DE102006043015A1 - Method for producing a component and component - Google Patents

Abstract

The invention relates to a method for producing a component, to a film module (21), in which a film of a functional material is embedded in an insulating material, and comprising a polymer carrier (23), wherein the film module (21) is connected to the polymer carrier (23) becomes. The film module (21) is embedded directly in the polymer carrier (23). Furthermore, the invention relates to a component comprising a film module (21), in which a film of a functional material is embedded in an insulating material, and a polymer carrier (23), with which the film module (21) is connected. The film module (21) is embedded in the polymer carrier (23).

Description

State of the art

The The invention relates to a method for producing a component according to the generic term of claim 1 and a component according to the preamble of the claim 8th.

If be used in components actuators or sensors that a predetermined Do not exceed the height allowed to, are generally designed as film modules actuators or Sensors used. Such film modules are commercially available and made of a functional material that helps in an insulating material embedded in a laminating process. The functional material is e.g. a piezoelectric ceramic, the insulating material a polymer film. Between the insulating material and the functional material are electrodes in the form of flat Electrodes or interdigital electrodes are formed outwardly are contacted.

Currently The film modules are generally made with the aid of an adhesive fixed to a component. Through the adhesive layer are additional inner interfaces attached the life of the connection between the film module and the component to which the film module is fixed by partially or complete Deleterious effect can. In addition to the influence on the life can be a bonding of the Film module with the component also the effectiveness of actuatory or sensory Impair function, since the adhesive layer is a spatial one Separation between the film module and the component in which the Foil module is fixed, brought about and the functionality thus can be influenced by the behavior of the adhesive layer.

Disclosure of the invention

Advantages of the invention

at the method according to the invention for producing a component comprising a film module in which a Foil made of a functional material embedded in an insulating material is, and a polymer carrier comprises, the film module is connected to the polymer carrier, wherein the film module directly into the polymer carrier is embedded. By embedding the foil module directly in the polymer carrier can to be dispensed with an intermediate layer. Such an intermediate layer is e.g. the adhesive layer when gluing the film module with the polymer carrier of the component. Due to the direct connection of the foil module with the polymer carrier the life of the compound can be increased by polymer module film module, because there are fewer interfaces are present, where a delamination of film module and polymer carrier done can. Also, due to the lack of the additional adhesive layer, the effectiveness of the actuatory and / or the sensory function of the film module, because an adhesive layer has a complex dynamic-mechanical behavior and the electrically mechanical coupling between the actuator or Sensor and substrate deteriorated.

In an embodiment the embedding of the film module in the polymer carrier is done by an injection molding process, wherein the film module initially in fixed a tool and then encapsulated by the polymer carrier becomes. By fixing the film module in the tool, it is possible that Foil module with the polymer carrier to overmold without the film module due to the injection pressure of the polymer carrier deformed. The film module may be e.g. by applying a negative pressure and / or fixed by a mechanical hold-down in the tool become. For this it is e.g. possible, to form a depression in the tool that corresponds to the shape of the film module is adjusted. As a mechanical hold-down for fixing the film module are suitable e.g. Downholder with which the film module in the is held to the shape of the film module adapted recess.

If fixing the film module in the tool by applying a negative pressure takes place, so are in the tool preferably at the positions on which the foil module rests, openings are formed, which are connected to a vacuum pump. When operating the vacuum pump is a negative pressure at the openings generated in the tool and the film module is due to the negative pressure sucked on the wall of the tool. The foil module is in the tool fixed.

Next the mechanical fixation of the film module in the tool and the Fixation of the foil module in the tool by applying a negative pressure it is also possible that the film module alone by the action of gravity in the Tool is held. For this purpose, the film module on the Bottom facing side of the tool inserted. Subsequently, will the film module over-injected with the polymer. Furthermore, any other, known in the art device suitable with which the film module are fixed in the injection mold can.

In order to cover the film module with the polymer on all sides, it is possible to carry out a multi-stage injection molding process. By applying the film module to the tool wall by applying the negative pressure or with the help of the hold-down the film module is not covered on the tool side facing with polymer. To be also this side with a polymer layer cover, for example, in a multi-step injection molding the already embedded on one side of the polymer support film module is placed in another tool and over-injected on the not covered by the polymer carrier side with the same or another polymer. Instead of flipping over the film module which is overmoulded with the polymer on one side, it is also possible to design the tool such that an intermediate wall on which the film module has been located is removed and then the polymer is subsequently injected into the free space created thereby.

In a further embodiment the embedding of the film module in the polymer carrier is done by a pressureless casting process a reactive resin with subsequent curing of the resin. Here too the film module is first placed in a tool and then encapsulated with the reactive resin. The fixing of the film module can, as in the injection molding process by the action of gravity, by mechanical hold-downs or by applying a negative pressure. Due to the unpressurized pouring of the reactive resin in the tool, it is generally sufficient that Insert foil module into the tool. On an additional Fixing by a mechanical hold-down and / or by applying a negative pressure can be dispensed with.

In a further alternative embodiment the embedding of the film module in the polymer carrier is done by a lamination process of multiple layers of polymeric composites in a layered arrangement. This is at least a part the layers are not complete hardened.

By the lamination process leaves if the film module is e.g. in printed circuit boards or in others polymeric composites of reaction resins with reinforcing elements embed.

suitable reinforcing elements are e.g. Fibers, fiber fabrics or platelets. For lamination which is not complete cured Layers and possibly also the cured layers of the polymeric Composite materials in suitable geometry and the film module placed in a tool and using mechanical pressure and / or by heating permanently connected.

suitable Polymers for Polymer carrier, in which the embedding of the film module by the injection molding process takes place, are e.g. Thermoplastics or other injection moldable polymers or precursors of polymer carriers. Suitable thermoplastics are, for example, partially aromatic or aliphatic polyamides, Polyester, preferably polybutadiene terephthalate (PBT) or polyethylene terephthalate (PET), polyolefins, preferably polypropylene (PP) or polyethylene (PE), polyetherimides, polyoxymethylene, liquid crystalline polymers (LCP), Polycarbonate, acrylonitrile butadiene styrene (ABS) and polytetrafluoroethylene (PTFE). Such precursors are e.g. Monomers of reactive resins, in the injection molding machine mixed together and then be injected into the tool. Curing to thermosets, preferably Epoxy resins, polyesters or phenolic resins, then done in the tool. Also can the precursors are already partially crosslinked and only complete crosslinking takes place in the injection mold. Further suitable polymers are all fiber-reinforced or mineral-reinforced polymers, for example glass fiber reinforced or carbon fiber reinforced Polymers, as well as polymer blends. The processing of the polymers too polymer supports preferably by injection molding.

suitable Reactive resins that can be connected to the film module are e.g. Epoxy resins, phenolic resins, cyanate esters, polyester imides, polyimides, Bismaleimides and bismaleimide triacines. Preferred epoxy resins are bisphenol A, bisphenol F, cycloaliphatic epoxy resins and multifunctional epoxy resins. The reactive resins are preferably by pouring or lamination processed.

In a preferred embodiment become the surfaces of the film module before embedding in the polymer carrier a plasma treatment cleaned and optionally activated. By The plasma treatment will be foreign matter from the surface of the Film module removes that have a negative impact on adhesion of the film module in the polymer carrier can have. Optionally existing nucleation sites where the foil module from the polymer carrier could be solved so removed.

The Invention further relates to a component which comprises a film module, in which a film of a functional material in an insulating material embedded, as well as a polymer carrier, with which the film module and in which the film module is embedded in the polymer carrier is. By embedding the film module in the polymer carrier is increases the life of the component because no adhesive layer is included, which can age and thereby a replacement of the film module lead from the component can. Also, due to the lack of the adhesive layer, the effectiveness of the actuator and / or improved sensory function of the film module.

In a first embodiment, the film module is completely enclosed by the polymer carrier. As a result, the film module is completely embedded in polymer carrier and a replacement of the Foil module from the polymer carrier can no longer be done. In a further embodiment, however, it is also possible that the film module is not covered on at least one side of the polymer carrier. In this case, it is possible that the film module protrudes partially from the polymer carrier surrounding the film module or that the film module and the polymer carrier surrounding the film module form a flat surface. Such a free surface may be required, for example, when the film module embedded in the polymer carrier has to contact another component directly.

Brief description of the drawings

embodiments The invention is illustrated in the drawings and in the following Description closer explained.

It demonstrate

1 a polymer module associated with a polymer carrier according to the prior art,

2 a film module connected to a polymer carrier in a first embodiment,

3 a film module connected to a polymer carrier in a second embodiment.

Embodiments of the invention

1 shows a film module, which is connected to a polymer carrier, according to the prior art.

A component 1 includes a polymer carrier 3 that with a slide module 5 connected is. The compound of the polymer carrier 3 with the foil module 5 done by means of an adhesive layer 7 , For the adhesive layer 7 Any suitable adhesive known to a person skilled in the art, with which polymer support can be bonded, can be used.

The foil module 5 generally comprises a functional material, eg a piezoelectric ceramic, and an insulating material, eg a polymer film. For the foil module 5 the functional material is embedded in the insulating material.

The polymer carrier 3 is for example an arbitrary thermoplastic or a reactive resin. Furthermore, the polymer carrier 3 Contain fibers, fiber fabric or platelets.

Through the connection of the foil module 5 with the polymer carrier 3 with the help of the adhesive layer 7 a first boundary layer forms 9 between the adhesive layer 7 and the polymer carrier 3 and a second boundary layer 11 between the film module 5 and the adhesive layer 7 out.

Disadvantage of the component 1 according to the prior art, as in 1 is shown that is through the adhesive layer 7 two additional boundary layers 9 . 11 be formed, where the film module 5 from the polymer carrier 3 can solve. In addition, there is no direct contact between the film module 5 and the polymer carrier 3 , so that eg in voltage measurements with the film module 5 This can cause errors to occur in the slide module 5 due to the adhesive layer 7 on the polymer carrier 3 shifts.

The component 1 , the polymer carrier 3 with the attached film module 5 is comprehensive in the in 1 illustrated embodiment with a carrier 13 connected. The carrier 13 can be made of any material. The connection of the carrier 13 with the polymer carrier 3 is generally done by a positive or a non-positive connection method. So can the carrier 13 with the polymer carrier 3 eg be connected by gluing or welding. However, it is also conceivable that the carrier 13 and the polymer carrier 3 are connected by screwing or riveting together.

Likewise, the component can 1 on the side on which the foil module 5 is attached, another component 15 connect. The other component 15 can as well as the wearer 13 be made of any material and by any positive or non-positive connection method with the polymer carrier 3 be connected. Furthermore, it is also possible that instead of the carrier 13 and the other component 15 the polymer carrier 3 with the attached foil module 5 surrounded by any other medium. Such a medium may be, for example, liquid or gaseous.

In 2 is a component designed according to the invention, comprising a polymer carrier with film module attached thereto, shown in a first embodiment.

In an inventively designed component 20 is a foil module 21 in a polymer carrier 23 embedded. At the in 2 illustrated embodiment is the film module 21 so in the polymer carrier 23 embedded that a surface 25 of the foil module 21 not from the polymer carrier 23 is covered. In the embodiment shown here is the film module 21 so in the polymer carrier 23 embedded that the polymer carrier 23 and the foil module 21 form a uniform surface.

As a material for the polymer carrier 23 are the lightweight materials, as they are known in the art. So can the polymer carrier 23 For example, be made of a thermoplastic material or a reactive resin. Any thermoplastic material known to the person skilled in the art and any reactive resin known to the person skilled in the art are suitable for this purpose. Preferred thermoplastics are, for example, partially aromatic or aliphatic polyamides, polyesters, preferably polybutadiene terephthalate (PBT) or polyethylene terephthalate (PET), polyolefins, preferably polypropylene (PP) or polyethylene (PE), polyetherimides, polyoxymethylene, liquid crystalline polymers (LCP), polycarbonate, acrylonitrile butadiene styrene ( ABS) and polytetrafluoroethylene (PTFE). Preferred reactive resins are epoxy resins, phenolic resins, cyanate esters, polyesterimides, polyimides, bismaleimides and bismaleimide triacines. Preferred epoxy resins are bisphenol A, bisphenol F, cycloaliphatic epoxy resins and polyfunctional epoxy resins.

Furthermore, the polymer carrier 23 also be a composite material and contain fibers, fiber fabric or platelets. Suitable fibers or fiber fabrics are, for example, glass fibers or carbon fibers.

To the foil module 21 in the polymer carrier 23 embed, for example, the film module 21 fixed in an injection mold and then with the polymer of the polymer carrier 23 molded. Fixing the foil module 21 In the injection mold, for example, using mechanical hold-down or by applying a negative pressure. It is also possible to use the foil module 21 For example, insert in a correspondingly shaped recess in the injection mold and then to overmold with the polymer. In this case, the positioning of the film module takes place 21 and its positioning in the injection mold solely by gravity. When the slide module 21 is held with mechanical hold down in the injection mold, then generally in ei fern first step, the film module 21 partially molded, then removed the mechanical hold-down. This is followed by the complete encapsulation of the film module 21 ,

In addition to embedding the foil module 21 in the polymer carrier 23 by an injection molding process it is also possible to use the polymer carrier 23 by a lamination process, wherein the film module 21 during the lamination process in the polymer carrier 23 is introduced. In the manufacture of the component 20 A laminating process coats composites of a polymeric material, generally a reaction resin such as epoxy resin or phenolic resin and reinforcing elements such as fibers, fibrous webs or platelets in incompletely cured layers and then permanently bonding them together using mechanical pressure and / or heating. Completely hardened layers may also be present between the individual incompletely cured layers, which then likewise adhere to the incompletely cured layer.

Furthermore, it is also possible, the polymer carrier 23 with the embedded film module 21 to produce by a casting process in which reactive resins are poured into a casting mold, in which the film module 21 was placed. After pouring the reactive resin, the resin is cured to produce the polymer carrier 23 ,

Like that in 1 represented and known from the prior art component 1 can also be the component of the invention 20 with a carrier 27 and another component 29 be connected. Again, the connection is made with the carrier 27 or the other component 29 as known from the prior art, by a non-positive or positive connection. Suitable form-fitting connections are, for example, gluing or welding and suitable non-positive connections are, for example, screwing or riveting. It is also possible that the component 20 is integrated into another component. In this case, the other component may be the component 20 completely enclose or only on one side of the component 20 issue. In addition to the connection with another component or as in 2 represented with a carrier 27 and another component 29 it is also possible that the component 20 surrounded by a liquid or gaseous medium. In this case, the material is for the polymer carrier 23 as well as for the foil module 21 to select so that this opposite the film module 21 and the polymer carrier 23 is inert.

3 shows an inventive component comprising a polymer carrier and a film module, in a second embodiment.

In the 3 illustrated embodiment differs from the embodiment shown in Figure in that the film module 21 completely in the polymer carrier 23 is embedded, leaving no surface of the film module 21 from the polymer carrier 23 protrudes. To the component 20 in the embodiment as shown in 3 is shown, for example, first the component, as in 2 represented, produced and then in a further production step on the free surface 25 of the foil module 21 coated with a polymer. The polymer is, for example, the same polymer as that from which the polymer carrier 23 is made. However, it is also possible to use a different polymer here, so that the polymer carrier 23 made of two different polymers. So it is possible, for example, first a component, as in 2 is is made to produce by an injection molding process, then insert this component in another injection mold and in a second injection molding process on the free top 25 of the foil module 21 with the polymer of the polymer carrier 23 to overspray. It is also possible, first, the component 20 as it is in 2 is shown to produce by a lamination process and then to close the thus produced laminate by a casting process with a reactive resin. In a lamination process, however, it is also possible immediately a component 20 as it is in 3 is shown to produce. For this purpose, before connecting the individual layers by application of mechanical pressure and / or by heating to the film module 21 at least one further layer of a not fully cured reactive resin, which optionally also contains reinforcing elements such as fibers, fiber fabric or platelets layered.

When preparing the polymer carrier 23 by a casting process with a reactive resin, it is necessary, as in the injection molding process, first a component, as in 2 is shown, and then produce the free surface 25 in a further step with the reactive resin to cover.

The component produced according to the invention 20 For example, it can be used in sensors such as yaw rate sensors or in control units such as pump control units. With such sensors or control devices, functional impairments or damage to the electronics may occur due to thermomechanical or mechanical stress. In addition, an insert of the component according to the invention 20 also conceivable in all other components that are made partially or completely of polymer materials and in which actuators or sensors are used in a flat design.

Claims (10)

Method for producing a component, a foil module ( 21 ), in which a film of a functional material is embedded in an insulating material, and a polymer carrier ( 23 ), wherein the film module ( 21 ) with the polymer carrier ( 23 ), characterized in that the film module ( 21 ) directly into the polymer carrier ( 23 ) is embedded. A method according to claim 1, characterized in that the embedding of the film module ( 21 ) in the polymer carrier ( 23 ) by an injection molding process, wherein the film module ( 21 ) first fixed in a tool and then for the preparation of the polymer carrier ( 23 ) is encapsulated by a polymer. Method according to claim 2, characterized in that the film module ( 21 ) is fixed in the tool by applying a negative pressure and / or by a mechanical hold-down. A method according to claim 1, characterized in that the embedding of the film module ( 21 ) in the polymer carrier ( 23 ) Is carried out by a non-pressurized casting process of a reactive resin with subsequent curing of the resin. A method according to claim 1, characterized in that the embedding of the film module ( 21 ) in the polymer carrier ( 23 ) is carried out by a laminating process of several layers of polymeric composite material of a layered arrangement, wherein at least a part of the layers is not completely cured. Method according to one of claims 1 to 5, characterized in that the surface of the film module ( 21 ) before embedding in the polymer carrier ( 23 ) is purified by a plasma treatment and optionally activated. Method according to Claim 6, characterized that the plasma treatment with an oxygen or argon plasma carried out becomes. Component comprising a foil module ( 21 ), in which a film of a functional material is embedded in an insulating material, as well as a polymer carrier ( 23 ), with which the film module ( 21 ), characterized in that the film module ( 21 ) in the polymer carrier ( 23 ) is embedded. Component according to claim 8, characterized in that the foil module ( 21 ) completely from the polymer carrier ( 23 ) is enclosed. Component according to claim 8, characterized in that the foil module ( 21 ) on at least one side of the polymer carrier ( 23 ) is covered.