CN221804346U - Light emitting assembly and light module - Google Patents
Light emitting assembly and light module Download PDFInfo
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- CN221804346U CN221804346U CN202323158639.6U CN202323158639U CN221804346U CN 221804346 U CN221804346 U CN 221804346U CN 202323158639 U CN202323158639 U CN 202323158639U CN 221804346 U CN221804346 U CN 221804346U
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- 230000003287 optical effect Effects 0.000 claims abstract description 133
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 38
- 239000010703 silicon Substances 0.000 claims abstract description 38
- 230000005540 biological transmission Effects 0.000 claims abstract description 32
- 239000013307 optical fiber Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 8
- 238000009434 installation Methods 0.000 abstract description 6
- 239000000835 fiber Substances 0.000 description 8
- 238000010168 coupling process Methods 0.000 description 5
- 238000005859 coupling reaction Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
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Abstract
The application discloses a light emitting assembly and a light module, wherein the light emitting assembly comprises a silicon light chip, a plurality of lasers and a coupling-out light path, wherein one side of the silicon light chip is provided with a plurality of input light ports, the lasers are arranged on one side of the silicon light chip, which is close to the input light ports, and each laser corresponds to one coupling-in light path between each laser and the input light port; each coupling-in light path comprises a turning prism arranged in the light emitting direction of the laser, each turning prism is used for deflecting the transmission direction of laser emitted by the corresponding laser and transmitting the laser deflected in the transmission direction to the corresponding input light port, and the silicon optical chip modulates the deflected laser and outputs an optical signal; the coupling-out light path is used for transmitting the optical signals to the outside of the optical emission component, and the space between two adjacent coupling-in light paths can be flexibly adjusted by arranging the turning prism, so that the condition of element interference is avoided, sufficient operation space is provided for the installation of the optical emission component, and the assembly difficulty is reduced.
Description
Technical Field
The present application relates to the field of optical communications, and in particular, to an optical transmitting assembly and an optical module.
Background
With the continuous expansion of technical applications such as 5G communication, big data, cloud computing and the like, flow data shows explosive growth. In order to meet the requirement of high-speed transmission of mass data, an optical communication technology is indispensable, and an optical module is a tool for realizing photoelectric signal mutual conversion and is a key device for realizing optical communication. With the rapid increase of data traffic, the demand for optical modules is also increasing. In the high-speed optical module solution, the silicon optical chip can simplify the configuration of other photoelectric devices in the optical module, can effectively reduce the power consumption and the cost, is suitable for different optical module packaging forms, and is a current research hot spot.
The main stream silicon optical chip generally comprises two adjacent light inlets, and the corresponding light sources emit laser to be directly coupled into the silicon optical chip, but because the distance between the light inlets is small, interference is easy to occur between the adjacent light sources and the corresponding light path system elements, even if the light path system elements are not interfered as much as possible, the tiny distance of the light path system elements also puts higher demands on the assembly process.
Disclosure of utility model
To overcome the above drawbacks, the present application aims to: the application provides a light emitting assembly and a light module, which fully utilize the narrow space of a silicon light chip on one side close to an input light port and improve the space utilization rate.
In order to achieve the above purpose, the application adopts the following technical scheme:
a light emitting assembly, the emitting assembly comprising:
a silicon optical chip, wherein one side of the silicon optical chip is provided with a plurality of input optical ports,
The lasers are arranged on one side of the silicon optical chip, which is close to the input optical port, and each laser corresponds to one coupling-in optical path between the laser and the input optical port;
Each coupling-in light path comprises a turning prism arranged in the light emitting direction of the laser, each turning prism is used for deflecting the transmission direction of laser emitted by the corresponding laser and transmitting the laser deflected in the transmission direction to the corresponding input light port, and the silicon optical chip modulates the deflected laser and outputs an optical signal;
And the coupling-out light path is used for transmitting the optical signal to the outside of the optical transmitting assembly.
In this embodiment, the turning prism includes:
Incident surface, light emergent measurement aligned with the laser
A light emitting surface aligned with the light input port
And the reflecting surface is 45 degrees with the output optical axis of the laser, and the output optical axis of the laser is parallel to the side edge where the input optical port is located.
In this embodiment, the coupling-in optical path further includes:
the collimating lens is used for collimating the laser emitted by the laser;
And the focusing lens is used for focusing and converging the collimated laser or the laser deflected in the transmission direction.
Further, the coupling-in optical path further comprises:
The isolator is arranged on the light-emitting side of the collimating lens, and laser emitted by the laser firstly passes through the collimating lens and then enters the turning prism or the focusing lens through the isolator.
In this embodiment, each of the transmission paths of the coupling-in optical paths is: the laser emitted from the laser sequentially passes through the collimating lens, the isolator, the turning lens and the focusing lens to enter the input light port
In this embodiment, the transmission paths of one of the coupling-in optical paths are: the laser emitted from the laser sequentially passes through the collimating lens, the isolator, the focusing lens and the turning lens to enter the corresponding input optical port;
The transmission paths of the adjacent other coupling-in light paths are: the laser emitted from the laser sequentially passes through the collimating lens, the isolator, the turning lens and the focusing lens to enter the corresponding input light port.
In this embodiment, the silicon optical chip further includes a plurality of output optical ports, and the plurality of output optical ports are all disposed on a second side edge adjacent to the side edge where the input optical port is disposed.
Further, the coupling-out optical path includes:
The substrate is arranged on one side of the silicon optical chip, which is close to the light output port;
The positioning plate is covered on the substrate, and a clamping space is formed between the positioning plate and the substrate;
The array optical fibers are positioned in the clamping space and comprise a plurality of optical fibers which are arranged in an array mode, and each optical fiber corresponds to one output light port.
Further, the positioning plate is provided with a plurality of positioning grooves which can accommodate optical fibers.
The embodiment of the application also provides an optical module, which comprises:
A housing, wherein an accommodating space is arranged in the housing, and a circuit board is arranged in the accommodating space;
the light emitting assembly as described above, disposed in the housing and on the circuit board, for emitting an optical signal to the outside of the optical module;
Light receiving assembly: and the optical module is arranged in the shell and positioned on the circuit board and is used for receiving an externally input optical signal of the optical module.
Advantageous effects
The application fully utilizes the narrow space of the silicon optical chip near one side of the input optical port, improves the space utilization rate, and by arranging the turning prism on each coupling optical path, the transmission direction of laser is deflected, the position relation between a plurality of lasers and the input optical port can be flexibly adjusted, the distance between two adjacent coupling optical paths can be flexibly adjusted, the condition of element interference can not exist, and sufficient operation space is provided for the installation of the light emitting component, thereby reducing the assembly difficulty.
Drawings
The accompanying drawings are included to provide an understanding of the technical aspects of the present disclosure, and are incorporated in and constitute a part of this specification, illustrate the technical aspects of the present disclosure and together with the embodiments of the disclosure, not to limit the technical aspects of the present disclosure. The shapes and sizes of the various components in the drawings are not to scale, and are intended to illustrate the present application only.
Fig. 1 is a schematic structural diagram of a light emitting device according to an embodiment of the present application;
FIG. 2 is an enlarged schematic view of portion A of FIG. 1;
FIG. 3 is a schematic diagram of a coupling-in optical path according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a coupling-in optical path according to another embodiment of the present application;
fig. 5 is a schematic diagram of an out-coupling optical path according to an embodiment of the present application.
Detailed Description
The above-described aspects are further described below in conjunction with specific embodiments. It should be understood that these examples are illustrative of the present application and are not intended to limit the scope of the present application. The implementation conditions employed in the examples may be further adjusted as in the case of the specific manufacturer, and the implementation conditions not specified are typically those in routine experiments.
Unless defined otherwise, technical or scientific terms used in the embodiments of the present disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present application pertains. The terms "first," "second," and the like, as used in embodiments of the present disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. In this context, "electrically connected" includes the case where constituent elements are connected together by an element having some electric action. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
In the present application, the azimuth or positional relationship indicated by the terms "upper", "lower", "inner", "middle", etc., are based on the azimuth or positional relationship shown in the drawings. These terms are only used to better describe the present application and its embodiments and are not intended to limit the scope of the indicated devices, elements or components to the particular orientations or to configure and operate in the particular orientations.
The application discloses a light emitting assembly and a light module, wherein the light emitting assembly comprises a silicon light chip, a plurality of lasers and a coupling-out light path, wherein one side of the silicon light chip is provided with a plurality of input light ports, the lasers are arranged on one side of the silicon light chip, which is close to the input light ports, and each laser corresponds to one coupling-in light path between each laser and the input light port; each coupling-in light path comprises a turning prism arranged in the light emitting direction of the laser, each turning prism is used for deflecting the transmission direction of laser emitted by the corresponding laser and transmitting the laser deflected in the transmission direction to the corresponding input light port, and the silicon optical chip modulates the deflected laser and outputs an optical signal; the application fully utilizes the narrow space near the side of the input light port in the silicon optical chip, improves the space utilization rate, deflects the light transmission direction by arranging a turning prism on each coupling light path, the position relation between the lasers and the input light ports can be flexibly adjusted, the distance between two adjacent coupling-in light paths can be flexibly adjusted, the condition of element interference is avoided, sufficient operation space is provided for the installation of the light emitting component, and the assembly difficulty is reduced.
The embodiment of the application provides an optical module, which comprises a shell, an optical emission assembly and an optical receiving assembly, wherein an accommodating space is arranged in the shell, and a circuit board is arranged in the accommodating space; the light emitting component is arranged in the shell and positioned on the circuit board and is used for emitting light signals to the outside of the light module; the light receiving assembly is arranged in the shell and positioned on the circuit board and is used for receiving an externally input light signal of the light module.
A light reflection assembly according to an embodiment of the present application will be described with reference to fig. 1 to 4
The light emitting assembly includes:
a silicon optical chip 10, a plurality of input optical ports 11 are arranged on one side of the silicon optical chip 10,
The lasers 20 are arranged on one side of the silicon optical chip 10 close to the input optical port 11, and each laser 20 is coupled with one optical path between the input optical port 11;
Each coupling-in optical path comprises a turning prism 30 arranged in the light emitting direction of the laser 20, each turning prism 30 is used for deflecting the transmission direction of laser light emitted by the corresponding laser 20 and transmitting the laser light deflected in the transmission direction into the corresponding input optical port 11, and the silicon optical chip 10 modulates the deflected laser light and outputs an optical signal;
The light path 70 is coupled out for transmitting the optical signal to the outside of the light emitting assembly.
Specifically, the silicon optical chip 10 in the present application is configured with two input optical ports 11, and correspondingly configured with two lasers 20 and two coupling-in optical paths.
Referring to fig. 2, in the present embodiment, the turning prism 30 includes an incident surface 31, an output surface 32 and a reflective surface 33, the incident surface 31 is aligned with the light output side of the laser 20, and is used for receiving the laser light emitted from the laser 20, the output surface 32 is aligned with the input light port 11, and is used for emitting the laser light emitted by the reflective surface 33, the reflective surface 23 forms 45 ° with the output optical axis of the laser, the turning prism 30 deflects the transmission direction of the laser light emitted by the laser by 90 ° and the output optical axis of each laser 20 is parallel to the side where the input light port is located, in this embodiment, by setting the turning prism 30, the installation space of the multiple lasers 20 is increased, the output optical axes of the multiple lasers 20 can be parallel to the side where the input light port 11 is located, the installation position of the multiple lasers 20 is not limited to the axial space corresponding to the input light port any more, which is beneficial for improving the space utilization, and at the same time, the space between two adjacent lasers 20 can also be flexibly adjusted.
Referring to fig. 1, in this embodiment, each of the coupling-in optical paths further includes: a collimator lens 40 and a focusing lens 60, the collimator lens 40 being used for collimating the laser light emitted by the laser 20; the focusing lens 60 is used for focusing and converging the collimated laser light or the laser light deflected in the transmission direction, and further, each coupling-in optical path further comprises an isolator 50, the isolator 50 is arranged on the light emitting side of the collimating lens 40, the laser light emitted by the laser 20 passes through the collimating lens 40 and then enters the turning prism 30 or the focusing lens 60 through the isolator 50, and the isolator 50 is arranged for reversely isolating the laser light.
Referring to fig. 3, in this embodiment, each transmission path of the in-coupling optical path is: the laser light emitted from the laser 20 sequentially passes through the collimating lens 40, the isolator 50, the turning lens 30 and the focusing lens 60 and enters the input light port 11, in this embodiment, the collimated laser light is deflected by 90 ° in the transmission direction, and then the deflected laser light is focused and converged, where the collimating lens 40, the isolator 50 and the laser 20 are coaxially distributed, and the focusing lens 60 and the input light port 11 are coaxially distributed, that is, the focusing lens faces the input light port, so that the design is beneficial to accurately adjusting the laser light coupled into the input light port, and effectively reducing the possibility of laser light deflection or partial deflection of the input light port.
Referring to fig. 4, as a modification of the above embodiment, the transmission paths of the two coupling-in optical paths are different, and this embodiment is applicable to a silicon optical chip 10 in which the space in the axial direction corresponding to the input optical port is relatively small, and two sets of turning lenses and focusing lenses arranged in a staggered manner cannot be mounted in the axial direction of the input optical port, specifically, the transmission paths of the two coupling-in optical paths are as follows: one of the transmission paths coupled into the optical path is: the laser light emitted from the laser 20a sequentially passes through the collimator lens 40a, the isolator 50a, the focusing lens 60a, and the turning lens 30a into the corresponding input optical port 11 a; the collimated laser is focused and converged firstly, and then the transmission direction of the focused and converged laser is deflected by 90 degrees, and the transmission path of the adjacent other coupling-in light path is as follows: the laser light emitted from the laser 20b sequentially passes through the collimating lens 40b, the isolator 50b, the turning lens 30b and the focusing lens 60b and enters the corresponding input optical port 11b, that is, the collimated laser light is deflected by 90 ° in the transmission direction, and then the deflected laser light is focused and converged. The transmission paths of the two coupling-in optical paths in this embodiment are different, so that the installation space of the silicon optical chip 10 in the axial direction corresponding to the input optical port is further saved.
Referring to fig. 4 to 5, in the present embodiment, a plurality of output optical ports 12 are further configured on the silicon optical chip 10, and the plurality of output optical ports 12 are all disposed on a second side edge adjacent to a side edge where the input optical port 11 is disposed, in the present application, four output optical ports 12 are configured on the silicon optical chip, and the output optical ports are configured to transmit optical signals generated by the silicon optical chip, further, the optical signals are transmitted to the outside of the optical transmitting assembly through the coupling-out optical path 70, specifically, the coupling-out optical path 70 includes a substrate 71, a positioning plate 72 and an array optical fiber 73, and the substrate 71 is disposed on a side of the silicon optical chip close to the output optical port; the positioning plate 72 is covered on the base plate, and a clamping space is formed between the positioning plate 72 and the base plate 71; the array optical fiber 73 is located the centre gripping space, and array optical fiber 73 includes the many optic fibre 731 of array arrangement, and every optic fibre 731 corresponds an output light mouth 12, and optic fibre 731's quantity is the same with the quantity of output light mouth 12, so array optical fiber includes four optic fibre 731 of array arrangement, will pass through optic fibre 731 and pass through the outside of the light signal transmission to the light emission subassembly after the modulation of silicon optical chip, and further, be equipped with the constant head tank 721 of several holding optic fibre on the locating plate, this constant head tank can be the V type groove, and the design is favorable to further stabilizing optic fibre ground position like this, avoids optic fibre to remove in the centre gripping space.
The above embodiments are provided to illustrate the technical concept and features of the present application, and are intended to enable those skilled in the art to understand the present application and implement the same according to the present application, not to limit the scope of the present application. All equivalent changes or modifications made by the spirit of the application are intended to be covered by the scope of the application.
Claims (10)
1. A light emitting assembly, comprising:
a silicon optical chip, wherein one side of the silicon optical chip is provided with a plurality of input optical ports,
The lasers are arranged on one side, close to the input optical port, of the silicon optical chip, and each laser corresponds to one coupling-in optical path between the corresponding laser and the corresponding input optical port;
Each coupling-in light path comprises a turning prism arranged in the light emitting direction of the laser, each turning prism is used for deflecting the transmission direction of laser emitted by the corresponding laser and transmitting the laser deflected in the transmission direction to the corresponding input light port, and the silicon optical chip modulates the deflected laser and outputs an optical signal;
And the coupling-out light path is used for transmitting the optical signal to the outside of the optical transmitting assembly.
2. A light emitting assembly as recited in claim 1, wherein,
The turning prism includes:
an incident surface aligned with the light output of the laser,
A light emergent surface aligned with the light input port,
And the reflecting surface is 45 degrees with the output optical axis of the laser, and the output optical axis of the laser is parallel to the side edge where the input optical port is located.
3. A light emitting assembly as recited in claim 1, wherein,
The coupling-in optical path further comprises:
the collimating lens is used for collimating the laser emitted by the laser;
And the focusing lens is used for focusing and converging the collimated laser or the laser deflected in the transmission direction.
4. A light emitting assembly as recited in claim 3, wherein,
The coupling-in optical path further comprises:
The isolator is arranged on the light-emitting side of the collimating lens, and laser emitted by the laser firstly passes through the collimating lens and then enters the turning prism or the focusing lens through the isolator.
5. A light emitting assembly as recited in claim 4, wherein,
The transmission path of each coupling-in light path is: the laser emitted from the laser sequentially passes through the collimating lens, the isolator, the turning lens and the focusing lens to enter the input light port.
6. A light emitting assembly as recited in claim 4, wherein,
One of the transmission paths coupled into the optical path is: the laser emitted from the laser sequentially passes through the collimating lens, the isolator, the focusing lens and the turning lens to enter the corresponding input optical port;
The transmission paths of the adjacent other coupling-in light paths are: the laser emitted from the laser sequentially passes through the collimating lens, the isolator, the turning lens and the focusing lens to enter the corresponding input light port.
7. A light emitting assembly as recited in claim 1, wherein,
The silicon optical chip further comprises a plurality of light output ports, and the light output ports are all arranged on a second side edge adjacent to the side edge where the light input ports are arranged.
8. A light emitting assembly as recited in claim 7, wherein,
The coupling-out light path includes:
The substrate is arranged on one side of the silicon optical chip, which is close to the light output port;
The positioning plate is covered on the substrate, and a clamping space is formed between the positioning plate and the substrate;
The array optical fibers are positioned in the clamping space and comprise a plurality of optical fibers which are arranged in an array mode, and each optical fiber corresponds to one output light port.
9. A light emitting assembly as recited in claim 8, wherein
The locating plate is provided with a plurality of locating grooves which can contain optical fibers.
10. An optical module, comprising:
A housing, wherein an accommodating space is arranged in the housing, and a circuit board is arranged in the accommodating space;
The light emitting assembly of any one of claims 1-9, disposed within the housing and on the circuit board, for emitting an optical signal to an exterior of the light module;
And the light receiving assembly is arranged in the shell and positioned on the circuit board and is used for receiving an externally input light signal of the light module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323158639.6U CN221804346U (en) | 2023-11-22 | 2023-11-22 | Light emitting assembly and light module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323158639.6U CN221804346U (en) | 2023-11-22 | 2023-11-22 | Light emitting assembly and light module |
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| Publication Number | Publication Date |
|---|---|
| CN221804346U true CN221804346U (en) | 2024-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323158639.6U Active CN221804346U (en) | 2023-11-22 | 2023-11-22 | Light emitting assembly and light module |
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| Country | Link |
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| CN (1) | CN221804346U (en) |
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- 2023-11-22 CN CN202323158639.6U patent/CN221804346U/en active Active
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