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CN2705251Y - Semiconductor IC plate main drilling bit with composite material - Google Patents

Semiconductor IC plate main drilling bit with composite material Download PDF

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Publication number
CN2705251Y
CN2705251Y CN 200420059811 CN200420059811U CN2705251Y CN 2705251 Y CN2705251 Y CN 2705251Y CN 200420059811 CN200420059811 CN 200420059811 CN 200420059811 U CN200420059811 U CN 200420059811U CN 2705251 Y CN2705251 Y CN 2705251Y
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CN
China
Prior art keywords
semiconductor
microbit
superhard alloy
base portion
drilling bit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
CN 200420059811
Other languages
Chinese (zh)
Inventor
林序庭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOP POINT TECHNOLOGY Co Ltd
Original Assignee
TOP POINT TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by TOP POINT TECHNOLOGY Co Ltd filed Critical TOP POINT TECHNOLOGY Co Ltd
Priority to CN 200420059811 priority Critical patent/CN2705251Y/en
Application granted granted Critical
Publication of CN2705251Y publication Critical patent/CN2705251Y/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Abstract

The utility model discloses a semiconductor IC plate micro drilling bit with composite material. The drill shank of the micro drilling bit comprises a stainless steel round rod. While the drill body comprises a superhard alloy round rod. Thus, the stainless steel round rod and the superhard alloy round rod can be welded in the abutting mode in a whole rod body. The further procedures of coarse grinding, crystal grinding, etc. are implemented on the drill body composed of the superhard alloy round rod. The base part and the drilling head of the micro drilling bit are molded. Thus, the semiconductor IC plate micro drilling bit with the perfect accuracy composed of the composite materials are formed and is economical and practical.

Description

Semiconductor IC board microbit with composite
Technical field
The utility model is about a kind of semiconductor IC board microbit structure with composite, especially refer to that a kind of stainless steel round bar and superhard alloy round bar adopted gives the germule that contraposition, welding constitute microbit, make the drillstock of microbit can be total to structure by two kinds of different metal materials by steps such as corase grind, crystalline substance mills and form, and reach the Practical Benefit that reduces cost with the brill body.
Background technology
Mostly the drill bit of being used to see was made with the high-speed steel material in the past, but because of the lower cause of limited high speed steel hardness, make the proportion of goods damageds of drill bit on using too high, must substitute new product often, cause operation interruption or phenomenons such as bore size accuracy error, misalignment, whole operating cost is improved.
Therefore, reduce drill bit overall losses rate effectively for asking, there is the dealer to adopt whole drill bit made with the tungsten carbon steel material, right this practice, though prolong the service life of drill bit effectively by the characteristic of tungsten carbon steel material high rigidity, but the cost that relatively also makes drill bit is subjected to selecting for use of tungsten carbon steel material and promotes, so for belonging to the drill bit of consumptive material, it is too high that its cost is still disliked.
Summary of the invention
The designer must be in this microbit in integral body the proportion of goods damageds and the materials cost between obtain the equalization point an of the best, create the semiconductor IC board microbit structure with composite of the present utility model eventually, use the service life of effective this microbit of lifting and reduce cost.
Main purpose of the present utility model, be to provide a kind of semiconductor IC board microbit structure with composite, this microbit mainly is total to structure and forms a drillstock and a brill body two parts by two kinds of different metal materials, order is bored and to be provided with one or the multistage base portion that is oblique cone shape between body and the drillstock, brill body surface forming in the base portion rear end has the spiral fluted bit head, and the diameter that makes bit head is the following size range of 0.25mm.The utility model adopts stainless steel round bar and superhard alloy round bar to give the germule of welding and contraposition formation microbit, make the drillstock of microbit can be total to structure by two kinds of different metal materials by steps such as corase grind, crystalline substance mills and form, and reach the Practical Benefit that promotes service life and reduce cost with the brill body.
Secondary objective of the present utility model, be to provide a kind of semiconductor IC board microbit structure with composite, the microbit germule that order is made of stainless steel round bar and superhard alloy round bar, further the drill body part branch that is constituted in the superhard alloy round bar imposes steps such as corase grind, brilliant mill, and mold the base portion and the bit head of microbit, if this is able to economic, practical compound materials and constitutes the splendid semiconductor IC board microbit of a durability.
Description of drawings
Fig. 1 is stereoscopic figure of the present utility model.
Fig. 2 is an exploded view of the present utility model.
Fig. 3 is the combination schematic diagram of the utility model welding and contraposition.
Fig. 4 forms the floor map of composite wood germule for the utility model.
Fig. 5 is the microbit processing schematic diagram one that is provided with the single-order base portion.
Fig. 6 is the microbit floor map that is provided with the single-order base portion.
Fig. 7 is the microbit processing schematic diagram two that is provided with the single-order base portion.
Fig. 8 is the microbit floor map that is provided with the second order base portion.
The specific embodiment
As shown in Figures 1 and 2, semiconductor IC board microbit with composite of the present utility model, mainly be that the superhard alloy round bar 20 that cuts the stainless steel round bar 10 of a suitable length and a designated length is base material, make a base material (can be chosen to be stainless steel round bar 10 or superhard alloy round bar 20) be able on the fixed jig that clamping is positioned fuse machine, and another base material is clamped on the rotating head of fuse machine, the axle that makes two base materials is exactly mutually corresponding on the straight line, the rotating head that makes fuse machine is turn and priming knee-action apace, allow the corresponding end face butt and produce the action (as shown in Figure 3) of accurate contraposition mutually of two base materials, so, even the contact end face of two base materials can produce the state of local welding through weld tabs 30 and scaling powder 301, after rotating head impulse effect constantly, make two base materials can be fused into one apace mutually, make stainless steel round bar 10 constitute the drillstock 1 of microbit, superhard alloy round bar 20 constitutes the composite wood germule 100 that microbit bores body 2, as shown in Figure 4.
Superhard alloy round bar with composite wood germule 100 1 ends imposes steps such as corase grind, brilliant mill for 20 sections again, the brill body 2 of microbit is molded have single order or the multistage base portion 21 that is oblique cone shape and a thin rod shape and have spiral fluted bit head 22, as Fig. 5 and shown in Figure 7.Like this, the semiconductor IC board microbit structure (as Fig. 6 and shown in Figure 8) that the utility model is done with composite, it mainly includes a brill body 2 that is made of the superhard alloy material drillstock 1 that stainless steel constituted and, body 2 is bored in order has single order or the multistage base portion 21 that is oblique cone shape in grinding near drillstock 1 place, and in the rear end of base portion 21 corase grind, crystalline substance wears into a thin rod shape and the surface has the bit head 22 of helicla flute 221, so, make microbit be total to structure by two kinds of different metal materials and form, can reach the Practical Benefit that promotes service life and reduce cost.
Moreover, the composition of aforementioned superhard alloy round bar 2, must asking of visual operation range of application and select different metal ingredients for use, all can implement such as superhard alloy materials such as tungsten carbide, titanium carbide, steel titanium carbides, so intactly grasped the use field of microbit, and be able to economic composition structure and make, make the manufacturing cost can be controlled effectively.
In addition, because of this semiconductor IC board microbit mainly is in the usefulness of bore operation for semiconductor IC board, so its length of boring body must long (about 38.1mm), and diameter dimension circle of drill bit is below 0.25mm, so, for for comparatively expensive superhard alloy, it is shared ratio on whole microbit, then can be controlled in the scope of boring body institute palpus length and diameter dimension, make manufacturing cost can control exactly and can not waste.Simultaneously, the drillstock 1 of this microbit rear end is because of it mainly is to use for clamping, so its selected material only is just enough for it with the stainless steel round bar 10 of par comparatively.
In addition, for guaranteeing that boring body still has a support strength when being ground to fine size, must be in boring the base portion 21 of body 2 near drillstock 1 place, with single order or the multistage slow size pattern of falling, reach best supporting role, so, when abrasive drill diameter dimension during greater than 0.25mm (as Fig. 5 and shown in Figure 6), get final product in boring the base portion 21 of only establishing the single order oblique cone shape on the body 2, and when abrasive drill diameter dimension circle during in the scope of 0.25mm~0.1mm, order is bored body 2 and is provided with the base portion 21 (as shown in Figures 7 and 8) that second order is oblique cone shape, if the abrasive drill diameter dimension during less than the size range of 0.1mm, then can make and bore body 2 and grind and have multistage oblique cone shape base portion 21 to come the progressively slow size drop that falls with drillstock 1.
In addition, because of the two the very big cause of fusing point gap of stainless steel round bar 10 and hard alloy round bar 20, make stainless steel round bar 10 and hard alloy round bar 20 when welding and contraposition, can be in folder contract one weld tabs 30 between the two, and fusing point circle that makes this weld tabs 30 is between the two, two side ends in weld tabs 30 respectively is coated with scaling powder 301 increase welding effects again, makes stainless steel round bar 10 and hard alloy round bar 20 can promptly be fused into one each other.

Claims (5)

1, a kind of semiconductor IC board microbit with composite, it is characterized in that, this microbit mainly is total to structure and forms a drillstock and a brill body two parts by two kinds of different metal materials, bore and to be provided with one or the multistage base portion that is oblique cone shape between body and the drillstock, brill body surface forming in the base portion rear end has the spiral fluted bit head, and the diameter of bit head is the following size range of 0.25mm.
2, the semiconductor IC board microbit with composite according to claim 1 is characterized in that, this single order or multistage base portion are constituted with slow pattern of falling size.
3, the semiconductor IC board microbit with composite according to claim 1 is characterized in that, this drillstock is partly made with stainless steel.
4, the semiconductor IC board microbit with composite according to claim 1 is characterized in that, this drill body part part is made with the superhard alloy material.
5, the semiconductor IC board microbit with composite according to claim 4 is characterized in that, this superhard alloy material is constituted by tungsten carbide metal.
CN 200420059811 2004-05-21 2004-05-21 Semiconductor IC plate main drilling bit with composite material Ceased CN2705251Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 200420059811 CN2705251Y (en) 2004-05-21 2004-05-21 Semiconductor IC plate main drilling bit with composite material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200420059811 CN2705251Y (en) 2004-05-21 2004-05-21 Semiconductor IC plate main drilling bit with composite material

Publications (1)

Publication Number Publication Date
CN2705251Y true CN2705251Y (en) 2005-06-22

Family

ID=34851925

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200420059811 Ceased CN2705251Y (en) 2004-05-21 2004-05-21 Semiconductor IC plate main drilling bit with composite material

Country Status (1)

Country Link
CN (1) CN2705251Y (en)

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C14 Grant of patent or utility model
GR01 Patent grant
C35 Partial or whole invalidation of patent or utility model
IW01 Full invalidation of patent right

Decision date of declaring invalidation: 20071207

Decision number of declaring invalidation: 10979