DD109669A1 - - Google Patents
Info
- Publication number
- DD109669A1 DD109669A1 DD17720774A DD17720774A DD109669A1 DD 109669 A1 DD109669 A1 DD 109669A1 DD 17720774 A DD17720774 A DD 17720774A DD 17720774 A DD17720774 A DD 17720774A DD 109669 A1 DD109669 A1 DD 109669A1
- Authority
- DD
- German Democratic Republic
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD17720774A DD109669A1 (en) | 1974-03-15 | 1974-03-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DD17720774A DD109669A1 (en) | 1974-03-15 | 1974-03-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DD109669A1 true DD109669A1 (en) | 1974-11-12 |
Family
ID=5494998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DD17720774A DD109669A1 (en) | 1974-03-15 | 1974-03-15 |
Country Status (1)
| Country | Link |
|---|---|
| DD (1) | DD109669A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2947306A1 (en) * | 1978-11-27 | 1980-06-04 | Macdermid Inc | SOLUTION AND METHOD FOR ELECTRICIZED COPPER DEPOSITION USING A HYPOPHOSPHITE REDUCER IN THE PRESENCE OF COBALT AND / OR NICKEL IONS |
| WO1982001015A1 (en) * | 1980-09-15 | 1982-04-01 | Shipley Co | Electroless alloy plating |
| DE3034877A1 (en) * | 1980-09-16 | 1982-04-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Electroless copper-nickel phosphorous plate - with low phosphorus content and wide range of copper contents |
| EP0067257A1 (en) * | 1981-06-15 | 1982-12-22 | Asahi Glass Company Ltd. | Heat radiation reflecting glass and preparation thereof |
-
1974
- 1974-03-15 DD DD17720774A patent/DD109669A1/xx unknown
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2947306A1 (en) * | 1978-11-27 | 1980-06-04 | Macdermid Inc | SOLUTION AND METHOD FOR ELECTRICIZED COPPER DEPOSITION USING A HYPOPHOSPHITE REDUCER IN THE PRESENCE OF COBALT AND / OR NICKEL IONS |
| WO1982001015A1 (en) * | 1980-09-15 | 1982-04-01 | Shipley Co | Electroless alloy plating |
| US4482596A (en) * | 1980-09-15 | 1984-11-13 | Shipley Company Inc. | Electroless alloy plating |
| DE3034877A1 (en) * | 1980-09-16 | 1982-04-29 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Electroless copper-nickel phosphorous plate - with low phosphorus content and wide range of copper contents |
| EP0067257A1 (en) * | 1981-06-15 | 1982-12-22 | Asahi Glass Company Ltd. | Heat radiation reflecting glass and preparation thereof |