CN222022492U - Thermal management system, cold and warm box device and vehicle - Google Patents

Abstract

The application provides a thermal management system, a cold and warm box device and a vehicle. The thermal management system is applied to the cold and warm box, and the cold and warm box comprises a box body and a semiconductor piece arranged on the box body; the heat management system comprises a heat exchanger component, wherein the heat exchanger component is arranged on one side of the semiconductor wafer and is positioned on the outer side of the box body; the heat exchanger component comprises a heat exchanger and a throttling piece which are assembled integrally, the heat exchanger and the throttling piece are located on the same side of the semiconductor wafer, and the heat exchanger is attached to the semiconductor wafer. Through the heat exchanger and the throttling piece which are integrally assembled, the heat exchanger assembly is simple in structure and convenient to assemble, the volume of the whole heat management system is reduced, and the structure is compact; through the semiconductor fin of locating the box, and heat exchanger and semiconductor fin laminate mutually, utilized the high characteristic of heat exchange efficiency of semiconductor fin and through reducing the volume of whole thermal management system, further shortened the heat transfer route to improve thermal management system's heat transfer effect.

Description

Thermal management system, cold and warm box device and vehicle

Technical Field

The present application relates to the field of thermal management, and in particular, to a thermal management system, a cold and warm box device, and a vehicle.

Background

The thermal management technology plays an important role in temperature regulation and control in the automobile industry, so that the safe use of the automobile is ensured, and the cold and warm box on the automobile is used as equipment needing temperature regulation, and the thermal management technology of the automobile is also needed. In the related art, the cold and warm box exchanges heat through the heat management system, and the heat management system has large occupied area, complex structure, difficult installation and low heat exchange effect due to large volume and complex pipelines.

Disclosure of utility model

The application provides a thermal management system, a cold and warm box device and a vehicle, which have the advantages of small volume, simple structure, easy installation and good heat exchange effect.

The application provides a thermal management system which is applied to a cold and warm box, wherein the cold and warm box comprises a box body and a semiconductor piece arranged on the box body; the thermal management system comprises a heat exchanger assembly, wherein the heat exchanger assembly is arranged on one side of the semiconductor wafer and is positioned on the outer side of the box body; the heat exchanger assembly comprises a heat exchanger and a throttling element which are assembled integrally, the heat exchanger and the throttling element are located on the same side of the semiconductor wafer, and the heat exchanger is attached to the semiconductor wafer.

Optionally, the thermal management system includes at least one heat dissipation assembly disposed on a side of the heat exchanger remote from the semiconductor die; and/or the heat dissipation component is arranged on one side of the semiconductor piece far away from the heat exchanger and is positioned in the box body.

Optionally, the heat dissipation assembly includes a heat sink and at least one fan disposed on a peripheral side of the heat sink.

Optionally, the number of the fans is set to be multiple, and multiple fans are located on the same side of the radiating fin.

Optionally, the heat sink includes a plurality of heat dissipation ports, and the fan is located at the heat dissipation ports.

Optionally, the radiating fin and the heat exchanger are integrally formed; and/or integrally assembled.

Optionally, the thermal management system includes a controller electrically connected to the throttle and the heat dissipation assembly; the cold and warm box comprises a first operation condition and a second operation condition; when the cold and warm box is in the first operation working condition, the controller controls the throttling element to be opened and controls the heat dissipation assembly to be closed; when the cold and warm box is in the second operation working condition, the controller controls the heat dissipation assembly to be opened and controls the throttling element to be closed; wherein the load of the first operating condition is greater than the load of the second operating condition.

Optionally, the cold-warm box comprises a plurality of semiconductor sheets, and the semiconductor sheets are arranged on the periphery of the box body; the thermal management system comprises a plurality of heat exchanger assemblies, and the plurality of heat exchanger assemblies are arranged corresponding to the plurality of semiconductor chips.

Optionally, a circulation pipeline is arranged in the heat exchanger, the throttling element comprises an inlet and an outlet, and the inlet and the outlet are respectively communicated with the circulation pipeline and are positioned on the same side of the circulation pipeline.

Optionally, the throttle member comprises an electronic expansion valve.

The application also provides a cold and warm box device, comprising:

The cold and warm box comprises a box body and a semiconductor piece arranged on the box body; and

The aforementioned thermal management system.

The present application also provides a vehicle including: the foregoing said a cold and warm box device.

According to the heat management system, the cold and warm box device and the vehicle, through the heat exchanger and the throttling piece which are integrally assembled, the heat exchanger assembly is simple in structure and convenient to assemble, the volume of the whole heat management system is reduced, and the structure is compact; through the semiconductor fin of locating the box, and heat exchanger and semiconductor fin laminate mutually, utilized the high characteristic of heat exchange efficiency of semiconductor fin and through reducing the volume of whole thermal management system, further shortened the heat transfer route to improve thermal management system's heat transfer effect.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description, serve to explain the principles of the disclosure.

FIG. 1 is a schematic diagram illustrating one embodiment of a thermal management system of the present application.

FIG. 2 is a schematic diagram of yet another embodiment of a thermal management system of the present application.

FIG. 3 is a schematic diagram of another embodiment of a thermal management system of the present application.

FIG. 4 is a schematic diagram of yet another embodiment of a thermal management system of the present application.

FIG. 5 is a schematic diagram illustrating one embodiment of a heat exchanger assembly and a heat dissipating assembly of the thermal management system of the present application.

FIG. 6 is a schematic diagram of yet another embodiment of a heat exchanger assembly and a heat dissipating assembly of the thermal management system of the present application.

FIG. 7 is a schematic diagram of another embodiment of a heat exchanger assembly and a heat dissipating assembly of the thermal management system of the present application.

FIG. 8 is a schematic diagram of one embodiment of a heat exchanger of the thermal management system of the present application.

FIG. 9 is a schematic block diagram of a controller of the thermal management system of the present application.

Reference numerals illustrate:

A cold and warm box device 10; a cold and warm box 100; a thermal management system 200; a controller 300; a case 1; a semiconductor wafer 2; a heat absorbing surface 21; a heat radiating surface 22; a heat exchanger assembly 3; a heat exchanger 31; a flow line 311; a throttle 32; an inlet 321; an outlet 322; a heat dissipation assembly 4; a heat sink 41; a blade 411; a heat sink 412; a fan 42.

Detailed Description

The technical solutions in the embodiments (or "implementations") of the present application will be clearly and completely described herein with reference to the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated.

If there are terms (e.g., upper, lower, left, right, front, rear, inner, outer, top, bottom, center, vertical, horizontal, longitudinal, lateral, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.) related to directional indications or positional relationships in embodiments of the present application, such terms are used solely to explain the relative positional relationships, movement, etc. between the components in a particular pose (as shown in the drawings); if the particular gesture changes, the directional indication or positional relationship changes accordingly. In addition, the terms "first", "second", etc. in the embodiments of the present application are used for descriptive convenience only and are not to be construed as indicating or implying relative importance.

The application provides a thermal management system, a cold and warm box device and a vehicle, wherein the thermal management system is applied to the cold and warm box, and the cold and warm box comprises a box body and a semiconductor sheet arranged on the box body; the heat management system comprises a heat exchanger component, wherein the heat exchanger component is arranged on one side of the semiconductor wafer and is positioned on the outer side of the box body; the heat exchanger component comprises a heat exchanger and a throttling piece which are assembled integrally, the heat exchanger and the throttling piece are located on the same side of the semiconductor wafer, and the heat exchanger is attached to the semiconductor wafer. Through the heat exchanger and the throttling piece which are integrally assembled, the heat exchanger assembly is simple in structure and convenient to assemble, the volume of the whole heat management system is reduced, and the structure is compact; through the semiconductor fin of locating the box, and heat exchanger and semiconductor fin laminate mutually, utilized the high characteristic of heat exchange efficiency of semiconductor fin and through reducing the volume of whole thermal management system, further shortened the heat transfer route to improve thermal management system's heat transfer effect.

The application provides a thermal management system, a cold and warm box device and a vehicle. The thermal management system, the cold and warm box device and the vehicle of the present application will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic diagram illustrating one embodiment of a thermal management system 200 of the present application. In the embodiment shown in fig. 1, the vehicle includes a cold box apparatus 10. The cold box apparatus 10 includes a cold box 100 and a thermal management system 200. The heat management system 200 is used for adjusting the temperature of the cold and warm box 100 and exchanging heat with the cold and warm box 100. The cold and warm box 100 may be a vehicle-mounted cold and warm box. The cooling and heating box 100 includes a box body 1 and a semiconductor wafer 2 provided in the box body 1. In the present embodiment, the semiconductor wafer 2 is provided between the inner wall of the case 1 and the outer wall of the case 1. In other embodiments, the semiconductor wafer 2 may be disposed on the outer wall of the case 1 or on the inner wall of the case 1, but is not limited thereto. In this embodiment, the semiconductor wafer 2 may be a thermoelectric refrigerator, and may be a semiconductor material, for example, a Peltier element, which forms a temperature difference by using a thermoelectric effect generated when an electric current flows through the semiconductor material. The semiconductor wafer 2 is arranged, the volume is smaller, the noise is low, and the vehicle-mounted use is convenient. When an electric current flows into the semiconductor wafer 2, one side of the semiconductor wafer 2 is a heat absorbing surface 21, and the other side is a heat dissipating surface 22. The magnitude of the current can be controlled by a power supply to thereby adjust the temperature of the heat absorbing surface 21 of the semiconductor wafer 2. In the present embodiment, the side of the semiconductor wafer 2 close to the inner wall of the case 1 is a heat absorbing surface 21, and the side close to the outer wall of the case 1 is a heat dissipating surface 22. In other embodiments, the cold and warm box 100 may be switched from the cooling mode to the heating mode by switching the anode and cathode of the semiconductor wafer 2, and at this time, the side of the semiconductor wafer 2 close to the inner wall of the box 1 is the heat dissipation surface 22, and the side close to the outer wall of the box 1 is the heat absorption surface 21. With this arrangement, the cooling and heating modes of the cold and warm box 100 can be simply switched. The heat exchanger assembly 3 of the thermal management system 200 is provided at one side of the semiconductor wafer 2 and is located outside the cabinet 1. The heat exchanger assembly 3 is used for exchanging heat with the cold and warm box 100 through a fluid medium, and the fluid medium can be a refrigerant or the like. This arrangement makes the heat exchanger assembly 3 easy to assemble with other components. In some embodiments, the thermal management system 200 further comprises a compressor, other heat exchanger, etc., which in turn is connected to the heat exchanger assembly 3 via the compressor and other heat exchangers, thereby allowing the fluid medium to circulate therethrough and exchange heat. In some embodiments, the compressor and other heat exchangers may be an all-vehicle compressor and an all-vehicle heat exchanger of a vehicle.

In the embodiment shown in fig. 1, the thermal management system 200 is applied to the cold and warm box 100. The cold and warm box 100 is used to meet the storage requirement of low temperature or high temperature by switching the cooling mode and the heating mode. The thermal management system 200 includes a heat exchanger assembly 3, the heat exchanger assembly 3 being disposed on one side of the semiconductor wafer 2 and outside the case 1. Wherein the heat exchanger assembly 3 comprises an integrally assembled heat exchanger 31 and a throttle 32. In this embodiment, the heat exchanger 31 and the throttling element 32 are integrally assembled, and the heat exchanger 31 and the throttling element 32 may be integrated into a complete unit, or the heat exchanger 31 and the throttling element 32 may be disassembled. In this embodiment, the heat exchanger 31 may be an evaporator, and may be a microchannel evaporator. In this embodiment, the throttle 32 comprises an electronic expansion valve. The electronic expansion valve is easy to control, convenient to adjust and low in cost. The heat exchanger 31 and the throttle member 32 are located on the same side of the semiconductor wafer 2, and the heat exchanger 31 is bonded to the semiconductor wafer 2. By the arrangement, the heat exchanger 31 and the throttling element 32 which are integrally assembled, the heat exchanger assembly 3 has simple structure, is convenient to assemble, reduces the volume of the whole thermal management system 200, and has compact structure; through locating the semiconductor wafer 2 of box 1, and heat exchanger 31 laminating mutually with semiconductor wafer 2, utilized the high characteristic of heat exchange efficiency of semiconductor wafer 2 and through reducing the volume of whole thermal management system 200, further shortened the heat transfer route to improve the heat transfer effect of thermal management system 200.

FIG. 2 is a schematic diagram of yet another embodiment of a thermal management system 200 of the present application. In the embodiment shown in fig. 2, thermal management system 200 includes at least one heat sink assembly 4. The heat dissipation assembly 4 is used for dissipating heat. In the present embodiment, the heat dissipation assembly 4 is provided with one. In other embodiments, the heat dissipation assembly 4 may be provided with two, three, etc., and the number is not limited thereto. The heat dissipation assembly 4 is provided on the side of the heat exchanger 31 remote from the semiconductor wafer 2. In the present embodiment, the heat dissipating assembly 4 is located at the outside of the cold and warm box 100, and the heat dissipating assembly 4 is used to dissipate heat at the outside of the cold and warm box 100. By this arrangement, the heat exchange efficiency outside the cooling/heating box 100 can be improved, and the heat dissipation mode of the heat management system 200 can be enriched.

FIG. 3 is a schematic diagram of another embodiment of a thermal management system 200 of the present application. In the embodiment shown in fig. 3, the heat dissipating assembly 4 is provided on the side of the semiconductor fin 2 remote from the heat exchanger 31 and is located within the case 1. In the present embodiment, the heat dissipation component 4 is disposed on the inner wall of the case 1 and is close to the semiconductor wafer 2. The heat dissipation assembly 4 is located at the inner side of the cold and warm box 100, and the heat dissipation assembly 4 is used for dispersing heat of the inner side of the cold and warm box 100. By this arrangement, the heat exchange efficiency inside the cooling/heating box 100 can be improved, and the heat dissipation mode of the heat management system 200 can be enriched.

FIG. 4 is a schematic diagram of yet another embodiment of a thermal management system 200 of the present application. In the embodiment shown in fig. 4, the heat dissipation assembly 4 is disposed on the side of the heat exchanger 31 away from the semiconductor fin 2, and the heat dissipation assembly 4 is disposed on the side of the semiconductor fin 2 away from the heat exchanger 31 and within the case 1. In the present embodiment, two heat dissipating members 4 are provided, the heat dissipating member 4 located at the outside of the cold and warm box 100 is used to dissipate heat at the outside of the cold and warm box 100, and the heat dissipating member 4 located at the inside of the cold and warm box 100 is used to dissipate heat at the inside of the cold and warm box 100. By this arrangement, the heat exchange efficiency between the inside and the outside of the cooling/heating box 100 can be improved, and the heat dissipation mode of the heat management system 200 can be enriched. In some embodiments, the cooling and heating box 100 includes a plurality of semiconductor chips 2, and the plurality of semiconductor chips 2 are provided on the peripheral side of the box body 1. In the present embodiment, the semiconductor wafer 2 is provided as one, but may be provided as two, three, four, or the like in other numbers, not limited thereto. The thermal management system 200 includes a plurality of heat exchanger assemblies 3, and the plurality of heat exchanger assemblies 3 are disposed corresponding to the plurality of semiconductor wafers 2. In the present embodiment, the heat exchanger assembly 3 is provided as one. In other embodiments, when the number of semiconductor wafers 2 is set to two, the number of heat exchanger assemblies 3 is set to two. The heat exchanger assembly 3 corresponds to the number of semiconductor wafers 2. So set up, can increase or reduce corresponding heat exchanger subassembly 3 and semiconductor wafer 2 according to the heat transfer demand of different cold and warm boxes 100 to when satisfying the heat transfer demand, reduce the energy consumption.

Fig. 5 is a schematic diagram illustrating one embodiment of a heat exchanger assembly 3 and a heat sink assembly 4 of a thermal management system 200 of the present application. In the embodiment shown in fig. 5, the heat dissipation assembly 4 includes a heat dissipation plate 41 and at least one fan 42 provided on a peripheral side of the heat dissipation plate 41. The heat sink 41 is used for heat dissipation, and the fan 42 is used for accelerating the heat exchange speed. So set up, improve heat exchange efficiency, utilize fan 42 to conveniently control the heat transfer. In the present embodiment, the fin 41 is integrally formed with the heat exchanger 31. So set up, the structure is more stable, and the radiating effect is better. In other embodiments, the fins 41 are integrally assembled with the heat exchanger 31. So set up, be convenient for the dismantlement and the equipment of fin 41 and heat exchanger 31, convenient operation.

Fig. 6 is a schematic diagram of yet another embodiment of a heat exchanger assembly 3 and a heat sink assembly 4 of a thermal management system 200 of the present application. In the embodiment shown in fig. 6, the heat sink 41 includes a plurality of heat dissipation ports 412. The fan 42 is located at the heat sink 412. In the present embodiment, the heat sink 41 sequentially includes a plurality of fins 411 disposed at intervals from top to bottom, the heat dissipation openings 412 are located between the fins 411 at intervals, and the fan 42 is located at the heat dissipation openings 412 and disposed on the peripheral side of the heat dissipation assembly 4. So set up, guarantee that fan 42 can the furthest accelerate heat transfer rate, improve heat exchange efficiency. In some embodiments, the number of fans 42 is set to be plural. In the present embodiment, two fans 42 are provided. In other embodiments, the fans 42 may be provided in one, three, four, etc., the number being not limited thereto. A plurality of fans 42 are located on the same side of the heat sink 41. So set up, guarantee that the heat of fin 41 can evenly dispel, and the heat is dispelled towards the same side of fin 41, convenient heat management.

Fig. 7 is a schematic diagram of another embodiment of a heat exchanger assembly 3 and a heat sink assembly 4 of a thermal management system 200 of the present application. FIG. 8 is a schematic diagram of one embodiment of a heat exchanger 31 of a thermal management system 200 of the present application. In the embodiment shown in fig. 7 and 8, a flow line 311 is provided in the heat exchanger 31. The flow line 311 is used for flowing a fluid medium. The throttle 32 includes an inlet 321 and an outlet 322, and the inlet 321 and the outlet 322 are respectively communicated with the circulation pipeline 311 and are positioned on the same side of the circulation pipeline 311. So set up, make things convenient for the equipment and the dismantlement of other pipelines of throttling element 32, the operation is more convenient. In this embodiment, the fluid medium enters the flow line 311 through the inlet 321 of the restriction 32 and then through the outlet 322 of the restriction 32. In this embodiment, the fluid medium flows in the direction indicated by the arrow shown in the figure when passing through the flow line 311. In some embodiments, the flow-through pipeline 311 may be a U-shaped pipeline, a Z-shaped pipeline, etc., but may also be other types of pipelines, without being limited thereto. By the arrangement, the path of the fluid medium in the circulation pipeline 311 is prolonged, so that the fluid medium is ensured to be contacted with the heat exchanger 31 as much as possible, and the heat exchange efficiency is improved. In the present embodiment, the circulation pipe 311 is laid on the inner surface of the heat exchanger 31, and the circulation pipe 311 is laid as full as possible on the inner surface of the heat exchanger 31. By the arrangement, the fluid medium can pass through the circulation pipeline 311 as much as possible, and heat exchange is more uniform.

Fig. 9 is a functional block diagram of a controller 300 of the thermal management system 200 of the present application. In the embodiment shown in fig. 4 and 9, thermal management system 200 includes a controller 300. The controller 300 may be a system controller 300. The controller 300 is electrically connected to the throttle 32 and the heat dissipation assembly 4. The controller 300 is used to control the operation of the throttle 32 and the heat sink assembly 4. The cold and warm box 100 includes a first operating condition and a second operating condition. The first operation condition is a high load state, which refers to a working state of the cold and warm box 100 in a higher temperature environment or when a large amount of food is stored, and the required energy consumption is high; the second operating condition is a low load condition, which refers to an operating condition of the cold and warm box 100 in a lower temperature environment or when less food is stored, and the required energy consumption is lower relative to the first operating condition. When the cold and warm box 100 is in the first operation condition, the controller 300 controls the throttle 32 to be opened and controls the heat dissipation assembly 4 to be closed. In this embodiment, when the cold and warm box 100 is in the cooling mode and the cold and warm box 100 is in the first operation condition, the semiconductor fin 2 is cooled, the fluid medium enters the inlet 321 of the throttling element 32 after passing through the compressor and other components, the heat is transferred from the heat absorbing surface 21 to the heat dissipating surface 22 of the semiconductor fin 2 through the circulation pipeline 311 of the throttling element 32 and the outlet 322 of the throttling element 32, and the heat is exchanged with the heat exchanger 31 through the heat dissipating surface 22 of the semiconductor fin 2, so as to be transferred to the fluid medium, and the fluid medium enters other heat exchanging components for heat management to exchange heat, and the heat dissipating assembly 4 is not operated. So arranged, when the energy consumption of the cold and warm box 100 is high, the throttle 32 needs to be opened to accelerate the heat exchange efficiency. When the cold and warm box 100 is in the second operation condition, the controller 300 controls the heat dissipating assembly 4 to be opened and controls the throttle 32 to be closed. Wherein the load of the first operating condition is greater than the load of the second operating condition. In the present embodiment, when the cold and warm box 100 is in the cooling mode and the cold and warm box 100 is in the second operation condition, the semiconductor fin 2 is cooled, and heat is transferred to the heat dissipation assembly 4 through the semiconductor fin 2, so that the heat dissipation is performed on the semiconductor fin 2 by the fan 42, and the throttle member 32 is closed. So arranged, when the energy consumption of the cold and warm box 100 is low, the heat radiation assembly 4 needs to be opened, thereby ensuring the heat exchange efficiency under low energy consumption. Through switching the working condition of throttling element 32 and radiator module 4, can satisfy the heat transfer of the different operating modes of cold and warm case 100, when satisfying the heat transfer demand, avoid the energy consumption too high.

It should be noted that the technical solutions or technical features described in the above embodiments may be combined or supplemented with each other without generating a conflict. The scope of the present application is not limited to the exact structures described in the above embodiments and shown in the accompanying drawings; modifications, equivalents, improvements, etc. which fall within the spirit and principles of the application are intended to be included within the scope of the application.

Claims (10)

1. The thermal management system is characterized by being applied to a cold and warm box, wherein the cold and warm box comprises a box body and a semiconductor piece arranged on the box body; the thermal management system comprises a heat exchanger assembly, wherein the heat exchanger assembly is arranged on one side of the semiconductor wafer and is positioned on the outer side of the box body; the heat exchanger assembly comprises a heat exchanger and a throttling element which are assembled integrally, the heat exchanger and the throttling element are located on the same side of the semiconductor wafer, and the heat exchanger is attached to the semiconductor wafer.

2. The thermal management system of claim 1, wherein the thermal management system comprises at least one heat sink assembly disposed on a side of the heat exchanger remote from the semiconductor die; and/or the heat dissipation component is arranged on one side of the semiconductor piece far away from the heat exchanger and is positioned in the box body.

3. The thermal management system of claim 2, wherein the heat dissipating assembly comprises a heat sink and at least one fan disposed on a peripheral side of the heat sink.

4. A thermal management system according to claim 3, wherein the number of fans is plural, a plurality of said fans being located on the same side of said heat sink; and/or

The radiating fin comprises a plurality of radiating ports, and the fan is positioned at the radiating ports.

5. The thermal management system of claim 3, wherein the fins are integrally formed with the heat exchanger; and/or integrally assembled.

6. The thermal management system of claim 2, wherein the thermal management system comprises a controller electrically connected to the throttle, the heat sink assembly; the cold and warm box comprises a first operation condition and a second operation condition; when the cold and warm box is in the first operation working condition, the controller controls the throttling element to be opened and controls the heat dissipation assembly to be closed; when the cold and warm box is in the second operation working condition, the controller controls the heat dissipation assembly to be opened and controls the throttling element to be closed; wherein the load of the first operating condition is greater than the load of the second operating condition.

7. The thermal management system of claim 1, wherein the cold and warm box comprises a plurality of the semiconductor chips, the plurality of semiconductor chips being provided on a peripheral side of the box body; the thermal management system comprises a plurality of heat exchanger assemblies, and the plurality of heat exchanger assemblies are arranged corresponding to the plurality of semiconductor chips.

8. The thermal management system of claim 1, wherein a flow line is disposed within the heat exchanger, the throttling element comprising an inlet and an outlet, the inlet and the outlet being in communication with the flow line, respectively, and on a same side of the flow line; and/or

The throttle member includes an electronic expansion valve.

9. A cold and warm box apparatus, comprising:

The cold and warm box comprises a box body and a semiconductor piece arranged on the box body; and

The thermal management system of any one of claims 1 to 8.

10. A vehicle, characterized by comprising: the cold and warm box apparatus of claim 9.