DE102006038643B4 - Microlithographic projection exposure apparatus and microlithographic exposure method - Google Patents
Microlithographic projection exposure apparatus and microlithographic exposure method Download PDFInfo
- Publication number
- DE102006038643B4 DE102006038643B4 DE200610038643 DE102006038643A DE102006038643B4 DE 102006038643 B4 DE102006038643 B4 DE 102006038643B4 DE 200610038643 DE200610038643 DE 200610038643 DE 102006038643 A DE102006038643 A DE 102006038643A DE 102006038643 B4 DE102006038643 B4 DE 102006038643B4
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- Prior art keywords
- projection exposure
- polarization
- exposure apparatus
- microlithographic projection
- light
- Prior art date
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70125—Use of illumination settings tailored to particular mask patterns
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70041—Production of exposure light, i.e. light sources by pulsed sources, e.g. multiplexing, pulse duration, interval control or intensity control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70158—Diffractive optical elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70191—Optical correction elements, filters or phase plates for controlling intensity, wavelength, polarisation, phase or the like
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
- G03F7/701—Off-axis setting using an aperture
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Polarising Elements (AREA)
Abstract
Mikrolithographische Projektionsbelichtungsanlage, mit
• einer Pulslichtquelle (110, 210) zur Erzeugung von Pulslicht;
• einer Beleuchtungseinrichtung (130, 230); und
• einem Projektionsobjektiv, wobei die Beleuchtungseinrichtung (130, 230) eine Objektebene des Projektionsobjektivs beleuchtet und wobei die Objektebene mittels des Projektionsobjektivs in eine Bildebene des Projektionsobjektivs abgebildet wird;
• wobei zwischen der Pulslichtquelle (110, 210) und der Beleuchtungseinrichtung (130, 230) wenigstens ein photoelastischer Modulator (120, 220) angeordnet ist.Microlithographic projection exposure machine, with
A pulse light source (110, 210) for generating pulse light;
• a lighting device (130, 230); and
A projection lens, wherein the illumination device illuminates an object plane of the projection objective and wherein the object plane is imaged by the projection objective into an image plane of the projection objective;
Wherein between the pulsed light source (110, 210) and the illumination device (130, 230) at least one photoelastic modulator (120, 220) is arranged.
Description
Die Erfindung betrifft eine mikrolithographische Projektionsbelichtungsanlage sowie ein mikrolithographisches Belichtungsverfahren.The The invention relates to a microlithographic projection exposure apparatus and a microlithographic exposure method.
Mikrolithographische Projektionsbelichtungsanlagen werden zur Herstellung mikrostrukturierter Bauelemente, wie beispielsweise integrierter Schaltkreise oder LCD's, angewendet. Eine solche Projektionsbelichtungsanlage weist eine Beleuchtungseinrichtung und ein Projektionsobjektiv auf. Im Mikrolithographieprozess wird das Bild einer mit Hilfe der Beleuchtungseinrichtung beleuchteten Maske (= Retikel) mittels des Projektionsobjektivs auf ein mit einer lichtempfindlichen Schicht (Photoresist) beschichtetes und in der Bildebene des Projektionsobjektivs angeordnetes Substrat (z. B. ein Siliziumwafer) projiziert, um die Maskenstruktur auf die lichtempfindliche Beschichtung des Substrats zu übertragen. microlithographic Projection exposure equipment is becoming more microstructured for fabrication Components, such as integrated circuits or LCD's applied. A Such projection exposure apparatus has a lighting device and a projection lens. In the microlithography process is the image of one illuminated by means of the illumination device Mask (= reticle) by means of the projection lens on a with a photosensitive layer (photoresist) coated and in the Image plane of the projection lens arranged substrate (eg. a silicon wafer) projected to the mask structure on the photosensitive Transfer coating of the substrate.
In der Beleuchtungseinrichtung ist für manche Anwendungen die Erzeugung von möglichst unpolarisiertem Licht erwünscht, wozu es erforderlich ist, das von der Laserquelle ausgehende linear polarisierte Licht zu depolarisieren.In The lighting device is the generation for some applications from as possible unpolarized light desired, what is required is the linear output from the laser source depolarize polarized light.
Aus
Aus
Aus
Bei
den oben genannten photoelastischen Modulatoren (PEM) handelt es
sich um optische Komponenten, die derart aus einem Material hergestellt
sind, welches Spannungsdoppelbrechung (SDB) zeigt, dass eine Anregung
des PEM zu akustischen Schwingungen zu einer periodisch wechselnden
mechanischen Spannung und somit zu einer zeitlich variierenden Verzögerung führt. Mit „Verzögerung" wird die Differenz
der optischen Wege zweier orthogonaler (senkrecht zueinander stehender)
Polarisationszustände
bezeichnet. Derartige photoelastische Modulatoren (PEM) sind im
Stand der Technik, z. B.
Aufgabe der vorliegenden Erfindung ist es, eine mikrolithographische Projektionsbelichtungsanlage sowie ein mikrolithographisches Belichtungsverfahren bereitzustellen, mittels der bzw. durch das ohne Notwendigkeit beweglicher, insbesondere rotierender optischer Komponenten eine pulsaufgelöste Modulation des Polarisationszustandes erreicht werden kann.task The present invention is a microlithographic projection exposure apparatus and to provide a microlithographic exposure method, by means of or by the needlessly movable, in particular rotating optical components a pulse-resolved modulation of the polarization state can be achieved.
Eine erfindungsgemäße mikrolithographische Projektionsbelichtungsanlage umfasst:
- – eine Pulslichtquelle zur Erzeugung von Pulslicht;
- – eine Beleuchtungseinrichtung; und
- – ein Projektionsobjektiv, wobei die Beleuchtungseinrichtung eine Objektebene des Projektionsobjektivs beleuchtet und wobei die Objektebene mittels des Projektionsobjektivs in eine Bildebene des Projektionsobjektivs abgebildet wird;
- – wobei zwischen der Pulslichtquelle und der Beleuchtungseinrichtung wenigstens ein photoelastischer Modulator angeordnet ist.
- A pulse light source for generating pulse light;
- A lighting device; and
- A projection lens, wherein the illumination device illuminates an object plane of the projection objective, and wherein the object plane is imaged by means of the projection objective into an image plane of the projection objective;
- - Wherein at least one photoelastic modulator is arranged between the pulsed light source and the illumination device.
Der photoelastische Modulator kann in für sich bekannter Weise durch geeignete (z. B. akustische) Anregung einer zeitlich variierenden Verzögerung unterworfen werden, welche wiederum mit dem Pulslicht zeitlich korreliert werden kann, so dass einzelne (z. B. aufeinanderfolgende) Pulse des Pulslichtes jeweils einer definierten Verzögerung und damit einer definierten Veränderung ihres Polarisationszustandes unterworfen werden, wobei diese Veränderung auch für einzelne Pulse unterschiedlich sein kann. Dabei werden durch den erfindungsgemäßen Einsatz eines photoelastischen Modulators zur Erzeugung dieser pulsaufgelösten Variation des Polarisationszustandes bewegliche (insbesondere rotierende) optische Komponenten vermieden, wodurch insbesondere auch eine in solche Komponenten infolge z. B. auftretender Fliehkräfte induzierte Spannungsdoppelbrechung und eine damit einhergehende unerwünschte Beeinflussung der Polarisationsverteilung vermieden wird.The photoelastic modulator can be subjected in a manner known per se by suitable (eg acoustic) excitation to a time-varying delay, which in turn can be temporally correlated with the pulse light, so that individual (eg consecutive) pulses of the pulse light respectively be subjected to a defined delay and thus a defined change in their polarization state, this change may also be different for individual pulses. This is due to the inventive use of a photoelastic modulator for He generating this pulse-resolved variation of the polarization state movable (in particular rotating) optical components avoided, which in particular also results in such components due z. B. occurring centrifugal induced stress birefringence and an associated undesirable influence on the polarization distribution is avoided.
Gemäß einer bevorzugten Ausführungsform kann beispielsweise die o. g. zeitliche Korrelation derart erfolgen, dass sich zwei aufeinanderfolgende Pulse des Pulslichtes nach Austritt aus dem photoelastischen Modulator in ihrer Polarisationswirkung gegenseitig aufheben, bzw. bei Austritt aus dem photoelastischen Modulator in ihrer Polarisationsrichtung orthogonal zueinander orientiert sind, um im Ergebnis unpolarisiertes Licht in der Beleuchtungseinrichtung zu erzeugen.According to one preferred embodiment for example, the o. g. temporal correlation done in such a way that two consecutive pulses of the pulse light after exit from the photoelastic modulator in their polarization effect mutually cancel, or at the exit from the photoelastic modulator in their polarization direction are orthogonal to each other, as a result unpolarized light in the lighting device to create.
Gemäß einer bevorzugten Ausführungsform ist in der Beleuchtungseinrichtung ferner ein polarisationsbeeinflussendes optisches Element angeordnet.According to one preferred embodiment in the lighting device also a polarisationsbeeinflussendes arranged optical element.
Im Rahmen der vorliegenden Anmeldung ist unter einem polarisationsbeeinflussenden optischen Element grundsätzlich jedes Element zu verstehen, das die Eigenschaft hat, einen Eingangspolarisationszustand von Licht, welches auf dieses Element trifft, in einen anderen Polarisationszustand umzuwandeln, sei es durch Drehung der Polarisationsvorzugsrichtung des Lichtes, Ausfilterung der Lichtkomponente eines bestimmten Polarisationszustandes oder Umwandlung eines ersten Polarisationszustandes in einen zweiten Polarisationszustand. Des Weiteren kann die Änderung des Polarisationszustandes grundsätzlich sowohl in Transmission als auch in Reflexion oder Absorption der Lichtkomponente eines Polarisationszustandes erfolgen.in the The scope of the present application is under a polarization-influencing optical element basically To understand each element that has the property, an input polarization state of light which meets this element, in a different polarization state be it by rotation of the polarization preferred direction the light, filtering out the light component of a particular polarization state or Conversion of a first state of polarization into a second state Polarization state. Furthermore, the change of the polarization state can basically be both in transmission as well as in reflection or absorption of the light component a polarization state take place.
Gemäß einer bevorzugten Ausführungsform weist dieses polarisationsbeeinflussende optische Element vier Polarisatorelemente auf, die in Umfangsrichtung um eine optische Achse der Beleuchtungseinrichtung um 90° gegeneinander versetzt angeordnet sind, wobei zwei einander gegenüberliegende Polarisatorelemente für Licht einer ersten Polarisationsrichtung durchlässig sind und die übrigen beiden Polarisatorelemente für Licht einer zweiten, hierzu senkrechten Polarisationsrichtung durchlässig sind.According to one preferred embodiment this polarization-influencing optical element four polarizer elements in the circumferential direction about an optical axis of the illumination device 90 ° against each other are arranged offset, with two opposing one another Polarizer elements for Light of a first polarization direction are permeable and the other two Polarizer elements for Light of a second, perpendicular thereto polarization direction are permeable.
Mittels eines derartigen polarisationsbeeinflussenden optischen Elementes kann in Verbindung mit einem gemäß der oben beschriebenen Weise durchgeführten, pulsaufgelösten Wechsel der Polarisationsrichtung zwischen einem in vertikaler Richtung polarisierten, horizontalen Beleuchtungssetting und einem in horizontaler Richtung polarisierten, vertikalen Beleuchtungssetting gewechselt werden, so dass ohne bewegliche Teile und in schneller Folge zwischen einem für vertikale Strukturen optimierten Beleuchtungssetting und einem für horizontale Strukturen optimierten Beleuchtungssetting umgeschaltet werden kann.through such a polarization-influencing optical element can be used in conjunction with one according to the above described way, pulse resolution Change of the polarization direction between one in the vertical direction polarized, horizontal lighting setting and one in horizontal Direction polarized, vertical lighting settings changed be so without moving parts and in quick succession between one for vertical structures optimized lighting settings and one for horizontal Structures optimized lighting setting can be switched.
Das polarisationsbeeinflussende optische Element ist bevorzugt in einer Pupillenebene der Beleuchtungseinrichtung angeordnet.The polarization-influencing optical element is preferably in one Pupil level of the lighting device arranged.
Gemäß einer bevorzugten Ausführungsform handelt es sich bei diesem polarisationsbeeinflussenden optischen Element um ein Polarisationsfilter.According to one preferred embodiment it is in this polarization-influencing optical element around a polarizing filter.
Gemäß einem weiteren Aspekt betrifft die Erfindung auch ein mikrolithographisches Belichtungsverfahren, bei welchem mit tels einer Pulslichtquelle erzeugtes Pulslicht einer Beleuchtungseinrichtung einer Projektionsbelichtungsanlage zugeführt wird, wobei Pulse des Pulslichtes vor Eintritt in die Beleuchtungseinrichtung jeweils definierten Änderungen ihres Polarisationszustandes ausgesetzt werden, wobei diese Änderungen des Polarisationszustandes mittels wenigstens eines im Strahlengang des Pulslichtes angeordneten photoelastischen Modulators erfolgen.According to one In another aspect, the invention also relates to a microlithographic Exposure method in which generated by means of a pulsed light source Pulse light of a lighting device of a projection exposure system supplied is, wherein pulses of the pulse light before entering the illumination device each defined changes their polarization state, these changes the polarization state by means of at least one in the beam path the pulse light arranged photoelastic modulator take place.
Gemäß einem weiteren Aspekt betrifft die Erfindung auch die Verwendung eines photoelastischen Modulators in einer mikrolithographische Projektionsbelichtungsanlage zur definierten, pulsaufgelösten Änderung des Polarisationszustandes von durch die Projektionsbelichtungsanlage hindurch tretenden Lichtes.According to one In another aspect, the invention also relates to the use of a photoelastic modulator in a microlithographic projection exposure apparatus to the defined, pulse-resolved change of the polarization state of the projection exposure apparatus passing light.
Weitere Ausgestaltungen der Erfindung sind der Beschreibung sowie den Unteransprüchen zu entnehmen.Further Embodiments of the invention are described in the description and the dependent claims.
Die Erfindung wird nachstehend anhand von in den beigefügten Abbildungen dargestellten Ausführungsbeispielen näher erläutert.The Invention is described below with reference to the accompanying drawings illustrated embodiments explained in more detail.
Es zeigen:It demonstrate:
Der
PEM
Von
der Pulslichtquelle
Da
die beiden zuvor beschriebenen Pulse bei Austritt aus dem PEM
Gemäß einer
weiteren Ausführungsform
wird die Anregung des PEM
Das
polarisationsbeeinflussende optische Element
Wie
schematisch in
Im
Ergebnis wechselt bei der anhand von
Des
Weiteren wird ein in der Beleuchtungseinrichtung
Wenn die Erfindung auch anhand spezieller Ausführungsformen beschrieben wurde, erschließen sich für den Fachmann zahlreiche Variationen und alternative Ausführungsformen, z. B. durch Kombination und/oder Austausch von Merkmalen einzelner Ausführungsformen. Dementsprechend versteht es sich für den Fachmann, dass derartige Variationen und alternative Ausführungsformen von der vorliegenden Erfindung mit umfasst sind, und die Reichweite der Erfindung nur im Sinne der beigefügten Patentansprüche und deren Äquivalente beschränkt ist.If the invention has also been described with reference to specific embodiments, open up for the Skilled in numerous variations and alternative embodiments, z. B. by combination and / or exchange of features of individual embodiments. Accordingly, it is understood by those skilled in the art that such Variations and alternative embodiments are covered by the present invention, and the range the invention only in the sense of the appended claims and their equivalents limited is.
Claims (15)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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DE200610038643 DE102006038643B4 (en) | 2006-08-17 | 2006-08-17 | Microlithographic projection exposure apparatus and microlithographic exposure method |
JP2009524157A JP4730675B2 (en) | 2006-08-17 | 2007-07-27 | Microlithography projection exposure apparatus and microlithography exposure method |
PCT/EP2007/057776 WO2008019936A2 (en) | 2006-08-17 | 2007-07-27 | Microlithographic projection exposure apparatus and microlithographic exposure method |
TW96130260A TWI342470B (en) | 2006-08-17 | 2007-08-16 | Microlithographic projection exposure apparatus and method |
US12/197,567 US8675178B2 (en) | 2006-08-17 | 2008-08-25 | Microlithographic projection exposure apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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DE200610038643 DE102006038643B4 (en) | 2006-08-17 | 2006-08-17 | Microlithographic projection exposure apparatus and microlithographic exposure method |
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DE102006038643A1 DE102006038643A1 (en) | 2008-02-28 |
DE102006038643B4 true DE102006038643B4 (en) | 2009-06-10 |
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DE200610038643 Expired - Fee Related DE102006038643B4 (en) | 2006-08-17 | 2006-08-17 | Microlithographic projection exposure apparatus and microlithographic exposure method |
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US (1) | US8675178B2 (en) |
JP (1) | JP4730675B2 (en) |
DE (1) | DE102006038643B4 (en) |
TW (1) | TWI342470B (en) |
WO (1) | WO2008019936A2 (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
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DE102008009601A1 (en) * | 2008-02-15 | 2009-08-20 | Carl Zeiss Smt Ag | Optical system for a microlithographic projection exposure apparatus and microlithographic exposure method |
DE102010029339A1 (en) | 2010-05-27 | 2011-12-01 | Carl Zeiss Smt Gmbh | Optical system for a microlithographic projection exposure apparatus and microlithographic exposure method |
DE102010029905A1 (en) | 2010-06-10 | 2011-12-15 | Carl Zeiss Smt Gmbh | Optical system of a microlithographic projection exposure apparatus |
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DE102011079777A1 (en) | 2011-07-26 | 2013-01-31 | Carl Zeiss Smt Gmbh | Microlithographic exposure method |
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DE102013204453B4 (en) | 2013-03-14 | 2019-11-21 | Carl Zeiss Smt Gmbh | Optical system for a microlithographic projection exposure apparatus, microlithographic projection exposure apparatus and method for the microlithographic production of microstructured components |
US8922753B2 (en) | 2013-03-14 | 2014-12-30 | Carl Zeiss Smt Gmbh | Optical system for a microlithographic projection exposure apparatus |
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Also Published As
Publication number | Publication date |
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WO2008019936A2 (en) | 2008-02-21 |
US8675178B2 (en) | 2014-03-18 |
DE102006038643A1 (en) | 2008-02-28 |
TW200832073A (en) | 2008-08-01 |
WO2008019936A3 (en) | 2008-04-17 |
TWI342470B (en) | 2011-05-21 |
JP2010501113A (en) | 2010-01-14 |
US20090040498A1 (en) | 2009-02-12 |
JP4730675B2 (en) | 2011-07-20 |
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