CN2532521Y - CPU ground shrapnel - Google Patents
CPU ground shrapnel Download PDFInfo
- Publication number
- CN2532521Y CN2532521Y CN 01202271 CN01202271U CN2532521Y CN 2532521 Y CN2532521 Y CN 2532521Y CN 01202271 CN01202271 CN 01202271 CN 01202271 U CN01202271 U CN 01202271U CN 2532521 Y CN2532521 Y CN 2532521Y
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- Prior art keywords
- cpu
- circuit board
- printed circuit
- heat sink
- elastic part
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- Expired - Fee Related
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- 238000005452 bending Methods 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 2
- 239000010974 bronze Substances 0.000 claims description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000012634 fragment Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 6
- 230000005672 electromagnetic field Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 208000032365 Electromagnetic interference Diseases 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
一种CPU接地弹片，具有一本体，该本体的一端延伸弯折而形成一抵接部，而于该本体下段外侧面处具有一止挡部，且于该止挡部下方的本体内侧面处，具有一卡止部，藉此，将其插设于印刷电路板上的CPU附近处，当散热片组装在CPU上时，该抵接部即与散热片触接，并使散热片形成接地的状态，如此，便可有效降低CPU电磁干扰的问题。
A CPU grounding spring has a body, one end of which is extended and bent to form an abutting portion, and a stopper is provided on the outer side of the lower section of the body, and a locking portion is provided on the inner side of the body below the stopper, whereby the spring is inserted near the CPU on a printed circuit board. When a heat sink is assembled on the CPU, the abutting portion contacts the heat sink and grounds the heat sink, thereby effectively reducing the problem of CPU electromagnetic interference.
Description
本实用新型涉及一种接地弹片，特别是一种可有效降低印刷电路板上CPU电磁干扰问题的CPU接地弹片。The utility model relates to a grounding shrapnel, in particular to a CPU grounding shrapnel which can effectively reduce the problem of CPU electromagnetic interference on a printed circuit board.
科技发展日新月异，数字电子产品已与我们的生活密不可分，例如，计算机、通讯产品或影音产品等。这些产品为提高品质及功能，操作频率越来越高，然而，高频所产生的电磁污染亦严重地威胁飞行、通讯或住家安全。With the rapid development of science and technology, digital electronic products are inseparable from our life, such as computers, communication products or audio-visual products. In order to improve the quality and function of these products, the operating frequency is getting higher and higher. However, the electromagnetic pollution generated by the high frequency also seriously threatens the safety of flight, communication or home.
有鉴于此，各国政府对于电子电机产品的“电磁兼容性(EMC，Electro MagneticCompatibility)”均严加管制，故如何在电子产品的开发过程中，快速取得各国“电磁兼容性”认证，亦为重要课题之一。In view of this, the governments of various countries strictly control the "EMC (Electro Magnetic Compatibility)" of electronic and electrical products, so how to quickly obtain the "EMC" certification of various countries in the development process of electronic products is also important. one of the subjects.
随着操作频率日渐提高，中央处理器(CPU)内含的晶体管已达到数百万个的组合，频率已达GHz(109Hz)，再加上极大功率消耗，故CPU运作时已造成极大的高频电磁干扰问题。As the operating frequency increases day by day, the transistors contained in the central processing unit (CPU) have reached millions of combinations, and the frequency has reached GHz (10 9 Hz). Great high frequency electromagnetic interference problem.
此外，因CPU运作时会产生高热，故需加装散热片，藉以将热快速散出，但CPU因高速运作时所产生的电磁场，却容易因散热片与CPU间的寄生电容(Parastic Capacitor)耦合(Coupling)至散热片上，再经由散热片的天线效应而幅射出来，造成严重的电磁干扰(EMI，Electro Magnetic Interference)问题。In addition, because the CPU generates high heat during operation, it is necessary to install a heat sink to dissipate the heat quickly. However, the electromagnetic field generated by the CPU during high-speed operation is easily caused by the parasitic capacitance (Parastic Capacitor) between the heat sink and the CPU. Coupling to the heat sink, and then radiating out through the antenna effect of the heat sink, causing serious electromagnetic interference (EMI, Electro Magnetic Interference) problems.
因此，若要解决以上的问题，较好的方式可将散热片接地，以屏蔽CPU所幅射的电磁场；虽可将散热片以锁螺丝方式与印刷电路板形成接地，但就组装的角度来考量，其拆装费时且对使用者而言较不方便。Therefore, in order to solve the above problems, a better way is to ground the heat sink to shield the electromagnetic field radiated by the CPU; Considering that the assembly and disassembly is time-consuming and inconvenient for users.
有鉴于此，本实用新型的主要目的，便在于解决上述的缺失，避免缺失的存在，本实用新型藉由多个设于印刷电路板CPU周缘的金属片体，当散热片组装于CPU上时，即同时与本实用新型作抵接，便能轻易达到接地的目的。In view of this, the main purpose of this utility model is to solve the above-mentioned deficiency and avoid the existence of the deficiency. The utility model uses a plurality of metal sheets arranged on the periphery of the printed circuit board CPU. When the heat sink is assembled on the CPU , that is, to abut against the utility model at the same time, the purpose of grounding can be easily achieved.
本实用新型的另一目的，在于利用插件式(Dip)或表面粘着技术(SMD)或其它适合的方式(如焊接或夹持)，将其与印刷电路板结合，以达易于组装的目的。Another purpose of the present invention is to combine it with the printed circuit board by using Dip or surface mount technology (SMD) or other suitable methods (such as soldering or clamping), so as to achieve the purpose of easy assembly.
本实用新型提供了一种CPU接地弹片，其具有一本体，该本体的一端延伸弯折而形成一抵接部，在该本体下段外侧面处具有一止挡部，且于该止挡部下方的本体内侧面处，具有一卡止部，藉此，将其插设于印刷电路板上的CPU附近处，当散热片组装于CPU上时，该抵接部与散热片触接，使散热片接地。The utility model provides a CPU grounding shrapnel, which has a body, one end of the body is extended and bent to form an abutment portion, and a stop portion is provided on the outer surface of the lower section of the body, and the stop portion is located below the stop portion. There is a locking part on the inner side of the main body, so that it can be inserted near the CPU on the printed circuit board. When the heat sink is assembled on the CPU, the abutment part will contact the heat sink to make the heat dissipation chip ground.
本实用新型还提供了一种降低CPU电磁干扰的印刷电路板，其包括一印刷电路板及多个插设于该印刷电路板上CPU周缘的弹片等构件，当散热片组装于CPU上时，该弹片即与散热片接触，形成接地状态，其特在于：该弹片具有一本体，该本体的一端延伸弯折形成一抵接部，该本体下段外侧面处具有一止挡部，且于该止挡部下方的本体内侧面处，具有一卡止部，藉此，将其插设于印刷电路板上的CPU附近处，散热片组装于CPU上时，会将弹片的抵接部略为压掣，藉由该抵接部的弹性力，使得抵接部与散热片接触的部分更加密合，以屏蔽CPU所幅射的电磁场。The utility model also provides a printed circuit board for reducing CPU electromagnetic interference, which includes a printed circuit board and a plurality of components such as shrapnel inserted on the periphery of the CPU on the printed circuit board. When the heat sink is assembled on the CPU, The shrapnel is in contact with the heat sink to form a grounded state. It is characterized in that: the shrapnel has a body, one end of the body is extended and bent to form an abutting portion, and the outer surface of the lower section of the body has a stop portion. There is a locking part on the inner side of the body below the stopper, so that it can be inserted near the CPU on the printed circuit board. When the heat sink is assembled on the CPU, the contact part of the shrapnel will be slightly pressed. By virtue of the elastic force of the abutting portion, the contact portion of the abutting portion and the heat sink is more tightly sealed, so as to shield the electromagnetic field radiated by the CPU.
有关本实用新型的详细说明及技术内容，现就配合图式说明如下：Relevant detailed description and technical content of the utility model, now just explain as follows with respect to coordinating drawing:
图1-1系本实用新型的外观立体示意图；Fig. 1-1 is the three-dimensional schematic diagram of the appearance of the utility model;
图1-2系本实用新型的侧视示意图；Fig. 1-2 is the side view schematic diagram of the utility model;
图2-1系本实用新型的使用状态示意图一；Figure 2-1 is a schematic view of the utility model in use;
图2-2系本实用新型的使用状态示意图二；Fig. 2-2 is the use status schematic diagram two of the utility model;
图2-3系本实用新型的使用状态示意图三；Fig. 2-3 is the use status schematic diagram three of the utility model;
图2-4系本实用新型的使用状态示意图四；Fig. 2-4 is the use state schematic diagram four of the utility model;
图2-5系本实用新型的使用状态示意图五。Fig. 2-5 is the use status schematic diagram five of the utility model.
零件标号说明1本体 11抵接部 12止挡部 13卡止部 14间隙2印刷电路板 21CPU 22插孔 3散热片
请参阅图1-1、1-2所示，本实用新型是由金属片体(如铍铜、磷青铜、不锈钢等)一体弯折而成为一本体1，该本体1的一端延伸弯折而形成一抵接部11，在该本体下段，系经由冲压破折的方式，形成一向本体1外侧面处弯折的止挡部12，且于该止挡部12下方，亦利用冲压的方式，形成一向本体1内侧面弯折的卡止部13，且该止挡部12与卡止部13间具有适当的间隙14。Please refer to Figures 1-1 and 1-2, the utility model is formed by bending a metal sheet (such as beryllium copper, phosphor bronze, stainless steel, etc.) into a
如图2-1、2-2、2-3、2-4和2-5所示，该印刷电路板2上的CPU21周缘处，设有多个贯穿印刷电路板2的插孔22，藉以供本实用新型插置，当本实用新型使用插件式(Dip)的方式组固于印刷电路板2上时，首先，将本体1的底端对准插孔22插入，此时，该卡止部13会略为压缩，待卡止部13通过插孔22后，会回复至预设的状态，并形成卡止的状态，且由于上述的间隙13恰等于印刷电路板2的厚度时，该止挡部12即恰抵止于印刷电路板2的顶面，如此，藉由该卡止部13与止挡部12即可使本实用新型固定插置于印刷电路板2上CPU21的周缘，而亦可使用表面粘着技术(SMD)或焊接的方式，让本实用新型组固于印刷电路板2的CPU周缘上。As shown in Figures 2-1, 2-2, 2-3, 2-4 and 2-5, at the periphery of the
此时，当散热片3组装于CPU21上时，散热片3会与抵接部11相触接，并将抵接部11略为压掣，而使散热片3形成接地的状态，且藉由该抵接部11的弹性恢复力，让抵接部11与散热片3接触的部分更加密合，以增加其导电(通)性，如此即可有效屏蔽CPU所幅射的电磁场，并达到降低电磁幅射的目的。At this time, when the
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01202271 CN2532521Y (en) | 2001-02-22 | 2001-02-22 | CPU ground shrapnel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01202271 CN2532521Y (en) | 2001-02-22 | 2001-02-22 | CPU ground shrapnel |
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| Publication Number | Publication Date |
|---|---|
| CN2532521Y true CN2532521Y (en) | 2003-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01202271 Expired - Fee Related CN2532521Y (en) | 2001-02-22 | 2001-02-22 | CPU ground shrapnel |
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| Country | Link |
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| CN (1) | CN2532521Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104460882A (en) * | 2014-11-25 | 2015-03-25 | 成都众智新思科技有限公司 | Minimized module based on loongson 2H processor |
| CN113137138A (en) * | 2020-01-17 | 2021-07-20 | 茂旭资讯股份有限公司 | Magnetic lock with elastic pushing piece to eliminate residual magnetism |
-
2001
- 2001-02-22 CN CN 01202271 patent/CN2532521Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104460882A (en) * | 2014-11-25 | 2015-03-25 | 成都众智新思科技有限公司 | Minimized module based on loongson 2H processor |
| CN113137138A (en) * | 2020-01-17 | 2021-07-20 | 茂旭资讯股份有限公司 | Magnetic lock with elastic pushing piece to eliminate residual magnetism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |