CN221930320U - Electronic equipment - Google Patents
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- CN221930320U CN221930320U CN202323551470.0U CN202323551470U CN221930320U CN 221930320 U CN221930320 U CN 221930320U CN 202323551470 U CN202323551470 U CN 202323551470U CN 221930320 U CN221930320 U CN 221930320U
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- electronic device
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- main board
- emitting element
- light emitting
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- 230000001681 protective effect Effects 0.000 claims description 7
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 4
- 239000006260 foam Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 description 22
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application discloses an electronic device. The electronic device comprises a main board; the main board is arranged in the shell; the bracket is arranged between the main board and the shell and comprises a first area and a second area, the second area at least partially surrounds the first area, and the thickness of the first area is smaller than that of the second area; the circuit board is arranged on one side of the bracket facing the shell and/or one side of the bracket facing the main board; and the functional element is arranged on the circuit board and corresponds to the first area. The electronic equipment provided by the application can effectively reduce the local heating condition of the electronic equipment.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to electronic equipment.
Background
Electronic devices generally include a screen assembly, a motherboard support, and a housing stacked along a thickness direction thereof, and a gap is provided between the motherboard and the motherboard support and between the motherboard support and the housing, wherein air in the gap can slow down a transfer speed of heat generated by an electronic device on the motherboard to the housing.
However, when the functional element is arranged between the main board support and the shell, for example, a flash lamp, the concentration between the main board and the shell through each part on the heat transfer path of the position where the functional element is located is higher, and the gap is smaller, so that the heat generated by the electronic device on the main board is easily transferred to the outside of the shell through the heat transfer path of the position where the functional element is located, and the temperature of the position where the functional element is located is higher, thereby generating local heating.
Disclosure of utility model
The electronic equipment provided by the application can effectively reduce the local heating condition of the electronic equipment.
The application provides an electronic device, wherein the electronic device comprises:
A main board;
The main board is arranged in the shell;
The bracket is arranged between the main board and the shell and comprises a first area and a second area, the second area at least partially surrounds the first area, and the thickness of the first area is smaller than that of the second area;
The circuit board is arranged on one side of the bracket facing the shell and/or one side of the bracket facing the main board;
And the functional element is arranged on the circuit board and corresponds to the first area.
The electronic device as described above, wherein the first region is penetrating in a direction perpendicular to the holder.
The electronic device as described above, wherein the support has a blind hole concavely formed on at least one side surface thereof, and a projection of the blind hole coincides with a projection of the first region along a direction perpendicular to the support.
The electronic device as described above, wherein the support includes a deformation portion, the deformation portion deforms toward a direction approaching the motherboard, a concave portion is formed on a side of the support facing the housing, a convex portion is formed on a side of the support facing the motherboard, the first region is located at the deformation portion, and the circuit board and the functional element are disposed in the concave portion.
According to the electronic equipment, the electronic components and the shielding cover are arranged on one side, facing the support, of the main board, the shielding cover and the main board are enclosed to form the sealing cavity, and at least part of the electronic components are located in the sealing cavity;
the shield cover is provided with a sinking groove, and the sinking groove is opposite to the deformation part.
The electronic device as described above, wherein the functional element includes a light emitting element, a through hole is formed in the housing, a lampshade is embedded in the through hole, and the light emitting element corresponds to the lampshade along the first direction.
According to the electronic device, the side, facing the light-emitting element, of the lampshade is provided with the avoidance groove, the avoidance groove is recessed in the direction away from the support, and the projection of the light-emitting element along the direction perpendicular to the support falls into the projection of the avoidance groove along the direction perpendicular to the support.
The electronic device as described above, wherein a peripheral edge of the light emitting element is provided with a protection element, and the protection element corresponds to the first area.
The electronic device as described above, wherein the protective member is made of foam, and the protective member is formed with an opening at one side in the circumferential direction of the light emitting element.
The electronic device as described above, wherein the projection of the light emitting element and the projection of the shielding element fall into the projection of the lamp housing in a direction perpendicular to the housing.
According to the electronic equipment provided by the application, the thickness of the first area of the bracket is smaller than that of the second area, and the functional element corresponds to the first area, so that the size of a gap formed between the functional element and the shell and/or between the functional element and the main board can be effectively increased, the density of each part is reduced, and the gap is filled with air which is an excellent medium for preventing heat transfer, so that the heat transfer efficiency of heat on a heat transfer path of the functional element can be effectively reduced, the temperature of the functional element is reduced, and the local heating condition of the electronic equipment is reduced.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are needed to be used in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of an electronic device provided by the present application;
FIG. 2 is an exploded view of an electronic device provided by the present application;
fig. 3 is another schematic structural diagram of the electronic device provided by the present application;
FIG. 4 is another exploded view of an electronic device provided by the present application;
Fig. 5 is a schematic view of a partial structure of a stand of an electronic device according to the present application;
fig. 6 is another schematic partial structure of a stand of an electronic device according to the present application;
Fig. 7 is a schematic view of a partial structure of a shielding case of an electronic device according to the present application;
Fig. 8 is another schematic partial structure of a shielding case of an electronic device according to the present application;
Fig. 9 is a schematic structural diagram of a lampshade of the electronic device according to the present application;
fig. 10 is another schematic structural view of a lampshade of the electronic device according to the present application;
fig. 11 is a schematic structural diagram of functional elements of an electronic device according to the present application;
Fig. 12 is another schematic structural diagram of functional elements of the electronic device provided by the present application.
Reference numerals illustrate:
1. A main board; 2. a housing; 21. a through hole; 3. a bracket; 31. a first region; 32. a second region; 33. a deformation portion; 4. a circuit board; 5. a functional element; 51. a light emitting element; 52. a protective element; 521. an opening; 6. an electronic component; 7. a shield; 71. sinking grooves; 8. a lamp shade; 81. an avoidance groove; 82. a pattern; 9. a screen assembly; x, thickness direction.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The arrow X indicating the direction drawn in the drawing indicates the thickness direction of the electronic device.
As shown in fig. 1 to 4, the present application provides an electronic device, wherein the electronic device includes a main board 1, a housing 2, a bracket 3, a circuit board 4 and a screen assembly 9 stacked along a thickness direction X of the electronic device, the housing 2 and the screen assembly 9 respectively form front and rear side surfaces of the electronic device, and a display assembly is used for displaying images to realize man-machine interaction.
The main board 1 is disposed inside the housing 2, i.e. between the screen assembly 9 and the housing 2, and is used for arranging various electronic components 6 to realize various functions of the electronic device.
The housing 2 serves to protect structural components inside the electronic device and to provide the electronic device with a flat rear surface.
The support 3 is arranged between the main board 1 and the shell 2, and the support 3 is connected with the main board 1, and the main board 1 can be independently supported and fixed through the support 3. The bracket 3 includes a first region 31 and a second region 32, the second region 32 at least partially surrounds the first region 31, the thickness of the first region 31 is smaller than that of the second region 32, it will be appreciated that the second region 32 has a normal thickness to ensure structural strength of the bracket 3, and the first region 31 acts as a thinned region to increase the distance between the position and other components arranged in a stacked manner, thereby increasing the size of the gap on the heat dissipation path passing through the position.
The circuit board 4 is arranged on one side of the support 3 facing the shell 2 and/or one side of the support 3 facing the main board 1, and the support 3 not only can provide supporting and positioning for the main board 1, but also provides a mounting foundation for the circuit board 4.
Alternatively, the circuit board 4 is a printed circuit board 4 or a flexible circuit board 4.
The functional element 5 is mounted on the circuit board 4, and the functional element 5 is electrically connected with the circuit board 4, so that the functional element 5 corresponds to the first area 31 along the thickness direction X of the electronic device, and the gap size on the heat dissipation path of the casing 2 passing through the first area 31 from the main board 1 is increased, so that the density between the components is reduced, the gap is filled with air, and the air is an excellent medium for preventing heat transfer, so that the functional element 5 corresponds to the first area 31, and the heat transfer efficiency of heat on the heat transfer path of the functional element 5 can be effectively reduced, thereby reducing the temperature of the functional element 5 and reducing the local heating condition of the electronic device.
As shown in fig. 1 to 6, in the electronic device provided by the present application, along the direction perpendicular to the support 3, that is, the thickness direction X of the electronic device, the first area 31 is in a penetrating shape, that is, the purpose of reducing the thickness of the first area 31 is achieved by forming the through hole 21, in this embodiment, the size of the first area 31 along the thickness direction X of the electronic device is equal to 0, so that the size of the gap on the heat transfer path of the functional element 5 can be maximized, and the transfer efficiency of heat on the heat transfer path of the functional element 5 can be reduced to the greatest extent.
In other embodiments, the electronic device provided by the application has the advantages that the blind hole is concavely formed on at least one side surface of the bracket 3, and the projection of the blind hole coincides with the projection of the first area 31 along the thickness direction X of the electronic device, that is, the purpose of reducing the thickness of the first area 31 is achieved by forming the blind hole, in this embodiment, the size of the first area 31 along the thickness direction X of the electronic device is not 0, so that the structural strength of the bracket 3 at the first area 31 can be ensured to a certain extent.
It should be noted that the dimension of the first region 31 along the thickness direction X of the electronic device may be comprehensively considered and adjusted according to the gap dimension along the heat transfer path and the structural strength of the bracket 3.
As shown in fig. 1 to 6, the electronic device provided by the application, wherein the bracket 3 includes a deformation portion 33, the deformation portion 33 is bent and deformed toward a direction approaching the motherboard 1 to form, a concave portion is formed on a side of the bracket 3 facing the housing 2, and a convex portion is formed on a side of the bracket 3 facing the motherboard 1, the first region 31 is located in the deformation portion 33, and the circuit board 4 and the functional element 5 are disposed in the concave portion. Through setting up deformation portion 33 for the size increase between deformation portion 33 and the casing 2 provides more sufficient layout space for deformation element, and can guarantee to have certain clearance between deformation element and the casing 2 after deformation element lays, with the heat transfer efficiency of reduction deformation element to casing 2, reduces the condition that the electronic equipment rear side is local to generate heat.
As shown in fig. 1 to 4 and fig. 7 to 8, in the electronic device provided by the application, an electronic component 6 and a shielding case 7 are arranged on one side, facing a bracket 3, of a main board 1, the shielding case 7 and the main board 1 are enclosed to form a sealed cavity, at least part of the electronic component 6 is located in the sealed cavity, the electronic component 6 located in the sealed cavity is protected by the shielding case 7, one or more shielding cases 7 can be arranged according to the type of the electronic component 6, and the shielding cases 7 are arranged in different shielding cases 7 according to the type of the electronic component 6 so as to reduce electromagnetic interference among different types of the electronic components 6.
The shielding cover 7 is provided with a sinking groove 71, the sinking groove 71 is opposite to the deformation part 33, specifically, along the thickness direction X of the electronic device, the sinking groove 71 is concavely formed at the position of the shielding cover 7 opposite to the deformation part 33 towards the direction away from the bracket 3, so that a convex part is formed on one side of the deformation part 33 of the bracket 3 towards the main board 1 to avoid, a certain gap is formed between the convex part and the shielding cover 7, the gap size on a heat transfer path at the position is further increased, the heat transfer efficiency from the deformation element to the shell 2 is further reduced, and the situation that the rear side of the electronic device locally heats is reduced.
As shown in fig. 1 to 4, the electronic device provided by the present application, wherein the functional element 5 includes a light emitting element 51, for being used as a flash lamp of the electronic device or providing a lighting function for the electronic device, the housing 2 is provided with a through hole 21, the through hole 21 is embedded with a lampshade 8, and the lampshade 8 is made of transparent or semitransparent material, so that light emitted by the light emitting element 51 passes through; along the thickness direction X of the electronic device, the light emitting element 51 corresponds to the lamp shade 8, so that as much light as possible emitted by the light emitting element 51 is emitted from the lamp shade 8, and the light emitting effect of the light emitting element 51 is ensured.
As shown in fig. 1 to 4 and fig. 9 to 10, in the electronic device provided by the application, an avoidance groove 81 is formed on one side of a lampshade 8 facing a light-emitting element 51, the avoidance groove 81 is recessed in a direction away from a bracket 3, and by arranging the avoidance groove 81, the distance between the lampshade 8 and the light-emitting element 51 can be effectively increased at the position of the avoidance groove 81 so as to ensure a certain gap between the light-emitting element 51 and the lampshade 8, and along the thickness direction X of the electronic device, the projection of the light-emitting element 51 falls into the projection of the avoidance groove 81 so as to fully utilize the space of the avoidance groove 81, and a gap is formed between the light-emitting element 51 and the lampshade 8.
Alternatively, a pattern 82 is formed on the bottom of the escape groove 81 to homogenize the light emitted from the light emitting element 51.
As shown in fig. 1 to 4, the electronic device provided by the application, wherein the periphery of the light-emitting element 51 is provided with the protection element 52, and the protection element 52 can protect the light-emitting element 51; along the thickness direction X of the electronic device, the protection element 52 corresponds to the first region 31, similar to the light emitting element 51, so that the protection element 52 corresponds to the first region 31, and the gap size on the heat transfer path of the protection element 52 can be increased, so that the transfer efficiency of heat on the heat transfer path of the protection element 52 is effectively reduced, and the temperature at the protection element 52 is reduced.
As shown in fig. 11 and 12, in the electronic device provided by the present application, the protection element 52 surrounds the peripheral surface of the light emitting element 51 to protect the light emitting element 51 as much as possible at each position on the peripheral side of the light emitting element 51, optionally, an opening 521 is formed on one side of the protection element 52 in the peripheral direction of the light emitting element 51, so that heat generated during the operation of the light emitting element 51 is dissipated from the opening 521, and heat accumulation at the light emitting element 51 is reduced.
Alternatively, the light emitting element 51 has a substantially rectangular structure, the shielding element 52 has a substantially U-shaped structure, surrounds three side surfaces of the light emitting element 51, and forms an opening 521 at a side where the light emitting element 51 is not surrounded.
Optionally, the light emitting element 51 is made of foam, which has good elastic deformation capability to provide buffer protection for the light emitting element 51, and has small mass, which is beneficial to the lightweight development of electronic equipment, and has certain air permeability for the heat generated in the operation process of the light emitting element 51 to be dissipated outwards.
As shown in fig. 12, in the electronic device provided by the present application, the protection element 52 and the light-emitting element 51 cooperate to form a regular geometric shape, and along the thickness direction X of the electronic device, the projection of the light-emitting element 51 and the projection of the protection element 52 fall into the projection of the lamp cover 8, and the center of the geometric shape is located on the central axis of the through hole 21, and since the lamp cover 8 is transparent or non-transparent, the light-emitting element 51 and the protection element 52 can be seen through the lamp cover 8, so that the structure seen through the lamp cover 8 is in a regular shape, thereby improving the appearance aesthetic property of the electronic device.
Alternatively, the functional element 5 may be another electronic component, and in the design, the thickness of the first area 31, the dimensions of the concave and convex portions formed by the deformed portion 33 along the thickness direction X of the electronic device, and the dimensions of the sink groove along the thickness direction X of the electronic device may be adjusted according to the specific dimensions of the functional element 5 along the thickness direction X of the electronic device.
According to the electronic equipment provided by the application, the thickness of the first area 31 of the bracket 3 is smaller than that of the second area 32, and the functional element 5 corresponds to the first area 31, so that the size of a gap formed between the functional element 5 and the shell 2 and/or between the functional element 5 and the main board 1 can be effectively increased, the density of each part is reduced, and the gap is filled with air which is an excellent medium for preventing heat transfer, so that the heat transfer efficiency of heat on a heat transfer path of the functional element 5 can be effectively reduced, the temperature of the functional element 5 is reduced, and the local heating condition of the electronic equipment is reduced.
The features of the application "first", "second" and the like in the description and in the claims may be used for the explicit or implicit inclusion of one or more such features. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/" generally means a relationship in which the associated object is an "or" before and after.
In the description of the present application, it should be understood that the terms "longitudinal," "transverse," "upper," "lower," "front," "middle," "rear," "left," "right," "clockwise," "counterclockwise," and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and they should be included in the scope of the present application.
Claims (10)
1. An electronic device, the electronic device comprising:
A main board;
The main board is arranged in the shell;
The bracket is arranged between the main board and the shell and comprises a first area and a second area, the second area at least partially surrounds the first area, and the thickness of the first area is smaller than that of the second area;
The circuit board is arranged on one side of the bracket facing the shell and/or one side of the bracket facing the main board;
And the functional element is arranged on the circuit board and corresponds to the first area.
2. The electronic device of claim 1, wherein the first region is through-shaped in a direction perpendicular to the stand.
3. The electronic device of claim 1, wherein at least one side surface of the holder is concavely formed with a blind hole, and a projection of the blind hole coincides with a projection of the first region in a direction perpendicular to the holder.
4. An electronic device according to any one of claims 1 to 3, wherein the holder includes a deformation portion which deforms toward a direction approaching the main board, a concave portion is formed on a side of the holder toward the housing, and a convex portion is formed on a side of the holder toward the main board, the first region being located at the deformation portion, and the circuit board and the functional element are provided in the concave portion.
5. The electronic device of claim 4, wherein an electronic component and a shielding case are arranged on one side of the main board facing the bracket, the shielding case and the main board are enclosed to form a sealing cavity, and at least part of the electronic component is positioned in the sealing cavity;
the shield cover is provided with a sinking groove, and the sinking groove is opposite to the deformation part.
6. An electronic device according to any one of claims 1 to 3, wherein the functional element comprises a light emitting element, a through hole is formed in the housing, a lamp cover is embedded in the through hole, and the light emitting element corresponds to the lamp cover.
7. The electronic device of claim 6, wherein a side of the lamp housing facing the light emitting element has an escape groove, the escape groove is recessed in a direction away from the bracket, and a projection of the light emitting element in a direction perpendicular to the bracket falls into a projection of the escape groove in a direction perpendicular to the bracket.
8. The electronic device according to claim 6, wherein a peripheral edge of the light emitting element is provided with a protective element, the protective element corresponding to the first region.
9. The electronic apparatus according to claim 8, wherein the protective member is made of foam, and the protective member is formed with an opening on one side in a circumferential direction of the light emitting element.
10. The electronic device of claim 8 or 9, wherein the projection of the light emitting element and the projection of the shielding element fall into the projection of the lamp housing in a direction perpendicular to the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323551470.0U CN221930320U (en) | 2023-12-25 | 2023-12-25 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323551470.0U CN221930320U (en) | 2023-12-25 | 2023-12-25 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221930320U true CN221930320U (en) | 2024-10-29 |
Family
ID=93200703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323551470.0U Active CN221930320U (en) | 2023-12-25 | 2023-12-25 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221930320U (en) |
-
2023
- 2023-12-25 CN CN202323551470.0U patent/CN221930320U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant |