CN222073469U - A flexible circuit board with an isolation shielding layer - Google Patents
A flexible circuit board with an isolation shielding layer Download PDFInfo
- Publication number
- CN222073469U CN222073469U CN202420287633.4U CN202420287633U CN222073469U CN 222073469 U CN222073469 U CN 222073469U CN 202420287633 U CN202420287633 U CN 202420287633U CN 222073469 U CN222073469 U CN 222073469U
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- layer
- circuit board
- flexible circuit
- insulating
- insulating substrate
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- 238000002955 isolation Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 239000010410 layer Substances 0.000 claims description 218
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 230000002093 peripheral effect Effects 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000004888 barrier function Effects 0.000 claims 1
- 239000007769 metal material Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
本实用新型公开了一种带隔离屏蔽层的柔性线路板，包括绝缘基材层、第一电路走线层和第二电路走线层，所述第一电路走线层和第二电路走线层分别设置于所述绝缘基材层的双侧表面上；所述绝缘基材层内嵌入有隔离屏蔽层。该柔性线路板带有隔离屏蔽层，可避免位于绝缘基材双侧表面上的电路走线层之间产生电磁干扰。
The utility model discloses a flexible circuit board with an isolation shielding layer, comprising an insulating substrate layer, a first circuit routing layer and a second circuit routing layer, wherein the first circuit routing layer and the second circuit routing layer are respectively arranged on the double-side surfaces of the insulating substrate layer; and the isolation shielding layer is embedded in the insulating substrate layer. The flexible circuit board is provided with an isolation shielding layer, which can avoid electromagnetic interference between the circuit routing layers located on the double-side surfaces of the insulating substrate.
Description
Technical Field
The present utility model relates to circuit board technology, and in particular, to a flexible circuit board.
Background
A flexible circuit board, also called a flexible printed circuit board or FPC for short, is a special printed circuit board, which is made of a flexible insulating substrate, has many advantages not possessed by a rigid printed circuit board, and its main characteristics include excellent electrical properties, high reliability, excellent flexibility, and high wiring density. The flexible circuit board can be freely bent, rolled and folded, and can bear millions of dynamic bending without damaging the wires. The flexible circuit board can be arranged randomly according to the space layout requirement and can move and stretch randomly in the three-dimensional space, so that the integration of component assembly and wire connection is achieved. The flexible circuit board has light weight, thin thickness and good flexibility, can greatly reduce the volume and weight of electronic products, and meets the requirements of the development of the electronic products in the directions of high density, miniaturization and high reliability.
Flexible circuit boards are of various types, such as single-sided, double-sided, and multi-layer boards, in which a circuit trace layer is printed on only a single-sided surface of an insulating substrate, while in double-sided or multi-layer boards, a circuit trace layer is printed on both-sided surfaces of an insulating substrate at the same time.
Because the double-sided board or the multi-layer board is printed with the circuit wiring layers on the two side surfaces of the insulating substrate, electromagnetic interference can be generated between the circuit wiring layers on the two sides, and the signal stability is affected.
Disclosure of utility model
In order to solve the above-mentioned shortcomings of the prior art, the present utility model provides a flexible circuit board with an isolation shielding layer, which can avoid electromagnetic interference between circuit trace layers on two side surfaces of an insulating substrate.
The technical problems to be solved by the utility model are realized by the following technical scheme:
The flexible circuit board with the isolation shielding layer comprises an insulating substrate layer, a first circuit wiring layer and a second circuit wiring layer, wherein the first circuit wiring layer and the second circuit wiring layer are respectively arranged on the surfaces of two sides of the insulating substrate layer; and an isolation shielding layer is embedded in the insulating substrate layer.
Further, the isolation shielding layer comprises a conductive film layer.
Further, the conductive film layer is a metal film layer.
Further, the conductive film layer is a conductive copper foil layer or a conductive silver film layer.
Further, the insulating substrate layer is provided with a through hole penetrating through the isolation shielding layer, an insulating layer is arranged on the inner wall of the through hole, and the first circuit wiring layer and the second circuit wiring layer are electrically connected through the through hole.
Further, the insulating substrate layer has a shielding region and a peripheral region, the peripheral region surrounding the shielding region; the insulating substrate layer comprises a first substrate layer and a second substrate layer, the isolation shielding layer is positioned in a shielding area between the first substrate layer and the second substrate layer, and the peripheral area between the first substrate layer and the second substrate layer is fixedly connected; the first circuit routing layer and the second circuit routing layer are at least partially routed within the shielded region.
Further, the flexible circuit board further comprises a first insulating film layer, and the first insulating film layer is arranged on the surface of one side, back to the insulating substrate layer, of the first circuit wiring layer.
Further, the flexible circuit board further comprises a first adhesive layer, and the first adhesive layer is arranged between the first insulating film layer and the first circuit wiring layer.
Further, the flexible circuit board further comprises a second insulating film layer, and the second insulating film layer is arranged on the surface of one side, back to the insulating substrate layer, of the second circuit wiring layer.
Further, the flexible circuit board further comprises a second adhesive layer, and the second adhesive layer is arranged between the second insulating film layer and the second circuit wiring layer.
The utility model has the following beneficial effects: according to the flexible circuit board, the isolation shielding layer is embedded in the insulating substrate layer, and electromagnetic signals generated by the first circuit wiring layer and the second circuit wiring layer during operation are shielded by the isolation shielding layer, so that electromagnetic interference between the first circuit wiring layer and the second circuit wiring layer on the two side surfaces of the insulating substrate is avoided, and the signal stability of the first circuit wiring layer and the second circuit wiring layer is improved.
Drawings
Fig. 1 is a schematic diagram of a stacking structure of a flexible circuit board according to the present utility model.
Fig. 2 is a schematic diagram of a stacking structure of another flexible circuit board according to the present utility model.
Detailed Description
The present utility model is described in detail below with reference to the drawings and the embodiments, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", or a third "may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, or can be communicated between two elements or the interaction relationship between the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
Example 1
As shown in fig. 1, a flexible circuit board with an isolation shielding layer 101 includes an insulating substrate layer 100, a first circuit wiring layer 200 and a second circuit wiring layer 500, wherein the first circuit wiring layer 200 and the second circuit wiring layer 500 are respectively disposed on two side surfaces of the insulating substrate layer 100; the insulating base layer 100 has an isolation shielding layer 101 embedded therein.
According to the flexible circuit board, the isolation shielding layer 101 is embedded in the insulating substrate layer 100, and electromagnetic signals generated by the first circuit wiring layer 200 and the second circuit wiring layer 500 during operation are shielded by utilizing the isolation shielding layer 101, so that electromagnetic interference between the first circuit wiring layer 200 and the second circuit wiring layer 500 on the two side surfaces of the insulating substrate is avoided, and the signal stability of the first circuit wiring layer 200 and the second circuit wiring layer 500 is improved.
In this embodiment, the insulating substrate layer 100 may be, but is not limited to, a PET substrate layer 100, a PI substrate layer 100, a PVC substrate layer 100, or the like.
The isolation shield 101 includes a conductive film layer.
The conductive film layer may absorb and reflect electromagnetic waves through its conductive material to limit the propagation of electromagnetic waves within a certain range, thereby reducing the amount of electromagnetic signals generated by the first circuit trace layer 200 propagating onto the second circuit trace layer 500, and reducing the amount of electromagnetic signals generated by the second circuit trace layer 500 propagating onto the first circuit trace layer 200, thereby controlling signal interference between the first circuit trace layer 200 and the second circuit trace layer 500.
The conductive film layer may be made of a conductive material such as metal, metal mesh, conductive cloth, or the like. These materials have good conductivity and can effectively absorb and reflect electromagnetic waves. Conductive shields are typically mounted in the housing, cable, etc. of electronic devices to provide protection against electromagnetic interference.
Preferably, the conductive film layer may be made of a metal material, for example, a metal film layer made of a metal material, and the metal material has good conductivity and can effectively absorb and reflect electromagnetic waves.
In this embodiment, the conductive film layer is a conductive copper foil layer or a conductive silver film layer.
The insulating base material layer 100 has a shielding region and a peripheral region, the peripheral region surrounding outside the shielding region; the insulating substrate layer 100 comprises a first substrate layer 102 and a second substrate layer 103, the isolation shielding layer 101 is positioned in a shielding area between the first substrate layer 102 and the second substrate layer 103, and the peripheral area between the first substrate layer 102 and the second substrate layer 103 is fixedly connected; the first circuit trace layer 200 and the second circuit trace layer 500 are at least partially disposed within the shielded region.
When the insulating substrate layer 100 is prepared, a copper substrate is formed into a film in a shielding region of the first substrate layer 102 or the second substrate layer 103 by electroplating or by screen printing silver paste, so as to form the conductive copper foil layer or the conductive silver film layer, then the second substrate layer 103 or the first substrate layer 102 is covered on one side surface of the first substrate layer 102 or the second substrate layer 103 with the conductive copper foil layer or the conductive silver film layer, and finally the peripheral region between the first substrate layer 102 and the second substrate layer 103 is fixedly connected by hot melting or bonding.
The flexible circuit board further comprises a first insulating film layer 400 and a second insulating film layer 700, wherein the first insulating film layer 400 is disposed on a side surface of the first circuit routing layer 200 facing away from the insulating substrate layer 100, and the second insulating film layer 700 is disposed on a side surface of the second circuit routing layer 500 facing away from the insulating substrate layer 100.
In this embodiment, the first insulating film layer 400 and the second insulating film layer 700 may be, but not limited to, a PET film layer, a PI film layer, a PVC film layer, or the like, and the first insulating film layer 400 and the second insulating film layer 700 are used for protecting the first circuit routing layer 200 and the second circuit routing layer 500, respectively.
One of the first insulating film layer 400 and the second insulating film layer 700 is provided with a first windowing region (not shown in the figure) at one end of the flexible circuit board, and the first wiring circuit layer or the second wiring circuit layer is exposed in the first windowing region to form a first PIN (not shown in the figure); the other one of the first insulating film layer 400 and the second insulating film layer 700 is provided with a second window opening area (not shown in the figure) at the other end of the flexible circuit board, and the first wiring circuit layer or the second wiring circuit layer is exposed in the second window opening area to form a second PIN (not shown in the figure).
Preferably, the flexible circuit board is welded with an electrical connector on at least one of the first PIN and the second PIN, so as to be electrically connected with the hard circuit board through the electrical connector.
The flexible circuit board further includes a first adhesive layer 300 and a second adhesive layer 600, where the first adhesive layer 300 is disposed between the first insulating film layer 400 and the first circuit routing layer 200, and the second adhesive layer 600 is disposed between the second insulating film layer 700 and the second circuit routing layer 500.
The first insulating film layer 400 and the first circuit routing layer 200 are adhered and fixed by the first adhesive layer 300, and the second insulating film layer 700 and the second circuit routing layer 500 are adhered and fixed by the second adhesive layer 600.
In this embodiment, the first adhesive layer 300 and the second adhesive layer 600 may be, but are not limited to, double-sided adhesive or epoxy resin.
Example two
As an optimization scheme of the first embodiment, in this embodiment, as shown in fig. 2, the insulating substrate layer 100 is provided with a through hole 110 penetrating through the isolation shielding layer 101, an insulating layer 120 is disposed on an inner wall of the through hole 110, and the first circuit routing layer 200 and the second circuit routing layer 500 are electrically connected through the through hole 110.
The flexible circuit board of the present utility model is formed by forming the through hole 110 in the insulating substrate layer 100, and the first circuit routing layer 200 or the second circuit routing layer 500 is electrically connected with the second circuit routing layer 500 or the first circuit routing layer 200 on the other side surface of the insulating substrate layer 100 by routing the through hole 110 to the other side surface, so as to form a complete circuit structure together; the insulating layer 120 on the inner wall of the through hole 110 is used for separating the first circuit routing layer 200 and the second circuit routing layer 500 from the embedded isolation shielding layer 101, so as to avoid shorting the conductive film layer with the first circuit routing layer 200 and the second circuit routing layer 500 when the isolation shielding layer 101 adopts the conductive film layer.
In this embodiment, the insulating layer 120 may be, but not limited to, insulating green oil, and is formed on the inner wall of the through hole 110 by silk screen printing.
Finally, it should be noted that the foregoing embodiments are merely for illustrating the technical solution of the embodiments of the present utility model and are not intended to limit the embodiments of the present utility model, and although the embodiments of the present utility model have been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the embodiments of the present utility model may be modified or replaced with the same, and the modified or replaced technical solution may not deviate from the scope of the technical solution of the embodiments of the present utility model.
Claims (10)
1. The flexible circuit board with the isolation shielding layer comprises an insulating substrate layer, a first circuit wiring layer and a second circuit wiring layer, wherein the first circuit wiring layer and the second circuit wiring layer are respectively arranged on the surfaces of two sides of the insulating substrate layer; the insulating substrate is characterized in that an insulating shielding layer is embedded in the insulating substrate layer.
2. The flexible circuit board of claim 1 wherein the isolation barrier comprises a conductive film layer.
3. The flexible circuit board of claim 2 wherein the conductive film layer is a metal film layer.
4. A flexible circuit board according to claim 2 or 3, wherein the conductive film layer is a conductive copper foil layer or a conductive silver film layer.
5. A flexible circuit board according to claim 2 or 3, wherein the insulating substrate layer is provided with a through hole penetrating through the isolation shielding layer, an insulating layer is provided on an inner wall of the through hole, and the first circuit wiring layer and the second circuit wiring layer are electrically connected through the through hole.
6. The flexible circuit board of claim 1 wherein the insulating substrate layer has a shielding region and a peripheral region, the peripheral region surrounding the shielding region; the insulating substrate layer comprises a first substrate layer and a second substrate layer, the isolation shielding layer is positioned in a shielding area between the first substrate layer and the second substrate layer, and the peripheral area between the first substrate layer and the second substrate layer is fixedly connected; the first circuit routing layer and the second circuit routing layer are at least partially routed within the shielded region.
7. The flexible circuit board of claim 1, further comprising a first insulating film layer disposed on a side surface of the first circuit trace layer facing away from the insulating substrate layer.
8. The flexible circuit board of claim 7, further comprising a first adhesive layer disposed between the first insulating film layer and the first circuit trace layer.
9. The flexible circuit board of claim 1, 7 or 8, further comprising a second insulating film layer disposed on a side surface of the second circuit trace layer facing away from the insulating substrate layer.
10. The flexible circuit board of claim 9, further comprising a second adhesive layer disposed between the second insulating film layer and the second circuit trace layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420287633.4U CN222073469U (en) | 2024-02-07 | 2024-02-07 | A flexible circuit board with an isolation shielding layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420287633.4U CN222073469U (en) | 2024-02-07 | 2024-02-07 | A flexible circuit board with an isolation shielding layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222073469U true CN222073469U (en) | 2024-11-26 |
Family
ID=93557588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420287633.4U Active CN222073469U (en) | 2024-02-07 | 2024-02-07 | A flexible circuit board with an isolation shielding layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222073469U (en) |
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2024
- 2024-02-07 CN CN202420287633.4U patent/CN222073469U/en active Active
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| GR01 | Patent grant |