DE102004015442A1 - Method of closing perforated membranes - Google Patents
Method of closing perforated membranes Download PDFInfo
- Publication number
- DE102004015442A1 DE102004015442A1 DE102004015442A DE102004015442A DE102004015442A1 DE 102004015442 A1 DE102004015442 A1 DE 102004015442A1 DE 102004015442 A DE102004015442 A DE 102004015442A DE 102004015442 A DE102004015442 A DE 102004015442A DE 102004015442 A1 DE102004015442 A1 DE 102004015442A1
- Authority
- DE
- Germany
- Prior art keywords
- fine
- layer
- pored layer
- dollar
- pored
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000012528 membrane Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00523—Etching material
- B81C1/00547—Etching processes not provided for in groups B81C1/00531 - B81C1/00539
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0111—Bulk micromachining
- B81C2201/0115—Porous silicon
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Micromachines (AREA)
- Separation Using Semi-Permeable Membranes (AREA)
- Pressure Sensors (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
Die Erfindung betrifft ein Verfahren zum Erzeugen einer Membranstruktur mit verschlossenen Perforationsöffnungen, welche einen Hohlraum überspannt, bei dem DOLLAR A - auf einem Substrat wenigstens eine feinporige Schicht erzeugt wird, DOLLAR A - durch einen die feinporige Schicht durchdringenden Ätzvorgang ein von wenigstens der feinporigen Schicht überspannter Hohlraum unter der feinporigen Schicht erzeugt wird, DOLLAR A - auf der feinporigen Schicht eine Verschlussschicht erzeugt wird, welche die feinporige Schicht wenigstens teilweise überdeckt.The invention relates to a method for producing a membrane structure with closed perforation openings, which spans a cavity in which DOLLAR A - at least one fine-pored layer is produced on a substrate, DOLLAR A - by an etching process penetrating the fine-pored layer one of at least the fine-pored layer spanned Cavity is produced under the fine-pored layer, DOLLAR A - on the fine-pored layer, a closure layer is produced, which at least partially covers the fine-pored layer.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004015442A DE102004015442A1 (en) | 2004-03-30 | 2004-03-30 | Method of closing perforated membranes |
GB0427160A GB2415828B (en) | 2004-03-30 | 2004-12-10 | Method for closing perforated membranes |
FR0550765A FR2868412A1 (en) | 2004-03-30 | 2005-03-24 | METHOD FOR CLOSING PERFORATED MEMBRANES |
JP2005099338A JP2005279928A (en) | 2004-03-30 | 2005-03-30 | Method for closing bored diaphragm |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004015442A DE102004015442A1 (en) | 2004-03-30 | 2004-03-30 | Method of closing perforated membranes |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102004015442A1 true DE102004015442A1 (en) | 2005-10-20 |
Family
ID=34072186
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102004015442A Withdrawn DE102004015442A1 (en) | 2004-03-30 | 2004-03-30 | Method of closing perforated membranes |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2005279928A (en) |
DE (1) | DE102004015442A1 (en) |
FR (1) | FR2868412A1 (en) |
GB (1) | GB2415828B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102017210459A1 (en) * | 2017-06-22 | 2018-12-27 | Robert Bosch Gmbh | Micromechanical device with a first cavity and a second cavity |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0750789B2 (en) * | 1986-07-18 | 1995-05-31 | 日産自動車株式会社 | Method for manufacturing semiconductor pressure converter |
DE19961578A1 (en) * | 1999-12-21 | 2001-06-28 | Bosch Gmbh Robert | Sensor comprises a micromechanical structure based on silicon integrated in the sensor chamber of a base wafer and a cover made of a transparent deposition layer and a sealing layer |
DE10053326A1 (en) * | 2000-10-27 | 2002-05-08 | Bosch Gmbh Robert | Micro-mechanical component for sensing dew point contains membrane and porous material thermal insulating zone membrane support |
FI112644B (en) * | 2000-11-10 | 2003-12-31 | Vaisala Oyj | Surface micromechanical absolute pressure sensor and method of manufacture thereof |
DE10064494A1 (en) * | 2000-12-22 | 2002-07-04 | Bosch Gmbh Robert | Method for producing a semiconductor component and a semiconductor component produced by the method, the semiconductor component in particular having a movable mass |
DE10065026A1 (en) * | 2000-12-23 | 2002-07-04 | Bosch Gmbh Robert | Micromechanical component and corresponding manufacturing method |
DE10117486A1 (en) * | 2001-04-07 | 2002-10-17 | Bosch Gmbh Robert | Method for producing a semiconductor component and a semiconductor component produced using the method |
GR1004106B (en) * | 2002-01-24 | 2003-01-13 | Εκεφε "Δημοκριτος" Ινστιτουτο Μικροηλεκτρονικης | Low power silicon thermal sensors and microfluidic devices based on the use of porous silicon sealed air cavity technology or microchannel technology |
-
2004
- 2004-03-30 DE DE102004015442A patent/DE102004015442A1/en not_active Withdrawn
- 2004-12-10 GB GB0427160A patent/GB2415828B/en not_active Expired - Fee Related
-
2005
- 2005-03-24 FR FR0550765A patent/FR2868412A1/en active Pending
- 2005-03-30 JP JP2005099338A patent/JP2005279928A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
GB2415828B (en) | 2006-06-28 |
GB2415828A (en) | 2006-01-04 |
JP2005279928A (en) | 2005-10-13 |
GB0427160D0 (en) | 2005-01-12 |
FR2868412A1 (en) | 2005-10-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8110 | Request for examination paragraph 44 | ||
R002 | Refusal decision in examination/registration proceedings | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |
Effective date: 20121002 |