[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

CN2665920Y - 散热型pcb板 - Google Patents

散热型pcb板 Download PDF

Info

Publication number
CN2665920Y
CN2665920Y CNU2003201005531U CN200320100553U CN2665920Y CN 2665920 Y CN2665920 Y CN 2665920Y CN U2003201005531 U CNU2003201005531 U CN U2003201005531U CN 200320100553 U CN200320100553 U CN 200320100553U CN 2665920 Y CN2665920 Y CN 2665920Y
Authority
CN
China
Prior art keywords
pcb board
type pcb
utility
model
led
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNU2003201005531U
Other languages
English (en)
Inventor
王文峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Top Century Optoelectronics Technology Co Ltd
Original Assignee
Shenzhen Top Century Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Top Century Optoelectronics Technology Co Ltd filed Critical Shenzhen Top Century Optoelectronics Technology Co Ltd
Priority to CNU2003201005531U priority Critical patent/CN2665920Y/zh
Application granted granted Critical
Publication of CN2665920Y publication Critical patent/CN2665920Y/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Illuminated Signs And Luminous Advertising (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

本实用新型公开了一种散热型PCB板,其包括基板本体与绝缘层,其外形成形为正多边形,其一组对边上设有半圆形的定位孔,其上还设有两极性孔及一组固定LED芯片孔;使用时,将LED芯片置于固定孔中,本实用新型可根据需要拼凑成各种样式,与现有技术相比,本实用新型具有下列优点:解决了LED灯的散热问题,提升了LED芯片光转换率及强度;便于组装,可拼成大小不同的发光体;由于多组LED组装在一起,其亮度与单个比相当高,使其可替代照明或灯饰;耗电少,节省能源。

Description

散热型PCB板
技术领域
本实用新型涉及一种灯饰用品,尤指一种应用于LED芯片固定的大功率散热型PCB板。
背景技术
目前,LED灯的应用非常普遍,这样,其散热问题就逐渐突现出来,而现市场上所使用的铝基板大功率LED发光工板体,其不管是体积或面积都较大,组装起来极其不便。
实用新型内容
本实用新型的目的在于提供一种散热型PCB板,其体积与面积都小,且便于组装。
为实现上述目的,本实用新型的解决方案为:一种散热型PCB板,其包括基板本体与绝缘层,其外形成形为正多边形,其中一组对边上设有半园形的定位孔,其上还设有两极性孔及一组反射盖定位孔,另外,其上还设有装置LED芯片的中心孔。
所述的散热型PCB板,其正多边形为正六边形或正八边形。
所述的一组固定孔为四个。
所述的散热型PCB板,其固定孔内设有绝缘层。
采用上述结构后,与现有技术相比,本实用新型具有下列优点:
1、解决了LED灯的散热问题,提升了LED芯片光转换率及强度;
2、便于组装,可拼成大小不同的发光体;
3、由于多组LED组装在一起,其亮度与单个比相当高,使其可替代照明或灯饰;
4、耗电少,节省能源。
说明书附图
图1为本实用新型实施例一的结构示意图;
图2为本实用新型实施例二的结构示意图;
图3为本实用新型与反射盖配合时的立体分解图;
图4为本实用新型使用状态图一;
图5为本实用新型使用状态图二。
具体实施方式
如图1、2所示,本实用新型公开了一种散热型PCB板1,其包括基板本体11与绝缘层12,其外形成形为正多边形,其中:
所述的PCB板1,其一组对边13上设有半园形的定位孔14,便于组装,其上还设有两极性孔15便于焊接电源线,四个固定反射盖的定位孔16,便于安装不同的反射盖2,改变其发光角度及提升发光强度;
所述的正多边形为正六边形或正八边形;
所述的定位孔16内设有绝缘层12;
所述的散热型PCB板1上还设有中心孔17,其是装置LED芯片,用导线将LED芯片极性与PCB板极性对应连接,套上反射盖2;
使用时,如图3所示,将反射盖2的脚柱21插设于固定孔16中,将LED灯的极性接通电源即可,并且,本实用新型可根据需要,拼凑成如图4或图5所示的样式,其中,定位孔14一方面可增大散热面积,另一方面,使相邻PCB板间固定。
与现有技术相比,本实用新型具有下列优点:
1、解决了LED灯的散热问题,提升了LED芯片光转换率及强度;
2、便于组装,可拼成大小不同的发光体;
3、由于多组LED组装在一起,其亮度与单个比相当高,使其可替代照明或灯饰;
4、耗电少,节省能源。

Claims (5)

1、一种散热型PCB板,其特征在于:其包括基板本体与绝缘层,其外形成形为正多边形,其中一组对边上设有半园形的定位孔,其上还设有两极性孔及一组反射盖定位孔,另外,其上还设有装置LED芯片的中心孔。
2、如权利要求1所述的散热型PCB板,其特征在于:所述的正多边形为正六边形。
3、如权利要求1所述的散热型PCB板,其特征在于:所述的正多边形为正八边形。
4、如权利要求1、2或3所述的散热型PCB板,其特征在于:所述的固定孔为四个。
5、如权利要求4所述的散热型PCB板,其特征在于:固定孔内设有绝缘层。
CNU2003201005531U 2003-10-15 2003-10-15 散热型pcb板 Expired - Fee Related CN2665920Y (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2003201005531U CN2665920Y (zh) 2003-10-15 2003-10-15 散热型pcb板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2003201005531U CN2665920Y (zh) 2003-10-15 2003-10-15 散热型pcb板

Publications (1)

Publication Number Publication Date
CN2665920Y true CN2665920Y (zh) 2004-12-22

Family

ID=34339311

Family Applications (1)

Application Number Title Priority Date Filing Date
CNU2003201005531U Expired - Fee Related CN2665920Y (zh) 2003-10-15 2003-10-15 散热型pcb板

Country Status (1)

Country Link
CN (1) CN2665920Y (zh)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100359709C (zh) * 2005-06-09 2008-01-02 宁波雷登照明有限公司 快速散热白光大功率发光二极管
US7679918B2 (en) 2007-09-27 2010-03-16 Beijing Boe Optoelectronics Technology Co., Ltd. LED element and printed circuit board with the same
CN101534599B (zh) * 2008-03-14 2010-08-25 西安孚莱德光电科技有限公司 Led散热基板及其制造方法
CN102287677A (zh) * 2011-05-09 2011-12-21 深圳市华星光电技术有限公司 Led光源组件、背光模组及液晶显示装置
US8128263B2 (en) 2008-09-16 2012-03-06 Toshiba Lighting & Technology Corporation Light source unit and lighting apparatus having light-emitting diodes for light source
CN102588813A (zh) * 2011-01-18 2012-07-18 鸿富锦精密工业(深圳)有限公司 发光二极管灯条及其制造方法
CN103148460A (zh) * 2008-05-30 2013-06-12 东芝照明技术株式会社 基板、模块基板及照明器具
US8491163B2 (en) 2009-09-25 2013-07-23 Toshiba Lighting & Technology Corporation Lighting apparatus

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100359709C (zh) * 2005-06-09 2008-01-02 宁波雷登照明有限公司 快速散热白光大功率发光二极管
US7679918B2 (en) 2007-09-27 2010-03-16 Beijing Boe Optoelectronics Technology Co., Ltd. LED element and printed circuit board with the same
CN101400210B (zh) * 2007-09-27 2010-06-02 北京京东方光电科技有限公司 设有发光二极管的印刷电路板
CN101534599B (zh) * 2008-03-14 2010-08-25 西安孚莱德光电科技有限公司 Led散热基板及其制造方法
US8545051B2 (en) 2008-05-30 2013-10-01 Toshiba Lighting & Technology Corporation Lighting apparatus with heat conductive substrate
CN103148460A (zh) * 2008-05-30 2013-06-12 东芝照明技术株式会社 基板、模块基板及照明器具
US8556460B2 (en) 2008-05-30 2013-10-15 Toshiba Lighting & Technology Corporation Lighting apparatus and light-emitting element mounting substrate having stress absorbing means
US9279575B2 (en) 2008-05-30 2016-03-08 Kabushiki Kaisha Toshiba Light emitting module having heat conductive substrate
US9303855B2 (en) 2008-05-30 2016-04-05 Toshiba Lighting & Technology Corporation Light emitting module having heat conductive substrate
US9410685B2 (en) 2008-05-30 2016-08-09 Toshiba Lighting & Technology Corporation Light emitting module having heat conductive substrate
US8128263B2 (en) 2008-09-16 2012-03-06 Toshiba Lighting & Technology Corporation Light source unit and lighting apparatus having light-emitting diodes for light source
US8491163B2 (en) 2009-09-25 2013-07-23 Toshiba Lighting & Technology Corporation Lighting apparatus
CN102588813A (zh) * 2011-01-18 2012-07-18 鸿富锦精密工业(深圳)有限公司 发光二极管灯条及其制造方法
CN102287677A (zh) * 2011-05-09 2011-12-21 深圳市华星光电技术有限公司 Led光源组件、背光模组及液晶显示装置

Similar Documents

Publication Publication Date Title
CN2665920Y (zh) 散热型pcb板
CN200955716Y (zh) 高功率发光二极管灯串的灯座结构
CN200961839Y (zh) Led照明模块
CN2679890Y (zh) 具夜视功能的电源分接器
CN2851827Y (zh) 一种射灯
CN101046278A (zh) 大功率发光二极管灯具
CN201121838Y (zh) 一种导光板结构及应用这种导光板结构的台灯
CN201651981U (zh) 自动扶梯或自动人行道用led照明装置
CN203215359U (zh) Led大角度发光球泡灯
CN2842170Y (zh) 多功能照明装置
CN201121815Y (zh) Led嵌入灯结构
CN200982583Y (zh) Led光导照明装置
CN201606710U (zh) 一种高亮度led线灯
CN2851845Y (zh) 发光装置
CN2854306Y (zh) 灯具的光源单元的改良结构
CN2575420Y (zh) 庭院灯式照明结构
CN2679485Y (zh) 一种灯具
CN2821373Y (zh) 发光二极管面状光源模组
CN2802257Y (zh) 发光二极管装饰灯
CN211952443U (zh) 一种高防眩冷柜灯
CN200958731Y (zh) 节能灯组
CN2804586Y (zh) 长寿顶灯
CN207880629U (zh) 一种聚光led筒灯
CN201582756U (zh) 节能led日光灯
CN2680964Y (zh) 阅读用照明板

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20041222

Termination date: 20101015