The surface intended for bonding remained covered with a liner. The laminate was returned to the glove box and used after seven days of drying time to establish a Ca test. Again, breakthrough time has been improved by 32%.
This shows that the method can also be carried out on a converter that produces diecuts for an end customer.

LIST OF REFERENCE NUMBERS

1

plasma nozzle

2

Präkursoreinheit

3

plasma unit

4

precursor

6

Carrier gas (inert gas)

7

plasma

8th

nozzle head

9

inlet

11

process gas

12

cover

13

discharge zone

14

electrode tip

16

grounded stainless steel housing

17

lateral inlet

18

Evaporator

19

precursor gas

20

Side edge of the adhesive layer

21

substratum

22

adhesive film

23

calcium levels

24

Thin glass pane

25

transfer tape

26

PET film

31

Plasmarandverkapselung

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• US 2016/0028041 A1 [0002, 0035, 0050]
• DE 102008047964 A1 [0026]
• WO 2013/057265 A1 [0026]
• US 8557084 B2 [0026]
• EP 2200105 A1 [0026]
• US 8460969 B2 [0026]
• WO 2007/087281 A1 [0026]
• WO 2009/148722 A1 [0026]
• EP 2502962 A1 [0026]
• JP 2015197969 A1 [0026]

Cited non-patent literature

• Abbott, Steven and Hansen, Charles M. (2008) Hansen Solubility Parameters in Practice, ISBN 0-9551220-2-3 [0015]
• Hansen, Charles M. (2007) Hansen solubility parameters: a user's handbook CRC Press, ISBN 0-8493-7248-8 [0015]
• A.G. Erlat et. al. in "47th Annual Technical Conference Proceedings-Society of Vacuum Coaters", 2004, pages 654 to 659 [0068]
• M.E.E. et al. in "46th Annual Technical Conference Proceedings Society of Vacuum Coaters", 2003, pages 89 to 92 [0068]
• Standard ASTM D 1003-11 [0071]

Claims (19)

Method for reducing the permeation in a bonding of an organic-electronic element on a surface of a substrate (21), comprising at least the following three method steps, which take place in any order in chronological order or of which in any combination at least two can take place simultaneously: an adhesive tape having an adhesive layer (22) is adhered to the surface of the substrate (21) with a first adhesive side; the adhesive tape with the adhesive layer (22) is glued to the opposite second adhesive side and / or around the organic-electronic element; Externally along at least one side edge (20) of the adhesive layer (22), a hydrophobic passivation layer (31) is applied by means of a plasma stream. Method according to Claim 1 , characterized in that the plasma stream is generated under atmospheric pressure. Method according to Claim 1 or 2 , characterized in that a precursor (4) is supplied to the plasma stream and silanes and / or silioxanes and / or silazanes are used as precursors (4). Method according to Claim 3 , characterized in that the precursor (4) is selected from the group consisting of aminopropyltriethoxysilane, perfluorooctyltriethoxysilane, HMDSO. Method according to at least one of Claims 1 to 4 , characterized in that the precursor (4) is vaporized and transported by means of an inert gas into the plasma stream. Method according to at least one of the preceding claims, characterized in that a process gas (11) is excited and ambient air is used as process gas (11). Method according to at least one of the preceding claims, characterized in that the adhesive layer (22) is a barrier adhesive comprising an adhesive base of - at least one polymer, in particular an elastomer - at least one adhesive resin and optionally a reactive resin. Method according to at least one of the preceding claims, characterized in that the Wasserdampfpermeationsrate the adhesive base is less than 100 g / m ² d, preferably less than 50 g / m ² d, in particular less than 15 g / m ² d. Method according to at least one of the preceding claims, characterized in that the elastomer from the group vinyl aromatics (also partially or fully hydrogenated variants), methyl methacrylate, cyclohexyl methacrylate, isobornyl methacrylate and isobornyl acrylate or from the group polyether, especially polyethylene glycol, polypropylene glycol or polytetrahydrofuran, or from Group polydienes, in particular polybutadiene or polyisoprene, (partially) hydrogenated polydienes, especially polyethylene butylene, polyethylene propylene or polybutylene, polybutylene, polyisobutylene, polyalkyl vinyl ethers, polymer blocks α, β-unsaturated ester, in particular acrylate copolymers is selected. Process according to at least one of the preceding claims, characterized in that the reactive resin is chosen from the group: 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate (EEC) and derivatives, dicyclopendadiene dioxide and derivatives, 3-ethyl-3-oxetanemethanol and derivatives, tetrahydrophthalic acid diglycidyl esters and derivatives, hexahydrophthalic acid diglycidyl esters and derivatives, 1,2-ethanediglycidyl ethers and derivatives, 1,3-propanediglycidyl ethers and derivatives, 1,4-butanediol diglycidyl ethers and derivatives, higher 1, n-alkanediglycidyl ethers and derivatives, bis - [(3, 4-epoxycyclohexyl) methyl] adipate and derivatives, vinylcyclohexyl dioxide and derivatives, 1,4-cyclohexanedimethanol bis (3,4-epoxycyclohexanecarboxylate) and derivatives, 4,5-epoxytetrahydrophthalic acid diglycidyl ester and derivatives, bis [1-ethyl (3-bis) oxetanyl) methyl) ethers and derivatives, pentaerythritol tetraglycidyl ethers and derivatives, bisphenol A diglycidyl ether (DGEBA), hydrogenated bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, hydrie bisphenol F diglycidyl ether, epoxyphenol novolacs, hydrogenated epoxyphenol novolaks, epoxycresol novolacs, hydrogenated epoxycresol novolacs, 2- (7-oxabicyclo) spiro [1,3-dioxanes-5,3 '- [7] oxabicyclo [ 4.1.0] heptanes], 1,4-bis ((2,3-epoxypropoxy) methyl) cyclohexanes. Method according to at least one of the preceding claims, characterized in that an adhesive-sticky soft phase is used as adhesive layer (22). Method according to Claim 9 , characterized in that the polyacrylates comprise (a) acrylic acid esters and / or methacrylic acid esters of the following formula CH ₂ = C (R ^I ) (COOR ^II ), where R '= H or CH ₃ and R ^{II is} an alkyl radical having 4 to 14 C Is (b) olefinically unsaturated monomers having functional groups already defined for reactivity with epoxide groups, (c) optionally further acrylates and / or methacrylates and / or olefinically unsaturated monomers which are copolymerizable with component (a). Method according to at least one of the preceding claims, characterized in that a stamped product or a cut piece of adhesive tape is used as the adhesive tape. Assembly with an organic-electronic element, an adhesive tape and a surface of a substrate (21), characterized in that the adhesive tape has an adhesive layer (22) with at least one side edge (20) and characterized by a along the side edge (20) of the adhesive layer (22) applied hydrophobic passivation layer (31). Build up Claim 14 , characterized in that the hydrophobic passivation layer (31) is formed as a SiOx layer with a weight fraction of up to 12% hydrocarbons. Build up Claim 14 or 15 , characterized in that the adhesive layer (22) has two side edges (20) which are both provided with the hydrophobic passivation layer (31). Structure according to at least one of Claims 14 to 16 , characterized in that the adhesive layer (22) comprises at least one elastomer and a reactive resin. Structure according to at least one of Claims 14 to 17 , characterized in that the elastomer from the group vinyl aromatics (also partially or fully hydrogenated variants), methyl methacrylate, cyclohexyl methacrylate, isobornyl methacrylate and isobornyl acrylate or from the group polyether, in particular polyethylene glycol, polypropylene glycol or polytetrahydrofuran or from the group polydienes, in particular polybutadiene or polyisoprene, (Partially) hydrogenated polydienes, in particular polyethylene butylene, polyethylene propylene or polybutylene butadiene, polybutylene, polyisobutylene, polyalkyl vinyl ethers, polymer blocks α, β-unsaturated esters, in particular acrylate copolymers. Structure according to at least one of Claims 14 to 18 characterized in that the reactive resin is selected from the group consisting of 3,4-epoxycyclohexylmethyl-3 ', 4'-epoxycyclohexanecarboxylate (EEC) and derivatives, dicyclopendadiene dioxide and derivatives, 3-ethyl-3-oxetanemethanol and derivatives, tetrahydrophthalic acid diglycidyl ester and derivatives, hexahydrophthalic acid diglycidyl ester and derivatives, 1,2-ethanediglycidyl ethers and derivatives, 1,3-propanediglycidyl ethers and derivatives, 1,4-butanediol diglycidyl ethers and derivatives, higher 1, n-alkanediglycidyl ethers and derivatives, bis - [(3,4-epoxycyclohexyl) methyl] adipate and derivatives, vinylcyclohexyl dioxide and derivatives, 1,4-cyclohexanedimethanol bis (3,4-epoxycyclohexanecarboxylate) and derivatives, 4,5-epoxytetrahydrophthalic acid diglycidyl ester and derivatives, bis [1-ethyl (3-oxetanyl) methyl) ethers and derivatives, Pentaerythritol tetraglycidyl ether and derivatives, bisphenol A diglycidyl ether (DGEBA), hydrogenated bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, epoxy phenol novolaks, hyd epoxyphenol novolacs, epoxycresol novolacs, hydrogenated epoxycresol novolaks, 2- (7-oxabicyclo) spiro [1,3-dioxanes-5,3 '- [7] oxabicyclo [4.1.0] heptanes], 1,4 cyclohexane-bis ((2,3-epoxypropoxy) methyl).

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