CN2727959Y - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN2727959Y CN2727959Y CN200420083051.7U CN200420083051U CN2727959Y CN 2727959 Y CN2727959 Y CN 2727959Y CN 200420083051 U CN200420083051 U CN 200420083051U CN 2727959 Y CN2727959 Y CN 2727959Y
- Authority
- CN
- China
- Prior art keywords
- radiator
- heat
- plate
- absorber plate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000006096 absorbing agent Substances 0.000 claims description 28
- 230000005855 radiation Effects 0.000 claims description 24
- 238000012546 transfer Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 9
- 239000004411 aluminium Substances 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Disclosed is a radiator, comprising a fixing base and a radiating body arranged on the fixing base. Wherein, the fixing base is composed of a radiating frame provided with a via hole, a heat absorbing plate and a heat transferring plate arranged on the heat absorbing plate, and the heat absorbing plate is fixed in the via hole of the radiating frame. Because the radiator of the utility model makes the heat absorbing plate and the heat transferring plate fixed in the radiating frame, different material can be chosen according to need of the heat absorbing plate, the heat transferring plate and the radiating frame for reducing the cost of the radiator.
Description
[technical field]
The utility model is about a kind of radiator, refers in particular to a kind of radiator that is applied to electronic component.
[background technology]
Along with developing rapidly of electronic industry, increase substantially as the arithmetic speed of electronic components such as central processing unit, the heat of its generation also increases severely thereupon, and how the heat with electronic component distributes, and to guarantee its normal operation, is the problem of industry in research always.For effectively distribute the heat that central processing unit produces in running, industry installs auxiliary its heat radiation of a radiator usually additional on the central processing unit surface, thereby makes central processing unit self temperature maintenance in normal range of operation.
Radiator commonly used is the aluminium extruded type radiator, it is at high temperature with half molten metal aluminium one extrusion molding, and make it have a flat body and, pass to radiating fin by the bulk absorption heat and further distribute again by the convex some radiating fins that stretch out of this body.Because heat passes to the radiating fin base by body, upwards conduct and then distribute along the fin body again, when the radiating fin longitudinal size was big, the regional temperature away from body on the radiating fin was lower, little with heat exchange amount on every side, the radiating fin utilance is not high.
For overcoming above-mentioned shortcoming, industry adopt "T"-shaped pedestal in case with heat transferred to the radiating fin in the zone away from body, thereby make full use of the performance that radiating fin heat radiation promotes radiator, correlation technique such as No. the 3269369th, TaiWan, China patent announcement exposure.This heat spreader structures also has its weak point, as being the raising heat dispersion, the material of "T"-shaped pedestal should be chosen the higher material of the coefficient of heat conduction such as copper, aluminium etc., the thermal conductivity ratio aluminium height of copper, but the density of copper is bigger than aluminium, choosing copper under equal volume can increase the weight of pedestal and cause the heater element load bigger, and the cost of copper is also higher relatively simultaneously; Though, can reduce the performance of radiator simultaneously and influence the operate as normal of heater element if choose aluminium and make weight and the cost that radiator can reduce pedestal.In addition, the heat that produces along with heater element constantly increases sharply, and this radiator relies on the thermal diffusion of metal to transmit heat merely, the heat that heater element produces can not be delivered to rapidly on the radiating fin away from the zone of body, can not satisfy the demand of heat radiation.
[summary of the invention]
The purpose of this utility model is to provide a kind of lower-cost radiator.
Further purpose of the present utility model is to provide a kind of pyroconductivity higher, the radiator that the heat that heater element produces can be lost rapidly.
The purpose of this utility model is achieved through the following technical solutions: radiator of the present utility model, comprise a holder and be located at radiator on this holder, wherein this holder comprises that one is provided with heat radiation frame, an absorber plate of through hole and is located at heat transfer plate on this absorber plate, and this absorber plate is fixed in the through hole on the heat radiation frame.
The utility model radiator also comprises at least one heat pipe, and this heat pipe is with absorber plate and heat transfer plate is hot is connected.
Because the utility model radiator is fixed in absorber plate and heat transfer plate in the heat radiation frame, so absorber plate, heat transfer plate can be selected different materials as required with the heat radiation frame, thereby make the cost reduction of radiator.In addition, because heat pipe is with absorber plate and heat transfer plate is hot is connected, thus the heat of absorber plate absorption can be passed to radiator rapidly, thus the pyroconductivity of raising radiator.
The utility model will be further described in conjunction with the embodiments with reference to the accompanying drawings.
[description of drawings]
Fig. 1 is the perspective exploded view of the utility model radiator one specific embodiment.
Fig. 2 is the perspective exploded view of holder among Fig. 1.
Fig. 3 is the schematic diagram after the assembling of Fig. 1.
[embodiment]
Referring to figs. 1 to Fig. 3, the utility model radiator 1 comprises one with the contacted holder 10 of heater element (not shown), is located at a some L-shaped heat pipe 20 and a radiator 30 on this holder 10, and the protective cover 40 of radiator 30.
This holder 10 comprise a heat radiation frame 18, an absorber plate 12 and with the perpendicular heat transfer plate 14 of this absorber plate 12.Absorber plate 12 and heat transfer plate 14 are selected higher material of the coefficient of heat conduction such as copper etc. for use, make by integral formation method.Be respectively equipped with some groove 16A, 16B in order to ccontaining heat pipe 20 on absorber plate 12 and heat transfer plate 14, heat pipe 20 is fixed in groove 16A, the 16B with interference fit or welding, mode such as bonding, thus with absorber plate 12 and 14 hot connections of heat transfer plate.In addition, also can heat transfer plate 14 be vertically fixed on the absorber plate 12 by alternate manners such as welding or screw connections.
Materials such as heat radiation frame 18 employing aluminium are made, though its coefficient of heat conduction is lower than absorber plate 12, its quality is lighter than adopting copper, and cost is also low than adopting copper.Heat radiation frame 18 upper surfaces are provided with some fin 15, and are provided with a through hole 17 in order to ccontaining absorber plate 12 in the central.Absorber plate 12 is fixed in the through hole 17 of heat radiation on the frame 18 in modes such as interference fit or welding, and directly contacts with heater element.During use, absorber plate 12 absorbs the heat that heater element produces, and a part of heat is passed to heat radiation frame 18 by itself and heat radiation frame 18 contact portions, accelerates heat dissipation and promotes radiating effect.
Radiator 30 is by welding or the both sides of mode is fixed in heat transfer plate 14 such as heat-conducting glue is bonding, and closely contacts with part that heat pipe 20 is positioned at groove 16A, thereby the heat of heat pipe 20 conduction can be lost rapidly.For avoiding radiator 30 and heat pipe 20 to be damaged; one protective cover 40 can be set outside radiator 30; by screw 44 pass the through hole 42 of protective cover 40 bottoms and heat radiation on the frame 18 fixing hole 19 and protective cover 40 is fixed on radiator 30 outsides, can avoid radiator 30 to be subjected to external impacts and promote the reliability of radiator 1.In addition, when when radiator 1 one sides are set up a fan auxiliary heat dissipation, protective cover 40 can play guide functions, and the air-flow that fan running is produced all flows through radiator 30, further strengthens radiating effect.
The utility model radiator 1 in use, the heat absorption that absorber plate 12 contacts with heater element and heater element is produced, absorber plate 12 is passed to the heat radiation frame 18 that joins with it with a part of heat and by the fin on the heat radiation frame 18 15 heat dissipation is fallen; Phase change and the thermal diffusion effect of heat transfer plate 14 of another part heat by heat pipe 20 passes to the radiator 30 on the heat transfer plate 14 rapidly and heat dissipation that heater element is produced falls.
Above-mentioned is a specific embodiment of the utility model radiator, but the utility model radiator is not limited in this, as shown in Figure 2, only be provided with fin 15, can set up fin to strengthen its radiating effect at heat radiation frame 18 side surfaces as required at heat radiation frame 18 upper surfaces; Also can increase the quantity of heat transfer plate 14, a plurality of heat transfer plates 14 are arranged parallel to each other, increase the quantity of heat pipe 20 simultaneously, thus the heat dissipation that can rapidly heater element be produced.
Claims (9)
1. radiator comprises a holder and is located at radiator on this holder, it is characterized in that: this holder comprises that one is provided with heat radiation frame, an absorber plate of through hole and is located at heat transfer plate on this absorber plate, and this absorber plate is fixed in the through hole on the heat radiation frame.
2. radiator as claimed in claim 1 is characterized in that: the pyroconductivity of this absorber plate frame height that dispels the heat.
3. radiator as claimed in claim 1 or 2 is characterized in that: this heat radiation frame adopts aluminium to make, and absorber plate and heat transfer plate all are made of copper.
4. radiator as claimed in claim 1 or 2 is characterized in that: this heat transfer plate is perpendicular to this absorber plate.
5. radiator as claimed in claim 4 is characterized in that: at least one L-shaped heat pipe is with absorber plate and heat transfer plate is hot is connected.
6. radiator as claimed in claim 1 or 2 is characterized in that: at least one heat pipe is with absorber plate and heat transfer plate is hot is connected.
7. radiator as claimed in claim 1 or 2 is characterized in that: this heat radiation frame table face is provided with some fin.
8. radiator as claimed in claim 1 or 2 is characterized in that: this radiator also comprises a protective cover, and this protective cover is located at the radiator outside.
9. radiator as claimed in claim 8; it is characterized in that: this protective cover comprises some through holes and is located in the interior screw of through hole; and corresponding through hole is provided with the plurality of fixed hole on the heat radiation frame, and above-mentioned screw passes through hole and fixing hole and protective cover is fixed on the heat radiation frame.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200420083051.7U CN2727959Y (en) | 2004-08-14 | 2004-08-14 | Radiator |
| US11/012,958 US20060032617A1 (en) | 2004-08-14 | 2004-12-14 | Heat sink electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200420083051.7U CN2727959Y (en) | 2004-08-14 | 2004-08-14 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2727959Y true CN2727959Y (en) | 2005-09-21 |
Family
ID=35043971
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200420083051.7U Expired - Fee Related CN2727959Y (en) | 2004-08-14 | 2004-08-14 | Radiator |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20060032617A1 (en) |
| CN (1) | CN2727959Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102221861A (en) * | 2010-04-14 | 2011-10-19 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN103344148A (en) * | 2013-07-10 | 2013-10-09 | 宁波司普瑞茵通信技术有限公司 | Heat exchanger core |
| CN107643806A (en) * | 2016-07-21 | 2018-01-30 | 联想（新加坡）私人有限公司 | Electronic equipment |
| CN108271332A (en) * | 2017-01-03 | 2018-07-10 | 广达电脑股份有限公司 | heat sink |
| CN108601194A (en) * | 2018-04-28 | 2018-09-28 | 芜湖超源力工业设计有限公司 | A kind of plastic housing plasma processor |
| CN112153879A (en) * | 2020-10-27 | 2020-12-29 | 厦门凯纳石墨烯技术股份有限公司 | Combined radiator |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100670273B1 (en) * | 2005-01-18 | 2007-01-16 | 삼성에스디아이 주식회사 | Heat dissipation assembly for plasma display device and plasma display device having same |
| CN100517665C (en) * | 2005-04-22 | 2009-07-22 | 富准精密工业(深圳)有限公司 | Heat-pipe radiating apparatus |
| US7866376B2 (en) * | 2007-10-29 | 2011-01-11 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device with U-shaped and S-shaped heat pipes |
| US7967059B2 (en) * | 2008-09-30 | 2011-06-28 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
| US20120305221A1 (en) * | 2011-06-02 | 2012-12-06 | Tsung-Hsien Huang | Heat pipe-attached heat sink |
| CN104602497B (en) * | 2015-01-19 | 2018-01-26 | 太仓市兴港金属材料有限公司 | A kind of processing technology of efficiently cabinet integration radiator |
| US11287192B2 (en) * | 2015-10-08 | 2022-03-29 | Furukawa Electric Co., Ltd. | Heat sink |
| CN108050496A (en) * | 2018-01-15 | 2018-05-18 | 深圳市天添智能云设备有限公司 | A kind of UVLED curing systems radiator |
| US11317539B2 (en) * | 2019-10-11 | 2022-04-26 | Arris Enterprises Llc | Hybrid heat sink |
| KR102379341B1 (en) * | 2020-02-28 | 2022-03-25 | 엘지전자 주식회사 | Apparatus for heatsink |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0779144B2 (en) * | 1992-04-21 | 1995-08-23 | インターナショナル・ビジネス・マシーンズ・コーポレイション | Heat-resistant semiconductor chip package |
| JP3942248B2 (en) * | 1997-02-24 | 2007-07-11 | 富士通株式会社 | Heat sink and information processing apparatus equipped with the same |
| US6021044A (en) * | 1998-08-13 | 2000-02-01 | Data General Corporation | Heatsink assembly |
| US6189601B1 (en) * | 1999-05-05 | 2001-02-20 | Intel Corporation | Heat sink with a heat pipe for spreading of heat |
| US6394175B1 (en) * | 2000-01-13 | 2002-05-28 | Lucent Technologies Inc. | Top mounted cooling device using heat pipes |
| TW543828U (en) * | 2001-07-12 | 2003-07-21 | Foxconn Prec Components Co Ltd | Assembly of heating-tube heat sink |
| TW511891U (en) * | 2002-03-13 | 2002-11-21 | Hon Hai Prec Ind Co Ltd | A heat dissipating device |
| US6625021B1 (en) * | 2002-07-22 | 2003-09-23 | Intel Corporation | Heat sink with heat pipes and fan |
| US7143819B2 (en) * | 2002-09-17 | 2006-12-05 | Hewlett-Packard Development Company, L.P. | Heat sink with angled heat pipe |
| US7059391B2 (en) * | 2004-04-09 | 2006-06-13 | Aavid Thermalloy, Inc. | Multiple evaporator heat pipe assisted heat sink |
| US6945319B1 (en) * | 2004-09-10 | 2005-09-20 | Datech Technology Co., Ltd. | Symmetrical heat sink module with a heat pipe for spreading of heat |
-
2004
- 2004-08-14 CN CN200420083051.7U patent/CN2727959Y/en not_active Expired - Fee Related
- 2004-12-14 US US11/012,958 patent/US20060032617A1/en not_active Abandoned
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102221861A (en) * | 2010-04-14 | 2011-10-19 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| CN103344148A (en) * | 2013-07-10 | 2013-10-09 | 宁波司普瑞茵通信技术有限公司 | Heat exchanger core |
| CN103344148B (en) * | 2013-07-10 | 2014-11-26 | 宁波司普瑞茵通信技术有限公司 | Heat exchanger core |
| CN107643806A (en) * | 2016-07-21 | 2018-01-30 | 联想（新加坡）私人有限公司 | Electronic equipment |
| CN107643806B (en) * | 2016-07-21 | 2020-12-04 | 联想（新加坡）私人有限公司 | Electronic device |
| CN108271332A (en) * | 2017-01-03 | 2018-07-10 | 广达电脑股份有限公司 | heat sink |
| CN108601194A (en) * | 2018-04-28 | 2018-09-28 | 芜湖超源力工业设计有限公司 | A kind of plastic housing plasma processor |
| CN112153879A (en) * | 2020-10-27 | 2020-12-29 | 厦门凯纳石墨烯技术股份有限公司 | Combined radiator |
Also Published As
| Publication number | Publication date |
|---|---|
| US20060032617A1 (en) | 2006-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050921 Termination date: 20130814 |