CN221370644U - MEMS micro-mirror packaging structure based on photoelectric feedback - Google Patents
MEMS micro-mirror packaging structure based on photoelectric feedback Download PDFInfo
- Publication number
- CN221370644U CN221370644U CN202323358777.9U CN202323358777U CN221370644U CN 221370644 U CN221370644 U CN 221370644U CN 202323358777 U CN202323358777 U CN 202323358777U CN 221370644 U CN221370644 U CN 221370644U
- Authority
- CN
- China
- Prior art keywords
- micro
- mirror
- light
- feedback
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 63
- 238000007789 sealing Methods 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims description 18
- 238000004026 adhesive bonding Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 5
- 230000010354 integration Effects 0.000 abstract description 9
- 238000012544 monitoring process Methods 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 238000003912 environmental pollution Methods 0.000 abstract description 3
- 230000003287 optical effect Effects 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 244000126211 Hericium coralloides Species 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Mechanical Light Control Or Optical Switches (AREA)
Abstract
The utility model provides a MEMS micro-mirror packaging structure based on photoelectric feedback, which is characterized in that a specific packaging shell is designed, and a photoelectric feedback module and a micro-mirror chip are arranged in a concave cavity of the packaging shell and are electrically connected with the packaging shell, so that real-time monitoring and feedback of the deflection angle of a movable micro-light reflecting mirror in the micro-mirror chip are realized. The movable micro-light reflecting mirror is protected by the sealing connection of the light-transmitting cover plate and the packaging shell, and the movable micro-light reflecting mirror is prevented from being influenced by environmental pollution to fail. The MEMS micro-mirror packaging structure based on photoelectric feedback has the characteristics of small volume, simple structure, simple implementation mode, high integration level and wide application range. The MEMS micro-mirror packaging structure based on photoelectric feedback is suitable for feedback control of various MEMS micro-mirrors, and is beneficial to further expanding the application field of the MEMS micro-mirrors.
Description
Technical Field
The utility model belongs to the technical field of micro-electro-mechanical systems (MEMS), and relates to an MEMS micro-mirror packaging structure based on photoelectric feedback.
Background
MEMS micromirrors are increasingly used in industry and consumer applications such as lidar, projection displays, 3D cameras, etc. However, due to its small complex structure, MEMS micromirrors are very susceptible to interference from external environments (such as temperature, vibration, etc.), and MEMS micromirrors generally require closed-loop feedback control and special packaging protection to ensure accurate and stable operation of MEMS micromirrors.
In the prior art, deflection angle monitoring of the MEMS micro mirror generally comprises four types of piezoresistive feedback, capacitive feedback, piezoelectric feedback and photoelectric feedback. The piezoresistive feedback mode is easier to integrate and realize, but the performance of the piezoresistive sensor is greatly influenced by temperature change, and the piezoresistive structure needs to be specially designed; the capacitive feedback mode generally needs to arrange a structure which generates capacitance change along with the mirror motion of the MEMS micro-mirror in the structure of the chip, such as comb tooth capacitance and the like, and the design and integration of the feedback capacitance have certain limitations; piezoelectric feedback is typically achieved by additionally depositing a piezoelectric film, such as an AlN film, adding additional materials and processes; the photoelectric feedback setting mode is flexible and is not limited by the driving mode, but additional components are required to be added, and the integration level is low. Therefore, the integration and system packaging of MEMS micromirrors based on photoelectric feedback presents great difficulty.
Therefore, how to realize the integration and system packaging of the MEMS micro-mirror based on the photoelectric feedback, and to improve the integration level of the components and the system packaging are the problems to be solved.
It should be noted that the foregoing description of the background art is only for the purpose of providing a clear and complete description of the technical solution of the present application and is presented for the convenience of understanding by those skilled in the art. The above-described solutions are not considered to be known to the person skilled in the art simply because they are set forth in the background of the application section.
Disclosure of utility model
In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a MEMS micro-mirror packaging structure based on photoelectric feedback, which is used for solving the problem of low integration of MEMS micro-mirrors based on photoelectric feedback in the prior art.
To achieve the above and other related objects, the present utility model provides a MEMS micro-mirror package structure based on photoelectric feedback, comprising:
The packaging shell is internally provided with a concave cavity, and the concave cavity extends from the front opening of the packaging shell to the back direction of the packaging shell;
The micro-mirror chip is arranged in the concave cavity and is electrically connected with the packaging shell, an opening is formed in the back surface of the micro-mirror chip, a movable micro-light reflecting mirror is arranged on the front surface of the micro-mirror chip, and the movable micro-light reflecting mirror is located right above the opening;
The photoelectric feedback module is arranged in the concave cavity and is electrically connected with the packaging shell, the photoelectric feedback module is positioned below the micro-mirror chip and comprises a laser transmitter and a photoelectric conversion receiver, the laser transmitter is used for providing feedback incident light to the back surface of the movable micro-light reflecting mirror, and the photoelectric conversion receiver is used for receiving feedback emergent light from the back surface of the movable micro-light reflecting mirror and converting the feedback emergent light into an electric signal;
The light-transmitting cover plate is positioned on the front surface of the packaging shell and covers the concave cavity, and the light-transmitting cover plate is connected with the packaging shell in a sealing mode.
Optionally, the MEMS micro-mirror packaging structure based on optical feedback further comprises a lens, wherein the lens is located between the optical feedback module and the micro-mirror chip so that the feedback incident light is focused on the back surface of the movable micro-light reflecting mirror through the lens.
Optionally, the cavity includes from bottom to top in proper order intercommunication and opening size increase one-level cavity, second grade cavity and tertiary cavity, the photoelectricity feedback module is fixed in the one-level cavity, the lens is fixed in the second grade cavity, the micromirror chip is fixed in the tertiary cavity.
Optionally, the laser emitter and the photoelectric conversion receiver are fixed in the concave cavity by means of gluing or welding, and the laser emitter and the photoelectric conversion receiver are electrically connected with the packaging shell by means of conductive glue, solder or wire bonding.
Optionally, the micro-mirror chip is fixed in the concave cavity by means of gluing or welding, and the micro-mirror chip is electrically connected with the packaging shell by means of conductive glue, solder or wire bonding.
Optionally, the micromirror chip is electrically connected with the package housing through a wire bonding mode, a wire bonding layer of the micromirror chip is arranged on the inner wall of the concave cavity, a wire bonding pad is arranged on the front surface of the micromirror chip, and the wire bonding layer of the micromirror chip is higher than the wire bonding pad.
Optionally, the light-transmitting cover plate is transparent as a whole, or the light-transmitting cover plate comprises a shading frame and a transparent light window inlaid in the shading frame.
Optionally, the transparent cover plate is parallel to the reference plane of the movable micro-light reflecting mirror, or the transparent cover plate is obliquely arranged relative to the reference plane of the movable micro-light reflecting mirror.
Optionally, the driving mode of the micro mirror chip includes at least one of electrostatic driving, electromagnetic driving, piezoelectric driving and electrothermal driving.
Optionally, the package housing is provided with a soldering electrode for electrical connection with an external circuit.
As described above, the utility model provides a MEMS micro-mirror packaging structure based on photoelectric feedback, and a specific packaging shell is designed, and a photoelectric feedback module and a micro-mirror chip are arranged in a concave cavity of the packaging shell and are electrically connected with the packaging shell, so that real-time monitoring and feedback of the deflection angle of a movable micro-light reflecting mirror in the micro-mirror chip are realized. The movable micro-light reflecting mirror is protected by the sealing connection of the light-transmitting cover plate and the packaging shell, and the movable micro-light reflecting mirror is prevented from being influenced by environmental pollution to fail. The MEMS micro-mirror packaging structure based on photoelectric feedback has the characteristics of small volume, simple structure, simple implementation mode, high integration level and wide application range. The MEMS micro-mirror packaging structure based on photoelectric feedback is suitable for feedback control of various MEMS micro-mirrors, and is beneficial to further expanding the application field of the MEMS micro-mirrors.
Drawings
Fig. 1 is a schematic cross-sectional structure of an MEMS micro-mirror package structure based on optical feedback according to an embodiment of the utility model, wherein a transparent cover plate is integrally transparent and is disposed parallel to a reference plane of a movable micro-mirror.
Fig. 2 is a schematic cross-sectional structure of a micromirror chip in the MEMS micromirror package structure based on photoelectric feedback according to the present utility model.
Fig. 3 is a schematic cross-sectional structure diagram of a MEMS micro-mirror package structure based on optical feedback according to another embodiment of the utility model, wherein the transparent cover plate is transparent as a whole and is disposed obliquely with respect to the reference plane of the movable micro-mirror.
Fig. 4 is a schematic cross-sectional structure diagram of an MEMS micro-mirror package structure based on photoelectric feedback according to an embodiment of the utility model, wherein a light-transmitting cover plate includes a light-shielding frame and a transparent light window embedded in the light-shielding frame, and the light-transmitting cover plate is disposed parallel to a reference plane of a movable micro-mirror.
Fig. 5 is a schematic cross-sectional structure diagram of an MEMS micro-mirror package structure based on optical feedback according to another embodiment of the utility model, wherein the light-transmitting cover plate includes a light-shielding frame and a transparent light window embedded in the light-shielding frame, and the light-transmitting cover plate is disposed obliquely with respect to a reference plane of the movable micro-mirror.
Description of element reference numerals
1. Packaging shell
11. Concave cavity
111. Primary cavity
112. Two-stage cavity
113. Three-stage cavity
2. Micro mirror chip
21. Movable micro-light reflecting mirror
22. Substrate layer
23. Device layer
24. Wire bonding welding disk
3. Photoelectric feedback module
31. Laser transmitter
32. Photoelectric conversion receiver
4. Light-transmitting cover plate
41. Shading frame
42. Transparent light window
5. Lens
6. Sealing layer
7. Micro-mirror chip wire bonding layer
8. Connecting wire
9. Welding electrode
Detailed Description
Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model.
Please refer to fig. 1 to 5. It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present utility model by way of illustration, and only the components related to the present utility model are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
The utility model provides a MEMS micro-mirror packaging structure based on photoelectric feedback, referring to FIG. 1, a schematic cross-sectional structure diagram of the MEMS micro-mirror packaging structure based on photoelectric feedback in an embodiment is shown, comprising a packaging shell 1, a micro-mirror chip 2, a photoelectric feedback module 3 and a light-transmitting cover plate 4, wherein a cavity 11 is arranged in the packaging shell 1, and the cavity 11 extends from the front opening of the packaging shell 1 to the back direction of the packaging shell 1; the micro-mirror chip 2 is arranged in the concave cavity 11 and is electrically connected with the packaging shell 1, an opening is formed in the back surface of the micro-mirror chip 2, a movable micro-light reflecting mirror 21 is arranged on the front surface of the micro-mirror chip 2, and the movable micro-light reflecting mirror 21 is located right above the opening; the photoelectric feedback module 3 is installed in the cavity 11 and is electrically connected with the package housing 1, the photoelectric feedback module 3 is located below the micro-mirror chip 2 and includes a laser emitter 31 and a photoelectric conversion receiver 32, the laser emitter 31 is used for providing feedback incident light to the back surface of the movable micro-light reflecting mirror 21, and the photoelectric conversion receiver 32 is used for receiving feedback emergent light from the back surface of the movable micro-light reflecting mirror 21 and converting the feedback emergent light into an electrical signal; the light-transmitting cover plate 4 is located on the front face of the packaging shell 1 and covers the concave cavity 11, and the light-transmitting cover plate 4 is in sealing connection with the packaging shell 1.
As an example, the MEMS micro-mirror package structure based on electro-optical feedback further comprises a lens 5, the lens 5 being located between the electro-optical feedback module 3 and the micro-mirror chip 2 such that the feedback incident light is focused on the back side of the movable micro-light mirror 21 via the lens 5. The lens 5 is used to achieve convergence of the laser beam to reduce the divergence angle of the laser beam.
Specifically, in this embodiment, the laser emitter 31 emits feedback incident light, which is focused on the back surface of the movable micro-light reflecting mirror 21 via the lens 5, and the light is reflected due to the smooth back surface of the movable micro-light reflecting mirror 21. Thus, the feedback incident light is reflected by the movable micro-mirror 21 to the bottom of the cavity 11. In operation, as the deflection angle of the movable micro-mirror 21 in the micro-mirror chip 2 changes, the light spot formed by the feedback incident light at the bottom of the concave cavity 11 also changes. Accordingly, the electrical signal of the feedback outgoing light received by the photoelectric conversion receiver 32 is also changed, so that the position information deflected by the movable micro-light reflecting mirror 21 can be converted into corresponding photoelectric information in real time. The deflection position of the current movable micro-light reflecting mirror 21 can be determined by analyzing photoelectric information, and the deflection position is transmitted to a peripheral control circuit of the micro-mirror chip 2 through an electrically connected packaging shell 1 structure to adjust a driving signal of the movable micro-light reflecting mirror 21, so that the real-time control of the deflection angle of the movable micro-light reflecting mirror 21 is realized based on photoelectric feedback.
As an example, the package body 1 is manufactured by molding, metal printing, sintering, and the like. A concave cavity 11 is arranged in the packaging shell 1, and the bottom of the concave cavity 11 is horizontally arranged. Preferably, the center line of the cavity 11 coincides with the center line of the package body 1.
As an example, a sealing layer 6 is located on top of the package housing 1 and forms an airtight package with the light-transmissive cover plate 4.
As an example, referring to fig. 2, the micromirror chip 2 is fabricated from a wafer by a semiconductor processing process. The wafer comprises at least a substrate layer 22 and a device layer 23, the movable micro-mirror being formed on the device layer 23.
As an example, referring to fig. 1 again, the micro-mirror chip 2 is fixed in the cavity 11 by gluing or soldering, and the micro-mirror chip 2 is electrically connected to the package housing 1 by conductive glue, solder or wire bonding. The micro-mirror chip 2 realizes the control of the working state of the movable micro-light reflecting mirror 21 through a peripheral control circuit electrically connected with the packaging shell 1, and particularly comprises the step of adjusting a driving signal of the movable micro-light reflecting mirror 21 through the peripheral control circuit, so that the deflection of the mirror surface of the movable micro-light reflecting mirror 21 in the two-dimensional direction can be conveniently and flexibly driven.
As an example, the micro-mirror chip 2 is electrically connected with the package housing 1 by wire bonding, a micro-mirror chip wire bonding layer 7 is disposed on the inner wall of the cavity 11, a wire bonding pad 24 is disposed on the front surface of the micro-mirror chip 2, and the micro-mirror chip wire bonding layer 7 is higher than the wire bonding pad 24.
Specifically, in this embodiment, the bonding pads 24 are formed on the device layer 23 of the micromirror chip 2 and are located on two sides of the movable micro-mirror 21. The micro-mirror chip routing layer 7 is connected with the routing welding disc through a connecting wire 8 so as to realize the electric connection between the packaging shell 1 and the micro-mirror chip 2. Since the bonding wires 8 are typically of a certain curvature or height, if the height of the micromirror chip 2 in the cavity 11 is too high, there may be a problem that the light-transmitting cover plate 4 is pressed to the bonding wires 8 to cause a short circuit. Therefore, in this embodiment, the height of the bonding pad 24 of the micro-mirror chip 2 in the cavity 11 is higher than the height of the bonding pad 7 of the micro-mirror chip 2 in the cavity 11.
As an example, the number of the photoelectric conversion receivers 32 in the photoelectric feedback module 3 is 1 or more. The feedback emergent light reflected by the back surface of the movable micro-light reflecting mirror 21 continuously scans the photoelectric conversion receiver 32 and is converted into an electric signal by the photoelectric conversion receiver 32, so as to obtain the deflection condition of the mirror surface of the movable micro-light reflecting mirror 21. Preferably, in the present embodiment, the number of the photoelectric conversion receivers 32 is 2.
As an example, the laser transmitter 31 and the photoelectric conversion receiver 32 are fixed in the cavity 11 by means of gluing or soldering, and the laser transmitter 31 and the photoelectric conversion receiver 32 are electrically connected to the package housing 1 by means of conductive paste, solder or wire bonding.
As an example, the cavity 11 includes a primary cavity 111, a secondary cavity 112 and a tertiary cavity 113, which are sequentially communicated from bottom to top and have progressively increased opening sizes, the optical feedback module 3 is fixed in the primary cavity 111, the lens 5 is fixed in the secondary cavity 112, and the micromirror chip 2 is fixed in the tertiary cavity 113.
Specifically, in this embodiment, any one of the primary cavity 111, the secondary cavity 112 and the tertiary cavity 113 includes a vertical longitudinal wall, and the bottom of any one of the cavities is horizontally disposed, and the any one of the cavities forms a vertical cavity in the package housing 1. The lens 5 is fixed in the secondary cavity 112, and the bottom surface of the lens 5 covers the opening of the primary cavity 111. The micro-mirror chip 2 is fixed in the tertiary cavity 113, and the front projection of the micro-mirror chip 2 in the secondary cavity 112 covers the opening of the secondary cavity 112, wherein at least a part of the front projection of the movable micro-light reflecting mirror 21 in the secondary cavity 112 covers the projection of the lens 5 on the surface of the secondary cavity 112.
As an example, the light-transmitting cover plate 4 is transparent as a whole, or the light-transmitting cover plate 4 includes a light-shielding frame 41 and a transparent light window 42 embedded in the light-shielding frame 41. The light-transmitting cover plate 4 can make the external incident light irradiate the front surface of the movable micro light reflecting mirror 21, and reflect to the outside of the package housing 1 according to the instantaneous deflection angle position of the movable micro light reflecting mirror 21, so as to form reflected light.
In an embodiment, referring to fig. 1 and 3, the transparent cover 4 is transparent as a whole, and the transparent cover 4 is fixed on the package housing 1 through the sealing layer 6 and is connected with the package housing 1 in a sealing manner. In this package structure, the transparent cover plate 4 may protect the movable micro-mirror 21 and the micro-mirror chip 2, so as to prevent the movable micro-mirror 21 from being disabled due to the influence of dust, moisture, humidity, or pollutants.
In another embodiment, referring to fig. 4 and 5, the light-transmitting cover plate 4 includes a light-shielding frame 41 and a transparent light window 42 embedded in the light-shielding frame 41, and the front projection of the transparent light window 42 on the bottom surface of the package housing 1 at least covers the front projection of the micro-mirror chip 2 on the bottom surface of the package housing 1, so as to realize effective control of the light-transmitting area. The transparent light window 42 in the transparent cover plate 4 is reliably connected with the light shielding frame 41, so that the intrusion of water vapor or impurities is prevented, the breakage of the transparent cover plate 4 caused by overlarge pressure is avoided, the protection is provided for the high-quality durable micro-mirror chip 2, and the stability and the yield of the packaging structure are effectively improved.
As an example, the light-transmitting cover plate 4 is parallel to the reference plane of the movable micro-mirror 21, or the light-transmitting cover plate 4 is disposed obliquely with respect to the reference plane of the movable micro-mirror 21. The reference plane of the movable micro light reflecting mirror 21 is a plane parallel to the direction of the bottom surface of the package case 1.
In one embodiment, referring to fig. 1 and 4, the transparent cover plate 4 is disposed parallel to the reference plane of the movable micro light reflecting mirror 21. External incident light irradiates the front surface of the movable micro light reflecting mirror 21 from the front surface of the transparent cover plate 4, and is reflected to the outside of the packaging shell 1 according to the instantaneous deflection angle position of the movable micro light reflecting mirror 21, so as to form reflected light. In this process, part of the incident light may be transmitted by the transparent cover plate 4 to the movable micro light reflecting mirror 21, or part of the incident light may be reflected directly into stray light through the outer surface of the transparent cover plate 4. Thus, in other embodiments of the application, a light-transmitting cover plate 4 arranged obliquely with respect to the reference plane of the movable micro-mirror 21 may be used to eliminate the influence of stray reflected light.
In particular, referring to fig. 3 and 5, in another embodiment, the light-transmitting cover plate 4 is disposed obliquely with respect to the reference plane of the movable micro-mirror 21. In this package structure, the transparent cover plate 4 disposed obliquely with respect to the reference plane of the movable micro-mirror 21 can protect the movable micro-mirror 21 and the micro-mirror chip 2, and can eliminate the influence of the stray reflected light.
As an example, the driving mode of the micromirror chip 2 includes at least one of electrostatic driving, electromagnetic driving, piezoelectric driving, and electrothermal driving. The specific type of driving mode of the micromirror chip 2 may be selected according to need, and is not excessively limited here.
As an example, the package housing 1 is provided with a soldering electrode 9 for electrical connection with an external circuit. The welding electrode 9 is located below the package body 1.
In summary, the utility model provides a MEMS micro-mirror packaging structure based on photoelectric feedback, which is characterized in that a specific packaging shell is designed, and a photoelectric feedback module and a micro-mirror chip are arranged in a cavity of the packaging shell and are electrically connected with the packaging shell, so that real-time monitoring and feedback of the deflection angle of a movable micro-light reflecting mirror in the micro-mirror chip are realized. The movable micro-light reflecting mirror is protected by the sealing connection of the light-transmitting cover plate and the packaging shell, and the movable micro-light reflecting mirror is prevented from being influenced by environmental pollution to fail. The MEMS micro-mirror packaging structure based on photoelectric feedback has the characteristics of small volume, simple structure, simple implementation mode, high integration level and wide application range. The MEMS micro-mirror packaging structure based on photoelectric feedback is suitable for feedback control of various MEMS micro-mirrors, and is beneficial to further expanding the application field of the MEMS micro-mirrors. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (10)
1. An MEMS micro-mirror packaging structure based on photoelectric feedback, comprising:
The packaging shell is internally provided with a concave cavity, and the concave cavity extends from the front opening of the packaging shell to the back direction of the packaging shell;
The micro-mirror chip is arranged in the concave cavity and is electrically connected with the packaging shell, an opening is formed in the back surface of the micro-mirror chip, a movable micro-light reflecting mirror is arranged on the front surface of the micro-mirror chip, and the movable micro-light reflecting mirror is located right above the opening;
The photoelectric feedback module is arranged in the concave cavity and is electrically connected with the packaging shell, the photoelectric feedback module is positioned below the micro-mirror chip and comprises a laser transmitter and a photoelectric conversion receiver, the laser transmitter is used for providing feedback incident light to the back surface of the movable micro-light reflecting mirror, and the photoelectric conversion receiver is used for receiving feedback emergent light from the back surface of the movable micro-light reflecting mirror and converting the feedback emergent light into an electric signal;
The light-transmitting cover plate is positioned on the front surface of the packaging shell and covers the concave cavity, and the light-transmitting cover plate is connected with the packaging shell in a sealing mode.
2. The MEMS micro-mirror package based on optical-electrical feedback of claim 1, further comprising a lens between the optical-electrical feedback module and the micro-mirror chip to focus the feedback incident light via the lens onto a back side of the movable micro-optic mirror.
3. The MEMS micro-mirror package structure based on the photoelectric feedback according to claim 2, wherein the cavity comprises a primary cavity, a secondary cavity and a tertiary cavity which are sequentially communicated from bottom to top and have an opening with an increasing size, the photoelectric feedback module is fixed in the primary cavity, the lens is fixed in the secondary cavity, and the micro-mirror chip is fixed in the tertiary cavity.
4. The MEMS micro-mirror package structure based on photoelectric feedback according to claim 1, wherein the laser transmitter and the photoelectric conversion receiver are fixed in the cavity by gluing or soldering, and the laser transmitter and the photoelectric conversion receiver are electrically connected with the package housing by conductive glue, solder or wire bonding.
5. The MEMS micro-mirror package structure based on the optical-electrical feedback according to claim 1, wherein the micro-mirror chip is fixed in the cavity by gluing or soldering, and the micro-mirror chip is electrically connected with the package housing by conductive glue, solder or wire bonding.
6. The MEMS micro-mirror package structure based on photoelectric feedback according to claim 5, wherein the micro-mirror chip is electrically connected with the package housing by wire bonding, a wire bonding layer of the micro-mirror chip is arranged on the inner wall of the cavity, a wire bonding pad is arranged on the front surface of the micro-mirror chip, and the wire bonding layer of the micro-mirror chip is higher than the wire bonding pad.
7. The MEMS micro-mirror package structure based on optical-electrical feedback according to claim 1, wherein the light-transmitting cover plate is transparent as a whole, or the light-transmitting cover plate comprises a light shielding frame and a transparent light window embedded in the light shielding frame.
8. The MEMS micro-mirror package structure based on optical-electrical feedback according to claim 1, wherein the light-transmitting cover plate is parallel to the reference plane of the movable micro-mirror or is disposed obliquely with respect to the reference plane of the movable micro-mirror.
9. The MEMS micro-mirror package structure of claim 1, wherein the driving mode of the micro-mirror chip comprises at least one of electrostatic driving, electromagnetic driving, piezoelectric driving and electrothermal driving.
10. The MEMS micro-mirror package based on optical-electrical feedback according to claim 1, wherein the package housing is provided with a bonding electrode for electrical connection with an external circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323358777.9U CN221370644U (en) | 2023-12-07 | 2023-12-07 | MEMS micro-mirror packaging structure based on photoelectric feedback |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323358777.9U CN221370644U (en) | 2023-12-07 | 2023-12-07 | MEMS micro-mirror packaging structure based on photoelectric feedback |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221370644U true CN221370644U (en) | 2024-07-19 |
Family
ID=91871745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323358777.9U Active CN221370644U (en) | 2023-12-07 | 2023-12-07 | MEMS micro-mirror packaging structure based on photoelectric feedback |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221370644U (en) |
-
2023
- 2023-12-07 CN CN202323358777.9U patent/CN221370644U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100707179B1 (en) | Optical scanner package and method for manufacturing the same | |
| JP5505424B2 (en) | Optical communication module | |
| US20070091293A1 (en) | Photoelectric sensor, optical module and method of producing same | |
| CN111725142A (en) | Integrated electronic module for 3D sensing applications and 3D scanning device comprising an integrated electronic module | |
| US20190363216A1 (en) | Optical Sensing Assembly and Method for Manufacturing the Same, and Optical Sensing System | |
| GB2312551A (en) | Encapsulating semiconductor optical devices | |
| JP6529431B2 (en) | Optical element package | |
| CN221370644U (en) | MEMS micro-mirror packaging structure based on photoelectric feedback | |
| JP7036236B2 (en) | Tactile and proximity sensors | |
| CN221370645U (en) | MEMS micro-mirror packaging structure | |
| US4833318A (en) | Reflection-type photosensor | |
| US12092310B2 (en) | Optical barrier using side fill and light source module including the same | |
| JPH05175614A (en) | Optical semiconductor device | |
| CN113031249B (en) | Micro-mirror control device based on photoelectric feedback | |
| JPS62190776A (en) | Photoelectric conversion device | |
| CN114942451A (en) | Method for manufacturing light-sensitive chip | |
| US20240219014A1 (en) | Lens barrel-equipped lens and light source device | |
| JP2007109851A (en) | Photo interrupter | |
| KR102241845B1 (en) | Reflective optical sensor package | |
| CN219389492U (en) | Lens and light-emitting device thereof | |
| WO2022255146A1 (en) | Light emitting device, and distance measuring device | |
| CN208444121U (en) | Projection arrangement | |
| KR20240118246A (en) | Transmissive photointerrupter optical sensor having an optical structure for replacing metal slit function in the housing and manufacturing method thereof | |
| JP4758069B2 (en) | Photocoupler, photocoupler array and photocoupler built-in semiconductor integrated circuit | |
| JP6426539B2 (en) | Optical device and method of manufacturing optical device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |