CN221240567U

CN221240567U - BGA chip processing device

Info

Publication number: CN221240567U
Application number: CN202322557691.2U
Authority: CN
Inventors: 孙尚坤; 陈近刚; 黄杰明
Original assignee: Shenzhen Zhicheng Jingzhan Technology Co ltd
Current assignee: Shenzhen Zhicheng Jingzhan Technology Co ltd
Priority date: 2023-09-19
Filing date: 2023-09-19
Publication date: 2024-06-28
Anticipated expiration: 2033-09-19

Abstract

The utility model relates to the technical field of BGA chip processing equipment, in particular to a BGA chip processing device, which comprises a mounting platform, a first moving assembly and a preheating mechanism, wherein the first moving assembly and the preheating mechanism are arranged on the mounting platform; the first motion assembly is connected with a first heating assembly, the first heating assembly comprises a first hot air heater and a first air guide cover, the first air guide cover comprises a first shell corresponding to the first hot air heater and a first air homogenizing plate arranged in the first shell, and a plurality of air outlet holes are formed in the first air homogenizing plate so that hot air blown by the first hot air heater heats components on the circuit board; the first shell outer ring is also provided with at least one air outlet, the air outlet and the first hot air heater are respectively positioned on two opposite sides of the first air homogenizing plate, and the air outlet is correspondingly provided with a guide plate, so that hot air flowing through the air outlet is blown in a direction away from the circuit board. The BGA chip processing device enables the flow direction of hot air to be controllable, and reduces the influence on adjacent components during heating.

Description

BGA chip processing device

Technical Field

The utility model relates to the technical field of BGA chip processing equipment, in particular to a BGA chip processing device.

Background

Along with the development of science and technology and society, the popularization and updating of electronic products are faster and faster, and in order to avoid wasting raw materials, BGA repair equipment is generally used to replace and update components on a PCB board, so as to reuse the PCB board.

Most of the existing BGA repairing equipment directly uses an air outlet nozzle of a hot air heating device to heat components, so that soldering tin is melted, and the corresponding components are replaced and maintained conveniently. Because the air outlet nozzle and the heated components have a certain distance during heating and the flow direction of hot air is uncontrollable, other components adjacent to the heated components can be obviously influenced, and the adjacent components are easy to damage.

Disclosure of utility model

The utility model aims to overcome the defects of the prior art and provides a BGA chip processing device, so that the flow direction of hot air is controllable, and the influence on adjacent components during heating is reduced.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a BGA chip processing device which comprises a mounting platform, a first motion assembly and a preheating mechanism, wherein the first motion assembly and the preheating mechanism are arranged on the mounting platform.

The first motion assembly is connected with a first heating assembly, the first heating assembly comprises a first hot air heater and a first air guide cover, the first air guide cover comprises a first shell corresponding to the first hot air heater and a first air homogenizing plate arranged in the first shell, and a plurality of air outlet holes are formed in the first air homogenizing plate so that hot air blown by the first hot air heater heats components on the circuit board.

The first shell outer ring is also provided with at least one air outlet, the air outlet and the first hot air heater are respectively positioned on two opposite sides of the first air homogenizing plate, and the air outlet is correspondingly provided with a guide plate, so that hot air flowing through the air outlet is blown in a direction away from the circuit board.

Optionally, the BGA chip processing apparatus further includes a camera module and an adsorption module, both of which are connected to the first moving assembly.

Optionally, the first motion assembly includes a first X-axis motion assembly disposed on the mounting platform, a first Y-axis motion assembly disposed on the first X-axis motion assembly, and a Z-axis motion assembly disposed on the first Y-axis motion assembly; the transmission directions of the first X-axis motion assembly, the first Y-axis motion assembly and the Z-axis motion assembly are mutually perpendicular; the first hot air heater, the photographing module and the adsorption module are all connected with the Z-axis movement assembly.

Optionally, the Z-axis motion assembly comprises a mounting plate connected with the first Y-axis motion assembly, and a first lifting assembly and a second lifting assembly arranged on the mounting plate; the first lifting assembly is provided with a first heating assembly, and the second lifting assembly is provided with an adsorption module.

Optionally, the first lifting assembly comprises a first driving motor arranged on the mounting plate, a first driving wheel in transmission connection with the first driving motor, a first driven wheel arranged on the mounting plate, and a first synchronous belt sleeved on the first driving wheel and the first driven wheel, wherein one side of the first synchronous belt is connected with the first hot air heater.

The second lifting assembly comprises a second driving motor arranged on the mounting plate, a second driving wheel in transmission connection with the second driving motor, a second driven wheel arranged on the mounting plate, and a second synchronous belt sleeved on the second driving wheel and the second driven wheel, wherein one side of the second synchronous belt is connected with the adsorption module.

Optionally, the camera module includes camera, light filling ring and the support of setting on the mounting panel, and camera and light filling ring all are connected with the support, and the light filling ring sets up in front of the camera's camera lens.

Optionally, the BGA chip processing device further includes a driving screw disposed on the mounting platform, and a first bracket and a second bracket connected to the driving screw, where the mounting platform is further provided with a sliding rail disposed parallel to the driving screw, so that the first bracket and the second bracket are slidably connected to the sliding rail.

Optionally, the preheating mechanism comprises a support shell and a plurality of heating elements, the support shell is arranged on the mounting platform, and the plurality of heating elements are arranged in the support shell in an array manner.

Optionally, the BGA chip processing apparatus further includes a second moving assembly disposed on the mounting platform, and a second heating assembly connected to the second moving assembly; the second heating assembly comprises a second hot air heater and a second diversion fan cover, the second diversion fan cover comprises a second shell corresponding to the second hot air heater and a second air homogenizing plate arranged in the second shell, and a plurality of air outlet holes are formed in the second air homogenizing plate so that hot air blown out by the second hot air heater heats components on the circuit board.

Optionally, the second motion assembly includes a second X-axis motion assembly disposed on the mounting platform, and a second Y-axis motion assembly disposed on the second X-axis motion assembly; the transmission directions of the second X-axis motion assembly and the second Y-axis motion assembly are mutually perpendicular, and the transmission directions of the second X-axis motion assembly and the first X-axis motion assembly are mutually parallel.

Compared with the prior art, the utility model has the beneficial effects that the first air homogenizing plate provided with a plurality of air outlet holes is arranged in the first shell, at least one air outlet is arranged on the outer ring of the first shell, and the air outlet is correspondingly provided with the guide plate, so that hot air blown by the first hot air heater is blown to the circuit board after passing through the first air homogenizing plate, and then is blown to a direction far away from the circuit board through the air outlet. Therefore, the first diversion fan cover can limit the flow direction of hot air, so that the hot air can be blown out in the direction away from the circuit board when heating the components to be heated, the flow direction of the hot air is controllable, and the influence on adjacent components during heating is reduced.

Drawings

The utility model will be further described with reference to the accompanying drawings and examples:

fig. 1 is a schematic structural diagram of a BGA chip processing apparatus according to an embodiment of the present application;

FIG. 2 is a schematic structural view of a first motion assembly and a mounting platform according to an embodiment of the present application;

FIG. 3 is a schematic diagram of a first heating assembly, an adsorption module, a camera module and a Z-axis motion assembly according to an embodiment of the present application;

FIG. 4 is a schematic diagram of a first heating assembly, an adsorption module, a camera module and a Z-axis motion assembly according to an embodiment of the present application;

Fig. 5 is a schematic structural diagram of a preheating mechanism according to an embodiment of the present application;

FIG. 6 is an exploded view of a first heating assembly according to an embodiment of the present application;

Fig. 7 is a schematic structural diagram of a first air guiding cover according to an embodiment of the present application;

FIG. 8 is a schematic diagram of a camera module according to an embodiment of the present application;

fig. 9 is a schematic diagram of an assembly structure of a transmission screw, a first bracket, a second bracket and a sliding rail according to an embodiment of the present application;

FIG. 10 is a schematic diagram of a second heating assembly according to an embodiment of the present application;

FIG. 11 is an enlarged partial schematic view of FIG. 10 at A;

FIG. 12 is a schematic view of an assembly structure of a second moving assembly and a second heating assembly on a mounting platform according to an embodiment of the present application;

fig. 13 is a second schematic structural diagram of a BGA chip processing apparatus according to an embodiment of the present application.

In the figure: 100. BGA chip processing device; 110. a mounting platform; 120. a first motion assembly; 121. a first X-axis motion assembly; 122. a first Y-axis motion assembly; 123. a Z-axis motion assembly; 1231. a mounting plate; 1232. a first lifting assembly; 12321. a first driving motor; 12322. a first drive wheel; 12323. a first driven wheel; 12324. a first synchronization belt; 1233. a second lifting assembly; 12331. a second driving motor; 12332. a second driving wheel; 12333. a second driven wheel; 12334. a second timing belt; 130. a preheating mechanism; 131. a support housing; 1311. a heat radiation hole; 132. a heating member; 140. a first heating assembly; 141. a first hot air heater; 142. a first air guide cover; 1421. a first housing; 1422. a first air homogenizing plate; 1423. an air outlet; 1424. a deflector; 150. an air outlet hole; 160. a camera module; 161. a camera; 162. a light supplementing ring; 163. a bracket; 170. an adsorption module; 181. a transmission screw rod; 182. a first bracket; 183. a second bracket; 184. a sliding rail; 191. a second motion assembly; 1911. a second X-axis motion assembly; 1912. a second Y-axis motion assembly; 192. a second heating assembly; 1921. a second hot air heater; 1922. a second air guide cover; 19221. a second housing; 19222. a second air homogenizing plate; 200. and protecting the shell.

Detailed Description

In order to solve the technical problems, the utility model provides a technical scheme and an embodiment of the utility model, which are described in detail with reference to the accompanying drawings.

The technical scheme adopted by the utility model is as follows:

As shown in fig. 1, the present utility model provides a BGA chip processing apparatus 100 including a mounting stage 110, and a first moving assembly 120 and a preheating mechanism 130 provided on the mounting stage 110.

Referring to fig. 1, 6 and 7, a first heating assembly 140 is connected to the first moving assembly 120, the first heating assembly 140 includes a first hot air heater 141 and a first air guiding cover 142, the first air guiding cover 142 includes a first housing 1421 corresponding to the first hot air heater 141, and a first air homogenizing plate 1422 disposed in the first housing 1421, and a plurality of air outlet holes 150 are formed in the first air homogenizing plate 1422, so that hot air blown by the first hot air heater 141 heats components on a circuit board; the outer ring of the first housing 1421 is further provided with at least one air outlet 1423, the air outlet 1423 and the first hot air heater 141 are respectively located at two opposite sides of the first air homogenizing plate 1422, and a deflector 1424 is correspondingly arranged at the air outlet 1423, so that hot air flowing through the air outlet 1423 is blown in a direction away from the circuit board.

The first housing 1421 may limit the flow direction of the hot air, so as to guide the hot air to flow through the first air distribution plate 1422 and blow out; the plurality of air outlets 150 formed in the first air equalizing plate 1422 can make the hot air blow to the circuit board in a more dispersed manner, so that the components to be heated are heated more uniformly; meanwhile, the hot air blown out through the first air homogenizing plate 1422 is correspondingly matched with the circuit board at the port of the first shell 1421, and in the continuous blowing process of the hot air, the hot air is blown out towards the direction far away from the circuit board through the guide of the air outlet 1423 and the guide plate 1424. Therefore, the first air guiding cover 142 can enable the hot air blown out by the first hot air heater 141 to flow along the air channel formed by the first shell 1421, the first air homogenizing plate 1422, the air outlet 1423 and the air guiding plate 1424, so that the flow direction of the hot air is controllable, and the negative influence of the hot air on adjacent components during heating is avoided.

Further, as shown in fig. 1, the BGA chip processing apparatus 100 further includes a camera module 160 and an adsorption module 170, and the camera module 160 and the adsorption module 170 are connected to the first moving assembly 120.

In practical production application, the first heating assembly 140, the camera module 160 and the adsorption module 170 are all connected with the first moving assembly 120, wherein the first heating assembly 140 can heat a specific area on the circuit board, the camera module 160 can calibrate the position of the circuit board or the component according to a preset mark point and obtain corresponding position information, and the adsorption module 170 can adsorb the component and place the component to the specific position.

In an alternative embodiment, BGA chip processing apparatus 100 has three modes of operation, the first mode of operation being a soldering mode, i.e., thermal solder for repairing and reinforcing a specified component on a circuit board; the second working mode is a disassembly mode, namely, specified components on the circuit board are disassembled and placed to specified positions; the third mode of operation is a mounting mode, i.e., mounting a chip or other component at a designated location on a circuit board.

Further, referring to fig. 2, the first moving assembly 120 includes a first X-axis moving assembly 121 provided on the mounting platform 110, a first Y-axis moving assembly 122 provided on the first X-axis moving assembly 121, and a Z-axis moving assembly 123 provided on the first Y-axis moving assembly 122; wherein, the transmission directions of the first X-axis motion assembly 121, the first Y-axis motion assembly 122 and the Z-axis motion assembly 123 are mutually perpendicular; the first hot air heater 141, the camera module 160, and the adsorption module 170 are all connected to the Z-axis moving assembly 123.

Wherein, the first X-axis movement assembly 121 can control the movement of the first hot air heater 141, the photographing module 160, and the adsorption module 170 in the X-axis direction, the first Y-axis movement assembly 122 can control the movement of the first hot air heater 141, the photographing module 160, and the adsorption module 170 in the Y-axis direction, and the Z-axis movement assembly 123 can control the movement of at least one of the first hot air heater 141, the photographing module 160, and the adsorption module 170 in the Z-axis direction.

In practical production applications, the first X-axis moving assembly 121, the first Y-axis moving assembly 122 and the Z-axis moving assembly 123 can be moved to the preset position at the same time, and then the position of at least one of the first hot air heater 141, the camera module 160 and the adsorption module 170 can be adjusted with higher precision in the X-axis direction, the Y-axis direction or the Z-axis direction according to the situation.

Further, as shown in fig. 4, the Z-axis moving assembly 123 includes a mounting plate 1231 coupled to the first Y-axis moving assembly 122, and a first elevation assembly 1232 and a second elevation assembly 1233 provided on the mounting plate 1231; the first heating assembly 140 is disposed on the first lifting assembly 1232, and the adsorption module 170 is disposed on the second lifting assembly 1233.

Wherein, the first lifting assembly 1232 can control the movement of the first heating assembly 140 in the Z-axis direction, and the second lifting assembly 1233 can control the movement of the adsorption module 170 in the Z-axis direction. When the machining operation is required, the first X-axis moving assembly 121, the first Y-axis moving assembly 122 and the Z-axis moving assembly 123 can be adjusted to the preset position at the same time, and then the first lifting assembly 1232 is used for fine adjustment of the position of the first heating assembly 140 in the Z-axis direction or the second lifting assembly 1233 is used for fine adjustment of the position of the adsorption module 170 in the Z-axis direction. This can improve the positioning accuracy of the first heating assembly 140 and the adsorption module 170, and thus can improve the processing accuracy of the first heating assembly 140 and the adsorption module 170.

In an alternative embodiment, when the disassembling operation is required, the circuit board to be processed may be placed at the designated position through the adsorption module 170, and then the thermal fusion welding tin at the designated position is melted through the cooperation of the first heating component 140 and the preheating mechanism 130; and finally, the specified components are disassembled and adsorbed to the specified positions by utilizing the adsorption module 170.

Further, referring to fig. 3, the first elevating assembly 1232 includes a first driving motor 12321 disposed on the mounting plate 1231, a first driving wheel 12322 drivingly connected to the first driving motor 12321, a first driven wheel 12323 disposed on the mounting plate 1231, a first timing belt 12324 sleeved on the first driving wheel 12322 and the first driven wheel 12323, and one side of the first timing belt 12324 is connected to the first hot air heater 141.

When the first lifting assembly 1232 is in a working state, the first driving motor 12321 drives the first driving wheel 12322 to rotate, the first driven wheel 12323 also synchronously rotates along with the first driving wheel 12322 under the driving of the first synchronous belt 12324, and the first hot air heater 141 connected with one side of the first synchronous belt 12324 synchronously moves along with the first driving wheel, that is, the first heating assembly 140 controls the movement in the Z-axis direction through the first lifting assembly 1232, so that the movement precision of the first heating assembly 140 in the Z-axis direction can be improved, and the machining precision of the first heating assembly 140 can be improved.

The second lifting assembly 1233 comprises a second driving motor 12331 arranged on the mounting plate 1231, a second driving wheel 12332 in transmission connection with the second driving motor 12331, a second driven wheel 12333 arranged on the mounting plate 1231, and a second synchronous belt 12334 sleeved on the second driving wheel 12332 and the second driven wheel 12333, wherein one side of the second synchronous belt 12334 is connected with the adsorption module 170.

When the second lifting assembly 1233 is in the working state, the second driving motor 12331 drives the second driving wheel 12332 to rotate, the second driven wheel 12333 also synchronously rotates along with the second driving wheel 12332 under the driving of the second synchronous belt 12334, and the adsorption module 170 connected with two sides of the second synchronous belt 12334 synchronously moves along with the second driving wheel 12332, that is, the adsorption module 170 controls the movement in the Z-axis direction through the second lifting assembly 1233, so that the movement precision of the adsorption module 170 in the Z-axis direction can be improved, and the machining precision of the adsorption module 170 can be improved.

In practical production applications, a sliding rail may be disposed on one side of the first synchronous belt 12324, so that the first hot air heater 141 is slidably connected with the sliding rail, which can reduce the movement resistance when the first hot air heater 141 and the first synchronous belt 12324 move synchronously, thereby improving the movement precision and positioning precision of the first hot air heater 141.

In practical production application, a sliding track can be arranged in the middle of the second synchronous belt 12334 so that the adsorption module 170 is in sliding connection with the sliding track, and in this way, the movement resistance of the adsorption module 170 and the second synchronous belt 12334 during synchronous movement can be reduced, so that the movement precision and the positioning precision of the adsorption module 170 can be improved. Further, as shown in fig. 8, the camera module 160 includes a camera 161, a light compensating ring 162, and a bracket 163 provided on a mounting plate 1231, the camera 161 and the light compensating ring 162 are connected to the bracket 163, and the light compensating ring 162 is provided in front of a lens of the camera 161.

In an alternative embodiment, the light compensating ring 162 may be connected to a driving motor, so that the light compensating ring 162 can perform fine adjustment on the position of the light compensating ring 162 in the Z-axis direction, so that the light compensating ring 162 achieves an optimal light compensating effect, and thus the camera 161 obtains a better shooting effect, and further, the positioning accuracy of the camera module 160 is improved.

Further, referring to fig. 9, the bga chip processing apparatus 100 further includes a driving screw 181 provided on the mounting platform 110, and a first bracket 182 and a second bracket 183 respectively connected to the driving screw 181, and a sliding rail 184 provided on the mounting platform 110 in parallel with the driving screw 181 such that the first bracket 182 and the second bracket 183 are respectively slidably connected to the sliding rail 184.

In practical production application, the positions of the first bracket 182 and the second bracket 183 in the X-axis direction can be controlled and adjusted through the motor driving transmission screw 181, so that the positions of the circuit boards placed on the first bracket 182 and the second bracket 183 are correspondingly adjusted, and the first heating assembly, the adsorption module 170 and the camera module 160 can conveniently process and position the circuit boards. The distance between the first bracket 182 and the second bracket 183 may be preset and adjusted before processing, so that the BGA chip processing apparatus 100 can process circuit boards of different specifications.

Further, as shown in fig. 5, the preheating mechanism 130 includes a supporting housing 131 and a plurality of heating elements 132, the supporting housing 131 is disposed on the mounting platform 110, and the plurality of heating elements 132 are arranged in an array in the supporting housing 131.

The heating element 132 is disposed in the supporting housing 131, so that the heat source of the preheating mechanism 130 is distributed uniformly, i.e. each part of the circuit board to be heated is heated uniformly, thereby achieving a better preheating effect.

In an alternative embodiment, referring to fig. 5, the support housing 131 is provided with a plurality of heat dissipation holes 1311, where the heat dissipation holes 1311 can enhance the fluidity of the air in the support housing 131, so as to reduce the risk of the preheating mechanism 130 not working properly due to excessive heat accumulated in the support housing 131.

Further, as shown in fig. 10 to 12, the BGA chip processing apparatus 100 further includes a second moving assembly 191 provided on the mounting stage 110, and a second heating assembly 192 connected to the second moving assembly 191; the second heating assembly 192 includes a second hot air heater 1921 and a second air guide cover 1922, the second air guide cover 1922 includes a second housing 19221 corresponding to the second hot air heater 1921, and a second air distribution plate 19222 disposed in the second housing 19221, and a plurality of air outlet holes 150 are formed in the second air distribution plate 19222, so that hot air blown by the second hot air heater 1921 heats components on the circuit board.

Wherein, the second housing 19221 can limit the flow direction of the hot air to guide the hot air to flow through the second air distribution plate 19222 for blowing out; the plurality of air outlets 150 formed in the second air distribution plate 19222 may enable the hot air to be blown to the circuit board in a more dispersed manner, so that the components to be heated are heated more uniformly.

Further, referring to FIG. 12, the second motion assembly 191 includes a second X-axis motion assembly 1911 disposed on the mounting platform 110, and a second Y-axis motion assembly 1912 disposed on the second X-axis motion assembly 1911; the transmission directions of the second X-axis moving assembly 1911 and the second Y-axis moving assembly 1912 are perpendicular to each other, and the transmission directions of the second X-axis moving assembly 1911 and the first X-axis moving assembly 121 are parallel to each other.

The second X-axis movement assembly 1911 and the second Y-axis movement assembly 1912 can control the movement accuracy of the second heating assembly 192 in the X-axis direction and the Y-axis direction, so that the machining accuracy of the second heating assembly 192 can be improved.

In an alternative embodiment, referring to fig. 13, the BGA chip processing apparatus 100 further includes a protective case 200, and the protective case 200 is disposed on the mounting platform 110 to protect internal components so as to reduce negative effects of external environment on the BGA chip processing apparatus 100, so that the BGA chip processing apparatus 100 can maintain good operation stability.

In practical production applications, a computer controller electrically connected to each component of the BGA chip processing apparatus 100 may be provided, and the BGA chip processing apparatus 100 may be automatically operated by inputting a preset programming program into the computer controller.

The foregoing description is only of the preferred embodiments of the utility model, and the above-described embodiments are not intended to limit the utility model. Various changes and modifications may be made within the scope of the technical idea of the present utility model, and any person skilled in the art may make any modification, modification or equivalent substitution according to the above description, which falls within the scope of the present utility model.

Claims

1. The BGA chip processing device is characterized by comprising a mounting platform, a first motion assembly and a preheating mechanism, wherein the first motion assembly and the preheating mechanism are arranged on the mounting platform;

The first motion assembly is connected with a first heating assembly, the first heating assembly comprises a first hot air heater and a first diversion fan cover, the first diversion fan cover comprises a first shell corresponding to the first hot air heater and a first air homogenizing plate arranged in the first shell, and a plurality of air outlet holes are formed in the first air homogenizing plate so that hot air blown by the first hot air heater heats components on a circuit board;

The first shell outer ring is also provided with at least one air outlet, the air outlet and the first hot air heater are respectively positioned on two opposite sides of the first air homogenizing plate, and the air outlet is correspondingly provided with a guide plate so that hot air flowing through the air outlet is blown in a direction away from the circuit board.

2. The BGA chip processing apparatus of claim 1, further comprising a camera module and an adsorption module, both of which are connected to the first moving assembly.

3. The BGA chip processing apparatus of claim 2, wherein the first movement assembly includes a first X-axis movement assembly provided on the mounting stage, a first Y-axis movement assembly provided on the first X-axis movement assembly, and a Z-axis movement assembly provided on the first Y-axis movement assembly;

The transmission directions of the first X-axis motion assembly, the first Y-axis motion assembly and the Z-axis motion assembly are mutually perpendicular;

The first hot air heater, the photographing module and the adsorption module are all connected with the Z-axis movement assembly.

4. The BGA chip processing apparatus of claim 3, wherein the Z-axis moving assembly includes a mounting plate coupled to the first Y-axis moving assembly, and first and second elevation assemblies provided on the mounting plate;

The first heating assembly is arranged on the first lifting assembly, and the adsorption module is arranged on the second lifting assembly.

5. The BGA chip processing apparatus of claim 4, wherein the first lifting assembly includes a first driving motor disposed on the mounting board, a first driving wheel drivingly connected to the first driving motor, a first driven wheel disposed on the mounting board, a first timing belt sleeved on the first driving wheel and the first driven wheel, and one side of the first timing belt is connected to the first hot air heater;

The second lifting assembly comprises a second driving motor arranged on the mounting plate, a second driving wheel in transmission connection with the second driving motor, a second driven wheel arranged on the mounting plate, and a second synchronous belt sleeved on the second driving wheel and the second driven wheel, and one side of the second synchronous belt is connected with the adsorption module.

6. The BGA chip processing apparatus of claim 2, wherein the camera module includes a camera, a light-compensating ring and a bracket disposed on the mounting board, the camera and the light-compensating ring are both connected to the bracket, and the light-compensating ring is disposed in front of a lens of the camera.

7. The BGA chip processing apparatus of claim 1, further comprising a driving screw provided on the mounting platform, and first and second brackets respectively connected to the driving screw, and sliding rails provided on the mounting platform in parallel with the driving screw so that the first and second brackets are respectively slidably connected to the sliding rails.

8. The BGA chip processing apparatus of claim 1, wherein the preheating mechanism includes a support housing disposed on the mounting platform and a plurality of heating elements disposed in an array within the support housing.

9. The BGA chip processing apparatus of any one of claims 3 to 5, further comprising a second moving assembly provided on the mounting stage, and a second heating assembly connected to the second moving assembly;

The second heating assembly comprises a second hot air heater and a second diversion fan cover, the second diversion fan cover comprises a second shell corresponding to the second hot air heater and a second air homogenizing plate arranged in the second shell, and a plurality of air outlet holes are formed in the second air homogenizing plate so that hot air blown out by the second hot air heater heats components on the circuit board.

10. The BGA chip processing apparatus of claim 9, wherein said second movement assembly includes a second X-axis movement assembly disposed on said mounting stage and a second Y-axis movement assembly disposed on said second X-axis movement assembly;

The transmission directions of the second X-axis motion assembly and the second Y-axis motion assembly are perpendicular to each other, and the transmission directions of the second X-axis motion assembly and the first X-axis motion assembly are parallel to each other.