CN221447156U - Relieved tooth liquid cooling plate, liquid cooling heat dissipation group, liquid cooling heat dissipation device and liquid cooling heat dissipation server - Google Patents

Abstract

The utility model discloses a relieved tooth liquid cooling plate, a liquid cooling heat radiation group, a liquid cooling heat radiation device and a liquid cooling heat radiation server, wherein the relieved tooth liquid cooling plate comprises a cold plate main body and a cover plate; the cold plate main body comprises a first surface and a second surface opposite to the first surface, the first surface is provided with a liquid cooling groove, and the second surface is provided with a fluid channel; the cover plate covers the liquid cooling tank, the cover plate comprises a third face, a separation strip and fins are arranged on the third face, the separation strip separates a space surrounded by the third face and the liquid cooling tank into a chip heat dissipation space and a liquid outlet space, and the chip heat dissipation space is communicated with the liquid outlet space through a fluid channel; the inlet opening sets up in the liquid cooling groove one end of keeping away from the parting bead and with chip heat dissipation space intercommunication, goes out liquid hole and play liquid space intercommunication. The relieved tooth liquid cooling plate disclosed by the utility model realizes the cyclic heat dissipation of two components of a chip and a mos inductor on the power calculating plate, and improves the heat dissipation effect on the power calculating plate.

Description

Relieved tooth liquid cooling plate, liquid cooling heat dissipation group, liquid cooling heat dissipation device and liquid cooling heat dissipation server

Technical Field

The utility model relates to the technical field of liquid cooling, in particular to a relieved tooth liquid cooling plate, a liquid cooling heat dissipation group, a liquid cooling heat dissipation device and a liquid cooling heat dissipation server.

Background

Along with the improvement of the computing power of the chips, the power consumption of the ASIC chips is increased, the common air-cooled radiator often cannot meet the heat dissipation requirement of the high-power computing power chips, the working efficiency and the service life of the ASIC chips can be reduced under high-temperature operation, but the ASIC chips are characterized by small size, high power consumption and high heat flux density in the future, and the heat of the chips is taken away in a high-efficiency concentrated heat dissipation mode.

The traditional liquid cooling heat dissipation mode has low heat dissipation efficiency, only can realize heat dissipation to chips on the power board, and cannot simultaneously and efficiently dissipate heat to other inductance components on the power board.

When a tensor calculus force plate on the server comprises a plurality of AISC chips, the heat dissipation device is attached to the chips, and the thickness of the chips on each force plate is different, so that the heat dissipation device cannot be in complete contact with each chip, the heat dissipation efficiency of each chip cannot be improved, and the heat dissipation effect is greatly reduced.

When a plurality of parallel heat dissipating devices are connected with the liquid distributor, cooling liquid enters the liquid distributor from the liquid inlet hole of the liquid distributor and then enters each heat dissipating device from each liquid distributing hole of the liquid distributor, but when the cooling liquid enters the liquid distributor, the positions of each liquid distributing hole are the same, and the flow rate of the cooling liquid flowing into the liquid distributor is not balanced, so that the flow rate of the cooling liquid entering the heat dissipating device from the liquid distributing hole is uneven.

Disclosure of utility model

Therefore, an object of the present utility model is to provide a relieved tooth liquid cooling plate to solve the problems mentioned in the background art, and to achieve the above object, the present utility model provides a relieved tooth liquid cooling plate comprising a cold plate main body and a cover plate; the cold plate main body comprises a first surface and a second surface opposite to the first surface, the first surface is provided with a liquid cooling groove, and the second surface is provided with a fluid channel; the cover plate covers the liquid cooling tank, the cover plate comprises a third face, a separation strip and fins are arranged on the third face, the separation strip separates a space surrounded by the third face and the liquid cooling tank into a chip heat dissipation space and a liquid outlet space, and the chip heat dissipation space is communicated with the liquid outlet space through a fluid channel; the inlet opening sets up in the liquid cooling groove one end of keeping away from the parting bead and with chip heat dissipation space intercommunication, goes out liquid hole and play liquid space intercommunication.

Preferably, the first heat dissipation connection plate extends vertically from the bottom of the fluid channel to the first surface direction, and the second heat dissipation connection plate extends vertically from the second surface to the first surface direction.

In any of the above aspects, preferably, the fluid channel is a T-shaped channel, and a partition plate is disposed inside the fluid channel, and the partition plate is matched with the channel shape of the fluid channel.

In any of the above aspects, it is preferable that the liquid storage device further comprises a fluid channel cover plate, wherein the fluid channel cover plate covers the fluid channel to prevent liquid in the fluid channel from overflowing.

In any of the above embodiments, preferably, a flow dividing strip matched with the fin is provided at the bottom of the liquid cooling tank.

The utility model also discloses a liquid cooling heat dissipation group which comprises N tooth liquid cooling plates connected in series, wherein N is an integer greater than or equal to 2, and is respectively a first tooth liquid cooling plate to an N tooth liquid cooling plate, and the first tooth liquid cooling plate to the N tooth liquid cooling plate are sequentially connected in series.

The utility model also discloses a liquid cooling heat dissipation device, which comprises a first liquid distributor and M liquid cooling heat dissipation groups connected in parallel; m is an integer greater than or equal to 2; the first liquid separator comprises a liquid separator main body, a main runner cover plate and M split runner cover plates; the liquid distributor main body comprises a fifth surface and a sixth surface opposite to the fifth surface, a first groove extends from the fifth surface of the liquid distributor main body to the sixth surface, M mutually independent second grooves extend from the bottom of the first groove to the sixth surface, and the flow distribution channel cover plates are covered on one side, close to the bottom of the first groove, of the second grooves in a one-to-one correspondence manner and form M mutually independent flow distribution channels with the second grooves; the main runner cover plate covers one side of the first groove close to the fifth surface and forms a main runner with the first groove; and each diversion channel cover plate is provided with a cover plate hole.

In any of the above solutions, preferably, one end of the dispenser body is provided with a main runner hole communicated with the bottom of the first groove, a first runner cover plate to an mth runner cover plate are sequentially arranged from near to far from the main runner hole, the cover plate holes from the first runner cover plate to the mth-1 runner cover plate are arranged at one end near to the mth runner cover plate, the cover plate holes of the mth runner cover plate are arranged at one end near to the mth-1 runner cover plate, and the dispenser body is in a strip shape.

In any of the above solutions, preferably, the system further includes a second knockout, the second knockout has the same structure as the first knockout, and the second knockout is connected with the liquid outlet hole of each nth tooth liquid cooling plate.

The utility model also discloses a liquid cooling heat dissipation server, the liquid cooling heat dissipation device and the power calculating plate of any one of the above, the power calculating plate is provided with a chip and an inductor, the radiating fin is attached to the chip on the power calculating plate, and the first heat dissipation connecting plate and the second heat dissipation connecting plate are in contact fit with the inductor.

Compared with the prior art, the utility model has the following advantages and beneficial effects:

1. The relieved tooth liquid cooling plate comprises a chip heat dissipation space and a liquid outlet space, wherein the two spaces are connected together through a fluid channel, cooling liquid flows into the chip heat dissipation space to dissipate heat, a cover plate on the chip heat dissipation space is attached to the chip to dissipate heat, the chips flow into the liquid outlet space through the fluid channel to flow out, the bottom of the fluid channel is connected with an inductance heat dissipation strip, and cooling liquid can dissipate heat for the inductance when flowing through the fluid channel, so that the circulation heat dissipation of the chip and two components of the mos inductance on the power board is realized, and the heat dissipation effect of the power board is improved.

2. The liquid cooling heat dissipation group comprises N number of tooth liquid cooling plates which are connected in series to realize heat dissipation of the power calculation plates which are connected in series, one power calculation plate and one tooth liquid cooling plate are arranged in one-to-one correspondence in the N number of the power calculation plates which are connected in series, the problem that chips with different thicknesses on the tooth liquid cooling plates and the power calculation plates are not completely contacted is avoided, and the problem of poor contact between the cold plates and the chips due to the height error of the chips in a single cold plate scheme is solved by the split type cold plate series design. According to the liquid cooling heat radiation group, the intervals between the fins on the first tooth liquid cooling plate and the intervals between the fins on the N tooth liquid cooling plate are sequentially reduced. The differential design of the relieved tooth runner of the cold plate and the design of the mos inductor runner meet the heat dissipation requirement of a PCB heating device, and the problem of poor temperature consistency of chips is solved.

3. According to the liquid cooling heat dissipation device, the first liquid distributor comprises the first sub-channels and the Mth sub-channels which are sequentially arranged from the near to the far from the main channel hole, the channel holes on the sub-channel cover plate on the Mth sub-channel are oppositely arranged with the channel holes of the Mth sub-channel, so that differential sub-channels are formed, when cooling liquid is filled into the liquid inlet holes, the cooling liquid is accumulated near the Mth sub-channel at first, and the problem of uneven flow of the cold plate branch is solved through the design of the differential sub-channels of the liquid distributor.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is an exploded view of a tooth liquid cooling plate structure according to an embodiment of the present utility model;

FIG. 2 is a schematic view of the structure of the tooth liquid cooling plate shown in FIG. 1 according to an embodiment of the present utility model;

FIG. 3 is a front view of the tooth liquid cooling plate shown in FIG. 1 in accordance with an embodiment of the present utility model;

FIG. 4 is an exploded view of the cold plate body and fluid passage cover plate configuration shown in FIG. 1 of a tooth liquid cooling plate in accordance with an embodiment of the present utility model;

FIG. 5 is an exploded view of the structure of the tooth liquid cooling plate shown in FIG. 1 in accordance with an embodiment of the present utility model;

FIG. 6 is a schematic diagram of a liquid-cooled heat sink according to an embodiment of the utility model;

FIG. 7 is a schematic diagram of a liquid-cooled heat sink according to an embodiment of the utility model;

FIG. 8 is a schematic diagram illustrating a structure of the first liquid dispenser shown in FIG. 7 of the liquid-cooled heat sink according to an embodiment of the present utility model;

FIG. 9 is an exploded view of the first liquid distributor of FIG. 8 of a liquid-cooled heat sink apparatus in accordance with an embodiment of the present utility model;

FIG. 10 is a front view of the first liquid distributor shown in FIG. 8 of the liquid-cooled heat sink apparatus in accordance with an embodiment of the present utility model;

FIG. 11 is a cross-sectional view of the first liquid distributor shown in FIG. 10 of a liquid-cooled heat sink apparatus according to an embodiment of the present utility model along the A-A direction;

FIG. 12 is a schematic view of the liquid-cooled heat sink apparatus according to an embodiment of the present utility model, illustrating the structure of the first dispenser body shown in FIG. 8;

FIG. 13 is a schematic diagram of a liquid-cooled heat sink server according to an embodiment of the present utility model;

Fig. 14 is a schematic structural diagram of a single tooth liquid cooling plate and a power calculating plate of the liquid cooling heat dissipation server according to an embodiment of the present utility model;

Fig. 15 is a front view of a single tooth liquid cooling plate mated with a power plate of a liquid cooled heat sink server according to an embodiment of the utility model.

Wherein: 1-a cold plate body; 2-cover plate; 3-a liquid cooling tank; 4-fluid channels; 5-a first heat dissipation connecting plate; 6-dividing strips; 7-fins; 8-a liquid inlet hole; 9-a liquid outlet hole; 10-dividing plates; 11-a fluid channel cover plate; 12-dividing strips; 13-a second heat dissipation connection plate; 14-cooling fins; 15-a knockout body; 16-a main runner; 17-split flow path; 18-a main runner cover plate; 19-primary flowpath holes; 20-cover plate holes; 21-a first knockout; 22-a second knockout; 23-chip; 24-inductance; 25-spring screws; 26-a first hole; 27-a second hole; 28-a split-flow duct cover plate; 29-force calculating plate; 30-connecting holes.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

As shown in fig. 1 to 5, a relieved tooth liquid cooling plate according to an embodiment of the present utility model includes a plate main body 1 and a cover plate 2;

The cold plate main body 1 comprises a first surface and a second surface opposite to the first surface, the first surface is provided with a liquid cooling groove 3, and the second surface is provided with a fluid channel 4; the cover plate 2 is covered on the liquid cooling tank 3, the cover plate 2 comprises a third surface, a separation strip 6 and fins 7 are arranged on the third surface, the separation strip 6 separates a space enclosed by the third surface and the liquid cooling tank 3 into a chip heat dissipation space and a liquid outlet space, and the chip heat dissipation space is communicated with the liquid outlet space through a fluid channel 4; the liquid inlet hole 8 is arranged at one end of the liquid cooling groove 3 away from the separation strip 6 and is communicated with the chip heat dissipation space, and the liquid outlet hole 9 is communicated with the liquid outlet space.

Further, a first heat radiation connection plate 5 extends perpendicularly from the bottom of the fluid passage 4 to the first surface direction, and a second heat radiation connection plate 13 extends perpendicularly from the second surface to the first surface direction. One end of the first heat radiation connecting plate 5 and one end of the second heat radiation connecting plate 13 are connected with the cold plate main body 1, and the other end is attached to the inductor 24 on the power calculating plate 29, so as to radiate heat of the inductor 24.

The cover plate 2 is matched with the liquid cooling tank 3 and embedded into the liquid cooling tank 3, a third face of the cover plate 2 is communicated with the liquid cooling tank 3, a separation strip 6 surrounds a chip heat dissipation space and a liquid outlet space, the chip heat dissipation space is communicated with the liquid outlet space through a fluid channel 4, fins 7 on the cover plate 2 are distributed in the chip heat dissipation space, a first heat dissipation connecting plate 5 is in contact with an inductor 24 on a power calculating plate 29 and dissipates heat of the inductor 24 on the power calculating plate 29, a part of the fluid channel 4 is distributed above the first heat dissipation connecting plate 5, a cooling liquid flows through the fluid channel 4 to dissipate heat of the first heat dissipation connecting plate 5, the separation strip 6 and the fins 7 are mutually perpendicular, a certain distance is reserved between the separation strip 6 and the fins 7, and a first hole 26 and a second hole 27 are formed in the side face of the liquid cooling tank 3.

The side of liquid cooling groove 3 is equipped with first hole 26, first hole 26 and fluid channel 4 intercommunication, have certain interval between dividing strip 6 and the fin 7, first hole 26 is established on the side that the interval part between dividing strip 6 and the fin 7 of liquid cooling groove 3 corresponds, liquid inlet 8 is established in the bottom of liquid cooling groove 3 and is located the one end of fin 7, first hole 26 is established in the side of liquid cooling groove 3 and is located the other end of fin 7, the coolant liquid gets into from liquid inlet 8, flow to the other end from the one end of fin 7, heat on the fin 7 is taken away to the flow through fin 7, finally the other end to the fin 7 flows into fluid channel 4 from first hole 26.

The second hole 27 is arranged on the side surface of the liquid cooling groove 3, the side surface of the liquid cooling groove 3 arranged on the liquid outlet space part is communicated with the fluid channel 4, after the cooling liquid flows out of the first hole 26 to the fluid channel 4, the bottom of the fluid channel 4 downwards extends to form a first heat dissipation connecting plate 5, the cooling liquid is arranged in the fluid channel 4 to take away heat on the first heat dissipation connecting plate 5, heat dissipation is further carried out on the inductance 24 element, then the cooling liquid enters the liquid outlet space through the second hole 27, and the liquid outlet hole 9 is arranged at the bottom of the liquid cooling groove 3.

The fins 7 are a plurality of and evenly distributed and arranged on the third surface of the cover plate 2, the direction of the distribution and arrangement of the fins 7 is consistent with the flowing direction of the cooling liquid, the cooling liquid takes away the heat on the cover plate 2 through the fins 7, and the cover plate 2 is attached to the chip 23 on the force calculating plate 29 to radiate the heat of the chip 23.

The relieved tooth liquid cooling plate comprises a chip heat dissipation space and a liquid outlet space, wherein the two spaces are connected together through a fluid channel 4, cooling liquid flows into the chip heat dissipation space to dissipate heat, a cover plate on the chip heat dissipation space is attached to a chip 23 to dissipate heat of the chip 23, then flows into the liquid outlet space through the fluid channel 4 to flow out, the bottom of the fluid channel 4 is connected with an inductance 24 heat dissipation strip, and cooling liquid can dissipate heat of the inductance 24 when flowing through the fluid channel, so that the circulation heat dissipation of the chip 23 on the power calculating plate 29 and the two components of the mos inductance 24 is realized, and the heat dissipation effect of the power calculating plate 29 is improved.

Further, the fluid channel 4 is a T-shaped channel, the inside of the fluid channel 4 is provided with a partition plate 10, and the partition plate 10 is matched with the channel shape of the fluid channel 4.

The partition plate 10 is also T-shaped, is matched with the shape of the fluid channel 4, is embedded into the fluid channel 4, and divides the cooling liquid in the fluid channel 4, the partition plate 10 is positioned between the first hole 26 and the second hole 27, so that the cooling liquid flowing in from the first hole 26 flows along the shape of the partition plate 10 and then flows into the second hole 27, the partition plate 10 contacts with the cooling liquid, the heat dissipation efficiency in the fluid channel 4 is improved, the cooling liquid flows more uniformly, and more heat is taken away.

Specifically, the fluid channel cover plate 11 is further included, and the fluid channel cover plate 11 covers the fluid channel to prevent liquid in the fluid channel from overflowing. The shape of the fluid channel cover plate 11 is matched with that of the fluid channel, the fluid channel cover plate covers the upper end of the fluid channel, the fluid channel is close to one end of the second surface, the fluid channel cover plate 11, the fluid channel and the partition plate 10 enclose a flow passage section with a square section, and the first hole 26 and the second hole 27 are square holes.

Further, a split flow strip 12 matched with the fins 7 is arranged at the bottom of the liquid cooling tank 3. The reposition of redundant personnel strip 12 sets up in the central authorities of apron, and the direction the same that arranges with fin 7, and the both sides evenly distributed of reposition of redundant personnel strip 12 has fin 7, and reposition of redundant personnel strip 12 effect is shunted the coolant liquid, makes the flow of coolant liquid more even.

Specifically, the cover plate further includes a fourth surface opposite the third surface, and the fourth surface is provided with a heat sink 14.

The heat sink 14 is attached to the die 23 on the power board 29 for conducting heat from the die 23 to the cover plate.

Further, a second heat radiation connection plate 13 extends from the other end of the cold plate main body 1 to the first surface. The second heat radiation connection plate 13 is connected to the cold plate main body 1, and radiates heat from the inductor 24 on the power plate 29. The first heat dissipation connecting plate 5 and the second inductance 24 are connected with the cold plate main body 1, and the end surfaces of the first heat dissipation connecting plate 5 and the second heat dissipation connecting plate 13 are attached to the inductance 24.

As shown in fig. 6, the present utility model further discloses a liquid cooling heat dissipation group, which includes N tooth liquid cooling plates connected in series, where N is an integer greater than or equal to 2, and is respectively from the first tooth liquid cooling plate to the nth tooth liquid cooling plate, and each tooth liquid cooling plate is connected in series through a pipeline.

Further, the intervals between the fins 7 on the first tooth liquid cooling plate and the intervals between the fins 7 on the nth tooth liquid cooling plate are sequentially reduced.

Further, from the first tooth liquid cooling plate to the N tooth liquid cooling plate in series connection, the liquid inlet 8 of the first tooth liquid cooling plate is connected with a liquid cooling system, the liquid outlet 8 of the first tooth liquid cooling plate is connected with the liquid inlet 8 of the second tooth liquid cooling plate, the liquid outlet 9 of the second tooth liquid cooling plate is connected with the liquid inlet 8 of the third tooth liquid cooling plate, and the like are sequentially performed, the liquid outlet of the N-1 tooth liquid cooling plate is connected with the liquid inlet 8 of the N tooth liquid cooling plate, the connection between the tooth liquid cooling plates is connected through a pipeline, and the liquid outlet 9 of the N tooth liquid cooling plate is connected with a cold liquid recovery system.

In order to make the temperature uniformity of the chips 23 on the force calculating plate 29 corresponding to the tooth liquid cooling plates, the tooth runners of the N tooth liquid cooling plates are differentially designed, the interval between the adjacent tooth fins 7 of the N tooth liquid cooling plates is smaller than the interval between the adjacent tooth fins 7 of the N tooth liquid cooling plates, and the interval between the adjacent tooth fins 7 of the N tooth liquid cooling plates is smaller than the interval between the adjacent tooth fins 7 of the N-1 tooth liquid cooling plates, and the interval between the adjacent tooth fins 7 of the N tooth liquid cooling plates is gradually reduced from the interval between the adjacent tooth fins 7 of the first tooth liquid cooling plate.

Adopt the connected mode of establishing ties, can omit the branch liquid runner structure of parallelly connected design, and parallelly connected design if the heat dissipation demand of many chips 23 is guaranteed in the parallel design, can increase external system's consumption like this, split type cold plate design, link up N number of shovel tooth liquid cooling plates through the hard tube, the feed liquor hole 8 and the one section hard tube of first shovel tooth liquid cooling plate are connected, then hard tube rethread hose is connected with the feed liquor system, the play liquid hole 9 and the play liquid system of nth shovel tooth liquid cooling plate are connected, compensate the poor contact of cold plate and chip 23 because of chip 23 altitude error through the flexible characteristic of hose material.

The liquid cooling heat dissipation group comprises N number of tooth liquid cooling plates which are connected in series to realize heat dissipation of the power calculation plates 29 connected in series, one power calculation plate 29 and one tooth liquid cooling plate are arranged in one-to-one correspondence in the N number of the power calculation plates 29, so that the installation error of the tooth liquid cooling plates on the power calculation plates 29 is reduced, chips 23 and the tooth liquid cooling plates can be completely attached, and the problem of poor contact between the cold plates and the chips 23 caused by the height error of the chips 23 in a single cold plate scheme is solved by the split type cold plate series design.

Optionally, N is 3.

As shown in fig. 7 to 12, the embodiment of the utility model further discloses a liquid cooling heat dissipation device, which comprises a first liquid distributor 21 and M liquid cooling heat dissipation groups connected in parallel; m is an integer greater than or equal to 2; the first dispenser 21 includes a dispenser body 15, a main flow channel cover plate 18, and M flow channel cover plates 28; the dispenser body 15 includes a fifth surface and a sixth surface opposite to the fifth surface, a first groove extends from the fifth surface of the dispenser body 15 toward the sixth surface, M second grooves independent from each other extend from the bottom of the first groove toward the sixth surface, and the manifold cover plates 28 cover one side of the second grooves close to the bottom of the first grooves in a one-to-one correspondence manner and form M independent manifolds with the second grooves; the main runner cover plate 18 covers one side of the first groove close to the fifth surface and forms a main runner 16 with the first groove; each of the manifold cover plates 28 has a cover plate aperture 20 formed therein.

Further, M is 3.

Specifically, one end of the knockout main body 15 is provided with a main runner hole 19 communicated with the bottom of the first groove, a first runner cover plate 28 to an Mth runner cover plate 28 are sequentially arranged from near the main runner hole 19 from near to far, the cover plate hole 20 from the first runner cover plate 28 to the Mth runner cover plate 28 is arranged at one end near to the Mth runner cover plate 28, the cover plate hole 20 of the Mth runner cover plate 28 is arranged at one end near to the Mth runner cover plate 28, and the knockout main body 15 is in a long strip shape.

The main runner cover plate 18 is embedded into one end of the first groove near the fifth surface of the non-liquid main body and forms a main runner space with the main runner 16, and one end of the shunt runner cover plate 28 embedded into the second groove near the fifth surface and forms a shunt runner space with the shunt runner 17, wherein the main runner space is communicated with the shunt runner space through the cover plate hole 20 on the shunt runner cover plate 28.

The sixth surface is provided with M connecting holes 30, and the connecting holes 30 are communicated with the shunt channels 17 in a one-to-one correspondence manner and are arranged in a staggered manner with the cover plate holes 20 of the corresponding shunt channel cover plates 28.

The cover plate hole 20 on the split-flow channel cover plate 28 is arranged at one end of the split-flow channel 17, and the connecting hole 30 is arranged at the other end of the split-flow channel 17 corresponding to the connecting hole on the sixth surface, so that when the cooling liquid enters from the hole of the split-flow channel cover plate 28, the cooling liquid does not directly flow out from the corresponding connecting hole 30, and the cooling liquid enters from one end of the split-flow channel 17 and flows out from the other end of the split-flow channel 17. Each connecting hole 30 is connected with a liquid inlet hole 8 on the first tooth liquid cooling plate.

Further, the device also comprises a second dispenser 22, the second dispenser 22 has the same structure as the first dispenser 21, and the second dispenser 22 is connected with the liquid outlet hole 9 of each Nth relieved tooth liquid cooling plate.

The second dispenser 22 includes a dispenser body 15, one end of the dispenser body 15 is provided with a main runner hole 19 communicated with the bottom of the first groove, first to Mth runner cover plates 28 and 28 are sequentially arranged from near the main runner hole 19 from near to far, cover plate holes 20 from the first to Mth runner cover plates 28 and 28 are arranged at one end near to the Mth runner cover plate 28, and cover plate holes 20 of the Mth runner cover plate 28 are arranged at one end near to the Mth runner cover plate 28, and the dispenser body 15 is in a strip shape.

One end of the knockout main body 15 is provided with a main runner hole 19 communicated with the bottom of the first groove, a first runner cover plate 28 to an Mth runner cover plate 28 are sequentially arranged from near to far from the main runner hole 19, a cover plate hole 20 from the first runner cover plate 28 to the Mth runner cover plate 28 is arranged at one end near to the Mth runner cover plate 28, a cover plate hole 20 of the Mth runner cover plate 28 is arranged at one end near to the Mth runner cover plate 28, and the knockout main body 15 is in a strip shape.

The second knockout 22 is provided with M connecting holes 30, each connecting hole 30 is connected with the liquid outlet hole 9 on the Nth tooth liquid cooling plate, the first cooling liquid enters from the first knockout 21, enters from the liquid inlet hole 8 of the first tooth liquid cooling plate, flows out from the liquid outlet hole 9 of the Nth tooth liquid cooling plate into the connecting holes 30 on the second knockout 22, passes through the diversion channel and the main channel of the second knockout 22, and finally flows out from the main channel hole 19 of the second knockout 22.

According to the liquid cooling heat dissipation device provided by the embodiment of the utility model, the first liquid separator 21 comprises the first sub-channels to the Mth sub-channels which are sequentially arranged from the main channel hole 19 from the near to the far, the channel holes on the Mth sub-channel cover plate 28 are oppositely arranged with the channel holes of the Mth sub-channel to form differential sub-channels, when the cooling liquid is filled into the liquid inlet hole 8, the cooling liquid is accumulated near the Mth sub-channel first, and the problem of uneven flow of the cold plate branch is solved through the design of the differential sub-channels of the liquid separator.

Firstly, cooling water outside the system enters the first liquid distributor 21 through a water inlet plug, the water inlet plug is connected with a main runner hole 19 of first liquid distribution, then flows through an internal flow distribution runner to enter a liquid distribution hose, and then enters a hard pipe connected with a liquid inlet hole 8 of a relieved tooth liquid cooling plate, and the liquid distribution hose, the liquid distributor and the hard pipe are connected through an adapter. The cooling water enters the interior of the relieved tooth liquid cooling plate from the hard pipe, firstly, the heat is radiated to the chip 23 through the relieved tooth runner in the chip heat radiation space, then the heat of the mos inductor 24 is taken away through the fluid channel 4 on one side of the relieved tooth liquid cooling plate, then the cooling water returns to the liquid outlet space, the cooling water enters the next relieved tooth liquid cooling plate through the connecting hard pipe between the cold plates until the cooling water flows out of the liquid outlet 9 on the last relieved tooth liquid cooling plate, then the cooling water returns to the second liquid distributor 22 through the liquid return hose, finally, the cooling water enters the outside of the system through the water outlet plug, the water outlet plug is connected with the main runner hole 19 of the second liquid distributor 22, and the water outlet plug is connected with the second liquid distributor 22, so that the circulation of fluid is completed, and the heat radiation of heating devices in the three power calculating plates 29 is realized.

The three tooth liquid cooling plates are connected in series, so that the temperature consistency of three chips 23 corresponding to the tooth liquid cooling plates is achieved, the tooth flow channels of the three tooth liquid cooling plates are designed differently, the fins 7 of the teeth of the tooth liquid cooling plates from the first tooth liquid cooling plate to the third tooth liquid cooling plate (the inflow sequence of cold water flows from the first tooth liquid cooling plate to the second tooth liquid cooling plate to the third tooth liquid cooling plate) are sparse to dense, a split flow channel structure in parallel connection design can be omitted by adopting a serial connection mode, and if the parallel connection design needs to ensure the heat dissipation requirement of the three chips 23, the power consumption of an external system is increased, the split type cold plate design is used for connecting the three tooth liquid cooling plates through a hard tube, and poor contact between the cold plates and the chips 23 caused by the height error of the chips 23 is compensated through the flexible characteristic of hose materials.

The processing of the cold plate, the hard tube and the liquid separator of the liquid cooling device needs CNC finish machining, a relieved tooth process, flame brazing, friction stir welding, vacuum brazing and other processes. CNC finish machining is needed to be completed on the main body structure of the relieved tooth liquid cooling plate, machining of the fins 7 is needed to be completed on the cover plate through a relieved tooth process, vacuum brazing is needed to be completed on the structural connection of the cover plate and the cold plate main body 1, friction stir welding or vacuum brazing is needed to be completed on the connection of the main runner cover plate 18 and the main runner and the connection of the split runner cover plate 28 and the split runners, and flame brazing is needed to be completed on the connection of the hard tube and the relieved tooth liquid cooling plate.

As shown in fig. 13 to 15, the embodiment of the utility model further discloses a liquid cooling heat dissipation server, which comprises the liquid cooling heat dissipation device and the power calculating plate 29, wherein the power calculating plate 29 is provided with at least one chip 23 and at least one inductor 24, the relieved tooth liquid cooling plates are in one-to-one corresponding fit connection with the chips 23, the heat dissipation fins 14 are attached to the chips 23 on the power calculating plate 29, and the first heat dissipation connection plate 5 is in contact fit with the inductors 24.

The power calculating plate 29 is provided with at least one chip 23, the relieved tooth liquid cooling plates are in one-to-one corresponding fit connection with the chips 23, and the radiating fins 14 are attached to the chips 23 on the power calculating plate 29. The server also comprises a power transformer and a housing, wherein the power transformer is connected with a power calculating plate 29, and the power calculating plate 29 is arranged inside the housing of the server through a bracket.

The number of the force calculating plates 29 is three, and three chips 23 are arranged on each force calculating plate 29. Three calculating plates 29 are vertically arranged in parallel, 3 chips 23 are arranged in parallel on each tensor calculus of the plates 29, a plurality of mos inductors 24 are arranged on each tensor calculus of the plates 29, each chip 23 of the embodiment corresponds to one liquid cooling plate, three liquid cooling plates are arranged on one tensor calculus of the plates 29, the cold plates are connected through pipelines, and a liquid circulation loop is formed, so that the problem of poor contact between the cold plates and the chips 23 caused by height errors of the chips 23 due to the fact that one liquid cooling plate corresponds to three chips 23 is solved. The water inlet pipe and the water outlet pipe of the liquid cooling system of each tensor calculus force plate 29 are respectively connected with the first liquid distributor 21 and the second liquid distributor 22, and the first liquid distributor 21 and the second liquid distributor 22 are respectively provided with a total water inlet joint and a total water outlet joint, so that the total liquid cooling circulation system is formed. In addition, the liquid distributor is designed to have different flow channels, so that the balance of the flow of each branch is ensured, and the design of the liquid cooling plate flow channel also gives consideration to the heat dissipation requirements of the chip 23 and the mos inductor 24.

Further, the tooth liquid cooling plate is locked with the force plate 29 by the spring screw 25. The three relieved tooth liquid cooling plates are locked with the PCB through the spring screws 25 respectively, and good contact between the cold plates and the chip 23 is realized through the buckling force of the specified spring screws 25. Four connecting holes 30 are formed in the main body of each tooth liquid cooling plate, and spring screws 25 penetrate through the connecting holes 30 to fix the tooth liquid cooling plates on the force calculating plate 29.

The liquid cooling heat radiation server of the utility model has the following working principle: starting a server, enabling elements on the force calculating plate to work, filling cooling liquid into a main runner hole of the first liquid distributor, enabling the cooling liquid to enter the main runner from the first main runner hole, enabling the cooling liquid to flow into a sub-runner, enabling the sub-runner to be connected with a liquid inlet of the relieved tooth liquid cooling plate, enabling the cooling liquid to flow into a liquid cooling groove of the first relieved tooth liquid cooling plate through the liquid inlet, enabling the cooling liquid to flow through the liquid cooling groove to cool a chip, enabling the cooling liquid to flow into a fluid channel, enabling the cooling liquid to cool an inductance element through the fluid channel, enabling the cooling liquid to flow into a liquid outlet hole, enabling the cooling liquid to flow into a liquid outlet channel through a second relieved tooth liquid cooling plate, enabling the cooling liquid to sequentially flow through the serially connected relieved tooth liquid cooling plates, enabling the cooling liquid to flow out of the sub-runner of the second liquid distributor, and enabling the cooling liquid to flow out of the main runner hole of the second liquid distributor through continuous circulation flow of the cooling liquid.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

It will be readily understood by those skilled in the art that the present utility model, including any combination of parts described in the summary and detailed description of the utility model above and shown in the drawings, is limited in scope and does not constitute a complete description of the various aspects of these combinations for the sake of brevity. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. The relieved tooth liquid cooling plate is characterized by comprising a cold plate main body and a cover plate;

The cold plate main body comprises a first surface and a second surface opposite to the first surface, the first surface is provided with a liquid cooling groove, and the second surface is provided with a fluid channel;

The cover plate covers the liquid cooling tank, the cover plate comprises a third face, a separation strip and fins are arranged on the third face, the separation strip separates a space enclosed by the third face and the liquid cooling tank into a chip heat dissipation space and a liquid outlet space, and the chip heat dissipation space is communicated with the liquid outlet space through the fluid channel;

The liquid inlet is arranged at one end of the liquid cooling groove away from the separation strip and is communicated with the chip heat dissipation space, and the liquid outlet is communicated with the liquid outlet space.

2. The tooth liquid cooling plate as claimed in claim 1, wherein a first heat radiation connection plate extends perpendicularly from a bottom of said fluid passage toward said first surface, and a second heat radiation connection plate extends perpendicularly from said second surface toward said first surface.

3. The relieved tooth liquid cooling plate of claim 2, wherein the fluid channel is a T-shaped channel, a divider plate is arranged in the fluid channel, and the divider plate is matched with the channel shape of the fluid channel.

4. A tooth liquid cooling plate as claimed in claim 3, further comprising a fluid passage cover plate mated with and covering said fluid passage.

5. The relieved tooth liquid cooling plate of claim 2, wherein the bottom of the liquid cooling tank is provided with a flow dividing strip matched with the fins; the cover plate further comprises a fourth surface opposite to the third surface, and a radiating fin attached to the chip is arranged on the fourth surface.

6. A liquid cooling heat sink assembly comprising N tooth cooling plates according to any one of claims 2-5 connected in series, N being an integer greater than or equal to 2, and being respectively a first tooth cooling plate to an nth tooth cooling plate, the first tooth cooling plate to the nth tooth cooling plate being connected in series in sequence.

7. A liquid cooling heat sink comprising a first liquid separator and M liquid cooling heat dissipation groups according to claim 6 connected in parallel; m is an integer greater than or equal to 2;

The first liquid separator comprises a liquid separator main body, a main runner cover plate and M split runner cover plates; the liquid distributor main body comprises a fifth surface and a sixth surface opposite to the fifth surface, a first groove extends from the fifth surface of the liquid distributor main body to the sixth surface, M mutually independent second grooves extend from the bottom of the first groove to the sixth surface, and the cover plates of the flow distribution channels are covered on one side, close to the bottom of the first groove, of the second grooves in a one-to-one correspondence manner, and form M mutually independent flow distribution channels with the second grooves; the main runner cover plate covers one side of the first groove close to the fifth surface and forms a main runner with the first groove; and each shunt channel cover plate is provided with a cover plate hole.

8. The liquid cooling heat dissipating device of claim 7, wherein a main flow channel hole communicating with the bottom of the first groove is provided at one end of the liquid separator main body, a first flow channel cover plate to an mth flow channel cover plate are sequentially arranged from near to the main flow channel hole from near to far, a cover plate hole from the first flow channel cover plate to the mth flow channel cover plate is provided at one end near to the mth flow channel cover plate, a cover plate hole of the mth flow channel cover plate is provided at one end near to the mth flow channel cover plate, and the liquid separator main body is in a long strip shape; and M connecting holes are formed in the sixth surface and are communicated with the shunt channels in one-to-one correspondence and are arranged in a staggered manner with corresponding cover plate holes of the shunt channel cover plates.

9. The liquid-cooled heat sink of claim 8 further comprising a second liquid separator, the second liquid separator being of the same construction as the first liquid separator, the second liquid separator being connected to the liquid outlet of each of the nth tooth liquid cooling plates.

10. A liquid cooling heat dissipation server, characterized by comprising the liquid cooling heat dissipation device and a power calculating plate according to any one of claims 7-9, wherein a chip and an inductor are arranged on the power calculating plate, a heat dissipation sheet is attached to the chip on the power calculating plate, and a first heat dissipation connection plate and a second heat dissipation connection plate are in contact fit with the inductor.