CN2872593Y - Structure of radiator - Google Patents
Structure of radiator Download PDFInfo
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- CN2872593Y CN2872593Y CN 200520120897 CN200520120897U CN2872593Y CN 2872593 Y CN2872593 Y CN 2872593Y CN 200520120897 CN200520120897 CN 200520120897 CN 200520120897 U CN200520120897 U CN 200520120897U CN 2872593 Y CN2872593 Y CN 2872593Y
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- heat
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- radiating substrate
- radiating
- heat pipe
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a heat dissipating device which is applied in combination with electronic devices with multiple electronic chips. The heat dissipating device comprises a heat pipe, a heat radiator provided with an accommodation cavity, a blower fan disposed in the accommodation cavity, a heat dissipating fin assembly arranged in an air-out guide slot on lateral wall of the accommodation cavity and connected with one end of the heat pipe, a first heat dissipating substrate connected with the heat radiator and provided with a first copper block on another lateral surface, and a second heat dissipating substrate. One end of the heat pipe is fixedly arranged on one lateral surface of the second heat dissipating substrate via a fixing buckle, and provided with a second and a third copper clock. Heat dissipating device of the utility model can dissipate heat of multiple heating electronic chips, and has the advantages of simple structure and good heat dissipating effect.
Description
Technical field
The utility model relates to a kind of structure of heat abstractor, especially relates to a kind of being applied in the electronic installation, simultaneously the structure of the heat abstractor that a plurality of heating electronic chips are dispelled the heat.
Background technology
Development along with electronics technology, the integrated level of electronic chip (as the central processing unit of computer) strengthens, operating rate also constantly increases, and therefore heat abstractor must be set to reduce the surface temperature of electronic chip on the surface of electronic chip, keeps its normal work.But we still will consider several factors when solving its heat dissipation problem, and the central processing unit with computer is that example illustrates below.
The fast development of the arithmetic speed of the central processing unit of computer, the solution of the heat dissipation problem of central processing unit just becomes the problem that the emphasis consideration is wanted the time in the main frame design, especially more is rich in challenge for the little computer of volume such as the design of notebook computer.Notebook computer is compact, and is therefore very high to the requirement of the heat abstractor in the notebook host.
The heat abstractor of the central processing unit of present most of notebook computers is to connect a radiator by heat-radiating substrate, radiator comprises a radiator fan and the radiator fan air outlet radiating fin that be provided with of configuration on it, and what have also is provided with heat pipe on heat-radiating substrate.Heat conducts to radiator through heat pipe, in the heat conductive process, heat pipe and spreader surface can be to external radiation part heats, and still most of heat all is to pass through the radiating fin of radiator to external radiation, and radiator fan has increased air flows and quickened dispersing of heat.But this kind heat abstractor is because area of dissipation is certain, and the radiating effect of the single fan of employing is limited, so the heat radiation power of this device has certain limit.
Along with the quickening of central processing unit arithmetic speed, the heat of its generation is also just many more.The heat radiation power of existing heat abstractor can not satisfy the heat radiation requirement of central processing unit.Thereby just need the heat abstractor of bigger heat radiation power.In general, according to radiating principle, area of dissipation is big more, and radiating effect is good more; Thermal resistance is more little, and radiating effect is good more; Fan power is strong more, and cross-ventilation is strong more, and heat radiation is also just strong more.So can adopt bigger area of dissipation and more powerful radiator fan to strengthen radiating effect.Particularly when notebook computer adopts the central processing unit of the above power of 1.3G, the heat that central processing unit produces even can surpass 100W, if but follow the mentality of designing of heat abstractor in the past, that is one years old, the heat abstractor of the central processing unit of so big heating power, the area of dissipation of the heat abstractor that it is required is huge, and the quantity of radiating fin also will be huge; Simultaneously, the increase of radiating fin quantity and size, and the increase of the power of radiator fan all will cause the volume of the heat abstractor that makes up to increase.But for the notebook computer of element arrangements compactness, the increase of the volume of heat abstractor is not meet the short and small frivolous demand for development of notebook computer.So the quantity of the radiating fin by simple increase radiator and size or the power that increases single radiator fan all can not satisfy heat radiation far away and require.Simultaneously, raising along with the electronic component integrated level, the electronic chip that has a plurality of high heatings in the notebook computer, utilize limited inner space to come good heat radiation for reaching to a plurality of heating electronic chips, therefore we more need to change mentality of designing, take all factors into consideration the caloric value of tight space and central processing unit and other electronic chip of notebook computer, it is moderate to design a kind of volume, and the heat abstractor that radiating efficiency is high satisfies the heat radiation requirement of the central processing unit of golf calorific value.
Summary of the invention
For addressing the above problem, the utility model has disclosed a kind of structure of heat abstractor, it cooperates electronic installation to use, and the volume and the heat radiation power of heat abstractor have been taken all factors into consideration, electronic chip to a plurality of high heatings in the electronic installation dispels the heat simultaneously, particularly a kind of heat abstractor that can satisfy high-power central processing unit of notebook computer and north and south bridge chip group (Chip Set) has good radiating effect.
For achieving the above object, the utility model has adopted following technical scheme to realize: a kind of structure of heat abstractor, be used with electronic installation with high electronic chip that generates heat, and this heat abstractor comprises: a heat pipe; One radiator has a container cavity and is placed in the fan in this container cavity and is arranged at radiating fin group in the air-out guide groove that above-mentioned container cavity one side-walls offers, and one of above-mentioned heat pipe terminally is connected setting with this radiating fin group; One first heat-radiating substrate, be connected setting with above-mentioned radiator, and a wherein side surface of this first heat-radiating substrate is provided with first holding tank that part is held above-mentioned heat pipe, one end portion of above-mentioned heat pipe is arranged in this first holding tank, and the opposite side surface of this first heat-radiating substrate is provided with one first copper billet; One second heat-radiating substrate, an end of above-mentioned heat pipe is fixedly set in the wherein side surface of this second heat-radiating substrate by clip, and another opposite flank is provided with second, third copper billet, and above-mentioned first, second and the 3rd copper billet are positioned at same horizontal plane.
Compared with prior art, the utility model has been taken all factors into consideration the requirement of the volume and the heat radiation power of heat abstractor, the electronic chip that can satisfy a plurality of high heatings in the electronic installation simultaneously dispels the heat, particularly a kind of heat abstractor that can satisfy high-power central processing unit of notebook computer and north and south bridge chip group.The heat abstractor that the utility model disclosed simple in structure, element is less, and easy to assembly, has preferable radiating effect.
Description of drawings
Fig. 1 is the perspective exploded view of the heat abstractor that the utility model disclosed.
Fig. 2 is one of schematic perspective view of the heat abstractor that the utility model disclosed.
Fig. 3 be heat abstractor shown in Figure 2 schematic perspective view two.
Decomposing schematic representation when Fig. 4 is used for heat abstractor that the utility model disclosed and electronic installation.
Fig. 5 is a schematic perspective view shown in Figure 4.
Embodiment
As shown in Figure 1, be the perspective exploded view of the heat abstractor that the utility model disclosed.The heat abstractor 100 that the utility model disclosed comprises a radiator 110, first, second heat- radiating substrate 120 and 130 and one heat pipe 140, wherein, above-mentioned first, second heat- radiating substrate 120 and 130 and above-mentioned radiator 110 be arranged at same horizontal plane, above-mentioned first heat-radiating substrate 120 is connected setting with above-mentioned radiator 110, and a wherein end of above-mentioned heat pipe 140 is connected in above-mentioned first, second heat- radiating substrate 120 and 130, and another end is connected in above-mentioned radiator 110.
Simultaneously, in conjunction with the schematic perspective view of Fig. 2 and the heat abstractor that the utility model disclosed 100 shown in Figure 3.Above-mentioned radiator 110 comprises a container cavity 112, a fan 116 and a radiating fin group 118, and said fans 116 is held and is arranged among the above-mentioned container cavity 112; A wherein side-walls of above-mentioned container cavity 112 offers an air-out guide groove 114, and above-mentioned radiating fin group 118 is arranged among the above-mentioned air-out guide groove 114; In addition, above-mentioned container cavity 112 also has a lower cover that can let in air 117, and lid invests a side of above-mentioned container cavity 112.Wherein, said fans 116 is a centrifugal fan.
Above-mentioned first, second heat-radiating substrate 120 and 130 is all for being made by metal material (such as metallic copper), the effect of having held concurrently and having supported and conduct heat, and its shape space structure that can adapt to the circuit board that is used with it is set to the metallic plate of square, polygon or other anomalistic object.Above-mentioned first, second heat-radiating substrate 120 and 130 is arranged at same horizontal plane, and both can connect or divide and are arranged.A wherein side of above-mentioned first heat-radiating substrate 120 is provided with one first copper billet 122, (be same as the side at above-mentioned first copper billet 122 places) on the side of above-mentioned second heat-radiating substrate 130 and be connected with second, third copper billet 132 and 134 that is separated from each other, above-mentioned first, second, third copper billet 122,132 and 134 all can directly be attached at the surface of heating electronic chip.
Above-mentioned heat pipe 140 is widely used in heat pipe in the cooling system for industry, and the one end is evaporation ends (fire end), and another end is condensation end (radiating end), at this enumeration no longer.A wherein end (condensation end) of above-mentioned heat pipe 140 is fixedly set in above-mentioned second heat-radiating substrate 130 another surface with respect to above-mentioned second, third copper billet 132 and 134 by a clip 150; And in above-mentioned first heat-radiating substrate 120 surfaces, be provided with first holding tank 124 that part is held above-mentioned heat pipe 140, above-mentioned heat pipe 140 parts are contained among the above-mentioned holding tank 124 on above-mentioned first heat-radiating substrate 120 surfaces; And a sidewall of the above-mentioned air-out guide groove 114 of above-mentioned radiator 110 is provided with second holding tank 115, and another end (evaporation ends) of above-mentioned heat pipe 140 holds and is arranged among above-mentioned second holding tank 115; And, above-mentioned second holding tank 115 is connected with above-mentioned air-out guide groove 114, so above-mentioned heat pipe 140 evaporation ends partly are attached at the surface that is arranged at the above-mentioned radiating fin group 118 in the above-mentioned air-out guide groove 114, and welding mode makes both fixedly connected settings.
Decomposing schematic representation when as shown in Figure 4 and Figure 5, heat abstractor that is respectively the utility model and is disclosed and electronic installation are used and assembling schematic diagram.
Electronic installation inside has the circuit board 200 (such as the mainboard of notebook) that can finish specific function, comprise on this circuit board 200 and have first of higher heating heat, the second and the 3rd electronic chip 210,220 and 230 (such as, above-mentioned first electronic chip 210 is a CPU, second, the 3rd electronic chip 220 and 230 is respectively south bridge and the north bridge chips on the mainboard of notebook), above-mentioned first, the second and the 3rd copper billet 122,132 and 134 are attached at above-mentioned first respectively, the second and the 3rd electronic chip 210,220 and 230 surface, as shown in Figure 5; And can be by lock member (not shown) such as screws with heat abstractor 100 of the present utility model and 200 lockings of foregoing circuit plate.
When electronic installation is in running order, above-mentioned first, second will produce heat and see through its outer surface with the 3rd electronic chip 210,220 and 230, above-mentioned first, second with surface attaching connection with it carries out heat exchange with the 3rd copper billet 122,132 and 134, and heat is by above-mentioned first, second heat-radiating substrate 120 and 130 backs and be passed to above-mentioned heat pipe 140; Because above-mentioned heat pipe 140 has the little advantage of thermal resistance, can fast heat be conducted to its radiating end; Heat conducts to the above-mentioned radiating fin group 118 that is connected with above-mentioned heat pipe 140 rapidly; Simultaneously, 116 of said fans have strengthened above-mentioned radiating fin group 118 surperficial speed air flows, quicken above-mentioned radiating fin group 118 surfaces and carry out heat exchange with outside air.
In sum, the structure of the heat abstractor that the utility model disclosed, it has taken all factors into consideration the requirement of the volume and the heat radiation power of heat abstractor, the electronic chip that can satisfy a plurality of high heatings in the electronic installation simultaneously dispels the heat, particularly a kind of heat abstractor that can satisfy high-power central processing unit of notebook computer and north and south bridge chip group.The heat abstractor that the utility model disclosed simple in structure, element is less, and easy to assembly, has preferable radiating effect.
Claims (4)
1. the structure of a heat abstractor is used with the electronic installation with high electronic chip that generates heat, and this heat abstractor comprises:
One heat pipe;
One radiator has a container cavity and is placed in the fan in this container cavity and is arranged at radiating fin group in the air-out guide groove that above-mentioned container cavity one side-walls offers, and one of above-mentioned heat pipe terminally is connected setting with this radiating fin group;
One first heat-radiating substrate, be connected setting with above-mentioned radiator, and a wherein side surface of this first heat-radiating substrate is provided with first holding tank that part is held above-mentioned heat pipe, one end portion of above-mentioned heat pipe is arranged in this first holding tank, the opposite side surface of this first heat-radiating substrate is provided with one first copper billet, it is characterized in that also comprising:
One second heat-radiating substrate, an end of above-mentioned heat pipe is fixedly set in the wherein side surface of this second heat-radiating substrate by clip, and another opposite flank is provided with second, third copper billet, and above-mentioned first, second and the 3rd copper billet are positioned at same horizontal plane.
2. the structure of heat abstractor as claimed in claim 1, it is characterized in that: above-mentioned first heat-radiating substrate is connected setting with second heat-radiating substrate.
3. the structure of heat abstractor as claimed in claim 1, it is characterized in that: above-mentioned first heat-radiating substrate separates setting with second heat-radiating substrate, a wherein end of above-mentioned heat pipe is fixedly set in a side surface of this second heat-radiating substrate by the said fixing button, another terminal fixedly connected above-mentioned radiating fin group.
4. as the structure of claim 1 or 2 or 3 described heat abstractors, it is characterized in that: a sidewall of the above-mentioned air-out guide groove of above-mentioned radiator is provided with second holding tank and is connected with above-mentioned air-out guide groove, so above-mentioned heat pipe one end holds and is arranged at above-mentioned second holding tank, and is attached at the surface of the above-mentioned radiating fin group in the above-mentioned air-out guide groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520120897 CN2872593Y (en) | 2005-12-22 | 2005-12-22 | Structure of radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520120897 CN2872593Y (en) | 2005-12-22 | 2005-12-22 | Structure of radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2872593Y true CN2872593Y (en) | 2007-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520120897 Expired - Fee Related CN2872593Y (en) | 2005-12-22 | 2005-12-22 | Structure of radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2872593Y (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101578027B (en) * | 2008-05-06 | 2011-07-13 | 华硕电脑股份有限公司 | Electronic device and radiating unit thereof |
| CN101453858B (en) * | 2007-12-07 | 2011-12-28 | 富准精密工业(深圳)有限公司 | Heat Radiation device |
| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| WO2018045933A1 (en) * | 2016-09-12 | 2018-03-15 | 华为技术有限公司 | Heat sink, heat dissipation apparatus, heat dissipation system and communication device |
| CN108922873A (en) * | 2018-07-02 | 2018-11-30 | 北京控制工程研究所 | A kind of radiating subassembly and mounting process for Spacecraft Electronic products C QFP device |
-
2005
- 2005-12-22 CN CN 200520120897 patent/CN2872593Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101453858B (en) * | 2007-12-07 | 2011-12-28 | 富准精密工业(深圳)有限公司 | Heat Radiation device |
| CN101578027B (en) * | 2008-05-06 | 2011-07-13 | 华硕电脑股份有限公司 | Electronic device and radiating unit thereof |
| CN106125872A (en) * | 2016-07-29 | 2016-11-16 | 华南理工大学 | A kind of bus type heat pipe type water-cooling heat radiating system |
| WO2018045933A1 (en) * | 2016-09-12 | 2018-03-15 | 华为技术有限公司 | Heat sink, heat dissipation apparatus, heat dissipation system and communication device |
| US11043442B2 (en) | 2016-09-12 | 2021-06-22 | Huawei Technologies Co., Ltd. | Heat sink, heat dissipation apparatus, heat dissipation system, and communications device |
| US11502019B2 (en) | 2016-09-12 | 2022-11-15 | Huawei Technologies Co., Ltd. | Heat sink, heat dissipation apparatus, heat dissipation system, and communications device |
| CN108922873A (en) * | 2018-07-02 | 2018-11-30 | 北京控制工程研究所 | A kind of radiating subassembly and mounting process for Spacecraft Electronic products C QFP device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070221 Termination date: 20111222 |