DE102007002492A1 - Plate type heat exchanger with a fixing surface and a heat exchange and/or cooling useful in production of electrical and electronic components has increased heat exchange efficiency - Google Patents
Plate type heat exchanger with a fixing surface and a heat exchange and/or cooling useful in production of electrical and electronic components has increased heat exchange efficiency Download PDFInfo
- Publication number
- DE102007002492A1 DE102007002492A1 DE102007002492A DE102007002492A DE102007002492A1 DE 102007002492 A1 DE102007002492 A1 DE 102007002492A1 DE 102007002492 A DE102007002492 A DE 102007002492A DE 102007002492 A DE102007002492 A DE 102007002492A DE 102007002492 A1 DE102007002492 A1 DE 102007002492A1
- Authority
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- Germany
- Prior art keywords
- heat exchanger
- recess
- cooling
- copper plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000010949 copper Substances 0.000 claims abstract description 27
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 15
- 239000010959 steel Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 8
- 239000002826 coolant Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 239000011324 bead Substances 0.000 claims description 3
- 238000007373 indentation Methods 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims description 2
- 230000035515 penetration Effects 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 2
- 239000000463 material Substances 0.000 description 5
- 239000007789 gas Substances 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
- B21D53/04—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers of sheet metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/24—Seam welding
- B23K26/244—Overlap seam welding
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/04—Tubular or hollow articles
- B23K2101/14—Heat exchangers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
- B23K2103/22—Ferrous alloys and copper or alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
Abstract
Description
Die Erfindung betrifft einen plattenförmig aufgebauten Wärmetauscher mit mindestens einer Befestigungsfläche und einer Wärmetauscher- oder Kühlfläche, einer unter Verwendung von Wärmetauschern aufgebauten Kühlvorrichtung, sowie ein Verfahren zur Herstellung eines Wärmetauschers.The The invention relates to a plate-shaped heat exchanger with at least one mounting surface and a heat exchanger or cooling surface, one using heat exchangers constructed cooling device, and a method for production a heat exchanger.
Aus
dem Gebrauchsmuster
Das Prinzip der Kühlvorrichtung nach dem Gebrauchsmuster besteht nun darin, die Verlustwärme eines Hochleistungsbauteils durch Kontaktkühlung abzuleiten, ohne dass es hierzu einer besonderen Zwangsbelüftung in Innern des Schaltschranks bedurfte. Der Kühlkörper nach dem Gebrauchsmuster ist plattenförmig aufgebaut und besteht aus einer wärmeleitenden Platte und einem darin eingebetteten, von einem Kühlmedium durchströmten Wärmetauscher. Die wärmeleitende Platte wurde vorzugsweise aus Aluminium und die Kühlplatte aus einer Doppelplatte mit zwei im Abstand voneinander verlaufenden Wänden hergestellt, wobei im Zwischenraum zwischen den Wänden Kanäle in einer nutförmigen Vertiefung ausgebildet waren, die etwa mäanderförmig verliefen und von einem Kühlmedium durchströmt wurden.The Principle of the cooling device according to the utility model is now in it, the heat loss of a high-performance component derive by contact cooling, without this one needed special forced ventilation inside the control cabinet. The heat sink according to the utility model is plate-shaped constructed and consists of a thermally conductive plate and an embedded therein, traversed by a cooling medium Heat exchanger. The thermally conductive plate was preferably made of aluminum and the cooling plate of a double plate made with two walls spaced apart, with channels in the space between the walls were formed in a groove-shaped depression, the run around meandering and flows through a cooling medium were.
In einer besonders effektiven Variante beschreibt das Gebrauchsmuster einen Wärmetauscher, der mit Kupferrohren ausgestattet ist, die von einem Kühlmedium durchströmt werden. Vorzugsweise sind diese Kupferrohre in einer nutartigen Vertiefung angeordnet, die sich über die ganze Länge der Kühlplatte erstreckt.In a particularly effective variant describes the utility model a heat exchanger equipped with copper pipes is, which are flowed through by a cooling medium. Preferably, these copper tubes are in a groove-like depression arranged over the entire length of the Cooling plate extends.
Bei dieser Variante wird in dem Ausführungsbeispiel des Gebrauchsmusters eine Kühlplatte mit an den Rändern quer abstehenden Vorsprüngen bzw. Stegen dargestellt, die in entsprechend ausgebildeten Nuträndern der nutartigen Vertiefung eingreifen. Zur Befestigung ist zusätzlich ein Federelement vorgesehen, das zwischen der Bodenfläche der Vertiefung und der dieser zugewandten Seite des Wärmetauschers angeordnet ist. Dadurch kann nach dem seitlichen Einschieben des Wärmetauschers eine Befestigung des Wärmetauschers über die Anpresskraft der Federelemente bewirkt werden.at This variant is in the embodiment of the utility model a cooling plate with transversely projecting at the edges Projections or webs shown in the corresponding trained groove edges of the groove-like depression engage. For attachment, a spring element is additionally provided, that between the bottom surface of the recess and this one facing side of the heat exchanger is arranged. Thereby can after the lateral insertion of the heat exchanger a Fixing the heat exchanger via the contact pressure the spring elements are effected.
Die
bekannte Vorrichtung nach Gebrauchsmuster
Aufgabe der vorliegenden Erfindung ist es, einen Wärmetauscher und eine Kühlvorrichtung zu entwickeln, welche eine effiziente Kontaktkühlung bei geringem Platzbedarf und geringen Fertigungskosten ermöglicht. Der neue Wärmetauscher soll aus möglichst wenigen Einzelteilen herstellbar und gewichtsgarend ausgebildet sein, sodass auch hocheffiziente Leichtbauteile hergestellt werden können, die mit einem unter Druck stehenden Kühl- oder Wärmetauschermedium beaufschlagt werden können.task The present invention is a heat exchanger and to develop a cooling device which is efficient Contact cooling with low space requirement and low production costs allows. The new heat exchanger should as possible a few items produced and formed gewichtsgarend so that even highly efficient lightweight components are produced can be used with a pressurized cooling or heat exchanger medium can be applied.
Ferner soll ein Herstellungsverfahren angegeben werden, mit dem eine druckdichte, korrosionsfeste und gewichtsgarende Bauweise für plattenförmig aufgebaute Wärmetauscher verwirklicht werden kann.Further it is intended to specify a production method with which a pressure-tight, corrosion-resistant and weight-saving design for plate-shaped constructed heat exchanger can be realized.
Diese Aufgabe wird erfindungsgemäß anhand mehrerer Ausführungsbeispiele näher erläutert. Es zeigen:These The object is achieved according to several embodiments explained in more detail. Show it:
Nach
Zur
Einleitung eines Druckmediums sind Anschlüsse
Die
Von
der Rückseite her sind die Vertiefungen
In
Danach wird die Vertiefung mit einem Kupferblech bzw. einer Kupferplatte abgedeckt, die bis über den Randbereich hinausreicht. Im Anschluss daran kann das Laserschweißen an den Randbereichen umlaufend um die Vertiefung erfolgen, ggf. können Druckanschlüsse in die Vertiefungen eingebracht werden.After that becomes the recess with a copper sheet or a copper plate covered, which extends beyond the edge area. in the This can be followed by laser welding on the edge areas circulating around the recess, possibly pressure connections be introduced into the wells.
Ausführungsbeispieleembodiments
Das erfindungsgemäße Verfahren zur Herstellung eines plattenförmig aufgebauten Wärmetauschers mit mindestens einer Befestigungsfläche und mindestens einer Wärmetauscherfläche bzw. Kühlfläche wird wie folgt durchgeführt:
- 1. Zunächst wird die Befestigungsfläche aus Edelstahl in eine Pressvorrichtung eingespannt und die Vertiefung mit Hilfe eines Prägewerkzeuges oder in einem Tiefziehvorgang hergestellt. Das eingesetzte Material bestand aus Edelstahl: 1.4571 X6CrNiMoTi17-12-2. Die Abmessungen der Befestigungsfläche betrugen: Länge 295 mm, Breite 62,5 mm, Dicke 1 mm. Länge der Vertiefung 260 mm, Breite der Vertiefung 28,5 mm, Tiefe 4 mm. Die Dicke des Edelstahlblechs kann im Bereich von 0,5 bis 2 mm, vorzugsweise bei 1 mm liegen. Die Wärmetauscher- bzw. Kühlfläche bestand aus einer Kupferplatte der Qualität Cu-DHP(SF-Cu) mit einer Dicke von 5 mm. Die Kupferplatte wurde so bemessen, dass die Vertiefung vollständig abgedeckt wurde und nur ein Randbereich mit der Befestigungsfläche überlappte.
- 2. In diesem Randbereich wurde mittels Laserschweißen eine Schweißverbindung wie folgt erzeugt: Die zu verbindenden Oberflächen wurden gesäubert, entfettet und durch Schleifen von der Oxidschicht befreit. Als Laser wurde ein Festkörperlaser eingesetzt mit den folgenden Parametern für Energieeintrag, Geschwindigkeit, Fokuslage, Schutzgas, Schutzgasmenge, Einstellung des Schutzgasrohres: Leistung P.: 2 KW Focus Z.: –0,5 mm Gesch. V.: 100 cm/min Schutzgas: 25 I Argon 4.6 Material: Stahlblech 1 mm 1.4571 und 5 mm Kupfer Cu DHP Material-Temperatur von ca.: 50°–60°C • Schutzgasdüse 8 Innendurchmesser • Leistungsrampen am Anfang auf den ersten 10 mm Leistung erhöhen, indem die Geschwindigkeit verringert wird • Leistungsrampen am Ende auf den letzten 10 mm Leistung verringern, indem die Geschwindigkeit erhöht wird. Brennweite 150 mm Während des Schweißens hatte die Probe eine Temperatur von ca. 50°C, die Eindringtiefe des Laserstrahls wurde im Beispiel auf 2 mm eingestellt. Vorzugsweise liegt der Bereich für die Einschweißtiefe bei 20 bis 50% bezogen auf die Dicke des Kupferbleches, das im vorliegenden Fall eine Dicke von 5 mm aufwies.
- 3. Anhand von metallographischen Untersuchungen wurde festgestellt, dass eine besonders günstige Schweißverbindung unter folgenden Voraussetzungen erhalten wurde: Mischungsverhältnis Kupfer zu Edelstahl 1: 2 bis 3 Temperierung der Proben vor dem Schweißen auf Temperaturen kleiner 100°C, vorzugsweise kleiner 60°C Unter diesen Voraussetzungen ist ein Optimum an mechanischer Festigkeit und Korrosions-Widerstand zu erreichen. Wichtige Faktoren sind hierbei: a) Geringe Korngrenzensprödigkeit b) Porenfreies, homogenes Schweißgefüge
- 1. First, the mounting surface made of stainless steel is clamped in a pressing device and the recess produced by means of a stamping tool or in a deep drawing process. The material used was stainless steel: 1.4571 X6CrNiMoTi17-12-2. The dimensions of the mounting surface were: length 295 mm, width 62.5 mm, thickness 1 mm. Length of the recess 260 mm, width of the recess 28.5 mm, depth 4 mm. The thickness of the stainless steel sheet may be in the range of 0.5 to 2 mm, preferably 1 mm. The heat exchanger or cooling surface consisted of a copper plate of the quality Cu-DHP (SF-Cu) with a thickness of 5 mm. The copper plate was sized so that the well was completely covered and only one edge area overlapped with the mounting surface.
- 2. In this edge region, a welded joint was produced by means of laser welding as follows: The surfaces to be joined were cleaned, degreased and freed from the oxide layer by grinding. As a laser, a solid-state laser was used with the following parameters for energy input, speed, focus position, inert gas, inert gas, adjustment of the inert gas tube: Power P: 2 KW Focus Z .: -0.5 mm Gesch. V: 100 cm / min shielding gas: 25 l argon 4.6 material: sheet steel 1 mm 1.4571 and 5 mm copper Cu DHP material temperature of approx .: 50 ° -60 ° C • protective gas nozzle 8 inner diameter • power ramps at the beginning on the first 10 Increase power by decreasing speed • Decrease power ramps to the last 10mm at the end by increasing the speed. Focal length 150 mm During welding, the sample had a temperature of about 50 ° C, the penetration depth of the laser beam was set to 2 mm in the example. Preferably, the welding depth range is 20 to 50% based on the thickness of the copper sheet, which in the present case had a thickness of 5 mm.
- 3. On the basis of metallographic investigations, it was found that a particularly favorable welded joint under the following Vo Mixing ratio of copper to stainless steel 1: 2 to 3 Tempering of the samples before welding to temperatures below 100 ° C, preferably below 60 ° C Under these conditions, an optimum of mechanical strength and corrosion resistance can be achieved. Important factors are: a) Low grain boundary brittleness b) Non-porous, homogeneous weld structure
- AA
- Einformen von mindestens je 1 Vertiefung in das oder die Stahlbleche Ausbilden eines Randbereichs, mindestens 1 mm Breitemolding of at least one recess each in the steel sheet (s) a border area, at least 1 mm wide
- BB
- Abdecken der Vertiefungen mit einem Cu-Blech/Platte bis über den Randbereich reichendCover the wells with a Cu plate / plate until over the Rim area reaching
- CC
- Laserschweißen, an den Randbereichen umlaufend um die Vertiefung, ggf. Einbringen von DruckanschlüssenLaser welding, at the edge areas surrounding the recess, possibly introducing of pressure connections
ZITATE ENTHALTEN IN DER BESCHREIBUNGQUOTES INCLUDE IN THE DESCRIPTION
Diese Liste der vom Anmelder aufgeführten Dokumente wurde automatisiert erzeugt und ist ausschließlich zur besseren Information des Lesers aufgenommen. Die Liste ist nicht Bestandteil der deutschen Patent- bzw. Gebrauchsmusteranmeldung. Das DPMA übernimmt keinerlei Haftung für etwaige Fehler oder Auslassungen.This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.
Zitierte PatentliteraturCited patent literature
- - DE 20200484 U1 [0002] - DE 20200484 U1 [0002]
- - DE 20200484 U [0006] DE 20200484 U [0006]
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007002492A DE102007002492A1 (en) | 2007-01-11 | 2007-01-11 | Plate type heat exchanger with a fixing surface and a heat exchange and/or cooling useful in production of electrical and electronic components has increased heat exchange efficiency |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007002492A DE102007002492A1 (en) | 2007-01-11 | 2007-01-11 | Plate type heat exchanger with a fixing surface and a heat exchange and/or cooling useful in production of electrical and electronic components has increased heat exchange efficiency |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102007002492A1 true DE102007002492A1 (en) | 2008-09-25 |
Family
ID=39712852
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102007002492A Withdrawn DE102007002492A1 (en) | 2007-01-11 | 2007-01-11 | Plate type heat exchanger with a fixing surface and a heat exchange and/or cooling useful in production of electrical and electronic components has increased heat exchange efficiency |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102007002492A1 (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015110865A1 (en) * | 2014-01-22 | 2015-07-30 | Provides Metalmeccanica S.R.L. | Heat exchanger |
DE102014105269A1 (en) * | 2014-04-14 | 2015-10-15 | Hella Kgaa Hueck & Co. | Device for cooling a power electronics by means of a cooling medium and method for producing the device |
CN105834652A (en) * | 2016-05-30 | 2016-08-10 | 兰州兰石集团有限公司 | Plate pair laser welding fixing and gas protection tool |
DE102015211163A1 (en) * | 2015-06-17 | 2016-12-22 | Zf Friedrichshafen Ag | Arrangement for cooling a power module |
DE102015211160A1 (en) * | 2015-06-17 | 2016-12-22 | Zf Friedrichshafen Ag | Arrangement for cooling a power module |
DE202018103109U1 (en) | 2018-01-10 | 2018-06-15 | Bystronic Laser Ag | Optical heat sink, laser cutting head and laser cutting machine |
DE102022111487A1 (en) | 2022-05-09 | 2023-11-09 | Elringklinger Ag | Temperature control element and battery storage device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20200484U1 (en) | 2002-01-14 | 2002-06-20 | Arnold Müller GmbH & Co. KG, 73230 Kirchheim | Cooling device for components, in particular for electrical or electronic components, such as converters or the like. |
-
2007
- 2007-01-11 DE DE102007002492A patent/DE102007002492A1/en not_active Withdrawn
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE20200484U1 (en) | 2002-01-14 | 2002-06-20 | Arnold Müller GmbH & Co. KG, 73230 Kirchheim | Cooling device for components, in particular for electrical or electronic components, such as converters or the like. |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015110865A1 (en) * | 2014-01-22 | 2015-07-30 | Provides Metalmeccanica S.R.L. | Heat exchanger |
US10224263B2 (en) | 2014-01-22 | 2019-03-05 | Provides Metalmeccanica S.R.L. | Heat exchanger |
DE102014105269A1 (en) * | 2014-04-14 | 2015-10-15 | Hella Kgaa Hueck & Co. | Device for cooling a power electronics by means of a cooling medium and method for producing the device |
US20150296660A1 (en) * | 2014-04-14 | 2015-10-15 | Hella Kgaa Hueck & Co. | Device for Cooling Power Electronics by Means of a Cooling Medium and Method for Producing the Device |
DE102015211163A1 (en) * | 2015-06-17 | 2016-12-22 | Zf Friedrichshafen Ag | Arrangement for cooling a power module |
DE102015211160A1 (en) * | 2015-06-17 | 2016-12-22 | Zf Friedrichshafen Ag | Arrangement for cooling a power module |
CN105834652A (en) * | 2016-05-30 | 2016-08-10 | 兰州兰石集团有限公司 | Plate pair laser welding fixing and gas protection tool |
CN105834652B (en) * | 2016-05-30 | 2018-07-10 | 兰州兰石集团有限公司 | Plate is fixed by Laser Welding and gas shield tooling |
DE202018103109U1 (en) | 2018-01-10 | 2018-06-15 | Bystronic Laser Ag | Optical heat sink, laser cutting head and laser cutting machine |
DE102022111487A1 (en) | 2022-05-09 | 2023-11-09 | Elringklinger Ag | Temperature control element and battery storage device |
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