CN221645110U

CN221645110U - Electroplating device

Info

Publication number: CN221645110U
Application number: CN202322839176.3U
Authority: CN
Inventors: 臧世伟
Original assignee: Shenzhen Jinmei New Material Technology Co ltd
Current assignee: Shenzhen Jinmei New Material Technology Co ltd
Priority date: 2023-10-19
Filing date: 2023-10-19
Publication date: 2024-09-03
Anticipated expiration: 2033-10-19

Abstract

The application discloses an electroplating device, which comprises a first electroplating group and a third electroplating group; the first electroplating group comprises a first power supply, a first electroplating anode and a first cathode conductive roller, wherein the positive electrode of the first power supply is electrically connected with the first electroplating anode, the negative electrode of the first power supply is electrically connected with the first cathode conductive roller, the first electroplating anode is arranged at the side of the film, and a first plating section of the film is attached to the first cathode conductive roller and is used for depositing a first plating layer on the film; the third electroplating group comprises a third power supply, an electroplating cathode and an anode conductive roller, the positive electrode of the third power supply is electrically connected with the anode conductive roller, the negative electrode of the third power supply is electrically connected with the electroplating cathode, the electroplating cathode is arranged on the side of the film, and a third plating section of the film is attached to the anode conductive roller and used for depositing a third plating layer on the film. The application solves the problem that the tensile strength of the current collector is reduced due to the deposition of larger crystal grains in the electroplating process of the film in the prior art.

Description

Electroplating device

Technical Field

The application relates to the technical field of film hydropower plating, in particular to a plating device.

Background

In the process of manufacturing the ion battery, the current collector is mainly welded on the tab as an important part for collecting current so as to output the current better.

In order to obtain a negative electrode composite current collector product, in the prior art, a thin film is coated with a copper layer by a magnetron sputtering coating device, and then enters a hydropower plating device for further copper plating.

The existing continuous hydropower plating apparatus comprises a plurality of plating tanks, wherein the cathode overpotential in the first plating tanks is too low to facilitate the formation of new crystal nuclei, so that the number of generated new crystal nuclei is smaller, metallic copper is more prone to be deposited on the generated crystal nuclei to enable the crystal nuclei to continue to grow, and the cathode overpotential is also lower until the plating tail end, metallic copper is more prone to be deposited on the generated crystal nuclei to enable the crystal nuclei to continue to grow to form coarser and more pyramid-shaped crystal grains, and the larger crystal grains lead to the reduction of the tensile strength of a current collector product.

Disclosure of utility model

The application mainly aims to provide an electroplating device for solving the problem that the tensile strength of a current collector is reduced due to larger deposited grains in the electroplating process of a film in the prior art.

According to an aspect of the present application, there is provided an electroplating apparatus for depositing a plating layer on a thin film, the electroplating apparatus comprising: the plurality of groups of electroplating assemblies are sequentially arranged along a first preset direction, and each group of electroplating assemblies comprises a first electroplating group and a third electroplating group which are sequentially arranged along a second preset direction; the first electroplating group comprises a first power supply, a first electroplating anode and a first cathode conductive roller, wherein the positive electrode of the first power supply is electrically connected with the first electroplating anode, the negative electrode of the first power supply is electrically connected with the first cathode conductive roller, the first electroplating anode is arranged at the side of the film, and a first plating section of the film is attached to the first cathode conductive roller and is used for depositing a first plating layer on the film; the third electroplating group comprises a third power supply, an electroplating cathode and an anode conductive roller, the positive electrode of the third power supply is electrically connected with the anode conductive roller, the negative electrode of the third power supply is electrically connected with the electroplating cathode, the electroplating cathode is arranged on the side of the film, and a third plating section of the film is attached to the anode conductive roller and used for depositing a third plating layer on the film.

Further, the plating assembly further includes a second plating group positioned between the first plating group and the third plating group; the second electroplating group comprises a second power supply, a second electroplating anode and a second cathode conductive roller, the positive electrode of the second power supply is electrically connected with the second electroplating anode, the negative electrode of the second power supply is electrically connected with the second cathode conductive roller, the second electroplating anode is arranged on the side of the film, and a second plating section of the film is attached to the second cathode conductive roller so as to deposit a second plating layer on the film.

Further, the current value of the third power supply is smaller than the current value of the first power supply and the current value of the second power supply respectively; and/or the current density J1 of the first power source is in the range: 2.5A/dm ²≤J1≤4A/dm²; and/or the current density J2 of the second power source is in the range: 1A/dm ²≤J2≤2A/dm²; and/or the current density J3 of the third power supply is in the range: 0.3A/dm ²≤J3≤0.5A/dm².

Further, the first power supply is a pulse current power supply; and/or the second power supply is a constant current power supply.

Further, the first plating group further includes: a first electroplating tank, wherein the first electroplating tank is provided with an electroplating solution, and at least part of the film is immersed in the electroplating solution of the first electroplating tank; the first liquid cutting roller set is arranged at one end of the first electroplating bath close to the second electroplating set and comprises two first liquid cutting rollers which are oppositely arranged, a first passing gap is formed between the two first liquid cutting rollers, the film passes through the first passing gap after electroplating in the first electroplating bath is completed, and two sides of the film are respectively contacted with the surfaces of the two first liquid cutting rollers.

Further, the second plating group further includes: the second electroplating tank is positioned at the side of the first electroplating tank, electroplating solution is arranged in the second electroplating tank, at least part of the film is immersed in the electroplating solution of the second electroplating tank, and the first cathode conductive roller is arranged between the first electroplating tank and the second electroplating tank; the second liquid cutting roller set is arranged at one end of the second electroplating bath close to the third electroplating set and comprises two second liquid cutting rollers which are oppositely arranged, a second through gap is formed between the two second liquid cutting rollers, the film penetrates out through the second through gap after electroplating in the second electroplating bath is completed, and two sides of the film are respectively in contact with the surfaces of the two second liquid cutting rollers.

Further, the third plating group further includes: the third electroplating tank is positioned at one side of the second electroplating tank far away from the first electroplating tank, electroplating liquid is arranged in the third electroplating tank, at least part of the film is immersed in the third electroplating tank, and the anode conductive roller is positioned at one side of the third electroplating tank far away from the second electroplating tank; the third liquid cutting roller set is arranged at one end of the third electroplating bath, which is far away from the second electroplating bath, and comprises two third liquid cutting rollers which are oppositely arranged, a third through gap is arranged between the two third liquid cutting rollers, the film penetrates out through the third through gap after electroplating in the third electroplating bath is completed, and two sides of the film are respectively contacted with the surfaces of the two third liquid cutting rollers.

Further, the plating apparatus further includes: the first stirring component is movably arranged in the first electroplating bath in position so as to stir the electroplating solution in the first electroplating bath; and/or a second stirring component, which is arranged in the second electroplating tank in a position movable way, so as to stir the electroplating solution in the second electroplating tank; and/or a third stirring component is arranged in the third electroplating tank in a position movable way so as to stir the electroplating solution in the third electroplating tank.

Further, the first cathode conductive roller comprises two oppositely arranged first cathode conductive rollers, a first penetrating gap is formed between the two first cathode conductive rollers, the second cathode conductive roller comprises two oppositely arranged second cathode conductive rollers, a second penetrating gap is formed between the two second cathode conductive rollers, the anode conductive roller comprises two anode conductive rollers, and a third penetrating gap is formed between the two anode conductive rollers; the film is sequentially arranged in the first passing gap, the second passing gap and the third passing gap in a penetrating manner, and is respectively attached to the first cathode conductive roller, the second cathode conductive roller and the anode conductive roller.

Further, each electroplating assembly comprises a plurality of first electroplating groups which are sequentially arranged at intervals; and/or each electroplating assembly comprises a plurality of second electroplating groups which are sequentially arranged.

Compared with the prior art, the technical scheme of the application has at least the following technical effects:

Compared with the prior art, after the film coating is finished, a large number of crystal grains are formed on the surface of the coating, and the tensile strength of the current collector is reduced, the electroplating device of the application connects the anode of the third power supply in the third electroplating group with the anode conductive roller, the negative electrode of the third power supply is connected with the electroplating cathode, and after the film is plated by the first electroplating group and the second electroplating group, grains generated on the film are peeled off from the tops of the grains, so that the thickness of the plating layer is uniformly distributed, the flatness of the plating layer is ensured, and the tensile strength of the current collector is improved.

Drawings

The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:

FIG. 1 is a schematic view of an embodiment of an electroplating apparatus of the present disclosure;

FIG. 2 is a schematic view of a first plating group in the plating apparatus of the present application;

FIG. 3 is a schematic view of a second plating group in the plating apparatus of the present application;

Fig. 4 is a schematic structural view of a third plating group in the plating apparatus of the present disclosure.

Wherein the above figures include the following reference numerals:

100. A film; 21. a first electroplating group; 22. a second electroplating group; 23. a third electroplating group; 210. a first power supply; 211. a first electroplating anode; 212. a first cathode conductive roller; 220. a second power supply; 221. a second electroplating anode; 222. a second cathode conductive roller; 230. a third power supply; 231. electroplating a cathode; 232. an anode conductive roller; 213. a first plating bath; 214. the first liquid cutting roller group; 2140. a first liquid cutting roller; 223. a second plating bath; 224. the second liquid cutting roller set; 2240. a second liquid cutting roller; 233. a third plating bath; 234. a third liquid cutting roller group; 2340. a third liquid cutting roller; 300. a first stirring member; 400. a second stirring member; 500. a third stirring member; 2120. a first cathode conductive roller; 2220. a second cathode conductive roller; 2320. an anode conductive roller; 600. an unreeling roller; 700. and (5) a wind-up roller.

Detailed Description

It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The application will be described in detail below with reference to the drawings in connection with embodiments.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the authorization specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

As mentioned in the background art, in the prior art, in the process of producing a composite current collector, after a film of the current collector is sequentially electroplated through a plurality of electroplating baths, a composite current collector is formed, and in the process, crystal grains are easily formed on the surface of the film due to different current values in each electroplating bath, and the crystal grains reduce the tensile strength of the current collector; in view of this problem, in the electroplating apparatus of the present application, by providing the first electroplating group 21, the second electroplating group 22 and the third electroplating group 23, the positive electrode of the first power supply 210 in the first electroplating group 21 is connected to the first electroplating anode 211, the negative electrode is connected to the first cathode conductive roller 212, the positive electrode of the second power supply 220 in the second electroplating group 22 is connected to the second electroplating anode 221, the negative electrode is connected to the second cathode conductive roller 222, the positive electrode of the third power supply 230 in the third electroplating group 23 is connected to the anode conductive roller 232, and the negative electrode is connected to the electroplating cathode 231, so that after the first power supply 210 and the second power supply 220 electroplate the thin film, the reverse plating current (i.e., the third power supply 230) in the third electroplating group 23 is used to peel off the plating layer on the thin film 100, and deposit the plating layer on the cathode 231 again, so that uniformity and flatness of the plating thickness distribution of the plating layer can be improved, the grain plating layer on the surface of the composite current collector can be reduced, the stress concentration site on the current collector can be avoided, and the tensile strength of the current collector can be improved.

Referring to fig. 1 to 4, the present application provides an electroplating apparatus for depositing a plating layer on a thin film 100, the electroplating apparatus comprising: a plurality of sets of plating assemblies sequentially arranged in a first predetermined direction (a longitudinal direction of the film 100), each plating assembly including a first plating group 21, a second plating group 22, and a third plating group 23 sequentially arranged in a second predetermined direction (a longitudinal direction of the film 100); the first electroplating group 21 comprises a first power supply 210, a first electroplating anode 211 and a first cathode conductive roller 212, wherein the anode of the first power supply 210 is electrically connected with the first electroplating anode 211, the cathode of the first power supply 210 is electrically connected with the first cathode conductive roller 212, the first electroplating anode 211 is arranged at the side of the film 100, and a first plating section of the film 100 is attached to the first cathode conductive roller 212 so as to deposit a first plating layer on the film 100; the second electroplating group 22 comprises a second power supply 220, a second electroplating anode 221 and a second cathode conductive roller 222, wherein the positive electrode of the second power supply 220 is electrically connected with the second electroplating anode 221, the negative electrode of the second power supply 220 is electrically connected with the second cathode conductive roller 222, the second electroplating anode 221 is arranged at the side of the film 100, and a second plating section of the film 100 is attached to the second cathode conductive roller 222 so as to deposit a second plating layer on the film 100; the third electroplating group 23 includes a third power supply 230, an electroplating cathode 231 and an anode conductive roller 232, wherein the anode of the third power supply 230 is electrically connected with the anode conductive roller 232, the cathode of the third power supply 230 is electrically connected with the electroplating cathode 231, the electroplating cathode 231 is arranged at the side of the film 100, and a third plating section of the film 100 is attached to the anode conductive roller 232 to deposit a third plating layer on the film 100.

According to the electroplating device provided by the application, a first electroplating group 21, a second electroplating group 22 and a third electroplating group 23 are sequentially arranged along the length direction of the film 100, in the first electroplating group 21, the first electroplating group is used for depositing the first electroplating layer on the film 100 by utilizing a first power supply 210, then the film 100 moves into the second electroplating group 22, the second electroplating layer is deposited on the basis of the first electroplating layer by utilizing a second power supply 220, further, after the film 100 enters the third electroplating group 23, the third power supply 230 strips the crystal grain plating layer protruding on the film 100, so that the surface of the plating layer is flat, after the film plating is carried out by a plurality of groups of electroplating assemblies, each group of electroplating assemblies strips the crystal grain tip preferentially by the reverse plating current of the third power supply 230, so that the thickness of each layer of plating layer is uniform, finally, a multi-layer structure is formed on the film 100, the position where stress concentration is generated is avoided, and the tensile strength of a current collector is improved.

In the practical application process, when the film 100 is electroplated in the first electroplating group 21 and the second electroplating group 22, a grain plating layer is formed on the surface of the film 100, after the film 100 enters the third electroplating group 23, the positive electrode of the third power supply 230 is connected with the anode conductive roller 232, and the negative electrode is connected with the electroplating cathode 231, so that the plating layer at the tip of the grain can be preferentially stripped, at the moment, the grain plating layer serving as the anode has high distribution density of the power lines of the surface protruding part, high current density, high electrolysis speed of the protruding part and low dissolution speed of the leveling part under the action of the reverse plating current of the third power supply 230, and the uniformity and flatness of the thickness distribution of the plating layer can be improved as a whole, thereby avoiding the occurrence of stress concentration parts on the plating layer, improving the tensile strength of the current collector, and solving the problem of the reduction of the tensile strength of the current collector caused by the formation of grains on the plating layer in the prior art.

Specifically, the current value of the third power supply 230 is smaller than the current value of the first power supply 210 and the current value of the second power supply 220, respectively. The main purpose of the third power supply 230 is to peel off the grains generated in the first plating group 21 and the second plating group 22 by the thin film 100, so that the current value of the third power supply 230 is adjusted to be smaller than the current value of the first power supply 210 and the current value of the second power supply 220, and excessive peeling of the thin film plating layer due to excessive current value of the third power supply 230 is avoided.

Preferably, the current density J1 of the first power supply 210 is in the range of 2.5A/dm ²≤J1≤4A/dm²; and/or the current density J2 of the second power supply 220 is in the range of 1A/dm ²≤J2≤2A/dm²; and/or the current density J3 of the third power supply 230 is in the range of 0.3A/dm ²≤J3≤0.5A/dm². In this current density range, a large number of small crystal nuclei are newly generated on the film surface of the film 100 under the action of the first power supply 210, after the film 100 with the large number of small crystal nuclei generated enters the second electroplating group 22, the second power supply 220 supplies current to enable the small crystal nuclei to continue to grow to form crystal grains, and then the film surface is made to be an anode by the reverse plating action of the third power supply 230, so that the tips of the crystal grains protruding from the surface of the film 100 are peeled off.

Wherein the first power supply 210 is a pulse current power supply; and/or the second power supply 220 is a constant current power supply. Since the pulse current is relatively large in some time period and the cathode overpotential of the thin film 100 is increased in the time period in which the pulse current is large, small crystal nuclei are generated on the surface of the thin film 100, and then the small crystal nuclei continue to grow to form crystal grains due to the constant current in the second power supply 220. In addition, since the thin film obtained after magnetron sputtering coating has a thin metal layer, if the thin film is subjected to a continuous high current, the thin film is overheated and burnt, so that the first power supply 210 adopts a pulse current, and in a period of time when the thin film is subjected to a high current, new crystal nuclei are more prone to be formed than to grow.

In the specific implementation, as shown in fig. 2, the first plating group 21 further includes: a first plating tank 213 having a plating solution within the first plating tank 213, at least a portion of the film 100 being immersed in the plating solution within the first plating tank 213; the first liquid cutting roller set 214 is disposed at one end of the first electroplating tank 213 near the second electroplating set 22, the first liquid cutting roller set 214 includes two first liquid cutting rollers 2140 disposed opposite to each other, a first passing gap is disposed between the two first liquid cutting rollers 2140, the film 100 passes through the first passing gap after electroplating in the first electroplating tank 213, and two sides of the film 100 are respectively contacted with the surfaces of the two first liquid cutting rollers 2140. After the film 100 is electroplated in the first electroplating tank 213, the surface of the film will adhere to the electroplating solution, so that the first solution cutting roller 2140 is provided, and in the process that the film 100 passes through the first passing gap, the first solution cutting roller 2140 extrudes the film 100 to scrape the excessive electroplating solution on the surface of the film 100 back into the first electroplating tank 213 through contact with the first solution cutting roller 2140, so that the film 100 is prevented from bringing the electroplating solution into the next processing tank and mixing with the liquid in the next processing tank to cause streaming.

As shown in fig. 3, the second plating group 22 further includes: the second electroplating tank 223 is located at the side of the first electroplating tank 213, the second electroplating tank 223 is internally provided with electroplating solution, at least part of the film 100 is immersed in the electroplating solution of the second electroplating tank 223, and the first cathode conductive roller 212 is arranged between the first electroplating tank 213 and the second electroplating tank 223; the second liquid cutting roller set 224 is disposed at one end of the second electroplating tank 223 near the third electroplating set 23, the second liquid cutting roller set 224 includes two second liquid cutting rollers 2240 disposed opposite to each other, a second passing gap is disposed between the two second liquid cutting rollers 2240, the film 100 passes through the second passing gap after electroplating in the second electroplating tank 223, and two sides of the film 100 are respectively contacted with surfaces of the two second liquid cutting rollers 2240. Similarly, the plating liquid on the surface of the film 100, which has been plated in the second plating vessel 223, is scraped off by the second cutoff roll 2240 to keep the surface of the film 100 clean.

As shown in fig. 4, the third plating group 23 further includes: the third electroplating tank 233 is located at a side of the second electroplating tank 223 away from the first electroplating tank 213, the third electroplating tank 233 is provided with electroplating solution therein, at least part of the film 100 is immersed in the third electroplating tank 233, and the anode conductive roller 232 is located at a side of the third electroplating tank 233 away from the second electroplating tank 223; the third intercepting roll set 234 is disposed at one end of the third electroplating bath 233 far away from the second electroplating bath 223, the third intercepting roll set 234 includes two third intercepting rolls 2340 disposed opposite to each other, a third through gap is disposed between the two third intercepting rolls 2340, the film 100 passes through the third through gap after electroplating in the third electroplating bath 233, and two sides of the film 100 are respectively contacted with surfaces of the two third intercepting rolls 2340. Similarly, the third cutoff roller 2340 is used to scrape the plating solution from the surface of the film 100 plated in the third plating tank 233, so as to prevent the film 100 from bringing the plating solution into the next tank.

In order to reduce the thickness of the diffusion layer on the film surface, destroy the concentration gradient of copper ions on the film surface, make more copper ions put the point on the film surface, accelerate the deposition of metal, the electroplating device further includes: a first stirring member 300 provided in the first plating tank 213 so as to be movable in position to stir the plating liquid in the first plating tank 213; and/or a second stirring member 400 provided in the second plating vessel 223 so as to be positionally movable to stir the plating solution in the second plating vessel 223; and/or a third stirring member 500, which is provided in the third plating vessel 233 so as to be positionally movable, for stirring the plating solution in the third plating vessel 233. Preferably, the first stirring member 300, the second stirring member 400, and the third stirring member 500 can be ultrasonic generators, respectively.

In particular implementations, the first cathode conductive roller 212 includes two oppositely disposed first cathode conductive rollers 2120 with a first pass-through gap between the two first cathode conductive rollers 2120, the second cathode conductive roller 222 includes two oppositely disposed second cathode conductive rollers 2220 with a second pass-through gap between the two second cathode conductive rollers 2220, the anode conductive roller 232 includes two anode conductive rollers 2320 with a third pass-through gap between the two anode conductive rollers 2320; the film 100 is sequentially inserted into the first, second and third insertion gaps, and the film 100 is respectively attached to the first cathode conductive roller 2120, the second cathode conductive roller 2220 and the anode conductive roller 2320. The first cathode conductive roller 212, the second cathode conductive roller 222 and the anode conductive roller 232 are utilized to deposit a coating on the surface of the film 100, and tension of the film 100 can be maintained in the coating process of the film 100, so that the film 100 is transported flatly.

In the practical application process, the two ends of the electroplating assembly are respectively provided with an unreeling roller 600 and a reeling roller 700, the unreeling roller 600 is rotatably arranged around the axis of the unreeling roller, the reeling roller 700 is rotatably arranged around the axis of the unreeling roller, and the film 100 sequentially passes through the first electroplating bath 213, the first liquid intercepting roller group 214, the first cathode conductive roller 212, the second electroplating bath 223, the second liquid intercepting roller group 224, the second cathode conductive roller 222, the third electroplating bath 233, the third liquid intercepting roller group 234 and the anode conductive roller 232 on the unreeling roller 600, and then is wound on the reeling roller 700, so that automatic reeling after film 100 is coated is realized.

Each electroplating assembly comprises a plurality of first electroplating groups 21, and the plurality of first electroplating groups 21 are sequentially arranged at intervals; and/or each plating assembly includes a plurality of second plating groups 22, the plurality of second plating groups 22 being disposed in sequence. The composite current collector product with a certain thickness can be obtained according to actual requirements.

In the actual processing process, the two sides of the film 100 are respectively provided with a first electroplating anode, the positive electrode of the first power supply 210 can be electrically connected with two first electroplating anodes at the same time, the negative electrode can be electrically connected with two first cathode conductive rollers 2120 at the same time, or two first power supplies 210 are provided, the positive electrode and the negative electrode of one first power supply 210 are respectively connected with the first electroplating anode 211 and the first cathode conductive roller 2120 on the upper side of the film 100, and the positive electrode and the negative electrode of the other first power supply 210 are respectively connected with the first electroplating anode 211 and the first cathode conductive roller 2120 on the lower side of the film 100.

In the present application, a metal is usually a polycrystal composed of a plurality of crystal grains, and the size of the crystal grains is represented by the number of crystal grains per unit volume, and the larger the number is, the finer the crystal grains are. Fine grain metals at normal temperature have higher strength, hardness, plasticity and toughness than coarse grain metals. This is because when fine grains are subjected to plastic deformation by an external force, the fine grains can be dispersed in more grains, the plastic deformation is uniform, and the stress concentration is small. The crystal grain is different from the crystal nucleus, and the crystal nucleus grows up to form the crystal grain. The need for lift-off of the raised tips is due to the difference in growth rates of the different crystal planes, some growth blocks, and some growth slowness. The current in the third power supply can not only peel off the grain coating, but also peel off the organic impurities in the coating, and in the electroplating process, the brightening agent and the inhibitor are added into the electroplating solution, so that the quality of the coating is facilitated. For example, it may be added in the first plating tank and the second plating tank of the application. However, if impurities such as brightening agent, inhibitor and the like are arranged in the coating, the oxidation resistance of the product can be influenced, and the binding force of the coating can be influenced. Organic additives such as brightening agent and inhibitor can be adsorbed on the surface of the metal layer in the electroplating process, and are entrained in the metal layer along with the electroplating process, and when the third plating tank is used for back plating, part of the metal is dissolved, and meanwhile, part of the entrained additives such as brightening agent and inhibitor can be released.

From the above description, it can be seen that the above-described embodiments of the present application achieve the following technical effects:

According to the electroplating device, the first electroplating group 21, the second electroplating group 22 and the third electroplating group 23 are arranged, the positive electrode and the negative electrode of the third power supply 230 in the third electroplating group 23 are respectively electrically connected with the electroplating cathode and the anode conductive roller, after the surface of the film 100 is plated in the first electroplating group 21 and the second electroplating group 22, the grains on the surface of the film 100 are stripped by the third power supply 230 in the third electroplating group 23, so that the surface of the film 100 is flat and uniform, and the tensile strength of a current collector is improved.

Spatially relative terms, such as "above … …," "above … …," "upper surface on … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present application.

The above is only a preferred embodiment of the present application, and is not intended to limit the present application, but various modifications and variations can be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An electroplating apparatus for depositing a coating on a thin film (100), the electroplating apparatus comprising:

The electroplating device comprises a plurality of groups of electroplating assemblies, wherein the groups of electroplating assemblies are sequentially arranged along a first preset direction, and each group of electroplating assemblies comprises a first electroplating group (21) and a third electroplating group (23) which are sequentially arranged along a second preset direction;

The first electroplating group (21) comprises a first power supply (210), a first electroplating anode (211) and a first cathode conductive roller (212), wherein the positive electrode of the first power supply (210) is electrically connected with the first electroplating anode (211), the negative electrode of the first power supply (210) is electrically connected with the first cathode conductive roller (212), the first electroplating anode (211) is arranged at the side of the film (100), and a first plating section of the film (100) is attached to the first cathode conductive roller (212) and is used for depositing a first plating layer on the film (100);

The third electroplating group (23) comprises a third power supply (230), an electroplating cathode (231) and an anode conductive roller (232), wherein the anode of the third power supply (230) is electrically connected with the anode conductive roller (232), the cathode of the third power supply (230) is electrically connected with the electroplating cathode (231), the electroplating cathode (231) is arranged at the side of the film (100), and a third plating section of the film (100) is attached to the anode conductive roller (232) and used for depositing a third plating layer on the film (100).

2. Electroplating device according to claim 1, characterized in that the electroplating assembly further comprises a second electroplating group (22), the second electroplating group (22) being located between the first electroplating group (21) and the third electroplating group (23);

The second electroplating group (22) comprises a second power supply (220), a second electroplating anode (221) and a second cathode conductive roller (222), wherein the positive electrode of the second power supply (220) is electrically connected with the second electroplating anode (221), the negative electrode of the second power supply (220) is electrically connected with the second cathode conductive roller (222), the second electroplating anode (221) is arranged at the side of the film (100), and a second plating section of the film (100) is attached to the second cathode conductive roller (222) so as to deposit a second plating layer on the film (100).

3. The plating apparatus according to claim 2, wherein a current value of the third power supply (230) is smaller than a current value of the first power supply (210) and a current value of the second power supply (220), respectively; and/or

The range of the current density J1 of the first power supply (210) is as follows: 2.5A/dm ²≤J1≤4A/dm²; and/or

The range of the current density J2 of the second power supply (220) is as follows: a/dm ²≤J2≤2A/dm²; and/or

The current density J3 of the third power supply (230) ranges from: 0.3A/dm ²≤J3≤0.5A/dm².

4. Electroplating apparatus according to claim 2, wherein the first power source (210) is a pulsed current power source; and/or

The second power supply (220) is a constant current power supply.

5. Electroplating device according to claim 2, characterized in that the first electroplating group (21) further comprises:

A first plating tank (213), wherein the first plating tank (213) has a plating solution therein, and at least a part of the thin film (100) is immersed in the plating solution in the first plating tank (213);

The first liquid cutting roller set (214) is arranged at one end, close to the second electroplating set (22), of the first electroplating bath (213), the first liquid cutting roller set (214) comprises two first liquid cutting rollers (2140) which are oppositely arranged, a first passing gap is formed between the two first liquid cutting rollers (2140), the film (100) passes through the first passing gap after electroplating in the first electroplating bath (213) is completed, and two sides of the film (100) are respectively contacted with the surfaces of the two first liquid cutting rollers (2140).

6. Electroplating device according to claim 5, wherein the second electroplating group (22) further comprises:

a second plating tank (223) located at a side of the first plating tank (213), wherein a plating solution is provided in the second plating tank (223), at least a part of the thin film (100) is immersed in the plating solution in the second plating tank (223), and the first cathode conductive roller (212) is arranged between the first plating tank (213) and the second plating tank (223);

The second liquid cutting roller set (224) is arranged at one end of the second electroplating bath (223) close to the third electroplating set (23), the second liquid cutting roller set (224) comprises two second liquid cutting rollers (2240) which are oppositely arranged, a second through gap is formed between the two second liquid cutting rollers (2240), the film (100) passes through the second through gap after electroplating in the second electroplating bath (223) is completed, and two sides of the film (100) are respectively contacted with the surfaces of the two second liquid cutting rollers (2240).

7. Electroplating device according to claim 6, wherein the third electroplating group (23) further comprises:

A third plating tank (233) located at a side of the second plating tank (223) away from the first plating tank (213), wherein a plating solution is provided in the third plating tank (233), at least a part of the thin film (100) is immersed in the third plating tank (233), and the anode conductive roller (232) is located at a side of the third plating tank (233) away from the second plating tank (223);

Third liquid cutting roller group (234) are arranged at one end of third electroplating bath (233) far away from second electroplating bath (223), third liquid cutting roller group (234) comprise two third liquid cutting rollers (2340) which are oppositely arranged, a third through gap is arranged between the two third liquid cutting rollers (2340), film (100) passes through the third through gap after electroplating in third electroplating bath (233) is completed, and two sides of film (100) are respectively contacted with surfaces of the two third liquid cutting rollers (2340).

8. The plating apparatus as recited in claim 7, wherein said plating apparatus further comprises:

A first stirring member (300) that is provided in the first plating tank (213) so as to be movable in position to stir the plating solution in the first plating tank (213); and/or

A second stirring member (400) provided in the second plating tank (223) so as to be positionally movable to stir the plating solution in the second plating tank (223); and/or

And a third stirring member (500) that is provided in the third plating tank (233) so as to be movable in position, and that stirs the plating solution in the third plating tank (233).

9. The electroplating device of claim 2, wherein the first cathode conductive roller (212) comprises two oppositely disposed first cathode conductive rollers (2120), a first pass-through gap is provided between the two first cathode conductive rollers (2120), the second cathode conductive roller (222) comprises two oppositely disposed second cathode conductive rollers (2220), a second pass-through gap is provided between the two second cathode conductive rollers (2220), the anode conductive roller (232) comprises two anode conductive rollers (2320), and a third pass-through gap is provided between the two anode conductive rollers (2320);

The thin film (100) is sequentially arranged in the first passing gap, the second passing gap and the third passing gap in a penetrating mode, and the thin film (100) is respectively attached to the first cathode conductive roller (2120), the second cathode conductive roller (2220) and the anode conductive roller (2320).

10. Electroplating device according to claim 2, wherein,

Each electroplating assembly comprises a plurality of first electroplating groups (21), and the first electroplating groups (21) are sequentially arranged at intervals; and/or

Each electroplating assembly comprises a plurality of second electroplating groups (22), and the plurality of second electroplating groups (22) are sequentially arranged.