DE102004039192B3 - Thermal riveting machine for attaching to semiconductor to baseplate with integrated upstanding rivets has intense light beam focused on thin rod which is then flattened by stamping tool - Google Patents
Thermal riveting machine for attaching to semiconductor to baseplate with integrated upstanding rivets has intense light beam focused on thin rod which is then flattened by stamping tool Download PDFInfo
- Publication number
- DE102004039192B3 DE102004039192B3 DE102004039192A DE102004039192A DE102004039192B3 DE 102004039192 B3 DE102004039192 B3 DE 102004039192B3 DE 102004039192 A DE102004039192 A DE 102004039192A DE 102004039192 A DE102004039192 A DE 102004039192A DE 102004039192 B3 DE102004039192 B3 DE 102004039192B3
- Authority
- DE
- Germany
- Prior art keywords
- component
- bol
- bel
- tnv
- dom
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000001816 cooling Methods 0.000 claims abstract description 10
- 229920001169 thermoplastic Polymers 0.000 claims abstract description 8
- 239000004416 thermosoftening plastic Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 32
- 238000010438 heat treatment Methods 0.000 claims description 23
- 230000003287 optical effect Effects 0.000 claims description 6
- 230000001427 coherent effect Effects 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 229920000299 Nylon 12 Polymers 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000036316 preload Effects 0.000 description 2
- 239000012815 thermoplastic material Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002103 nanocoating Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/56—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using mechanical means or mechanical connections, e.g. form-fits
- B29C65/60—Riveting or staking
- B29C65/606—Riveting or staking the rivets being integral with one of the parts to be joined, i.e. staking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/72—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by combined operations or combined techniques, e.g. welding and stitching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/81—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps
- B29C66/812—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/8126—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the composition, by the structure, by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps characterised by the intensive physical properties or by the optical properties of the material constituting the pressing elements, e.g. constituting the welding jaws or clamps
- B29C66/81266—Optical properties, e.g. transparency, reflectivity
- B29C66/81267—Transparent to electromagnetic radiation, e.g. to visible light
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
- B29C66/832—Reciprocating joining or pressing tools
- B29C66/8322—Joining or pressing tools reciprocating along one axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
- B29C65/1409—Visible light radiation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/03—After-treatments in the joint area
- B29C66/034—Thermal after-treatments
- B29C66/0342—Cooling, e.g. transporting through welding and cooling zone
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/80—General aspects of machine operations or constructions and parts thereof
- B29C66/82—Pressure application arrangements, e.g. transmission or actuating mechanisms for joining tools or clamps
- B29C66/824—Actuating mechanisms
- B29C66/8242—Pneumatic or hydraulic drives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
- B29C66/9261—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the displacement of the joining tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/94—Measuring or controlling the joining process by measuring or controlling the time
- B29C66/949—Measuring or controlling the joining process by measuring or controlling the time characterised by specific time values or ranges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/95—Measuring or controlling the joining process by measuring or controlling specific variables not covered by groups B29C66/91 - B29C66/94
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2101/00—Use of unspecified macromolecular compounds as moulding material
- B29K2101/12—Thermoplastic materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Description
Die Erfindung betrifft ein Verfahren zum thermischen Vernieten von Bauteilen eines Geräts, wobei ein erstes Bauteil Montagezapfen aus einem Thermoplast aufweist, die mit Öffnungen eines zweiten Bauteils korrespondieren und wobei das zweite Bauteil auf das erste Bauteil gelegt bzw. gesteckt wird, wobei das Ende eines jeweiligen Montagezapfens durch eine jeweilige korrespondierende Öffnung, insbesondere eine Bohrung, ragt. Anschließend vernietet ein auf das erhitzte Ende eines jeweiligen Montagezapfens einwirkender Druckstempel das zweite Bauteil mit dem Montagezapfen. Die Erfindung betrifft eine entsprechende Vorrichtung, welche eine Erhitzungsvorrichtung, eine Vorrichtung zum Vernieten des zweiten Bauteils mit dem jeweiligen Montagezapfen sowie eine Steuereinheit aufweist. Schließlich betrifft die Erfindung eine Verwendung des Verfahrens in einem Fertigungs- oder Automatisierungsprozesses sowie ein Gerät, welches mittels des Verfahrens hergestellt wird. Die zweiten Bauteile sind insbesondere elektrische oder elektronische Bauelemente wie auch elektrische oder elektronische Baugruppen. Das erste Bauteil ist insbesondere ein Teil eines Gehäuses eines Geräts.The The invention relates to a method for thermal riveting of components a device, wherein a first component comprises mounting pins made of a thermoplastic, those with openings a second component correspond and wherein the second component is placed or plugged onto the first component, wherein the end a respective mounting pin through a respective corresponding opening, in particular a hole, protrudes. Then riveted on the heated end of a respective mounting pin acting plunger that second component with the mounting pin. The invention relates to a corresponding device, which is a heating device, a Device for riveting the second component with the respective one Has mounting pin and a control unit. Finally, concerns the invention provides a use of the method in a manufacturing or automation process and a device which by means of the method will be produced. The second components are in particular electrical or electronic components as well as electrical or electronic Assemblies. The first component is in particular a part of a housing of a Device.
Am Ende eines Fertigungs- oder Automatisierungsprozesses erfolgt die Montage von Baugruppen, insbesondere von elektronischen Flachbaugruppen in einem Gerät. Die jeweiligen Baugruppen können z.B. mit dem Gehäuses bzw. mit zumindest einem Teil des Gehäuses, wie z.B. dem Gehäuseboden, verschraubt oder verklebt werden. Darüber hinaus sind auch thermische Verfahren bekannt.At the The end of a manufacturing or automation process is the Assembly of assemblies, in particular electronic printed circuit boards in a device. The respective modules can e.g. with the housing or with at least a part of the housing, such as e.g. the caseback, screwed or glued. In addition, are also thermal Known method.
Bereits bekannt sind Verfahren, welche mit einem heißen Druckstempel arbeiten. Dort werden in einem Arbeitsschritt die Oberseite eines Montagezapfens aus einem Thermoplast, wie z.B. Polyamid 12 (PA12), kontaktbehaftet erhitzt und zugleich verpresst.Already Methods are known which work with a hot plunger. There are in one step, the top of a mounting pin made of a thermoplastic, e.g. Polyamide 12 (PA12), contact-based heated and compressed at the same time.
Nachteilig daran ist, dass der bei dieser Vernietung entstehende Nietkopf keine mechanische Vorspannung aufweist und die Verbindung folglich nicht sonderlich stabil ist.adversely it is that the rivet head resulting from this riveting no mechanical bias and therefore not the connection is especially stable.
Bekannt sind auch Verfahren, welche mittels eines Lasers die Oberseite eines Montagezapfens erhitzen.Known are also methods which by means of a laser, the top of a Heat mounting pin.
Nachteilig daran sind aber die hohen Sicherheitsanforderungen zum Betrieb einer Laseranlage sowie auch der hohe Anschaffungspreis für eine solche Anlage.adversely But this is the high safety requirements for the operation of a Laser system as well as the high purchase price for such Investment.
Bekannt sind weiterhin Verfahren auf Ultraschallbasis, um die die Oberseite eines Montagezapfens zu erhitzen. Für empfindliche elektronische Bauteile ist dieses Verfahren unbrauchbar, da die übertragenen hochfrequenten mechanischen Schwingungen zu einer Zerstörung der zu montierenden elektronischen Bauelemente führen können.Known are still methods based on ultrasound to which the top to heat a mounting pin. For sensitive electronic This process is unusable because of the components transferred high-frequency mechanical vibrations to destroy the can lead to mounted electronic components.
Aus US 2002/0001639 A1 ist ferner eine Vorrichtung zum thermischen Vernieten von Bauteilen eines Geräts bekannt, wobei ein erstes Bauteil Montagezapfen aus einem Thermoplast aufweist, die mit Öffnungen eines zweiten Bauteils korrespondieren, welches auf das erste Bauteil legbar bzw. steckbar ist, und wobei das Ende eines jeweiligen Montagezapfens durch eine jeweilige Öffnung ragt, wobei die Vorrichtung eine Erhitzungsvorrichtung mit einer nichtkohärenten Lichtquelle und einer optischen Fokussiereinheit zur Lichtbündelung auf einen Zapfendom und eine Vorrichtung zum Vernieten des zweiten Bauteils mit dem jeweiligen Montagezapfen mittels eines Druckstempels aufweist.Out US 2002/0001639 A1 is also a device for thermal riveting of components of a device known, wherein a first component mounting pin made of a thermoplastic that has openings a second component correspond, which on the first component be laid or pluggable, and wherein the end of a respective mounting pin through a respective opening protrudes, wherein the device is a heating device with a non-coherent light source and an optical focusing unit for focusing the light on a pin-type dome and a device for riveting the second component with the having respective mounting pin by means of a plunger.
Nachteilig daran ist, dass auch der durch diese Vorrichtung entstehende Nietkopf keine hinreichende mechanische Vorspannung aufweist und die Verbindung folglich nicht sonderlich stabil ist.adversely it is that also the rivet head resulting from this device does not have sufficient mechanical preload and the connection consequently not very stable.
Es ist somit eine Aufgabe der Erfindung ein Verfahren anzugeben, welches die o.g. Nachteile vermeidet.It Thus, it is an object of the invention to provide a method which the o.g. Disadvantages avoids.
Es ist eine weitere Aufgabe der Erfindung, eine geeignete Vorrichtung zur Durchführung des Verfahrens sowie eine vorteilhafte Verwendung des Verfahrens anzugeben.It Another object of the invention is a suitable device to carry out the method and an advantageous use of the method specify.
Schließlich ist es eine Aufgabe der Erfindung ein Gerät anzugeben, welches nach dem Verfahren hergestellt ist.Finally is It is an object of the invention to provide a device which according to the Process is made.
Die Aufgabe wird durch ein Verfahren mit den im Anspruch 1 angegebenen Merkmalen gelöst.The The object is achieved by a method with the specified in claim 1 Characteristics solved.
Durch Verwendung einer Lichtquelle, insbesondere einer punktförmigen nichtkohärenten Lichtquelle, kann vorteilhaft auf eine aufwendige Lasereinrichtung zur Erhitzung des Zapfendoms verzichtet werden. Die zur Beachtung bei einer Lasereinrichtung erforderlichen hohen Sicherheitsauflagen entfallen. Stattdessen kann z.B. eine handelsübliche und kostengünstige 250W-Halogenleuchte verwendet werden. Deren u.a. sichtbares Licht kann mittels eines optischen Fokussierelements, wie z.B. mittels eines Reflektors, einer Bündellinse oder eines Hohlspiegels, auf den zu erhitzenden Zapfendoms ausgerichtet werden.By Use of a light source, in particular a punctiform non-coherent light source, can be advantageous to a complex laser device for heating be dispensed with the pin dome. The attention to a laser device required high safety requirements omitted. Instead can e.g. a commercial one and cost-effective 250W halogen light can be used. Their u.a. visible light can be detected by means of an optical focusing element, e.g. by means of a reflector, a pencil lens or a concave mirror, aligned on the mandrel to be heated become.
Vorzugsweise werden die Verfahrensschritte Erhitzung und Vernietung für alle Montagezapfen des Geräts wiederholt. Dies ist vorteilhaft für Geräte, bei denen zur Befestigung eine Vielzahl von zweiten Bauelementen vernietet werden muss.Preferably, the method steps Heating and riveting repeated for all mounting pins of the unit. This is advantageous for devices in which a variety of second components must be riveted for attachment.
In einer bevorzugten Ausführungsform wird der Druckstempel gekühlt, wie z.B. mit Kühlluft, die den Druckstempel umströmt und die beispielsweise von einem Lüfter bereitgestellt wird.In a preferred embodiment the plunger is cooled, such as. with cooling air, which flows around the plunger and which is provided by a fan, for example.
Durch das Verpressen bzw. Vernieten eines zuvor erhitzten Zapfendoms mittels des kalten bzw. gekühlten Druckstempels wird eine besonders vorteilhafte mechanische Vorspannung im durch das Verpressen bzw. Vernieten erzeugten Nietkopf erreicht. Die mechanische Verspannung entsteht durch das „Abschrecken" der heißen thermoplastischen Kunststoffmasse.By the pressing or riveting a previously heated pin mandrel means of the cold or chilled Plunger is a particularly advantageous mechanical bias achieved in the rivet head produced by the pressing or riveting. The mechanical stress is created by the "quenching" of the hot thermoplastic material.
Dadurch wird eine besonders feste und zugleich langlebige unlösbare Verbindung der ersten und zweiten Bauteile untereinander erzielt.Thereby becomes a particularly strong and at the same time durable indissoluble connection achieved the first and second components with each other.
Vorzugsweise ist bzw. sind die Dauer zur Erhitzung eines Zapfendoms und/oder der Abstand der Lichtquelle zur Oberseite eines Zapfendoms einstellbar. Das Lichtbündel wird vorzugsweise während einer Dauer von ungefähr 2 bis 10 Sekunden auf den zu erhitzenden Zapfendom gerichtet, so dass im Anschluss eine ausreichende Abkühlzeit verbleibt. Vorzugsweise kann auch die Brennweite, z.B. mittels optischer Linsen, verstellt werden. Dadurch kann das Lichtbündel auf Montagezapfen unterschiedlicher Bauhöhe eingestellt werden.Preferably is or are the duration for heating a pin dome and / or the distance of the light source to the top of a pin dome adjustable. The light beam is preferably during a duration of approximately 2 to 10 seconds on the pin to be heated, so that then remains a sufficient cooling time. Preferably the focal length, e.g. using optical lenses, adjusted become. This allows the light beam can be adjusted to mounting pins of different heights.
Das Verfahren ist für elektrische Geräte, insbesondere für elektronische Baugruppen sowie in einem Fertigungs- oder Automatisierungsprozess vorteilhaft verwendbar. Die Geräte können z.B. Flachbaugruppen, RFID-Transponder o.ä. sein.The Procedure is for electronical devices, especially for electronic assemblies as well as in a manufacturing or automation process advantageously usable. The devices can e.g. PCBs, RFID transponders or similar be.
Die Aufgabe wird weiterhin gelöst mit einer Vorrichtung zum thermischen Vernieten von Bauteilen eines Geräts, wobei ein erstes Bauteil Montagezapfen aus einem Thermoplast, wie z.B.The Task is still solved with a device for the thermal riveting of components of a device, wherein a first component mounting pin made of a thermoplastic, such as e.g.
Polyamid 12, aufweist. Die Montagezapfen korrespondieren mit Öffnungen eines zweiten Bauteils, welches auf das erste Bauteil legbar bzw. steckbar ist, und wobei das Ende eines jeweiligen Montagezapfens durch eine jeweilige Öffnung ragt. Das jeweilige herausragende Ende weist z.B. eine Länge von ca. 2 mm auf. Der Durchmesser eines Montagezapfens beträgt z.B. 2 bis 4 mm.polyamide 12, has. The mounting pins correspond with openings a second component which can be laid on the first component or is pluggable, and being the end of a respective mounting pin through a respective opening protrudes. The respective protruding end has e.g. a length of about 2 mm. The diameter of a mounting pin is e.g. 2 to 4 mm.
Erfindungsgemäß weist die Vorrichtung eine Erhitzungsvorrichtung mit einer nichtkohärenten Lichtquelle und eine Fokussiereinheit zur Lichtbündelung auf einen Zapfendom auf. Zudem weist die erfindungsgemäße Vorrichtung eine Vorrichtung zum Vernieten des zweiten Bauteils mit dem jeweiligen Montagezapfen mittels eines Druckstempels sowie eine Steuereinheit zumindest zum Verfahren des Stempels und/oder der Erhitzungsvorrichtung hin zu den jeweiligen Oberseiten der Montagezapfen auf.According to the invention the device is a heating device with a non-coherent light source and a focusing unit for light focusing on a pin-type dome on. In addition, the device according to the invention has a device for riveting the second component with the respective mounting pin by means of a plunger and a control unit at least for Method of the punch and / or the heating device towards the on respective tops of the mounting pins.
Gemäß der Erfindung sind mindestens eine Erhitzungsvorrichtung und mindestens eine Vorrichtung zum Vernieten an einer Trägervorrichtung angebracht. Die Trägervorrichtung ist dann insbesondere horizontal verfahrbar ausgebildet, wie z.B. mittels eines Stellmotors oder mittels eines pneumatischen oder hydraulischen Antriebs. So können z.B. mit mehreren Erhitzungseinrichtungen zuerst mehrere Zapfendome erhitzt werden. Nach einem Verfahren der Trägervorrichtung um eine vorgebbare Wegstrecke können dann zugleich mittels der Vernietvorrichtung mehrere Zapfendome verpresst bzw. vernietet werden.According to the invention are at least one heating device and at least one device for riveting on a support device appropriate. The carrier device is then formed in particular horizontally movable, such. by means of a servomotor or by means of a pneumatic or hydraulic drive. So can e.g. with several heating devices, first several pin dome to be heated. After a method of the carrier device by a predetermined Distance can then at the same time by means of Vernietvorrichtung several pin domes be pressed or riveted.
Gemäß der Erfindung ist bzw. sind die Erhitzungsvorrichtung und/oder die Vorrichtung zum Vernieten insbesondere vertikal pneumatisch, elektromotorisch oder hydraulisch verfahrbar. Dies ist insbesondere dann von Vorteil, wenn in einer Monta gefolge unterschiedliche Geräte mit einer unterschiedlichen Anordnung von Montagezapfen mit unterschiedlicher Länge montiert werden sollen. Die Steuereinheit kann dann die Trägervorrichtung und/oder die Erhitzungsvorrichtung und/oder die Vorrichtung zum Vernieten in geeigneter Weise mittels eines geeigneten Steuersatzes für ein jeweiliges zu montierendes Gerät horizontal und vertikal verfahren.According to the invention is or are the heating device and / or the device for riveting, in particular vertical pneumatic, electric motor or hydraulically movable. This is particularly advantageous if in a Monta wake different devices with a different Assembly of mounting pins with different lengths mounted should be. The control unit can then use the carrier device and / or the heating device and / or the device for Riveting in a suitable manner by means of a suitable tax rate for a respective device to be mounted moved horizontally and vertically.
In einer besonderen Ausführungsform sind die Erhitzungsvorrichtung und die Vorrichtung zum Vernieten in eine gemeinsame Vorrichtung integriert, wobei der Druckstempel optisch transparent ist und insbesondere gekühlt ist. Der Werkstoff des Druckstempels kann z.B. eine Nano-Beschichtung aufweisen, so dass der zu verpressende Kunststoff nicht haften bleibt. Der Stempel kann auch zugleich ein optisches Bündelelement, wie z.B. eine plankonkave Linse, zur Fokussierung des Lichtstrahls der punktförmigen Lichtquelle sein, wobei die Unterseite des Druckstempels zur Verpressung bzw. Vernietung flächig ausgeführt ist.In a particular embodiment are the heating device and the device for riveting integrated into a common device, wherein the plunger is optically transparent and in particular is cooled. The material of the Plunger can e.g. have a nano-coating, so that the plastic to be pressed does not adhere. The Stamp At the same time, an optical bundling element, such as e.g. a plano-concave lens, for focusing the light beam of the punctiform light source be, wherein the underside of the plunger for pressing or Riveting flat accomplished is.
Dadurch reduziert sich der Aufwand zum sequentiellen Verfahren der Erhitzungseinrichtung und der Vorrichtung zum Vernieten.Thereby reduces the effort for the sequential process of the heating device and the device for riveting.
Die Erfindung betrifft schließlich ein Gerät, insbesondere elektrisches bzw. elektronisches Gerät, welches durch das erfindungsgemäße Verfahren hergestellt ist.The Invention finally relates a device, in particular electrical or electronic device produced by the method according to the invention is.
Insbesondere weist das Gerät Montagezapfen auf, welche eine Auflagefläche für das zweite Bauelement ausbilden. Auf diese Weise ist vorteilhaft eine Kühlung des zweiten Bauelements über dessen Unterseite möglich.In particular, the device has mounting pins, which form a bearing surface for the second component. In this way is advantageous a cooling of the second component on the underside possible.
Die Erfindung wird anhand der nachfolgenden Figur näher erläutert. Die Figur zeigt eine geeignete Vorrichtung zur Durchführung des erfindungsgemäßen Verfahrens.The Invention will be explained in more detail with reference to the following figure. The figure shows a suitable device for implementation the method according to the invention.
Die beispielhafte thermische Nietvorrichtung TNV weist bereits eine Trägervorrichtung TVV auf, an welcher beispielhaft eine Erhitzungsvorrichtung EV sowie eine Vorrichtung zum Vernieten VV angebracht sind. Im Beispiel der Figur bewegt sich die Trägervorrichtung TV in Richtung des eingezeichneten horizontalen Pfeils. Zur Steuerung der thermischen Nietvorrichtung TNV weist diese eine Steuereinheit SE, wie z.B. einen Steuerrechner, auf.The exemplary thermal riveting TNV already has a support device TVV, which exemplifies a heating device EV as well a device for riveting VV are attached. In the example of Figur moves the carrier device TV in the direction of the horizontal arrow. For controlling the thermal riveting device TNV has this control unit SE, such as a control computer, on.
Unterhalb der thermischen Nietvorrichtung TNV ist eine zu montierende beispielhafte Flachbaugruppe als Gerät FBG, insbesondere als elektronisches Gerät dargestellt. Ein erstes Bauteil G – im Beispiel der Figur ist dies ein im Schnitt dargestellter Gehäuseboden – weist Montagezapfen BOL auf, welche mit entsprechenden Öffnungen, insbesondere Bohrungen BO, eines zweiten Bauteils BEL korrespondieren. Im Beispiel der Figur ist das zweite Bauteil BEL eine Leiterplatte mit elektronischen Bauelementen. Die Montagezapfen BOL bilden bereits gemäß der Erfindung eine Aufnahmefläche AF in einem Abstand a zum Gehäuseboden aus, so dass das zweite aufgelegte Bauteil BEL auch über dessen Unterseite kühlbar ist bzw. Wärme abgeben kann. Vorzugsweise ist das erste Bauteil G samt den Montagezapfen BOL vollständig aus einem Thermoplast, wie z.B. Polyamid 12, hergestellt, wie z.B. mittels eines Spritzgussverfahrens.Below the thermal riveting device TNV is an exemplary to be mounted PCB as device FBG, shown in particular as an electronic device. A first component G - im Example of the figure, this is a sectional case bottom - has Mounting pin BOL on, which with appropriate openings, in particular holes BO, a second component BEL correspond. In the example of the figure, the second component BEL is a printed circuit board with electronic components. The mounting bolts BOL are already forming according to the invention a receiving area AF at a distance a to the housing bottom out, so that the second launched component BEL also on the Bottom coolable is or heat can deliver. Preferably, the first component G together with the mounting pin BOL Completely made of a thermoplastic, e.g. Polyamide 12, prepared as e.g. by means of an injection molding process.
Ein Endstück DOM eines Montagezapfens BOL ragt durch eine korrespondierende Öffnung BO eines zweiten Bauteils BEL hindurch. Die Figur zeigt, wie mittels der Erhitzungsvorrichtung EV die Oberseite des Zapfendoms DOM erhitzt wird. Gemäß der Erfindung erfolgt dies über eine Lichtquelle PL, insbesondere einer punktförmigen konventionellen Halogenleuchte, deren Lichtstrahlen als Lichtbündel LB mittels eines beispielhaften Hohlspiegels RF auf die Oberseite des Zapfendoms DOM fokussiert werden. Der erzeugte Lichtfleck weist z.B. einen Durchmesser von ca. 3 mm auf und ist vorzugsweise geringfügig größer als der Durchmesser des Zapfendoms DOM. Der seitlich zur Erhitzungsvorrichtung EV eingezeichnete vertikale Pfeil zeigt beispielhaft an, dass die Erhitzungsvorrichtung EV auch vertikal verfahren werden kann, um den Brennfleck ggf. auf Montagezapfen BOL verschiedener Bauhöhen ausrichten zu können.One tail DOM of a mounting pin BOL protrudes through a corresponding opening BO of a second component BEL through. The figure shows how using the Heating device EV, the top of the pin DOM heated becomes. According to the invention this is done over a light source PL, in particular a punctiform conventional halogen lamp, their light rays as a light beam LB by means of an exemplary concave mirror RF on the top of the pin DOM be focused. The generated light spot points e.g. a diameter of about 3 mm and is preferably slightly larger than the diameter of the pin DOM. The side of the heating device EV drawn vertical arrow indicates by way of example that the Heating device EV can also be moved vertically to If necessary, align the focal spot with mounting bolts BOL of different heights to be able to.
Im rechten Teil der Figur ist ein Montagezapfen BOL dargestellt, welcher gemäß der Erfindung mittels eines kalten bzw. gekühlten Druckstempels ST verpresst bzw. vernietet worden ist. Der Zapfendom DOM wurde durch diesen Vernietvorgang zu einem Nietkopf NK umgeformt, welcher nun vorteilhaft das erste mit dem zweiten Bauteil unlösbar verbindet. Gemäß der Erfindung bewirkt die Vernietung durch den kalten Druckstempel ST eine vorteilhafte mechanische Vorspannung im thermoplastischen Material des Zapfendoms DOM.in the right part of the figure, a mounting pin BOL is shown, which according to the invention by means of a cold or chilled Stamp ST has been pressed or riveted. The peg dome DOM was transformed by this riveting process to a rivet head NK, which now advantageously connects the first to the second component inextricably. According to the invention riveting caused by the cold plunger ST an advantageous mechanical preload in the thermoplastic material of the pin mandrel DOM.
Zur Kühlung des Druckstempels ST ist im oberen Bereich der Trägervorrichtung TV eine beispielhafte Kühlluftzufuhr KL dargestellt. Der Druckstempel ST ist für den Verniet- bzw. Verpressvorgang vertikal verfahrbar. Dies ist durch einen weiteren in der Figur dargestellten Pfeil symbolisiert.to cooling of the printing stamp ST is in the upper region of the carrier device TV an exemplary cooling air supply KL shown. The plunger ST is vertical for the Verniet- or Verpressvorgang traversable. This is illustrated by another in the figure Arrow symbolizes.
Claims (14)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004039192A DE102004039192B3 (en) | 2004-08-12 | 2004-08-12 | Thermal riveting machine for attaching to semiconductor to baseplate with integrated upstanding rivets has intense light beam focused on thin rod which is then flattened by stamping tool |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004039192A DE102004039192B3 (en) | 2004-08-12 | 2004-08-12 | Thermal riveting machine for attaching to semiconductor to baseplate with integrated upstanding rivets has intense light beam focused on thin rod which is then flattened by stamping tool |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102004039192B3 true DE102004039192B3 (en) | 2006-01-26 |
Family
ID=35511665
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004039192A Expired - Fee Related DE102004039192B3 (en) | 2004-08-12 | 2004-08-12 | Thermal riveting machine for attaching to semiconductor to baseplate with integrated upstanding rivets has intense light beam focused on thin rod which is then flattened by stamping tool |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE102004039192B3 (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007022827A1 (en) * | 2007-05-15 | 2008-11-20 | Braun Gmbh | Toothbrush attachment and method for its production |
CN103931015A (en) * | 2011-12-29 | 2014-07-16 | 日产自动车株式会社 | Battery coupling method and battery coupling device |
CN104416114A (en) * | 2013-08-28 | 2015-03-18 | 北汽福田汽车股份有限公司 | Cross beam riveting clamp |
EP3002105A1 (en) * | 2014-10-02 | 2016-04-06 | SONOTRONIC Nagel GmbH | Riveting device and method for its use |
CN106270348A (en) * | 2016-09-18 | 2017-01-04 | 中国农业大学 | A kind of battery riveting set with heating function and clinching method thereof |
EP3103620A4 (en) * | 2014-07-11 | 2017-10-25 | Gunyang Itt Co., Ltd. | Vehicle door trim bonding device |
CN114109018A (en) * | 2021-12-21 | 2022-03-01 | 黄伟 | Scaffold connecting device for house construction and using method thereof |
CZ309312B6 (en) * | 2019-02-21 | 2022-08-17 | METESS s.r.o. | Equipment for thermally joining plastic parts by riveting |
CN117067615A (en) * | 2023-08-16 | 2023-11-17 | 海宁超艺精密五金有限公司 | Riveting piece for fixing connection of upper and lower PCB boards |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020001639A1 (en) * | 2000-03-20 | 2002-01-03 | Lanser Mark W. | Heat staking head with radiant heat source |
-
2004
- 2004-08-12 DE DE102004039192A patent/DE102004039192B3/en not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020001639A1 (en) * | 2000-03-20 | 2002-01-03 | Lanser Mark W. | Heat staking head with radiant heat source |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007022827A1 (en) * | 2007-05-15 | 2008-11-20 | Braun Gmbh | Toothbrush attachment and method for its production |
CN103931015A (en) * | 2011-12-29 | 2014-07-16 | 日产自动车株式会社 | Battery coupling method and battery coupling device |
EP2800163A1 (en) * | 2011-12-29 | 2014-11-05 | Nissan Motor Co., Ltd | Battery coupling method and battery coupling device |
EP2800163A4 (en) * | 2011-12-29 | 2015-04-01 | Nissan Motor | BATTERY COUPLING METHOD AND BATTERY COUPLING DEVICE |
CN103931015B (en) * | 2011-12-29 | 2016-04-06 | 日产自动车株式会社 | Battery linking method and battery hookup mechanism |
US9461280B2 (en) | 2011-12-29 | 2016-10-04 | Nissan Motor Co., Ltd. | Battery coupling method and battery coupling device |
CN104416114A (en) * | 2013-08-28 | 2015-03-18 | 北汽福田汽车股份有限公司 | Cross beam riveting clamp |
EP3103620A4 (en) * | 2014-07-11 | 2017-10-25 | Gunyang Itt Co., Ltd. | Vehicle door trim bonding device |
EP3002105A1 (en) * | 2014-10-02 | 2016-04-06 | SONOTRONIC Nagel GmbH | Riveting device and method for its use |
CN106270348A (en) * | 2016-09-18 | 2017-01-04 | 中国农业大学 | A kind of battery riveting set with heating function and clinching method thereof |
CN106270348B (en) * | 2016-09-18 | 2018-04-20 | 中国农业大学 | A kind of battery riveting set and its clinching method with heating function |
CZ309312B6 (en) * | 2019-02-21 | 2022-08-17 | METESS s.r.o. | Equipment for thermally joining plastic parts by riveting |
CN114109018A (en) * | 2021-12-21 | 2022-03-01 | 黄伟 | Scaffold connecting device for house construction and using method thereof |
CN114109018B (en) * | 2021-12-21 | 2023-05-12 | 黄伟 | Scaffold connecting device for building construction and application method thereof |
CN117067615A (en) * | 2023-08-16 | 2023-11-17 | 海宁超艺精密五金有限公司 | Riveting piece for fixing connection of upper and lower PCB boards |
CN117067615B (en) * | 2023-08-16 | 2024-04-12 | 海宁超艺精密五金有限公司 | Riveting piece for fixing connection of upper and lower PCB boards |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2807905B1 (en) | Placement method for circuit carrier | |
EP2693108B1 (en) | Light module and method of manufacturing the light module | |
DE2852753C3 (en) | Method for fastening components with flat connection contacts on a printed circuit board and template for carrying out the method | |
DE102004039192B3 (en) | Thermal riveting machine for attaching to semiconductor to baseplate with integrated upstanding rivets has intense light beam focused on thin rod which is then flattened by stamping tool | |
EP2693109B1 (en) | Light module | |
WO2016094913A1 (en) | Method for producing a circuit carrier, and circuit carrier | |
DE112011103942B4 (en) | Optical assembly | |
EP3321570B1 (en) | Method for arranging a circuit carrier and lighting device for a motor vehicle with a circuit carrier arranged according to this method | |
WO2005027598A1 (en) | Flexible circuit support arrangement | |
EP1899143B1 (en) | Device and method for producing a device | |
EP3492809B1 (en) | Vehicle headlight and method for adjusting a light source and an adaptor lens | |
WO2020025419A1 (en) | Lighting device for a vehicle | |
WO2016124184A1 (en) | Camera module and method for the production thereof | |
DE102005055949A1 (en) | Torque and rotation angle sensors manufacturing method for use in motor vehicle, involves deriving control signal for controlling device to control welding and positioning process from representation of reference object | |
DE19801346C1 (en) | Shape embossing apparatus for fusible materials | |
DE102006019717A1 (en) | Optical module, has snap-in hook arranged in such a manner that surface of printed circuit board is aligned at definite preset distance with respect to optical lens in self adjustable manner | |
EP0792092A2 (en) | Process for manufacturing a composite arrangement | |
DE60008198T2 (en) | Semiconductor laser module and method for mounting a semiconductor laser element thereon | |
DE102018113561B4 (en) | Method for mounting and aligning a DMD chip in a light module for a motor vehicle headlight | |
EP2285197A1 (en) | Method for connecting an electronic component with a circuit board | |
DE102020102938A1 (en) | Circuit carrier plate and method for manufacturing a circuit carrier plate | |
EP2777369A1 (en) | Method and system for producing circuit boards | |
DE102019117950B4 (en) | Tool, device and method for welding a lens to a housing of an automobile light | |
DE102021206458A1 (en) | Method of manufacturing a camera module | |
DE102022213939A1 (en) | Method for constructing a camera and camera for a motor vehicle |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8100 | Publication of the examined application without publication of unexamined application | ||
8364 | No opposition during term of opposition | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20130301 |